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Part Manufacturer Description Datasheet BUY
DRA622CIZKKQ1 Texas Instruments 640-BGA visit Texas Instruments
DRA622CIZKKRQ1 Texas Instruments 640-BGA visit Texas Instruments
X9520B20I-A Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
X9520B20I-B Intersil Corporation DIGITAL POTENTIOMETER, PBGA20, BGA-20 visit Intersil
TMS320C28345ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments
TMS320C28346ZEPQ Texas Instruments Delfino Microcontroller 256-BGA visit Texas Instruments

BGA package tray 64

Catalog Datasheet MFG & Type PDF Document Tags

Kostat tray

Abstract: KS-8308 Chapter 7 Trays Tray Suppliers per Package Type (Continued) Package Plastic Ball Grid Array (BGA , and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication , serving as a cover. The diagrams and tables that follow show tray dimensions per package and the , Device Count per Tray and Box (Continued) Devices per Tray Devices per Box1 24 120 569 BGA , ) 388 BGA (35 mm x 35 mm) 420 BGD (35 mm x 35 mm) 492 BGA (35 mm x 35 mm) Plastic Quad Flat Package
Advanced Micro Devices
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LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu ­ SOJ Small Outline J-Leaded Package 1.27 ­ BGA Ball Grid Array 1.5/1.27/1.0 , substrate 10 Package Structures Lamination: Metal seal, frit seal Plastic BGA (cavity down type , LSI are rapidly increasing. Given this environment, package technology is rapidly increasing in , packages in the design of their products, and therefore focuses on the package outline drawings , Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case
Fujitsu
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LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 PACKAGE 176 PIN PLASTIC BGA-176P-M03 176-pin plastic FBGA Lead pitch 0.50 mm Package width × , Package code (BGA-176P-M03) Tab: Shows form 176-pin plastic FBGA (BGA-176P-M03) 8.00±0.10 , Quad Flat Non-Leaded Package (JEITA) BGA Ball Grid Array FBGA Fine pitch Ball Grid Array , package is suited for high-density mounting of packages with 64 or more pins. A special surfacemount , , and 70 mm. 0.50 to 0.15mm BGA This package has a grid of equally spaced leads (solder ball
Fujitsu
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NEC A39A

Abstract: NEC A39A 240 BGA 3 CHAPTER 1 1.1.2 PACKAGE OUTLINES AND EXPLANATION Outer view and characteristics , chip is connected to the leads of the film pattern. BGA Balls are on one surface of the package , Package QTP G Land Grid Array BGA Quad Tape Carrier Package (iii) Number of package pins (example of code) Code Number of Package Terminals 0008 8 0014 14 0064 64 0144 , Package) Package Outline Drawing No. Pin Count 64 pin Remarks Page Features Forming
NEC
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BGA PACKAGE TOP MARK intel

Abstract: 144 bga for Easy BGA Packages µBGA* Package Thin Tray Dimensions Pkg. Type M M1 M2 M3 Rows , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and Dimensions . 1 2.0 Easy BGA Package Schematics: Silicon , . 2 3.0 Easy BGA Package Media Information . 3 3.1 3.2 3.3 3.4 Carrier Tape Diagram and Dimensions for Easy BGA Package
Intel
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daewon tray

Abstract: Daewon T0809050 tray). â  Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA , 652 BGA Parts or Tray Vendor and Vendor Part Number Handling J-Lead and QFP Devices , -12213-00 24 1152 35 ï'´ 35 Flip Chip BGA Package thickness >2.2mm Daewon T0809050 A E20 , Corporation Tray Revision 256 FineLine BGA Vendor and Vendor Part Number Primary Supplier , Flat No-Lead (QFN) E20-12212-00 68 M B 64 Micro BGA (MBGA) Daewon 12V-2727-319
Altera
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daewon tray Daewon T0809050 DAEWON tray 48 daewon tray 1F1-1717-AXX strapack s-669 E20-12213-00 AN-071-5 E30-04766 S-699

