NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| BGA6489 | NXP Semiconductors | RF/Microwave Amplifier, 850 MHz - 2500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SC-62, TO-243, SOT-89, 3 PIN | 
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| BGA6489,135 | NXP Semiconductors | RF/Microwave Amplifier, 850 MHz - 2500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SC-62, TO-243, SOT-89, 3 PIN |
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| LS-BGA64E-41 | Ironwood Electronics | BGA-01 Land Socket Adapters (Male); Top Package Code: 64E; Bottom Package Code: 64E; Top Pitch (mm): 1; Bottom Pitch (mm): 1; Top Pin Count: 64; Bottom Pin Count: 64; Top Array Size: 8 x 8; Bottom Array Size: 8 x 8; Top Interface: SMT Lands; Bottom Interface: Machined Pins; Compatible Part 1: SF-BGA64E-B-42; Part Description: BGA Land Socket; |
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| LS-BGA64F-61 | Ironwood Electronics | BGA Land Socket Adapters (Male); Top Pin Count: 64; Bottom Pitch (mm): 0.8; Top Array Size: 8 x 8; Compatible Part 1: SF-BGA64F-B-62; Top Package Code: 64F; Bottom Package Code: 64F; Top Pitch (mm): 0.8; Bottom Pin Count: 64; Bottom Array Size: 8 x 8; Top Interface: SMT Lands; Bottom Interface: Machined Pins; Part Description: BGA Male SMT Foot -- LIF; |
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| SF-BGA64E-B-11 | Ironwood Electronics | Surface Mount Feet: BGA (Male); Part Description: BallOnPinFoot; Top Pin Count: 64; Top Pitch (mm): 1; Top Array Size: 8 x 8; Compatible Part 1: SK-UGA8/64A-01; Bottom Package Code: BGA64E; |
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| Part | Manufacturer | Description | Type | Ordering |
| BGA6489 | NXP Semiconductors / Philips Semiconductors | MMIC wideband medium power amplifier - @: 0.9 GHz; 1dB Compression point: 20 dBm; Gain: 20 dB; I<sub>s</sub>: 78 mA; NF: 3.1 dB; Output IP3 (3rd order Intercept Point): 33 dBm; Ptot max: 480 mW; Remarks: MMIC wideband medium power amplifier ; V<sub>s</sub>: 8.0 V |
13 pages, |
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| BGA6489 | Philips Semiconductors / NXP Semiconductors | MMIC wideband medium power amplifier |
12 pages, |
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| BGA6489,135 | NXP Semiconductors / Philips Semiconductors | MMIC wideband medium power amplifier - @: 0.9 GHz; 1dB Compression point: 20 dBm; Gain: 20 dB; I<sub>s</sub>: 78 mA; NF: 3.1 dB; Output IP3 (3rd order Intercept Point): 33 dBm; Ptot max: 480 mW; Remarks: MMIC wideband medium power amplifier ; V<sub>s</sub>: 8.0 V; Package: SOT89 (MPT3; UPAK); Container: Tape reel smd |
13 pages, |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: AE-B64-NM2 AE-B64-NM2 Page 1 of 2 AE-B64-NM2 AE-B64-NM2 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 10.0 x 8.0 x 1.2 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 BGA-64 D5,D6 B8 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 11 11 1 D4 ... | Original |
2 pages, |
DIP-40 74HC573 DATASHEET 74HC573 BGA64 AE-B64-NM2 DIP40/BGA64 AE-B64-NM2 abstract |
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| Abstract: AE-B56-SP1 AE-B56-SP1 Page 1 of 2 AE-B56-SP1 AE-B56-SP1 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 9.0 x 7.0 x 1.2 mm, 0.8 mm pitch Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 2 3 11 11 1 4 B4 5 6 7 A5 8 C4 9 A4 10 A2 11 B2 12 C2 13 D2 14 B1 15 C1 16 D1 17 E1 18 ... | Original |
