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Part : MPC-NCNCD30240F-SS Supplier : CommScope Manufacturer : Onlinecomponentscom Stock : - Best Price : $2,225.4600 Price Each : $2,225.4600
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CD3024 Datasheet

Part Manufacturer Description PDF Type
CD3024B Compensated Devices 1 WATT CAPABILITY WITH PROPER HEAT SINKING Original

CD3024

Catalog Datasheet MFG & Type PDF Document Tags

CD3024

Abstract: IEEE802-3 TEMPERATURE RANGE C » Commercial (0 to +70°C) -c. PACKAGE TYPE D - 28-Pin (Slim) Ceramic DIP (CD3024) b , (CD3024) -C. DEVICE CLASS /B = Class B b. SPEED OPTION Not Applicable -a. DEVICE NUMBER/DESCRIPTION
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AM7992B IEEE802-3 class D controller DIP manchester encoder 10 pin dip amd 223ZD 0SS7527 7992B IEEE-802 MIL-STD-883C

amd am2 pin diagram

Abstract: 27s49 (PD3024 Of CD3024) e. OPTIONAL PROCESSING Blank -= Standard processing B - Burn-in d. TEMPERATURE RANGE , DIP (CD 024) or 24-Pin (300 Mil) Ceramic DIP (CD3024) L - 32-Pin Rectangular Ceramic Leadless Chip , (CD3024) -C- DEVICE CLASS /B - Class B b. SPEED OPTION Blank -65 ns A - 55 ns SA - 30 fis a. DEVICE
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27S49A amd am2 pin diagram 27s49 cd3024 amd AM27S49 am27s49dc 27S49/27S49A/29S49SA 27S49 A0-A12 BD006081 27S49SA

CD3024

Abstract: ) - T - 24-Pin (300-Mil) DIP (PD3024 or CD3024) e. OPTIONAL PROCESSING Blank *= Standard , DIP (CD3024) L *> 32-Pin Rectangular Ceramic Leadless Chip Carrier (CLR032) b. SPEED Blank , -Mil) Ceramic DIP (CD3024) C. DEVICE CLASS /B - Class B b. SPEED OPTION Blank » 65 ns A - 55 ns SA Â
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B0006081 27S49/27S49A/27S49SA WF021480
Abstract: ) Ceram ic DIP (CD3024) b. SPEED OPTION Not Applicable a. DEVICE NUMBER/DESCRIPTION Am7992B , -Pin Slim Ceram ic DIP (CD3024) c. DEVICE CLASS /B * C la ss B b. SPEED OPTION Not Applicable -
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amd 8506

Abstract: -Pin Slim Ceramic DIP (CD3024) L - 28-Pin Rectangular Ceramic Leadless Chip Carrier (CLR028) B. SPEED , -Pin Slim Ceramic DIP (CD3024) U - 28-Pin Rectangular Ceramic Leadless Chip Carrier (CLR028) C. DEVICE , * 07089B CD3024 1.235 1.280 24 1 13 12 T .280 ' L J U U L J U I- II- JU LU LLI i- ll
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amd 8506 99C58/A 99C59 99C58 WF021442 MIL-STD-883

PD3028

Abstract: PD3024 SIDE VIEW 16-000038H-3 CD 020 DF8 3-29-95 ae CD3024 24-Pin 300 mil Ceramic SKINNYDIP , .008 .018 16-000038H-3 CD3024 DF9 3-30-95 ae 4-47 AMD CFL024 24-Pin Ceramic Flatpack
Vantis
Original
PD3028 D-F79 AMD pd 020 CERAMIC FLATPACK 20pin 90013 AMD pd 016 16-000038H 16-038-SQ

amd am2 pinout

Abstract: AM29C861/BLA -Pin Slim Plastic DIP (PD3024) D - 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic Small Outline Package , DIP d. PACKAGE TYPE L - 24-Pin Slim Ceramic DIP (CD3024) K - 24-Ptn Rectangular Medium Ceramic , "»-Il-» -HbT-SH .009 .015 PID * 07089C CD3024 1.235 1.280 nnnnnnnnnrinm rsr « 12 .ose MAX
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amd am2 pinout AM29C861/BLA AM29C861 AM2S pinout AM2 AMD 29C861 29C863 29C961 29C963 29C900 CS-11

v06c

Abstract: AM29C841/B3A Ceramic DIP (CD3024) Plastic Small Outline Package (SO 024) Plastic Leaded Chip Carrier (PL 028) Ceramic , Ceramic DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 - 28-Pin Ceramic Leadless , · « T - & - \ PID * 07089C CD3024 1.235 1.280 " h V 13 .ose MAX. i m
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29C843 v06c AM29C841/B3A Am29C841 29C841 29C941 29C943 29C841/ 29C941/A

