NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| DC-QFP/BGA-95XX-S-B-01 | Ironwood Electronics | Device Conversion Adapters; Top Pin Count: 325; Bottom Pin Count: 325; Top Interface: QFP: Altera MAX 9320; Bottom Interface: BGA: Xilinx XC95XX; Device Specific: yes; Compatible Part 1: SF-BGA352A-B-01; Part Description: Device Converter; | 
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| PC-BGA/QFP-ALDC-F-01 | Ironwood Electronics | Miscellaneous Package Converters; Top Package Code: BGA361; Bottom Package Code: QFP304SA; Top Pitch (mm): Bottom Pitch (mm): Top Pin Count: 361; Bottom Pin Count: 304; Top Interface: BGA; Bottom Interface: QFP; Compatible Part 1: N/A; Compatible Part 2: N/A; Device Specific: yes; Devices Supported: IMB ALDC; Part Description: Package Converter; |
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| PC-BGA/QFP-ALDC-G-01 | Ironwood Electronics | Miscellaneous Package Converters; Top Package Code: BGA361; Bottom Package Code: QFP304SA; Top Pitch (mm): Bottom Pitch (mm): Top Pin Count: 361; Bottom Pin Count: 304; Top Interface: BGA; Bottom Interface: QFP; Compatible Part 1: N/A; Compatible Part 2: N/A; Device Specific: yes; Devices Supported: IMB ALDC; Part Description: Package Converter; |
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| PC-BGA/QFP-SX72A-S-01 | Ironwood Electronics | Miscellaneous Package Converters; Top Package Code: BGA484F; Bottom Package Code: QFE256SC; Top Pitch (mm): Bottom Pitch (mm): Top Pin Count: 484; Bottom Pin Count: 256; Top Interface: BGA; Bottom Interface: QFP; Compatible Part 1: N/A; Compatible Part 2: N/A; Device Specific: yes; Devices Supported: Actel A54SX72A; Part Description: Package Converter; |
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| PC-BGA/QFP-SX32A-S-01 | Ironwood Electronics | Miscellaneous Package Converters; Top Package Code: BGA484F; Bottom Package Code: QFE256SC; Top Pitch (mm): Bottom Pitch (mm): Top Pin Count: 484; Bottom Pin Count: 256; Top Interface: BGA; Bottom Interface: QFP; Compatible Part 1: N/A; Compatible Part 2: N/A; Device Specific: yes; Devices Supported: Actel A54SX32A; Part Description: Package Converter; |
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| Part | Manufacturer | Description | Type | Ordering |
| BGA and QFP Package | Altera Corporation | CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices |
2 pages, |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: CUSTOMER ADVISORY ADV0505 ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change , as an additional shipping tray for various BGA and QFP packaged devices. The new Daewon tray dimensions are comparable to the existing Peak trays and have been fully qualified by Altera. However, Daewon and Peak trays cannot be stacked together and should be handled separately. Each Altera shipping , products to ensure availability and sourcing flexibility. Products Affected: Table 1 Â Package and ... | Original |
2 pages, |
altera bga trays daewon 1420 bga Shipping Trays fbga100 dimension fbga100 Shipping Trays 1f1-1717-a19 FBGA672 33 x 33 DAEWON tray FBGA256 BGA652 QFP Shipping Trays 12C-0707-E19 ADV0505 ADV0505 abstract |
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| Abstract: ) Fine-pitch BGA package mouning pad dimension examples are added. APPENDIX (1) Fine-pitch BGA package daisy-chain wiring diagrams are added. (2) Reworking conditions of BGA package are added. (3) PWB layout is , . 164 A.5 Reference Example of Reworking Conditions of BGA Package , expected that surface mount packages, such as QFP and SOP, which are more suitable for surface mounting , , are increasingly incorporating slimmer package, more pins, and finer pin pitch, and surface mount type ... | Original |
171 pages, |
NIHON SMD MARKING codes EDR-7313 uPC451g 7313 28 pin TRANSISTOR SMD MARKING CODE MP TRANSISTOR SMD MARKING CODE 352 08172 smd transistor 1p7 smd code marking NEC rma390dh3 MBB mini relay Ultrasonic humidifier circuit 1.6/SmD TRANSISTOR av C10535EJ9V0IF00 C10535EJ9V0IF00 abstract |
