BGA-352P-M08 BGA352010SC-1-1 - Datasheet Archive

 

FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M08 352-pin plastic TAB-BGA Lead pitch 0.80 mm Package width ×

 

TAB BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M08 BGA-352P-M08 352-pin plastic TAB-BGA Lead pitch 0.80 mm Package width × package length 23.00 × 23.00 mm Lead shape Ball Sealing method Resin seal Mounting height 1.20 mm Max (BGA-352P-M08 BGA-352P-M08) 352-pin plastic TAB-BGA (BGA-352P-M08 BGA-352P-M08) Note: The actual shape of coners may differ from the dimension. 23.00±0.10(.906±.004)SQ 352-Ø0.45±0.15 (352-Ø.018±.006) 22.40±0.20(.882±.008)SQ Ø0.30(.012) M S AB 1.50(.059) B 1.50(.059) INDEX A 20.00±0.20 (.787±.008) 0.40(.016) 0.80±0.20 (.031±.008) 0.125±0.035 (.005±.001) 0.60±0.16 (.024±.006) 1.00±0.20 (.039±.008) S 0.20(.008) S C 1998 FUJITSU LIMITED BGA352010SC-1-1 BGA352010SC-1-1 0.25(.010) MIN 0.80±0.20 (.031±.008) 0.40(.016) 20.00±0.20(.787±.008) 0.40±0.10 (.016±.004) Dimensions in mm (inches). The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 9811