ING21

Abstract: MIL-STD-603 Thinner Ceramic Thickness (CLT028) - T * 24-Pin (300-Mil) DIP (PD3024 or CD3024) e. OPTIONAL PROCESSING , DIP (CD3024) L » 32-Pin Rectangular Ceramic Leadless Chtp Carrier (CLR032) b. SPEED Blank ASA - , Carner (CLR032) L - 24-Pin (300-Mil) Ceramic DIP (CD3024) C. DEVICE CLASS /B - Class 8 SPEED OPTION
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ING21 MIL-STD-603 WF02U80

amd am2 pinout

Abstract: AM29C821/B3A . PACKAGE TYPE P = 24-Pin Slim Plastic DIP (PD3024) D - 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic , d. PACKAGE TYPE L - 24-Pin Slim Ceramic DIP (CD3024) K-24-Pin Rectangular Medium Ceramic Flatpack , PLANE -.015 MO "»-Il-» -HbT-SH .009 .015 PID * 07089C CD3024 1.235 1.280 nnnnnnnnnrinm rsr
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AM29C821/B3A AM29C823 AM29C821PC 29C821 29C823 29C921 29C923 29C800 T-90-20

AM29827

Abstract: AM29828 .045 .065 PID * 07089C CD3024 1.235 1.280 .096 MAX. nnnnnnnnnnnm [24 13 .280 .310 "H pH h- J , Interface Products_ . CD3024 T-90-20 24-Pin 300-miI Ceramic SKINNYDIP 06850C PL 028 28-Pin Plastic
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AM29827 AM29828 29827/A AIS-WCP-20M-01/88-0 0257S25 07089F-002 06751E G2575H5

AM29827

Abstract: Am29827/Am29828  140 .225 SEATING PLANE -.015 MO "»-II-» -l-aT-SH .009 .015 PID * 07089C CD3024 1.235 1.280 , Interface Products_ . CD3024 T-90-20 24-Pin 300-mil Ceramic SKINNYDIP 06850C PL 028 28-Pin Plastic
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Am29827/Am29828 Y043 0G37413

PD3024

Abstract: PH 21 DIODE * 07089C CD3024 1.235 1.280 .ose MAX. nnnnnnnnnnnm [24 13 .280 .310 -H K] pH h- .005 MW, 290 Ja , DEVICES SflE D â  0257525 0037412 7 â  AND Bus Interface Products_ . CD3024 T-90-20 24-Pin 300
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PH 21 DIODE AM29800 09310B

VC 5022

Abstract: 1N30S4 Dual 7 Deep Pipeline Register with 0 and Feedthrough CONNECTION DIAGRAM Top View CD3024 PD3024 CL , . TEMPERATURE RANGE C - Commercial (0 to + 70"C) C. PACKAGE TYPE P - 24-Pill Plastic DIP (CD3024) D - 24 , /BLA = 24-Pin CD3024 /B3C = 28-Pin CL 028 C. DEVICE CLASS /B-Class B B. SPEED OPTION Not Applicable , Electronic-Library Service CopyRight 2003 PHYSICAL DIMENSIONS* CD3024 CL 028 1.280 r-i^irHmmmmr-irnnmrn '
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VC 5022 1N30S4 RSN 312 H 24 H32 305 5V L Am29500 rsn 313 29520A/A 29521A 29520A AIS-WCP-15M-9/86-0

PAL20L8

Abstract: MMI PAL 20R4 - 24-Pin (300 mil) Ceramic SKINNYDIP (CD3024) Valid Combinations PAL20L8-5 PC, JC PAL20R8 , -Pin 300 mil Ceramic ' SKINNYDIP (CD3024) OPERATING CONDITIONS C = Commercial (0°C to+75°C) Valid , LEAD FINISH A = Hot Solder Dip PACKAGE TYPE L - 24-Pin (300-mil) Ceramic SKINNYDIP (CD3024) 3 - 28 , MIL-STD-883, Class B PACKAGE TYPE (Per 09-000) JS = 24-Pin 300-MII Ceramic SKINNYDIP (CD3024) W = 24
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PAL20L8 PAL20R6 PAL20R4 MMI PAL 20R4 mmi pal20l8 MMI TOP MARKING amd part marking PAL20R8-5 PAL20R8A

CD3024

Abstract: PD3024 DIP (PD3024) D = 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic Small Outline Package (SO 024) J , (CD3024) K-24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 - 28-Pin Ceramic Leadless Chip Carrier , '" .005 MIN â 140 .225 SEATING PLANE -.015 MO "»-II-» -l-aT-SH .009 .015 PID * 07089C CD3024 1.235
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29C821/A 05S7525

AM29C841/BLA

Abstract: AM29C841PC . PACKAGE TYPE P - 24-Pin Slim Plastic DIP (PD3024) 0 - 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic , d. PACKAGE TYPE L - 24-Pin Slim Ceramic DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack , CD3024 1.235 1.280 nnnnnnnnnrinm rsr « 12 .ose MAX. .280 .310 I_11_Il_11_I LJ LJ I_I LU LU I_I
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AM29C841/BLA AM29C841PC Am29C900 CD0014 am29c800