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| Abstract: Edition Page Chapter 1 Revised points (1) BGA package mounting pad dimension examples are added. , Appendix (1) BGA package daisy-chain wiring diagrams are added. (2) Plastic-BGA socket product , , but it is expected that surface mount packages, such as QFP and SOP, which are more suitable for , package, more pins, and finer pin pitch, and surface mount type semiconductor devices (SMDs) (surface , IC 75 Flip Chip 75 & CSP COB & TAB 50 50 SOP, TSOP & other SMT QFP 25 BGA 25 ... | Original |
154 pages, |
Cu6Sn5 PP7F transistor smd marking 2a1 smd code marking NEC SMD BGA 672 DRAWING S225S GE4F GE2 TRANSISTOR smd code marking NEC g sealed relay ge mil 7451 SMD 6PIN IC MARKING CODE C10535EJ8V0IF00 C10535EJ8V0IF00 abstract |
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| Abstract: J-leaded package) Surface mount QFP (Quad Flat Package) Quadruple sides LQFP (Low profile , MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION BGA PACKAGE [Mounting Method , (Cavity Down Type) FBGA(Fine pitch BGA) M-CSP(MoldChip Scale Package) TCP PACKAGE Surface , MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE CLASSIFICATION 2. IC PACKAGE CLASSIFICATION The following pages classify Mitsubishi Packages by the sealing method and the mounting method. The ... | Original |
4 pages, |
integrated circuit BGA and QFP Package mounting datasheet abstract |
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| Abstract: Drawings Plastic DIP Package - PD8 11 0-29 R Package Drawings SOIC and TSOP Packages - SO8 , Scale Package - CS280 CS280 280-BALL 280-BALL CHIP SCALE BGA (CS280 CS280) 0-36 Package Drawings 0 R Package , Drawings 0 R Package Drawings BGA Packages - BG225 BG225 11 0-43 R Package Drawings BGA Packages - BG256 BG256 0-44 R Package Drawings BGA Packages - BG352 BG352, BG432 BG432 11 0-45 R Package Drawings BGA Packages - BG560 BG560 0-46 Package Drawings 0 R Package Drawings Ceramic ... | Original |
33 pages, |
vo8 diode BG352 CS144 CS280 CS48 HT144 packages pc44 PC84 SOIC package SO20 PQ304 plcc how package fg676 BGA and QFP Package datasheet abstract |
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| Abstract: Capabilities · 0.3mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, QFN, QFP, SOIC · 3000 pin count · , 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip replacement , 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 5000 pin count · Heat sink options · Easy chip , BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, QFN, LGA LGA, QFN BGA, LGA, QFN, QFP , ) Capabilities · 0.5mm to 1.27mm pitch · 2x3mm to 50x50mm device · BGA, LGA, QFN, QFP, SOIC · 2000 pin count ... | Original |
10 pages, |
8 soic pcb footprint bga socket QFP 0.3mm pitch particle QFP lead pitch 0.3mm datasheet abstract |
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| Abstract: susceptibility to coplanarity issues and easier PCB signal routing under a BGA package (see Figure 14-1). The , to see and may require higher resolution equipment. Figure 14-1. Misalignment of BGA Balls vs. QFP , 2009 01.5 Updated BGA Board Layout Recommendations table and BGA Package Types table for 0.4 mm , considerations when working with BGA packages. It outlines some of the most common problems and provides tips for avoiding them at the design stage. Advantages and Disadvantages of BGA Packaging One of the ... | Original |
4 pages, |
ultra fine pitch BGA FPBGA BGA NSMD ball ball grid array image solder mask FTBGA TN1074 TN1074 abstract |