2 pages, |
DIP-40 BGA64 74HC573 DATASHEET 74HC573 AE-B56-SP1 DIP40/BGA64 AE-B56-SP1 abstract |
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| Abstract: AE-B64-SP1 AE-B64-SP1 Page 1 of 2 AE-B64-SP1 AE-B64-SP1 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 13.0 x 11.0 x 1.4 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 D8,F1 2 G1 3 11 11 1 4 B5 5 F8 6 G8 7 A5 8 A4 9 B4 10 A3 11 C3 12 D3 13 B2 14 ... | Original |
2 pages, |
DIP-40 74HC573 BGA64 AE-B64-SP1 DIP40/BGA64 AE-B64-SP1 abstract |
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| Abstract: AE-B64-NM3 AE-B64-NM3 Page 1 of 2 AE-B64-NM3 AE-B64-NM3 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 10.0 x 8.0 x 1.2 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 D5,D6,G4 2 3 11 11 1 4 D4 5 B6 6 B8 7 G8 8 E8 9 A4 10 A3 11 C2 12 A2 13 D2 14 D1 15 C1 ... | Original |
2 pages, |
BGA64 74HC573 DIP-40 AE-B64-NM3 DIP40/BGA64 AE-B64-NM3 abstract |
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| Abstract: AE-B64-SP3 AE-B64-SP3 Page 1 of 2 AE-B64-SP3 AE-B64-SP3 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 11.6 x 8.0 x 1.2 mm, 0.8 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 2 3 11 11 1 4 D5 5 6 7 C6 8 E5 9 C5 10 C3 11 D3 12 E3 13 F3 14 D2 15 E2 16 F2 ... | Original |
2 pages, |
DIP-40 BGA64 74HC573 AE-B64-SP3 DIP40/BGA64 AE-B64-SP3 abstract |
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| Abstract: AE-B64-SP5 AE-B64-SP5 Page 1 of 2 AE-B64-SP5 AE-B64-SP5 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 9.0 x 9.0 x 1.4 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 D8,F1 2 G1 3 11 11 1 4 B5 5 F8 6 G8 7 A5 8 A4 9 B4 10 A3 11 C3 12 D3 13 B2 14 ... | Original |
2 pages, |
DIP-40 74HC573 AE-B64-SP5 DIP40/BGA64 AE-B64-SP5 abstract |
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| Abstract: AE-B64-SP4 AE-B64-SP4 Page 1 of 2 AE-B64-SP4 AE-B64-SP4 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 13.0 x 10.0 x 1.2 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 BGA-64 G4 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 11 11 1 D4 G8 B8 ... | Original |
2 pages, |
DIP-40 74HC573 AE-B64-SP4 DIP40/BGA64 AE-B64-SP4 abstract |
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| Abstract: AE-B64-MX2 AE-B64-MX2 Page 1 of 2 AE-B64-MX2 AE-B64-MX2 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 13.0 x 10.0 x 1.2 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 BGA-64 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 1 D8,F1 2 G1 3 11 11 1 4 B5 5 F8 6 G8 7 A5 8 A4 9 B4 10 A3 11 C3 12 D3 13 B2 14 ... | Original |
2 pages, |
DIP-40 BGA64 74HC573 AE-B64-MX2 DIP40/BGA64 AE-B64-MX2 abstract |
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| Abstract: AE-B64-SP2 AE-B64-SP2 Page 1 of 2 AE-B64-SP2 AE-B64-SP2 DIP40/BGA64 specialized adapter for FLASH memory. Device package dimensions: 13.0 x 10.0 x 1.2 mm, 1.0 mm pitch. Click the programmer model below to get an appropriate list of the devices supported by the adapter: ChipProg+ ChipProg-40 ChipProg-48, ChipProg-G4 Adapter Connection Table: DIP-40 DIP-40 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 BGA-64 D5,D6 B8 U1, 74HC573 74HC573 U2, 74HC573 74HC573 C1, 150pF C2, 0.1uF 11 11 1 D4 ... | Original |
2 pages, |
DIP-40 74HC573 AE-B64-SP2 DIP40/BGA64 AE-B64-SP2 abstract |
