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Part Manufacturer Description Datasheet BUY
CLTEQ-M16-BLT-GUIDE TE Connectivity Ltd CLTEQ-M16-BLT-GUIDE visit Digikey
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
DRA622CIZKKQ1 Texas Instruments 640-BGA visit Texas Instruments
DRA622CIZKKRQ1 Texas Instruments 640-BGA visit Texas Instruments
SPMU018M Texas Instruments StellarisWare? Graphics Library User's Guide (SW-GRL-UG) visit Texas Instruments

BGA reflow guide

Catalog Datasheet MFG & Type PDF Document Tags

BGA reflow guide

Abstract: BGA Socket FinderTM at www.bgasockets.com. Step 1: Reflow solder the BGA device to the Guide Box , BGA Socket Adapter System BGA Guide Box Socketing System With Extraction Screw Feature Table , 140°C (-40°F to 284°F) Insulator Size: BGA Device body + 0.315/(8.00) with guide box* Description , °F) Insulator Size: BGA Device body + 0.315/(8.00) with guide box* Features: · Facilitates easy insertion , . Specifications subject to change without notice. inch/(mm) BGA Guide Box Socketing System With Extraction
Advanced Interconnections
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BGA reflow guide

Abstract: pcb warpage* in smt reflow Solder Reflow Guide for Surface Mount Devices November 2010 Technical Note TN1076 , . www.latticesemi.com 1-1 tn1076_02.4 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor , 2 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak , 245 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak , , MachXO, LatticeXP2. 2. LatticeECP3. 4 Solder Reflow Guide for Surface Mount Devices Lattice
Lattice Semiconductor
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BGA reflow guide pcb warpage* in smt reflow pcb warpage in ipc standard 324 bga thermal reballing JEDEC SMT reflow profile 1-800-LATTICE

BGA reflow guide

Abstract: JEDEC SMT reflow profile Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction , . www.latticesemi.com 1-1 tn1076_02.3 Solder Reflow Guide for Surface Mount Devices Lattice Semiconductor , Guide for Surface Mount Devices Lattice Semiconductor Table 2. Peak Reflow Temperature (TP) by , PQFP 3 100 3 225 160 3 225 208 3 225 3 Solder Reflow Guide for , 1156 ftBGA 3 250 256 3 260 324 3 260 4 Solder Reflow Guide for Surface
Lattice Semiconductor
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304-PQFP fine BGA thermal profile BGA PROFILING

xilinx topside marking

Abstract: xilinx part marking Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , balls for BGA packages. In addition, suitable material sets are chosen and qualified for higher reflow , peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA solder balls do , Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.6) September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification
Xilinx
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xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 SMD MARKING CODE C1G UG072 UG075 XAPP427

xilinx part marking

Abstract: xilinx topside marking . . . . . . . . 111 Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . , process usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA , Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.2) March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3.2) March
Xilinx
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FGG484 HQG160 qfn 3x3 tray dimension top marking 957 so8 FF1148 TT 2076

XILINX/part marking Hot

Abstract: PC84/PCG84 Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA solder , Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.4) June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3.4) June 10
Xilinx
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XILINX/part marking Hot PC84/PCG84 SMT, FPGA FINE PITCH BGA 456 BALL sn63pb37 solder SPHERES SPARTAN-II xc2s50 pq208 diode MARKING A1 v34

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations Instruments. MicroStar BGA Packaging Reference Guide iii Texas Instruments addressed several key , your application. This guide is designed to give you technical background on MicroStar BGA packages , . . . . . . . . B­13 MicroStar BGA Packaging Reference Guide v Contents (continued) 240GGW , BGA Packaging Reference Guide vii List of Figures (continued) Figure Page 38 , . . . . . . . . . . . . . . . . . . . . . . 6­5 MicroStar BGA Packaging Reference Guide PCB
Texas Instruments
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smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 P6K6 A10D10 k5m6 SSYZ015B

qfn 3x3 tray dimension

Abstract: XCDAISY Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . , process usually has a peak reflow temperature of 205oC - 220oC. At this temperature range, the SnAgCu BGA , Device Package User Guide [Guide Subtitle] [optional] UG112 (v3.5) November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the , property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3
Xilinx
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XCDAISY BFG95 XC5VLX330T-1FF1738I WS609 XC3S400AN-4FG400I jedec so8 Wire bond gap

