CM1423 MILSTD-883 MIL-STD-883 - Datasheet Archive

 

California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 CM1423 Secure Digital Card EMI Filter Array with ESD Protection

 

PRELIMINARY California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 CM1423 CM1423 Secure Digital Card EMI Filter Array with ESD Protection Features Applications · · · · · · · Six channels of EMI filtering with ESD protection 4 channels of ESD protection ±15kV ESD protection on all I/O pins (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Better than 25dB of attenuation at 1GHz for 12pF100-12pF filter configuration Integrates 34 components into small form factor CSP solution · · · Secure Digital (SD) Card data lines in mobile handsets SD Card interface protection for other mobile electronics such as MP3 players, PDAs and digital cameras I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. General Description CAMD's CM1423 CM1423 is an EMI filter array with ESD protection, which integrates six (6) Pi- filters (C-R-C) and 4 channels of ESD protection. The CM1423 CM1423 has component values of 12pF-100-12pF. The part includes ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MILSTD-883 MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1423 CM1423 is ideal for EMI filtering and protecting data lines from ESD for the Secure Digital (SD) Card interface slot in mobile handsets. The CM1423 CM1423 is an all-inclusive solution for the SD card interface since its EMI filters provide the proper cut-off frequency to attenuate unwanted signals while limiting current with the appropriate pull-up resistor values. The CM1423 CM1423 is available in a space-saving, low-profile, chip-scale package, and is fabricated with one of California Micro Devices' semiconductor processes. Package Diagram 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 1 California Micro Devices PRELIMINARY 430 N. McCarthy Blvd Milpitas, CA 95035 Schematic Diagram 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 2 PRELIMINARY California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 Pin Description Pin Number A1 A2 A3 A4 A5 A6 A7 A8 B1 B2 B3 B4 C1 C2 C3 C4 C5 C6 C7 C8 Specifications: Pin Description DATA2 EMI Filter with ESD Protection ­ System Side DATA3 EMI Filter with ESD Protection ­ System Side EMI Filter with ESD Protection for CMD Signal ­ System Side ESD Protection for VMMC (VSS2) Supply EMI Filter with ESD Protection for CLK Signal ­ System Side ESD Protection for DET Signal DATA0 EMI Filter with ESD Protection ­ System Side DATA1 EMI Filter with ESD Protection ­ System Side Ground Ground Ground Ground DATA2 EMI Filter with ESD Protection ­ Secure Digital (SD) Card Side DATA3 EMI Filter with ESD Protection ­ SD Card Side EMI Filter with ESD Protection for CMD Signal ­ SD Card Side ESD Protection for VCC (VSS1) Supply EMI Filter with ESD Protection for CLK Signal ­ SD Card Side ESD Protection for DET Signal DATA0 EMI Filter with ESD Protection ­ SD Card Side DATA1 EMI Filter with ESD Protection ­ SD Card Side (At 25°C unless specified otherwise) Min. Resistance R1 Capacitance C1 at 2.5V dc; 1MHz, 30mV ac Stand-off Voltage, I = 10µA Diode Leakage at 3.3V reverse bias voltage Signal Clamp Voltage: Positive Clamp, 10mA Negative Clamp, -10mA In-system ESD withstand voltage*: Human Body Model (MIL-STD-883 MIL-STD-883, method 3015) IEC 61000-4-2, contact discharge method 80 10 5.5 Clamping voltage during ESD discharge* MIL-STD-883 MIL-STD-883 (Method 3015), 8kV Temperature Range: Operating Storage DC Power per Resistor: DC Package Power Rating: Typ. 100 12 Max. 120 15 100 5.6 -1.5 6.8 -0.8 9.0 -0.4 pF V nA V V kV kV ±30 ±15 Positive Negative Unit 12 -7 -40 -65 V V 85 150 0.1 0.5 °C W W * ESD applied to input / output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left open. These parameters are guaranteed by design. 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 3 PRELIMINARY California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 Insertion Loss Typical EMI filter performance (2.5V d.c., 50 environment) Cut-off Frequency R1 C1 (MHz) () 20dB Attenuation (pF) 207 100 12 All parameters in the table are typical values. (MHz) Over 25dB Range (MHz) 600 800 - 3000 Typical diode capacitance vs. input voltage (normalized to 2.5V d.c.) 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 4 California Micro Devices PRELIMINARY 430 N. McCarthy Blvd Milpitas, CA 95035 Application Information Note: 100k and 10k pull-up resistors are not included in CM1423 CM1423. Designer will need to determine the appropriate pull-up resistor value for each design. 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 5 PRELIMINARY California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 PRINTED CIRCUIT BOARD RECOMMENDATIONS Pad size in PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Bond Trace Finish Tolerance ­ Edge to Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm (round) 50/50 by volume No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 60 seconds 260°C Solder Reflow Profile 11/11/03 Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 6 PRELIMINARY California Micro Devices 430 N. McCarthy Blvd Milpitas, CA 95035 Tape & Reel Information CMD PART # CM1423 CM1423 11/11/03 CHIP SIZE (mm) 4.00 x 1.46 x 0.6 POCKET SIZE (mm) Bo x Ao x Ko TBD TAPE WIDTH W 8mm REEL DIAMETER QTY PER REEL P0 P1 178mm (7") 3500 4mm 4mm Tel: (408) 263-3214 · Fax: (408) 263-7846 · Website: www.calmicro.com 7