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| Abstract: TQFP64 TQFP64 TQFP64a SOIC28 SOIC28 PLCC44 PLCC44 PLCC44 PLCC44 QFN64 QFN64 QFN64 QFN64 QFN64 QFN64 PLCC28 PLCC28 BGA64 BGA64 BGA64(3) BGA64(3) BGA64(3) 1Q/06 1Q/06 4Q/05 4Q/05 Now TQFP32 TQFP32 TQFP64 TQFP64 PLCC52 PLCC52 Availability ... | Original |
6 pages, |
ATA6660 AT90CAN128 at90can128 SPI code example AT90CAN32 AT90CAN64 Atmel 8051 Architecture BGA64 CANopen EMBEDDED C programming for atmel 128 T89C51CC01 AT6660 can interfacing atmel jtag ice mkII AT6660 datasheet abstract |
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| Abstract: Ball Grid Array (FBGA) 64 Balls, 7x7mm, 11x11 Pattern SYMBOL A A1 A2 A3 b D D1 E E1 e MIN. 1.00 0.165 0.16 0.675 0.25 MILLIMETER NOM. 1.10 0.20 0.20 0.70 0.30 7.00 BSC 5.00 BSC 7.00 BSC 5.00 BSC 0.50 BSC MAX. 1.20 0.235 0.24 0.725 0.35 MIN. 0.039 0.006 0.006 0.027 0.010 INCH* NOM. 0.043 0.008 0.008 0.028 0.012 .276 BSC .197 BSC .276 BSC .197 BSC .0197 BSC MAX. 0.047 0.009 0.009 0.029 0.014 * For Reference Only. Controll ... | Original |
1 pages, |
MO-195 11x11 11x1 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| SCANH16602 SCANH16602 SCANH16602 SCANH16602 : entity is PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N:C8, OEBA1:F1 www.datasheetarchive.com/files/national/scanh166.bsd |
National | 25/02/2004 | 5.9 Kb | BSD | scanh166.bsd |
| SCANH162602 SCANH162602 SCANH162602 SCANH162602 : entity is PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N:C8, OEBA1:F1 www.datasheetarchive.com/files/national/scanh163.bsd |
National | 25/02/2004 | 5.91 Kb | BSD | scanh163.bsd |
| SCANH162512 SCANH162512 SCANH162512 SCANH162512 : entity is PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N www.datasheetarchive.com/files/national/scanh162.bsd |
National | 25/02/2004 | 6.11 Kb | BSD | scanh162.bsd |
| PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N:C8, OEBA1_N:F1, OEBA2_N:F8 www.datasheetarchive.com/files/national/scanh165.bsd |
National | 25/02/2004 | 6.1 Kb | BSD | scanh165.bsd |
| PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N:C8, OEBA1_N:F1, OEBA2_N:F8 www.datasheetarchive.com/files/national/scan1651.bsd |
National | 25/02/2004 | 6.09 Kb | BSD | scan1651.bsd |
| PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64 www.datasheetarchive.com/files/national/scan1660.bsd |
National | 25/02/2004 | 5.88 Kb | BSD | scan1660.bsd |
| SCAN162602 SCAN162602 SCAN162602 SCAN162602 : entity is PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N:C8, OEBA1:F1 www.datasheetarchive.com/files/national/scan1626.bsd |
National | 25/02/2004 | 5.9 Kb | BSD | scan1626.bsd |
| SCAN162512 SCAN162512 SCAN162512 SCAN162512 : entity is PHYSICAL_PIN_MAP; - BGA_64_BALL identifies each pin as a "BALL" identifier constant BGA_64_BALL:PIN_MAP_STRING:= "OEAB1_N:C4, OEAB2_N www.datasheetarchive.com/files/national/scan1625.bsd |
National | 25/02/2004 | 6.1 Kb | BSD | scan1625.bsd |
| BGA64 | |[Description] BGA64 from dwg. SOT 744AA1 744AA1 744AA1 744AA1 |[Number Of Pins] 56 | [Package www.datasheetarchive.com/files/nxp/misc/support/models/cbt/ibis/cbtv4010.ibs |
NXP | 01/07/2006 | 20.05 Kb | IBS | cbtv4010.ibs |
| Number Speed Package 128K x 24 7MMV4101 7MMV4101 7MMV4101 7MMV4101 10ns 119 BGA 64K x 16 x 2 7MMV4103 7MMV4103 7MMV4103 7MMV4103 10ns 121 BGA Specialty Memory www.datasheetarchive.com/download/64966214-137418ZC/wcd00395.ppt |
IDT | 23/12/1999 | 1047.5 Kb | PPT | wcd00395.ppt |