CBG064-052A

Abstract: csp process flow diagram ® FLASH MEMORY CHIP SCALE PACKAGE USER'S GUIDE D Figure 2-5. Easy BGA Package Manufacturing Flow , D Intel Flash Memory Chip Scale Package User's Guide ® The Complete Reference Guide 1999 , USER'S GUIDE D CONTENTS 1.0 CHIP SCALE PACKAGING , . 2.3 The Easy BGA and Intel® Stacked-CSP Process Flow , . 9 3.5 The Easy BGA Package
Intel
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CBG064-052A csp process flow diagram CBG064 BGA Solder Ball 0.35mm collapse 28F160C18 intel 845 MOTHERBOARD pcb CIRCUIT diagram

sn63pb37 solder wire

Abstract: BGA reflow guide GHz BGA Socket User Manual Tel: (800) 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen Elastomer Cleaning , SGB.doc, Rev. P, VP, 8/20/2009 Tel: (800) 404-0204 www.ironwoodelectronics.com Selecting a BGA , www.ironwoodelectronics.com. Select the "Products" link, then under the "Browse" menu, select the "GHz BGA & MLF socket" link
Ironwood Electronics
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sn63pb37 solder wire TL-TORQUEDRIVER-01 size 0204 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-09 100C MIL-STD202

PCB design for very fine pitch csp package

Abstract: Senju Incorporated. MicroStar BGA Packaging Reference Guide iii Texas Instruments addressed several key , production units. This guide is designed to give you technical background on MicroStar BGA packages as well , local TI field sales office. MicroStar BGA Packaging Reference Guide Contents 1 PCB Design , B­17 MicroStar BGA Packaging Reference Guide v List of Figures Figure 1 2 3 4 5 6 7 , Packaging Reference Guide PCB Design Considerations 1 PCB Design Considerations MicroStar BGA
Texas Instruments
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SSYZ015A PCB design for very fine pitch csp package Senju 37K-1 B12-246 Senju metal solder paste 179GHH

CM16C550P

Abstract: sad1 diode smd 1-15. BGA Example SMT Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 , Rev. 2.1 i960® Rx I/O Processor Design Guide November, 1997 Order Number: 273004-002 , GUIDE 1.1 80960Rx Layout and Routing Recommendations . . . . . . . . . . . . . . . . . . . . . 1 , 1.16 Designing Your PCB for the BGA Package . . . . . . . . . . . . . . . . . . . . . . . . . 40 1.17 , . . . . . . . . . . . . . . . . . . . . 47 1.21 Surface Mount Technology Processing of BGA . . . .
Intel
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N82C42PE CM16C550P sad1 diode smd 4.7 uf/50v smd capacitor SPER 1A1 C4 NPN CD100 transistor 0.1 uf/50v smd capacitor 80960JA/JF 82372SB C01100-7 3278MH 80960R

BFG95

Abstract: Implementing and Optimizing Solder Reflow Process for BGA Packages . . . . . . . . . . . . . . . . . . . . . . , Device Package User Guide UG112 (v3.7) September 5, 2012 R R Notice of Disclaimer The , the property of their respective owners. Device Package User Guide www.xilinx.com UG112 (v3 , )â', and Table 1-2: â'Xilinx Device Marking Definitionâ'"Exampleâ'. Updated â'Flip-Chip BGA , Updated â'Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,â' page 87; added missing (D
Xilinx
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BGA reflow guide

Abstract: sn63pb37 solder SPHERES www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to www.ironwoodelectronics.com. Select "Products" link, then under "Browse" menu, select "GHz BGA & MLF socket" link. For 1.27mm, 1mm, 0.8mm and 0.75mm pitch BGA device, select "SG-BGA-6xxx" link. . For 0.65mm, and 0.5mm pitch BGA device, select "SG-BGA-7xxx" link , sectional views and the material details. The second page shows the recommended PCB layout (Note: BGA pads
Ironwood Electronics
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1mm pitch BGA socket TL-VACUUMPEN-01 20mm light dependent resistors ultra fine pitch BGA 23M1 sn63pb37 0.4mm

