NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: IDTQS3861PAG ICS9LPRS437 ICS9LRS954A4GLF ICS9LP505 ICS9LPR363 ics954310bglf ICs9lpr426bglft ICS9lpr310 ICS9LPRS916JGLF ICS9LPRS552AGLF ICS9LPR363DGLF ICS9LPRS587EGLF ICS9LPR316AGLF ICS9LPRS355BGLF ICS954310 ICS9LPRS365BGLF successfully qualified Copper wire bond process and has shipped million of units assembled at Carsem, Malaysia ... | Original |
21 pages, |
IDT74FCT3245APGG8 ICS954206AGLF ICS951418 ICS951417 A0807-02R1 A0807-02R1 abstract |
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| Abstract: customers that IDT is adding Carsem, Malaysia ( 9 mm x 9 mm VFQFPN-64 VFQFPN-64 ) and Chipmos, Taiwan ( 9 mm x 9 mm , adding Carsem, Malaysia ( 9 mm x 9 mm VFQFPN-64 VFQFPN-64 ) and Chipmos, Taiwan ( 9 mm x 9 mm VFQFPN-64 VFQFPN-64 and 10 mm , , Indonesia for 9 mm x 9 mm VFQFPN-64 VFQFPN-64 package type, and Carsem, Malaysia and PT Unisem, Indonesia for 10 mm x , mm x 10 mm VFQFPN-72 VFQFPN-72, Carsem, Malaysia ii) 10 mm x 10 mm VFQFPN-72 VFQFPN-72, Chipmos, Taiwan Test Results , ) Test Method Carsem, Malaysia JESD22-A110 JESD22-A110 45/0 JESD22-A104 JESD22-A104 1 JESD22-A103 JESD22-A103 77/0 ... | Original |
4 pages, |
9LPR350 9lprs357 9LPRS918 9lprs4 JESD22-B116 9lprs929 9LPRS397 9lprs113 cv179 9lprs480 9lprs476 9lprs914 9LPR 9lprs365 9lprs325 A0903-04 A0903-04 abstract |
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| Abstract: Description Existing Add Assembly Location Carsem, China UTL, Thailand Die Attach: QMI519 QMI519 ... | Original |
4 pages, |
sumitomo 9UMS9610CKLFT 9UMS9633BKILF CARSEM QMI-519 G770 8200T g770HCD G770HC QMI519 G770H sumitomo g770hcd A0907-03 A0907-03 abstract |
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| Abstract: Description Assembly Location Existing ASAC, China ; PT Unisem, Indonesia ; Carsem, Malaysia Die Attach ... | Original |
4 pages, |
A0812 G770C IDT5T929-10NLGI IDT5T929-10NLI8 IDT5T9306NLGI8 019n VFQFPN-56 VFQFPN 28 CRM1066C G770H G770HC IDT5T9306NLGI IDT5V9888CNLGI IDT5V2305NRGI8 A0812-02 A0812-02 abstract |
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| Abstract: customers that IDT is adding Carsem, Malaysia and UTL, Thailand as the alternate assembly facilities for , Detail Of Change: This notification is to advise our customers that IDT is adding Carsem, Malaysia and , Carsem, Malaysia on VFQFPN-64 VFQFPN-64 and VFQFPN-72 VFQFPN-72 package types. Copper bond wire process is presently used by , : 1. Copper Bond Wire Qual Results Qual Vehicle: i) Carsem, Malaysia, VFQFPN-72 VFQFPN-72 (3 lots) Test ... | Original |
5 pages, |
VFQFPN-20 A0910 CARSEM 9LVRS396AKLF 9LP505 9lprs 9LRS 9LRS3125BKILF copper bond wire VFQFPN-56 9LVS 9LvS3199 9LRS3199 JESD22-A110 9LRS4123AKLFT A0910-01 A0910-01 abstract |
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| Abstract: : Carsem-Ipoh, Malaysia is currently a qualified subcontractor and might be used as an alternate assembly ... | Original |
5 pages, |
sp1481ecn SP485RCN-L SP485REN-L SP6661EN-L XR3171eid-f SPX2951ACS-L-5-0 SP813LEN-L SP690SEN-L cel8240 SP485EEN-L/TR XR3174EID-F sp485een-l QMI519 XR3175EID-F datasheet abstract |
