BSC205N10LS IEC61249-2-21 205N10LS J-STD20 JESD22

OptiMOSTM2 Power-Transistor Product Summary Features V DS · Excellent gate charge x R DS(on) product (FOM) V R DS(on),max

BSC205N10LS BSC205N10LS G OptiMOSTM2 Power-Transistor Product Summary Features V DS · Excellent gate charge x R DS(on) product (FOM) V R DS(on),max · N-channel, logic level 100 20.5 m ID 45 A · Very low on-resistance R DS(on) PG-TDSON-8 · 150 °C operating temperature · Pb-free lead plating; RoHS compliant · Qualified according to JEDEC1) for target application · Ideal for high-frequency switching and synchronous rectification · Halogen-free according to IEC61249-2-21 IEC61249-2-21 Type Package Marking BSC205N10LS BSC205N10LS G PG-TDSON-8 205N10LS 205N10LS Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C 45 T C=100 °C Unit 29 T A=25 °C, R thJA=50 K/W 2) A 7.4 Pulsed drain current3) I D,pulse T C=25 °C 180 Avalanche energy, single pulse E AS I D=45 A, R GS=25 60 mJ Gate source voltage V GS ±20 V Power dissipation P tot 76 W Operating and storage temperature T j, T stg -55 . 150 °C T C=25 °C IEC climatic category; DIN IEC 68-1 Rev. 2.08 55/150/56 page 1 2009-11-04 BSC205N10LS BSC205N10LS G Parameter Values Symbol Conditions Unit min. typ. max. bottom - - 1.6 top - - 18 minimal footprint - - 62 6 cm2 cooling area 2) - - 50 100 - - 1.2 1.85 2.4 Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient R thJC R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA Gate threshold voltage V GS(th) V DS=V GS, I D=43 µA Zero gate voltage drain current I DSS V DS=100 V, V GS=0 V, T j=25 °C - 0.01 1 V DS=100 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 1 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=23 A - 20.5 28 m V GS=10 V, I D=45 A - 16.9 20.5 - 1 - 36 72 - S Gate resistance RG Transconductance g fs 1) |V DS|>2|I D|R DS(on)max, I D=45 A J-STD20 J-STD20 and JESD22 JESD22 2) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 3) see figure 3 Rev. 2.08 page 2 2009-11-04 BSC205N10LS BSC205N10LS G Parameter Values Symbol Conditions Unit min. typ. max. - 2200 2900 - 270 360 Dynamic characteristics Input capacitance C iss Output capacitance C oss Reverse transfer capacitance C rss - 17 - Turn-on delay time t d(on) - 14 - Rise time tr - 24 - Turn-off delay time t d(off) - 30 - Fall time tf - 4 - Gate to source charge Q gs - 8 - Gate to drain charge Q gd - 5 - - 9 - V GS=0 V, V DS=50 V, f =1 MHz V DD=50 V, V GS=10 V, I D=25 A, R G=1.6 pF ns Gate Charge Characteristics 4) V DD=50 V, I D=25 A, V GS=0 to 10 V nC Switching charge Q sw Gate charge total Qg - 31 41 Gate plateau voltage V plateau - 3.5 - Output charge Q oss - 28 37 nC - - 45 A - - 180 - 1 1.2 V - 86 - ns - 238 - nC V DD=50 V, V GS=0 V V Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr 4) T C=25 °C V GS=0 V, I F=45 A, T j=25 °C V R=50 V, I F=25 A, di F/dt =100 A/µs See figure 16 for gate charge parameter definition Rev. 2.08 page 3 2009-11-04 BSC205N10LS BSC205N10LS G 1 Power dissipation 2 Drain current P tot=f(T C) I D=f(T C); V GS10 V 80 50 40 60 I D [A] P tot [W] 30 40 20 20 10 0 0 0 40 80 120 160 0 40 80 T C [°C] 120 160 10-2 10-1 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 103 101 1 µs 10 µs 102 100 µs 0.5 100 10 1 Z thJC [K/W] I D [A] 1 ms 10 ms DC 10 0.1 0.05 10-1 0.02 0.01 0 single pulse 10-1 10 10-2 -1 10 0 10 1 10 2 10 3 V DS [V] Rev. 2.08 0.2 10-5 10-4 10-3 t p [s] page 4 2009-11-04 BSC205N10LS BSC205N10LS G 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 35 160 10 V 3.5 V 30 4V 7.5 V 120 4.5 V 25 6V R DS(on) [m] I D [A] 4.5 V 80 7.5 V 20 10 V 15 4V 10 40 3.5 V 5 3.2 V 0 0 0 1 2 3 4 0 5 50 100 V DS [V] 150 I D [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 160 120 100 120 g fs [S] I D [A] 80 80 60 40 40 20 150 °C 25 °C 0 0 0 2 4 6 Rev. 2.08 0 20 40 60 80 100 I D [A] V GS [V] page 5 2009-11-04 BSC205N10LS BSC205N10LS G 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=45 A; V GS=10 V V GS(th)=f(T j); V GS=V DS parameter: I D 45 3 40 2.5 35 2 25 V GS(th) [V] R DS(on) [m] 30 98 % 20 typ 430 µA 43 µA 1.5 15 1 10 0.5 5 0 0 -60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 104 1000 Ciss 103 100 25 °C I F [A] C [pF] Coss 102 150 °C, 98% 150 °C 25 °C, 98% 10 Crss 101 1 0 20 40 60 80 Rev. 2.08 0 0.5 1 1.5 2 V SD [V] V DS [V] page 6 2009-11-04 BSC205N10LS BSC205N10LS G 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 V GS=f(Q gate); I D=25 A pulsed parameter: T j(start) parameter: V DD 100 10 8 80 V 100 °C 10 50 V 6 V GS [V] I AS [A] 25 °C 125 °C 20 V 4 2 0 1 1 10 100 0 1000 10 20 30 Q gate [nC] t AV [µs] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 110 V GS Qg V BR(DSS) [V] 105 100 V g s(th) 95 Q g(th) Q sw Q gs 90 -60 -20 20 60 100 140 Q g ate Q gd 180 T j [°C] Rev. 2.08 page 7 2009-11-04 BSC205N10LS BSC205N10LS G Package Outline: PG-TDSON-8 Rev. 2.08 page 8 2009-11-04 BSC205N10LS BSC205N10LS G Dimensions in mm Rev. 2.08 page 9 2009-11-04 BSC205N10LS BSC205N10LS G Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.08 page 10 2009-11-04