40KHZ ULTRASONIC CLEANER CIRCUIT

Abstract: 1mm pitch zif BGA socket . 2 Selecting a BGA Stamped pin socket , . 3 IC and PCB Reflow Requirement , . 5 0.5mm, 0.65mm & 0.8mm Center ­ BGA Stamped Contact Specification (Scale 40:1 , ) . 7 1mm & 1.27mm Center ­ BGA Stamped Contact Specification (Scale 25:1 , compresses on the circuit board and thereby making electrical connection. Selecting a BGA Stamped pin
Ironwood Electronics
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40KHZ ULTRASONIC CLEANER CIRCUIT 1mm pitch zif BGA socket pogo pin cleaning 40KHz ultrasonic interface maintenance program

Soldering Instructions

Abstract: reflow soldering profile BGA www.ironwoodelectronics.com Giga-snaPTM & BGA Surface Mount Foot Soldering Instructions (cont.) Soldering Reflow , Tel: (800) 404-0204 www.ironwoodelectronics.com Giga-snaPTM & BGA Surface Mount Foot Soldering Instructions Target PCBs, which are intended to accept the Ironwood Electronics BGA surface mount emulator , that can be used to attach the BGA surface mount emulator feet to target PCBs. Because of these wide , general Figure 1: Target PCB/BGA Emulator Foot soldering instructions. Ironwood's BGA surface mount
Ironwood Electronics
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Soldering Instructions reflow soldering profile BGA reflow temperature bga

IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Abstract: Coffin-Manson Equation Place Components and PIH Connectors Component Placement (BGA, SMT) Wave Solder Reflow , CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 ® Copyright , ://www.chips.ibm.com CBGA Surface Mount Assembly and Rework User's Guide May 23, 2002 . CBGA Surface Mount Assembly and Rework User's Guide Contents Figures , . 2.7 Solder Reflow
IBM
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies Coffin-Manson Equation senju solder bar senju solder paste vps 06107 entek Cu-56

BGA reflow guide

Abstract: pitch 0.75mm BGA Guide Post Socket (SG) · Adapter size equals the BGA Device body + .157/(4.0) Features: · Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to , Type -700 0.75mm Pitch Type -757 ADAPTER Reflow (solder) BGA Device to Adapter .182 (4.62 , Ball Grid Array (BGA) Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel , BGA Adapters Standard Adapter (A): · Mates with Standard Socket (S) · Adapter size equals BGA
Advanced Interconnections
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pitch 0.75mm BGA 1024 ball bga C36000 ASTM-B-16

BGA reflow guide

Abstract: 1024 ball bga Extraction Socket (SB) or Guide Post Socket (SG) · Adapter size equals the BGA Device body + .157/(4.0 , Type -715 Type -700 Type -757 7 7* Reflow (solder) BGA Device to Adapter a^ / j. .182 , ADVANCED INTERCONNECTIONS. Ball Grid Array (BGA) Adapters Standard Adapter (A): · Mates with Standard Socket (S) · Adapter size equals BGA Device body + .079/(2.0) 5 Energy Way, P.O. Box 1019, West , Internet http://w ww .advintcorp.com BGA Adapters Extraction Slot Adapter (AX): · Slots allow AIC
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OCR Scan

land pattern BGA 0.75

Abstract: BGA reflow guide Design Summary for 96GKE/114GKF MicroStar BGA Packages TM PCB Design Guidelines Package Via to Board Land Area Configuration MicroStar BGA Package Package ball via Near-Sn/Pb eutectic solder , reflow. · Paste contributes to the final volume of solder in the joint, and thus allows this volume to , the mounted components. IR Reflow Profile Packaging Tape and Reel 4.0 + 0.10 1.75 + 0.10 - , tolerances are specified at ±80 microns. These packages are selfaligning during solder reflow, so final
Texas Instruments
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land pattern BGA 0.75 BGA and CSP bo 137 LFBGA-96 LFBGA-114 SSYZ015
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