BU42G BU42F BU42FVE BU43G BU43F BU43FVE 09006ECT02 BU42G/F/FVE BU43G/F/FVE - Datasheet Archive

 

Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42G series, BU42F series, BU42FVE series, BU43G series,

 

Voltage Detector IC Series Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series No.09006ECT02 09006ECT02 Description ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. Features 1) Detection voltage from 0.9V to 4.8V in 0.1V increments 2) Highly accurate detection voltage: ±1.0% 3) Ultra-low current consumption 4) Nch open drain output (BU42G/F/FVE BU42G/F/FVE)and CMOS output (BU43G/F/FVE BU43G/F/FVE) 5) Small surface package SSOP5: BU42GBU43G BU42GBU43G SOP4: BU42FBU43F BU42FBU43F VSOF5: BU42FVEBU43FVE BU42FVEBU43FVE Applications All electronics devices that use microcontrollers and logic circuits. Selection Guide No. 2 2:Open Drain Output, 3:CMOS Output Detection Voltage Example VDET: Represented as 0.1V steps in the range from 0.9V to 4.8V (Displayed as 0.9 in the case of 0.9V) 1 Output Circuit Format Part Number : BU4 Specifications Package G:SSOP5(SMP5C2)/ F :SOP4/ FVE:VSOF5(EMP5) 3 Description Lineup Making Detection voltage Part Number Making Detection voltage Part Number Making Detection voltage Part Number Making Detection voltage Part Number ZR ZQ ZP ZN ZM ZL ZK ZJ ZH ZG ZF ZE ZD ZC ZB ZA YZ YY YX YW 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V BU4248 BU4248 BU4247 BU4247 BU4246 BU4246 BU4245 BU4245 BU4244 BU4244 BU4243 BU4243 BU4242 BU4242 BU4241 BU4241 BU4240 BU4240 BU4239 BU4239 BU4238 BU4238 BU4237 BU4237 BU4236 BU4236 BU4235 BU4235 BU4234 BU4234 BU4233 BU4233 BU4232 BU4232 BU4231 BU4231 BU4230 BU4230 BU4229 BU4229 YV YU YT YS YR YQ YP YN YM YL YK YJ YH YG YF YE YD YC YB YA 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V BU4228 BU4228 BU4227 BU4227 BU4226 BU4226 BU4225 BU4225 BU4224 BU4224 BU4223 BU4223 BU4222 BU4222 BU4221 BU4221 BU4220 BU4220 BU4219 BU4219 BU4218 BU4218 BU4217 BU4217 BU4216 BU4216 BU4215 BU4215 BU4214 BU4214 BU4213 BU4213 BU4212 BU4212 BU4211 BU4211 BU4210 BU4210 BU4209 BU4209 1H 1G 1F 1E 1D 1C 1B 1A 0Z 0Y 0X 0W 0V 0U 0T 0S 0R 0Q 0P 0N 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V BU4348 BU4348 BU4347 BU4347 BU4346 BU4346 BU4345 BU4345 BU4344 BU4344 BU4343 BU4343 BU4342 BU4342 BU4341 BU4341 BU4340 BU4340 BU4339 BU4339 BU4338 BU4338 BU4337 BU4337 BU4336 BU4336 BU4335 BU4335 BU4334 BU4334 BU4333 BU4333 BU4332 BU4332 BU4331 BU4331 BU4330 BU4330 BU4329 BU4329 0M 0L 0K 0J 0H 0G 0F 0E 0D 0C 0B 0A ZZ ZY ZX ZW ZV ZU ZT ZS 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V BU4328 BU4328 BU4327 BU4327 BU4326 BU4326 BU4325 BU4325 BU4324 BU4324 BU4323 BU4323 BU4322 BU4322 BU4321 BU4321 BU4320 BU4320 BU4319 BU4319 BU4318 BU4318 BU4317 BU4317 BU4316 BU4316 BU4315 BU4315 BU4314 BU4314 BU4313 BU4313 BU4312 BU4312 BU4311 BU4311 BU4310 BU4310 BU4309 BU4309 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*4 SSOP5 Power *2*4 SOP4 Dissipation *3*4 VSOF5 Operating Temperature Ambient Storage Temperature *1 *2 *3 *4 Symbol VDD-GND VOUT Pd Topr Tstg Technical Note Limits -0.3 ~ +7 GND-0.3 ~ +7 GND-0.3 ~ VDD+0.3 540 400 210 -40 ~ +125 -55 ~ +125 Unit V V mW °C °C When used at temperatures higher than Ta=25°C, the power is reduced by 5.4mW per 1°C above 25°C. When used at temperatures higher than Ta=25°C, the power is reduced by 4.0mW per 1°C above 25°C. When used at temperatures higher than Ta=25°C, the power is reduced by 2.1mW per 1°C above 25°C. When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted. Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Detection Voltage Symbol VDET Circuit Current when ON Idd1 Circuit Current when OFF Idd2 Operating Voltage Range Vopl `High' Output Current (Pch) IOH `Low' Output Current (Nch) Iol Leak Current when OFF `High' Output Current (Pch) Ileak Ioh CT pin Threshold Voltage Vcth Output Delay Resistance Rct CT pin Output Current Ict Detection Voltage Temperature coefficient Hysteresis Voltage Condition Min. Max. Vdet(T) ×0.99 Vdet(T) Vdet(T) ×1.01 0.70 0.90 2.0 20 1.0 3.6 1.7 2.0 Vdd ×0.35 Vdd ×0.40 9 5 200 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 4.0 100 3.3 6.5 0 0 3.4 4.0 Vdd ×0.45 Vdd ×0.50 10 40 400 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.1 1 Vdd ×0.55 Vdd ×0.60 11 - - ±30 - VDET1.0V Vdet ×0.03 Vdet ×0.05 Vdet ×0.08 VDET1.1V Vdet ×0.03 Vdet ×0.05 Vdet ×0.07 VDD=HL, Ta=25°C, RL=470k VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V VDD=VDET-0.2V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V VDD=VDET+2.0V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VOL0.4V, Ta=25~125°C, RL=470k VOL0.4V, Ta=-40~25°C, RL=470k VDS=0.5V VDD=6.0V VDET=4.0-4.8V VDS=0.05V VDD=0.85V VDS=0.5V VDD=1.5V VDET=1.7-4.8V VDS=0.5V VDD=2.4V VDET=2.7-4.8V VDD=VDS=7V Ta=-40~85°C VDD=VDS=7V Ta=85~125°C VDS=0.5V VDD=4.8V VDET=0.9-3.9V VDS=0.5V VDD=6.0V VDET=4.0-4.8V VDD=VDET×1.1, VDET=0.9-2.5V Ta=25°C RL=470k VDD=VDET×1.1, VDET=2.6-4.8V Ta=25°C RL=470k VDD=VDET×1.1 VCT=0.5V Ta=25°C VCT=0.1V VDD=0.85V VCT=0.5V VDD=1.5V VDET=1.7-4.8V *1 Vdet/T Ta=-40°C ~125°C VDET Limit Typ. VDD=LHL Ta=-40~125°C RL=470k Unit V µA µA V mA µA mA µA mA V M µA ppm/°C V *1: Designed guarantee. (Outgoing inspection is not done all products.) VDET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note Block Diagrams BU42G/F/FVE BU42G/F/FVE BU43G/F/FVE BU43G/F/FVE VDD VDD VOUT VOUT Vref Vref CT GND CT GND Fig.1 Fig.2 TOP VIEW TOP VIEW TOP VIEW SSOP5 SOP4 VSOF5 PIN No. Symbol Function PIN No. Symbol Function PIN No. Symbol Function 1 VOUT Reset output 1 GND GND 1 VOUT Reset output 2 VDD Power supply voltage 2 VDD Power supply voltage 2 SUB 3 GND GND 4 N.C. Unconnected terminal 5 CT Capacitor connection terminal for output delay time 3 CT 4 Capacitor connection terminal VOUT for output delay time 3 CT Substrate* Capacitor connection terminal for output delay time 4 VDD Power supply voltage 5 Reset output GND GND *Connect the substrate to VDD www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT IDD [A] 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 5 BU4216F BU4216F 4 3 2 VDD =1.2V 1 0 0.0 0.5 1.0 1.5 2.0 2.5 "HIGH" OUTPUT CURRENT IOH [mA] Reference Data (Unless specified otherwise, Ta=25°C) 25 BU4318G BU4318G 20 VDD =6.0V 15 VDD =4.8V 10 5 0 0 1 2 3 4 5 6 VDD SUPPLY VOLTAGE VDD [V] DRAIN-SOURCE VOLTAGE VDS[V] DRAIN-SOURCE VOLTAGE VDS[V] Fig.3 Circuit Current Fig.4 "LOW" Output Current Fig.5 "High" Output Current 5 4 3 2 1 0 0 1 2 3 4 5 6 BU4216F BU4216F 0.8 0.6 0.4 0.2 0.0 0.0 7 CT OUTPUT CURRENT ICT [A] 6 700 1.0 BU4216F BU4216F OUTPUT VOLTAGE VOUT [V] OUTPUT VOLTAGE VOUT [V] 7 0.5 1.0 1.5 2.0 BU4216F BU4216F 600 500 400 300 200 100 0 2.5 0 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE VDD [V] VDD SUPPLY VOLTAGE VDD [V] Fig.6 I/O Characteristics Fig.7 Operating Limit Voltage Fig.8 Ct Terminal Current Low to high(VDET+VDET) 1.5 High to low(VDET) BU4216F BU4216F 0 40 80 120 0.5 BU4216F BU4216F 0.4 0.3 0.2 0.1 0.0 -40 TEMPERATURE Ta[] 80 120 80 120 TEMPERATURE Ta[] Fig.12 Operating Limit Voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. RESISTANCE OF CT RCT [M] 0.5 40 0.6 0.4 0.2 0.0 -40 0 80 120 10000 BU4216F BU4216F 16 14 12 10 8 6 4 2 0 -40 40 Fig.11 Circuit Current when OFF 18 BU4216F BU4216F 0 BU4216F BU4216F 0.8 TEMPERATURE Ta[] Fig.10 Circuit Current when ON 1.0 MINIMUM OPERATING VOLTAGE V OPL[V] 40 1.0 TEMPERATURE Ta[] Fig.9 Detecting Voltage Release Voltage 0.0 -40 0 0 40 80 120 TEMPERATURE Ta[] Fig.13 