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| Abstract: from each package body in two directions, and can be mounted flat. The standard lead pitch is 1.27 mm , thin SOPs with a package L-Leaded mounting height of less than 1.27 mm, and are suited to ultra-thin , Heat Sink Quad Flat L-Leaded Package with Heat Spreader QFP packages are characterized by gull-wing type leads which are drawn out from each package body in four directions, and can be mounted , package body fixed. QFP packages with a heat sink.(for high power device) QFP packages with built-in ... | Original |
4 pages, |
ceramic QFP Package 100 lead BGA and QFP Package mounting BGA 256 PACKAGE power dissipation datasheet abstract |
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| Abstract: issues and easier PCB signal routing under a BGA package (see Figure 1). Figure 1. Misalignment of , ispANALYZERTM software utility to provide full accessibility and testability to the PLD in a BGA package. The , in switching from QFP to BGA package use can be overcome. BGA packages are tolerant to misalignment , considerations when working with BGA packages. It outlines some of the most common problems and provides tips , the entire pad) are more difficult to see and may require higher resolution equipment. BGA ... | Original |
3 pages, |
hot air bga wicked popular nsmd smd BGA and QFP Package "x-ray machine" datasheet abstract |
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| Abstract: pins: 176 QFP Installation height: (1.20 mm < x 1.70 mm) Plastic package Example 2: Body: 17mm x , in body and the like) Pin pitch: 0.80 mm Number of pins: 256 BGA Installation height: (1.20 mm , Renesas Package Code Notation The overall structure of the package code is as follows. Ã- Ã- Ã-Ã- , common rules; this code is used to identify lead shape and the like) Appearance identification code (1 alphanumeric character; sequential) (No general common rules; this code is used to identify body shape and the ... | Original |
2 pages, |
LQFP176 alphanumeric display 2 character datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| PATH, SERVER QFP Contact Local Distributor FW82452KX FW82452KX FW82452KX FW82452KX SU029 SU029 SU029 SU029 BGA PACKAGE OMC DATA PATH, DESKTOP BGA .31 FW82454GX FW82454GX FW82454GX FW82454GX BGA PACKAGE, PCI BRIDGE SERVER BGA $248.34 S82454GX S82454GX S82454GX S82454GX PCI BRIDGE, SERVER SQFP PACKAGE QFP PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB S82375EB S82375EB QFP PACKAGE, PCI TO ORDER S Z868 QFP $10.55 82424ZX 82424ZX 82424ZX 82424ZX : CACHE AND DRAM CONTROLLER S82424ZX S82424ZX S82424ZX S82424ZX QFP PKG, CACHE ACCELERATOR S82433LX S82433LX S82433LX S82433LX QFP PACKAGE, LBX FOR MERCURY CHIPSET,SZ942 SZ942 SZ942 SZ942 QFP $13.55 S82433NX S82433NX S82433NX S82433NX LBX FOR NEPTUNE QFP www.datasheetarchive.com/files/intel/products/design/pricelst/ccom2.htm |
Intel | 23/10/1996 | 7.65 Kb | HTM | ccom2.htm |
| , SERVER QFP Contact Local Distributor FW82452KX FW82452KX FW82452KX FW82452KX SU029 SU029 SU029 SU029 BGA PACKAGE OMC DATA PATH, DESKTOP BGA $82 82454GX 82454GX 82454GX 82454GX BGA PACKAGE, PCI BRIDGE SERVER BGA $248.34 S82454GX S82454GX S82454GX S82454GX PCI BRIDGE, SERVER SQFP PACKAGE QFP PACKAGE ORDER S Z867, A-2 STEP QFP $25.70 82375 : PCI TO EISA BRIDGE S82375EB S82375EB S82375EB S82375EB QFP PACKAGE, PCI TO ORDER S Z868 QFP $10.55 82424ZX 82424ZX 82424ZX 82424ZX : CACHE AND DRAM CONTROLLER S82424ZX S82424ZX S82424ZX S82424ZX QFP PKG, CACHE LX QFP PACKAGE, LBX FOR MERCURY CHIPSET,SZ942 SZ942 SZ942 SZ942 QFP $13.55 S82433NX S82433NX S82433NX S82433NX LBX FOR NEPTUNE QFP PKG, SZ899 SZ899 SZ899 SZ899,A www.datasheetarchive.com/files/intel/design/pricelst/ccom2.htm |
Intel | 31/01/1997 | 6.76 Kb | HTM | ccom2.htm |
| matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40-lead TSOP (Thin Small consistent component placement and reliable solder joint integrity. uBGA packages will allow customers to Packs) and TSOP. The uBGA package also integrates a flexible elastomer between the flash memory die Comprehensive User's Guide for uBGA* Packages Flash Components Packaging Data (Mechanical specs Development Tools (Electronic Tools Catalog) uBGA* Package Backgrounder www.datasheetarchive.com/files/intel/design/ubga.htm |