PD3024

Abstract: CFM024 PACKAGE OUTLINES* PD3024 1.240 1.280 24 13 12 i .240 ID 1 290 *- .006 MIN. SEA TIN G P LA N E -4 140 CD3024 1.235 1.280 .096 MAX. 290 *For reference only. 111 PACKAGE OUTLINES (Cont'd.) SO 024 .6141 - J i r u l l l : . : . : . : - L .0138 .0192 T553 > .0040 ".0118 ' .0926 0* ft* ' Jf F a (L, _ f ._ m i .0125 JL PO # 093108 CFM024 -.045 MAX. 112 PACKAGE OUTLINES (Cont'd.) PL 028 CL 028 m ' -310 Hl U 5I t i | - j
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la 1240

cd3024 amd

Abstract: PD3024 « T - & - \ PID * 07089C CD3024 1.235 1.280 m n [2 4 ru n n n n n , Products 2flE D 02S7S2S 0037412 7 AMD CD3024 24 -Pin 300-m il Ceram ic SKINNYDIP ~~ T
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0D37413

CD3024

Abstract: PD3024 "»-II-» -l-aT-SH .009 .015 PID * 07089C CD3024 1.235 1.280 nni-ir-innnnnr-inm rsr i3 12 .ose MAX , Interface Products_ . CD3024 T-90-20 24-Pin 300-mil Ceramic SKINNYDIP 06850C PL 028 28-Pin Plastic
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29861A 29800A

CD0014

Abstract: CD3024 24-Pin Slim Plastic DIP (PD3024) D - 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic Small , DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 - 28-Pin Ceramic Lead less , "»-Il-» -HuT-SH .009 .015 PID * 07089C CD3024 1.235 1.280 nnnnnnnnnrinm rsr « 12 .ose MAX
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29841A/A 29843A/A 29845A 29941A/A 29943A/A 29945A

ci 0925 -PPL

Abstract: AM29116 SLIM (CD3024) b7C 1* W 24 â¡ vcc bell 2 23 â¡ a7 b5C 3 22 â¡ ag b4I= 4 21 bac 5 20 =K b2C 6 , -Pin Ceramic DIP (CD3024) B. SPEED OPTION Not Applicable A. DEVICE NUMBER/DESCRIPTION Am29118 8 , PHYSICAL DIMENSIONS CD3024 1.235 1â'"Iâ'"!â'"' â'" Iâ'" iâ'"â  , : :â'" iâ'" ~T' I 1_12
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ci 0925 -PPL AM29116 d-latch c00102 AM2952 BD002182 2910A AIS-RRD-15M-11/86-0
Abstract: 24-Pin Slim Plastic DIP (PD3024) D - 24-Pin Slim Ceramic DIP (CD3024) S - 24-Pin Plastic Small , DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 - 28-Pin Ceramic Lead less , SEATING PLANE -.015 MO "»-II-» -HuT-SH â 00« .015 PID * 07089C CD3024 1.235 1.280 -
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29900A 29841A 29843A

aj 312

Abstract: CD3024 -Pin Slim Plastic DIP (PD3024) D - 24-Pin Slim Ceramic DIP (CD3024) L - 28-Pin Rectangular Ceramic Leadless , Hot Solder DIP C - Gold d. package type L = 24-Pin Slim Ceramic DIP (CD3024) U = 28-Pin Rectangular ,  140 .225 .125 )J L « JL^ii H PH r ~ r^ .065 mp J» I .320 rid * 07089b CD3024 1.235 pid # 06650b 11
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aj 312 06852B
Abstract: Ceramic DIP (CD3024) S - 24-Pin Plastic Small Outline Package (SO 024) J - 28-Pin Plastic Leaded Chip , . Î t LEAD FINISH A -H o t Solder DIP - , *8-11 - % -+ · « T -& - \ PID * 07089C CD3024 1.235 1.280 "h V m n [2 4 -
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29833A/A 29853A/A 29855A 29833A 29853A 415MN

29520A

Abstract: CD3024 Register with 0 and Feedthrough CONNECTION DIAGRAM Top View CD3024 PD3024 («STOUCTIOH) In I , Commercial (0 to + 70®C) C. PACKAGE TYPE P = 24-Pin Plastic DIP (CD3024) D - 24-Pin Ceramic DIP (PD3024 , -Pin CD3024 /B 3C = 28-Pin CL 028 C. DEVICE CLASS /B = Class B B. SPEED OPTION Not Applicable A
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am29s20 RSN 315 H 41 AM29520A am29325 AM29520ADC PD302 BDR02270

Am29C82

Abstract: Plastic DIP (PD3024) D = 24-Pin Slim Ceramic DIP (CD3024) S = 24-Pin Plastic Small Outline Package (SO 024 , Ceramic DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 - 28-Pin Ceramic Leadless , - \ PID * 07089C CD3024 1.235 1.280 " h V 13 .ose MAX. i m n [2 4 run
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Am29C82 29C921/A
Abstract: Ceramic DIP (CD3024) S - 24-Pin Plastic Small Outline Package (SO 024) J - 28-Pin Plastic Leaded Chip , -Pin Slim Ceramic DIP (CD3024) K - 24-Pin Rectangular Medium Ceramic Flatpack (CFM024) 3 * 28-Pin Ceramic , * 8 -1 1 - % - + · « T - & - \ PID * 07089C CD3024 1.235 1.280 -
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29C827/A 29C828 29C927/A 29C928 29C827 29C927
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