Ct Terminal Circuit Resistance 4/11 BU4216F BU4216F 1000 DELAY TIME TPLH [ms] 1.0 -40 CIRCUIT CURRENT WHEN ON IDD1 [A] DETECTION VOLTAGE VDET[V] 2.0 CIRCUIT CURRENT WHEN OFF IDD2 [A] VDD SUPPLY VOLTAGE VDD [V] 100 10 1 0.1 0.01 0.001 0.0001 0.001 0.01 0.1 CAPACITANCE OF CT CCT[F] Fig.14 Delay Time (TPLH) and CT Terminal External Capacitance 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD TPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+VDET) VDD-VCTH TPLH=-1×CCT×RCT×ln CCT: RCT: VDD CT pin Externally Attached Capacitance CT pin Internal Impedance(P.2 RCT refer.) Ln: VCTH: CT pin Threshold Voltage(P.2 VCTH refer.) Natural Logarithm Reference Data of Falling Time (TPHL) Output Examples of Falling Time (TPHL) Output Part Number TPHL [µs] BU4245G BU4245G 275.7 BU4345G BU4345G 359.3 * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Explanation of Operation For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the Vdd pins reaches the applicable threshold voltage, the Vout terminal voltage switches from either "High" to "Low" or from "Low" to "High". BU42G/F/FVE BU42G/F/FVE and BU43G/F/FVE BU43G/F/FVE have delay time function which set TPLH (Output "Low""High") using an external capacitor (CCT). Because the BU42G/F/FVE BU42G/F/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD Q2 R1 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 VOUT Q1 Q3 Q3 R3 R3 GND GND CT Fig.15 (BU42 type internal block diagram) CT Fig.16 (BU43 type internal block diagram) Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until TPHL. There fore it is VDET+VDET possible that the reset signal is not outputted when the rise time of VDET VDD is faster than TPHL. VDD VOPL When VDD is greater than VOPL but less than the reset release 0V voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. 1/2 VDD If VDD exceeds the reset release voltage (VDET+VDET), then VOUT VCT switches from L to H (with a delay to the CT terminal). If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, TPLH TPHL TPLH VOUT switches to L (with a delay of TPHL). TPHL VOUT The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply Fig.17 fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note Circuit Applications 1) Examples of a common power supply detection reset circuit VDD1 VDD2 RL Microcontroller RST BU42 CIN CT CL (Capacitor for noise filtering) GND Fig.18 Open collector Output type VDD1 Application examples of BU42G/F/FVE BU42G/F/FVE series (Open Drain output type) and BU43G/F/FVE BU43G/F/FVE series (CMOS output type) are shown below. CASE1:The power supply of the microcontroller (Vdd2) differs from the power supply of the reset detection (Vdd1). Use the Open Drain Output Type (BU42G/FVE BU42G/FVE) attached a load resistance (RL) between the output and Vdd2. (As shown Fig.18) CASE2:The power supply of the microcontroller (Vdd1) is same as the power supply of the reset detection (Vdd1). Use CMOS output type (BU43G/FVE BU43G/FVE) or Open Drain Output Type (BU42G/FVE BU42G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.19) Microcontroller CIN CT When a capacitance CL for noise filtering is connected to the Vout pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (Vout). RST BU43 CL (Capacitor for noise filtering) GND Fig.19 CMOS Output type www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note 2) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from "High" to "Low" or vice versa.) V1 IDD R2 I1 R1 Through Current VDD BU42 BU43 CIN VOUT CL GND VDD VDET 0 Fig.20 A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from "Low" to "High". When the input voltage decreases and falls below the detection voltage, the output voltage switches from "High" to "Low". At this time, the