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| Abstract: Operation Foundry BA11217ROOM BA11217ROOM: N/A MS1402 MS1402 SP3070 SP3070 _ CARSEM N/A CHARROOM Process , Foundry A131096125C A131096125C: N/A MS1402 MS1402 SP3070 SP3070 _ CARSEM N/A CHAR25C CHAR25C Process Date Tested , MS1402 MS1402 SP3070 SP3070 _ CARSEM N/A CHARROOM Process Date Tested Tester Test Program , CARSEM N/A CHAR25C CHAR25C Process Date Tested Tester Test Program 27-FEB2006 27-FEB2006 I3077Edual05_e_ , MS1402 MS1402 SP3070 SP3070 _ CARSEM N/A CHARROOM Process Date Tested Tester Test Program ... | Original |
1657 pages, |
955E 9698 TTL 7446 SP3078 SP3075 SP3074 ISC 9809 din 5480 9736 6174 9836 CARSEM 2504 9729 sipex 9602 4322 020 9717 sp3072 SP3077 SP3070 SP3077 abstract |
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| Abstract: Manufacturer: Episil Assembly Location: Carsem / Unisem - Malaysia Package Information: Package ... | Original |
6 pages, |
SP3223EEA SP232CE B5C1 SP232c Episil process SP232CE abstract |
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| Abstract: , Carsem, to Unisem's Batam plant (formerly AIT) In addition, assembly of certain products packaged in the 80 lead MQFP package at Carsem will be assembled in the 80 lead LQFP package at Unisem's Batam plant , foot) A A1 A2 b c D D1 E E1 e L CARSEM - MQFP MIN NOM MAX (mm) (mm) (mm) 2.45 , Carsem to Unisem's Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem's Batam plant (formerly AIT). REASON FOR ... | Original |
5 pages, |
SP514CF SP3508CF SP3508CF-L SP3508EF SP3508EF-L SP505ACF-L SP508CF SP508EF CARSEM SP506CF-L datasheet abstract |
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| Abstract: Corporation, Milpitas, CA Carsem Unisem Penang Malaysia, ASAT Hong Kong Linear Technology Corporation , Corporation Plastic SOIC/DIP Linear Technology Corporation, Milpitas, CA Carsem Unisem Penang Malaysia , Plastic SOIC Linear Technology Corporation, Milpitas, CA Carsem/Unisem/Penang-Malaysia, ASAT-Hong Kong , Plastic SOIC Linear Technology Corporation, Milpitas, CA Carsem/Unisem/Penang-Malaysia, ASAT-Hong Kong ... | Original |
20 pages, |
nicolet bach up to me INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION, STORES RECEIVED RAW MATERIAL CHECK LIST SPC Technology pyrometer PLASMA TV APPLICATION NOTES ESD test plan INCOMING Plate INSPECTION oxygen sensor magnetron plasma tv circuit diagram ISO9001 ISO9001 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Subcontractor SO20 Muar Malaysia STMicroelectronics plant TO92 Carsem Malaysia Subcontractor Fastech plant SOT23 Carsem Malaysia Subcontractor TQFP48 TQFP48 TQFP48 TQFP48 Muar Malaysia STMicroelectronics plant TEST AND plant TO92 Carsem Malaysia Subcontractor Muar Malaysia STMicroelectronics plant SOT23, TSSOP www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7540.htm |
STMicroelectronics | 25/01/2001 | 4.4 Kb | HTM | 7540.htm |
| Press Release - NATIONAL SEMICONDUCTOR TO SELL DYNA-CRAFT INCORPORATED NATIONAL SEMICONDUCTOR TO SELL DYNA-CRAFT INCORPORATED Carsem Enterprises to Buy National's Subsidiary Business SANTA CLARA, CA and Kuala Lumpur, Malaysia, November 9, 1995 -National Semiconductor signed an agreement today to sell its subsidiary lead frame business, Dyna- Craft Inc. (DCI) to Malaysia Pacific Industries' (MPI) semiconductor division, Carsem Enterprises. The agreement includes www.datasheetarchive.com/files/national/docs/wcd00038/wcd0388f.htm |
