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C/RH85

Catalog Datasheet MFG & Type PDF Document Tags

Ultrasonic humidifier circuit

Abstract: land pattern for vsop 60 pins ) Twice Ta=125°C Pressure Cooker RH=85% Bias Test DC 20Hrs. Fig-1 HEATING TREATMENT , Storage Test Ta=­65°C 1000h 22 0/1 5 Temperature and Humidity Storage Test Ta=85°C RH=85 , 0/1 USPCBT Ta=125°C RH=85% 2 × 10 Pa DC=VDD (MAX.) 100h 11 0/1 USPCT Ta=125°C RH=85% 2 ×10 Pa 100h 11 0/1 Ta=260°C (dipping) 10s 11 0/1 Ta=350°C (only , Test Ta=125°C DC=VDD (MAX.) 1000h 32 0/1 2 Temperature and Humidity Bias Test Ta=85°C RH=85
Ricoh
Original
SC-82AB Ultrasonic humidifier circuit land pattern for vsop 60 pins quality MANUALS ultrasonic humidifiers land pattern for vsop 40KHZ ULTRASONIC ISO9001
Abstract: Storage at Ta=-65°C 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C Copyright © 2007 ROHM Co., Ltd. All rights reserved , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub ROHM
Original
BA00DD0W HRP5/TO220FP-3/TO220FP-5/TO220CP-V5

ba00cc0w

Abstract: TO252-3 Storage at Ta=-65°C 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C Copyright © 2007 ROHM Co., Ltd. All rights , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub
ROHM
Original
ba00cc0w TO252-3 BA00CC0W
Abstract: 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours , implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C ROHM
Original
BA4560R

BA3258FP

Abstract: BA3258HFP > Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure Cooker Storage at Ta=121°C , . Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85 , Soldering Heat Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat
ROHM
Original
BA3259HFP BA3258FP BA3258HFP

BA2901

Abstract: 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours , . Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C
ROHM
Original
BA2901
Abstract: Storage at Tstg min 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub ROHM
Original
BU7242 BU7242S

BA10393

Abstract: 100hours stress (IR reflow : peak 260°C) Resistance to Soldering Hea Soak into solder tub 260±3°C Temperature Cycling Tstg min (30min) / Tstg max (30min) Humidity Place at Ta=85°C / RH=85% Temperature Storage Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , >>Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h
ROHM
Original
BA10393 100hours

BA14741

Abstract: 1000hours Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure , after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C Temperature Cycling
ROHM
Original
BA14741

BA4558

Abstract: 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours , implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C
ROHM
Original
BA4558

BA10339

Abstract: Storage at Tstg min 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , /SSOP-B14. Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85 , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub
ROHM
Original
BA10339

BA15218 equivalent

Abstract: BA15218 1000hours Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure , after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , : peak 260°C) Resistance to Soldering Hea Soak into solder tub 260±3°C Temperature Cycling
ROHM
Original
BA15218 BA15218 equivalent

BA4580R

Abstract: 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours , implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C
ROHM
Original
BA4580R
Abstract: Storage at Tstg min 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , >> Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub ROHM
Original
BA2904
Abstract: Storage at Ta=-65°C Temperature Humidity Storage Place at Ta=85°C / RH=85% Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure , following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C Copyright , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C ROHM
Original
Abstract: > Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure Cooker Storage at Ta=121°C , , Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C Copyright © 2007 ROHM Co., Ltd , Soldering Heat Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat ROHM
Original
BA00JC5W
Abstract: > Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours 22×3 0 Pressure Cooker Storage at Ta=121°C , . Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C Copyright © 2007 ROHM Co., Ltd , Heat Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak ROHM
Original
Abstract: min Place at Ta=85°C / RH=85% Apply the specified voltage at Ta=85°C / RH=85% CONDITION 10sec 100cycles 1000hours 1000hours 1000hours 1000hours 1000hours Pressure Cooker Storage at Ta=121°C , implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Reflow, Peak=260°C , Humidity Bias Soldering heat stress (IR reflow : peak 260°C) Soak into solder tub 260±3°C Tstg min ROHM
Original
BA2115

BA2902

Abstract: 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85% 1000hours , >>Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h , heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub 260±3°C
ROHM
Original
BA2902
Abstract: Storage at Tstg min 1000hours 22×3 0 Temperature Humidity Storage Place at Ta=85°C / RH=85% 1000hours 22×3 0 Temperature Humidity Bias Apply the specified voltage at Ta=85°C / RH=85 , is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h Test is implemented after following preprocessing. Bake, Ta=125°C Soak, Ta=85°C / RH=85% / 168h , > Soldering heat stress (IR reflow : peak 260°C) Resistance to Soldering Heat Soak into solder tub ROHM
Original
BA3404
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