through-current stops flowing through output "Low", and the voltage drop is eliminated. As a result, the output switches from "Low" to "High", which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. Consider the use of BU42 when the power supply input it with resistor dividers. VDD - IDD Peak Current Ta=25°C 10 0.1 0.01 VDD3V VDD6V VDD7V VDD4V 2.5 IDD peak Current[mA] 1 IDD-peak[mA] Temp - IDD(BU42xx) BU43xx BU42xx BD52xx BD53xx 2.0 1.5 1.0 0.5 0.0 0.001 3 4 5 6 7 VDD[V] 8 9 10 -50 -30 -10 10 30 50 Temp 70 90 110 130 Fig.21 Current Consumption vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note Notes for use 1. Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7 . The VDD line inpedance might cause oscillation because of the detection current. 8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. Case of needless Delay time, recommended to insert more 470k resister between VDD and CT. Recommended value of RL Resistar is over 50k (VDET=1.5~4.8V),over 100k (VDET=0.9~1.4V). 12. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by × RCT × CCT changes. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series 13. Technical Note Delay time (tPLH) tPLH = × RCT × CCT (sec) : time constant RCT : 10M (typ.) (built-in resistor) CCT : capacitor connected CT pin. Recommended value of CCT capacitor is over 100pF. The reference value 6 ( × RCT) ×10 VDET = 0.9 to 2.5V 6 6 6 Ta = 25°C (min. = 5.1 × 10 typ.= 6.0 × 10 max = 6.9 × 10 ) 6 6 6 Ta = -25 to 125°C (min. = 3.3 × 10 typ. = 6.0 × 10 max = 8.7 × 10 ) VDET = 2.6 to 4.8V 6 6 6 Ta = 25°C (min. = 5.9 × 10 typ.= 6.9 × 10 max = 7.9 × 10 ) 6 6 6 Ta = -25 to 125°C (min. = 3.8 × 10 typ.= 6.9 × 10 max = 10.0 × 10 ) 14. External parameters The recommended parameter range for CT is 100pF~0.1µF. For RL, the recommended range is 50k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 15. CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 16. Power on reset operation Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation. 17. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 18. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/11 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note Part Number Selection B U 4 2 0 BU42: Adjustable Delay Time CMOS Reset IC Open Drain Type Output Type BU43: Adjustable Delay Time CMOS Reset IC CMOS Output Type 9 G Detection voltage 09 : 0.9V (0.1V step) 48 : 4.8V Package G: SSOP5 F: SOP4 FVE: VSOF5 T R Taping Specifications TR: Embossed tape and reel SSOP5 5 Tape 2 0.2Min. 1 3 Embossed carrier tape Quantity 4 +0.2 1.6 -0.1 2.8±0.2 +6° 4° -4° 2.9±0.2 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 -0.03 +0.05 0.42 -0.04 0.05±0.05 1.1±0.05 1.25Max. ) 0.95 0.1 Direction of feed Reel (Unit : mm) Order quantity needs to be multiple of the minimum quantity. SOP4 1.3 4 Tape 3 0.9±0.05 2.1±0.2 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 2 0.05 +0.05 0.13 ­0.03 1pin S 0.05±0.05 1.05Max. 1 Embossed carrier tape Quantity +6° 4° ­4° 0.27±0.15 +0.2 1.25 ­0.1 2.0±0.2 +0.05 0.42 ­0.04 0.1 S +0.05 0.32 ­0.04 Direction of feed (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 10/11 Order quantity needs to be multiple of the minimum quantity. 2009.11 - Rev.C BU42G BU42G series, BU42F BU42F series, BU42FVE BU42FVE series, BU43G BU43G series, BU43F BU43F series, BU43FVE BU43FVE series Technical Note VSOF5 1.2 ± 0.05 1.6 ± 0.05 4 (MAX 1.28 include BURR) 5 0.2MAX 1.6±0.05 1.0±0.05 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin 1 2 3 0.6MAX 0.13±0.05 0.5 Direction of feed 0.22±0.05 (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 11/11 Order quantity needs to be multiple of the minimum quantity. 2009.11 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A R0039A