National | 03/04/1998 | 3.6 Kb | HTM | wcd0388f.htm |
| Part Reference Value PCB Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS 112404 CONN,BNC,5 PINS RES, 0603 0 OHM JUMPER TAIYO YUDEN LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM www.datasheetarchive.com/download/81145239-364568ZC/1118a-a.zip (DC1118A.DSN) |
Linear | 22/09/2009 | 1586.39 Kb | ZIP | 1118a-a.zip |
| Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 SANYO OSCON 16SP270M 16SP270M 16SP270M 16SP270M TAIYO YUDEN EMK316BJ EMK316BJ EMK316BJ EMK316BJ LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 CAP, 1206 OPTION TAIYO YUDEN www.datasheetarchive.com/download/84584522-364752ZC/1400a.zip (1400A-1.DSN) |
Linear | 22/09/2009 | 2630.45 Kb | ZIP | 1400a.zip |
| POWER MODULE Part Reference Value PCB Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM P ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 CAP, 1206 OPTION TAIYO YUDEN EMK316BJ475ML-T EMK316BJ475ML-T EMK316BJ475ML-T EMK316BJ475ML-T OPTION www.datasheetarchive.com/download/42668945-365299ZC/823b-a.zip (823BB-1.DSN) |
Linear | 22/09/2009 | 1039.55 Kb | ZIP | 823b-a.zip |
| , SIP POWER MODULE Part Reference Value PCB Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 CAP, 1206 OPTION TAIYO YUDEN EMK316BJ475ML-T EMK316BJ475ML-T EMK316BJ475ML-T EMK316BJ475ML-T OPTION www.datasheetarchive.com/download/42668945-365299ZC/823b-a.zip (823BA-1.DSN) |
Linear | 22/09/2009 | 1039.55 Kb | ZIP | 823b-a.zip |
| Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 SANYO OSCON 16SP270M 16SP270M 16SP270M 16SP270M , 0603 0 OHM JUMPER TAIYO YUDEN LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 www.datasheetarchive.com/download/64323932-364547ZC/1084a-a_b.zip (1084A-1.DSN) |
Linear | 12/09/2011 | 907.33 Kb | ZIP | 1084a-a_b.zip |
| Part Reference Value PCB Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS P-SIPLGA15X15-25LS 112404 CONN,BNC,5 PINS RES, 0603 0 OHM JUMPER TAIYO YUDEN LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM www.datasheetarchive.com/download/76911270-364570ZC/1118a-c.zip (DC1118A.DSN) |
Linear | 22/09/2009 | 1586.07 Kb | ZIP | 1118a-c.zip |
| Reference Value PCB Footprint SIPLGA Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 ,BNC,5 PINS RES, 0603 0 OHM JUMPER TAIYO YUDEN LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15 P-SIPLGA15 P-SIPLGA15 P-SIPLGA15 www.datasheetarchive.com/download/25704915-364951ZC/1668b.zip (1668B-1.DSN) |
Linear | 16/12/2011 | 4837.3 Kb | ZIP | 1668b.zip |
| Description IC, SIPLPGA Part Number CARSEM P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 P-SIPLGA15X15-25LS-CO136 SANYO OSCON 16SP270M 16SP270M 16SP270M 16SP270M TAIYO YUDEN EMK316BJ EMK316BJ EMK316BJ EMK316BJ LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T LMK107BJ105MA-T PADS ONLY FIDUC FIDUCIAL CARSEM P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 P-SIPLGA15X15-S1LD-CO136 CAP, 1206 OPTION TAIYO YUDEN www.datasheetarchive.com/download/40919954-364891ZC/1588a.zip (1588A-2.DSN) |
Linear | 23/07/2010 | 3079.36 Kb | ZIP | 1588a.zip |