BGA54C FR4/G10 LS-BGA54C-61 BOX21151

BGA54C 3.75mm [0.148"] See BGA pattern code to the right for actual pattern layout Y 6.00mm [0.236"] 0.75mm typ. Top

Tooling hole (X2) BGA54C BGA54C 3.75mm [0.148"] See BGA pattern code to the right for actual pattern layout Y 6.00mm [0.236"] 0.75mm typ. Top View (reference only) X Ø 0.41mm [Ø 0.016"] 3.52mm [0.139"] BGA pad 1.93mm [0.076"] 1 0.20mm [0.008"] dia. Top View of Land Pattern Scale: 2:1 2 Side View (reference only) 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Pin Count 54 Array Size 6x9 Pitch 0.75mm Adapter Perimeter (XxY) 5.25mm [0.207"] x 7.50mm [0.295"] Description: Land Socket. 54 position 0.75mm pitch BGA SMT land pattern to male pins. LS-BGA54C-61 LS-BGA54C-61 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX21151 BOX21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: N/A Rev: A Drawing: H. Hansen Date: 11/4/05 File: LS-BGA54C-61 LS-BGA54C-61 Dwg Modified: Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.