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| Part Number | Manufacturer | Description | ||||||
| 1. |  C521 |
XP Power | Rack and Cabinet Mounting Converters - Industrial: Module | 196.96 Kb | 8 Pg. | |||
| 2. | C52100JSL1 |
BI Technologies | Capacitor: Ceramic: 10PF: 100: SL: 5%: SIP: 4 | 41.3 Kb | 3 Pg. | |||
| 3. | C52100JSL2 |
BI Technologies | Capacitor: Ceramic: 10PF: 25: SL: 5%: SIP: 4 | 41.3 Kb | 3 Pg. | |||
| 4. | C52100JSL5 |
BI Technologies | Capacitor: Ceramic: 10PF: 50: SL | 41.3 Kb | 3 Pg. | |||
| 5. | C52100KSL1 |
BI Technologies | Capacitor: Ceramic: 10PF: 100: SL: | 41.3 Kb | 3 Pg. | |||
| 6. | C52100KSL5 |
BI Technologies | Capacitor: Ceramic: 10PF: 50: SL: | 41.3 Kb | 3 Pg. | |||
| 7. | C52100MSL1 |
BI Technologies | Capacitor: Ceramic: 10PF: 100: SL: | 41.3 Kb | 3 Pg. | |||
| 8. | C52100MSL2 |
BI Technologies | Capacitor: Ceramic: 10PF: 25: SL: | 41.3 Kb | 3 Pg. | |||
| 9. | C52100MSL5 |
BI Technologies | Capacitor: Ceramic: 10PF: 50: SL: | 41.3 Kb | 3 Pg. | |||
| 10. | C52100ZSL1 |
BI Technologies | Capacitor: Ceramic: 10PF: 100: SL: -20% to | 41.3 Kb | 3 Pg. |
| « Previous 1 2 Next » |
| 1. |  43.66 Kb • 2 Pages |
Abstract: ... Contact Material :Copper Alloy (C521) Plating Underplate :80 μ, (2.0 μm) Nickel — QQ-N-290, Class 2 Wiping Area :20 μ, (0.51 μm) Min Gold — MIL-G-45204, Type II, Grade C. Solder Area :Tin-Lead Shroud ... Labels: C521 |
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| 2. |  500.22 Kb • 4 Pages |
Abstract: ... Material: Copper Alloy (C521) Plating. Underplating: 80 μ′′ (2.0 μm) Nickel - QQ-N-290, Class 2 Wiping Area: 30 μ′′ (0.76 μm) Min Gold - MIL-G-45204, Type II, Grade C Solder Tails: See ordering information ... Labels: C521, RoHS |
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| 3. |  196.7 Kb • 5 Pages |
Abstract: ... Color: Black Contact Material: Copper Alloy (C521) Plating Underplating: 80 μ′′ (2.54 μm) Nickel — QQ-N-290, Class 2. Wiping Area: 30 μ′′ (0.76 μm) Min Gold — MIL-G-45204, Type II, Grade C Body Material ... Labels: C521 |
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| 4. |  385.52 Kb • 4 Pages |
Abstract: ... Contact Material: Copper Alloy (C521) Plating Underplate: 80 μ′′ [ 2.0μm ] Nickel — QQ--N--290, Class 2 Wiping Area: 20 μ′′ [ 0.76μm ] Min gold — MIL--G--45204 Type II, Grade C. Shroud Material: Steel ... Labels: C521 |
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| 5. |  33.34 Kb • 3 Pages |
Abstract: ... Contact Material: Copper Alloy (C521) Plating Underplate: 80 μ, (2.0 μm) Nickel — QQ-N-290, Class 2 Wiping Area: 30 μ, (0.76 μm) Min Gold — MIL-G-45204, Type II, Grade C. Body. Material: Zinc Alloy ... Labels: C521 |
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| 6. |  452.48 Kb • 4 Pages |
Abstract: ... Material: Copper Alloy (C521) Plating. Underplating: 80 μ′′ (2.0 μm) Nickel - QQ-N-290, Class 2 Wiping Area: 30 μ′′ (0.76 μm) Min Gold - MIL-G-45204, Type II, Grade C Body. Material: Zinc Alloy Plating ... Labels: C521, RoHS |
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| 7. |  387.33 Kb • 4 Pages |
Abstract: ... Material: Copper Alloy (C521) Plating. Underplating: 80 μ′′ (2.0 μm) Nickel - QQ-N-290, Class 2 Wiping Area: 30 μ′′ (0.76 μm) Min Gold - MIL-G-45204, Type II, Grade C Solder Tails: See ordering information ... Labels: C521, RoHS |
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| 8. |  524.05 Kb • 4 Pages |
Abstract: ... : See ordering information Contact Material: Copper Alloy (C521) Plating. Underplating: See ordering information Wiping Area: See ordering information Solder Tails: See ordering information ... Labels: C521, RoHS |
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| 9. |  732.29 Kb • 30 Pages |
Abstract: ... Contact Material: Copper Alloy (C521) Plating Underplate: 80 μ, [2.0 μm] Nickel — QQ-N-290, Class 2 Wiping Area: 20 μ, [0.50 μm] Min Gold — MIL-G-45204, T ype II, Grade C Shroud and Latch Hook. Material ... Labels: C521, Application Notes |
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| 10. |  456.95 Kb • 29 Pages |
Abstract: ... Contact Material: Copper Alloy (C521) Plating Underplate: 80 μ, [2.0 μm] Nickel — QQ-N-290, Class 2 Wiping Area: 20 μ, [0.50 μm] Min Gold — MIL-G-45204, Type II, Grade C Shroud and Latch Hook. Material ... Labels: C521, Application Notes |
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