Intel | 01/11/1998 | 14.74 Kb | HTM | ubga.htm |
| -effective transition for current users of other fine-pitch packages such as QFP (Quad Flat Packs) and TSOP. The uBGA positioning system units, palm size computers and portable instrumentation. The uBGA package, a ball matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40-lead TSOP (Thin Small Outline Package) counterpart. The uBGA package's relaxed 0.75 mm (30 mil) ball pitch and placement and reliable solder joint integrity. uBGA packages will allow customers to leverage existing www.datasheetarchive.com/files/intel/design/ubga-v2.htm |
Intel | 06/08/1998 | 10.66 Kb | HTM | ubga-v2.htm |
| matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40-lead TSOP (Thin Small consistent component placement and reliable solder joint integrity. uBGA packages will allow customers to Packs) and TSOP. The uBGA package also integrates a flexible elastomer between the flash memory die Comprehensive User's Guide for uBGA* Packages Flash Components Packaging Data (Mechanical specs Development Tools (Electronic Tools Catalog) uBGA* Package Backgrounder www.datasheetarchive.com/files/intel/design/ubga-v3.htm |
Intel | 02/02/1999 | 14.72 Kb | HTM | ubga-v3.htm |
| matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40-lead TSOP (Thin Small consistent component placement and reliable solder joint integrity. uBGA packages will allow customers to Packs) and TSOP. The uBGA package also integrates a flexible elastomer between the flash memory die Comprehensive User's Guide for uBGA* Packages Flash Components Packaging Data (Mechanical specs Development Tools (Electronic Tools Catalog) uBGA* Package Backgrounder www.datasheetarchive.com/files/intel/design/ubga-v1.htm |
Intel | 15/11/1998 | 14.71 Kb | HTM | ubga-v1.htm |
| matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40-lead TSOP (Thin Small consistent component placement and reliable solder joint integrity. uBGA packages will allow customers to Packs) and TSOP. The uBGA package also integrates a flexible elastomer between the flash memory die Comprehensive User's Guide for uBGA* Packages Flash Components Packaging Data (Mechanical specs Development Tools (Electronic Tools Catalog) uBGA* Package Backgrounder www.datasheetarchive.com/files/intel/products one/design/ubga.htm |
Intel | 03/05/1999 | 15.11 Kb | HTM | ubga.htm |
| -effective transaction for current users of other fine-pitch packages such as QFP (Quad Flat Packs) and TSOP. The uBGA memory using a 5x8 ball matrix uBGA package is 80 percent smaller and 17 percent thinner than its 40 placement and reliable solder joint integrity. uBGA packages will allow customers to leverage existing Intel has adopted the uBGA* package as part of its packaging portfolio with implementation beginning in find broad-based industry support already in place for this new package. The uBGA www.datasheetarchive.com/files/intel/design/news/ubga.htm |
Intel | 31/01/1997 | 3.6 Kb | HTM | ubga.htm |
| Integrated Circuit (IC) Storage and Handling: Package Types - Peripheral Chip-Set Types Integrated Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because BGA packages, see Chapter 14 of the Intel Packaging Databook www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2.htm |
Intel | 30/04/1998 | 3.1 Kb | HTM | packag~2.htm |
| Integrated Circuit (IC) Storage and Handling: Package Types - Peripheral Chip-Set Types Integrated Circuit (IC) Storage and Handling: Package Types Peripheral Chip-Set Types The Ball Grid Array (BGA) package can be made much smaller than corresponding Quad Flat Pack (QFP) packages and with a large number of pins because BGA packages, see Chapter 14 of the Intel Packaging Databook www.datasheetarchive.com/files/intel/design/quality/icstor~1/packag~2-v1.htm |
Intel | 31/10/1998 | 3.11 Kb | HTM | packag~2-v1.htm |