KGA0E000BA

Abstract: kgc0g000dm : 64 - BGA A : 272 D : 153 G : 388 - PBGAH E : 918 B : 416 E : 208 - SOP C:8 K : 20 O , : 308 7 : 256 T : 64 14. Packing B : Tube U : Bulk R : Tray T : Tape & Reel S : Tape & Reel , : 1.5M byte W : 144K byte 8. Version A~Z *1st Version X 9~10. Mask Option 11. " - " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R : TSSOP S : SOP U , XXXXXX 1 2 3 4 5 13. Package Pin Wafer/CHIP BIZ = 0 (NONE) - SDIP B : 56 M : 24 Q : 42
Samsung Electronics
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ARM10 KGA0E000BA kgc0g000dm fBGA package tray 12 x 19 KGB0F000BA FCMSP kga0a000am HT80C51 SC-200 SC-100 SC-300

QFN tray

Abstract: 7x7x1.4 tray . 7 Marketing Outline, 64-Lead PDIP , . 17 Marketing Outline, 64-Lead LQFP. 18 Marketing Outline, 64-Lead LQFP , . 28 Marketing Outline, 144-Lead BGA , . 37 Package Migration
ZiLOG
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PS007229-1010 QFN tray 7x7x1.4 tray qfn 5 x 5 TRAY MKT71C1176-00 tray datasheet bga lqfp 7x7 tray 936/BAG 500/BAG 400/BAG 225/BAG 66/TRAY

MD300-10A

Abstract: QFN tray -100-400B-1 Magazine MD400-1A Tray Plastic DIP Nominal 20 Package LA-0530B-1 22 NEC Code , NEC Code Tray LA-027 40 P40E-100-A-1 - - 42 P42E-100-A-1 - - 64 , -65-375B-1 Magazine MM375-2A 500 70 P70G7-80-500A Tray LA-3521A-1 525 64 P64GW , TSOP (2) 400MIL18 S28G5-50-7KD5 Tray TSOP (2) 400MIL18 CHAPTER 4 Package TSOP (II , -0551A-1 12 × 12 64 P64GK-65-8A8-1 Tray LA-1004A-1, LA-0557A-1 14 × 14 64 P64G
NEC
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MD300-10A SIP 400B BGA package tray 64 TSOP TRAY 40 PIN 6-tsop NEC A39A 240 X100KW-65A-1 LA-014 X100KL-65A X100KL-65A1 X120KW-80A-1 P119S1-R4

CCGA

Abstract: 938 SO-16 . Tray OPN Pkg Code AMD Pkg Code Pin/Lead/ Ball Count Pkg Family A BGA 272 A , PBGA BGA 569 PLH 28 Devices per Tray Trays per Box Devices per Box PBGA , 250 64 TQFP PQT 80 Y PDH Y Devices per Tray Trays per Box Devices , The table below summarizes the packing quantities for each package leadcount. The data is sorted first by OPN package code, then by AMD internal package code, and then by lead/ball count. Details on each
Advanced Micro Devices
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CCGA 938 SO-16 LQFP 48 Package Box CBF 420 tray BGA 520 amd 638 pin

bga trays

Abstract: tray 20 x 14 quantities are specified below. Table II. Tray Quantities by Package Type Device Package Type Number , 420 450 420 300 200 135 120 ­3­ a Table II. Tray Quantities by Package Type (continued , Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride , resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type Device Package , Quantities by Package Type (continued) Device Package Type Number of Leads Quantity per Tube
Analog Devices
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bga trays tray 20 x 14 BGA 31 x 31 tray bga tray tray bga 17 E04102

fBGA package tray 12 x 19

Abstract: FCCSP : 64 - BGA A : 272 D : 153 G : 388 - PBGAH E : 918 B : 416 E : 208 - SOP C:8 K : 20 O , : 308 7 : 256 T : 64 14. Packing B : Tube U : Bulk R : Tray T : Tape & Reel S : Tape & Reel , : 1.5M byte W : 144K byte 8. Version A~Z *1st Version X 9~10. Mask Option 11. " - " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R : TSSOP S : SOP U , XXXXXX 1 2 3 4 5 13. Package Pin Wafer/CHIP BIZ = 0 (NONE) - SDIP B : 56 M : 24 Q : 42
Samsung Electronics
Original
FCCSP SecuCalm a44e I18N 64 pin IC microcontroller LCD cortex my

secucalm

Abstract: SecuCalm16 11. " - " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB , : 64 - BGA A : 272 D : 153 G : 388 - PBGAH E : 918 B : 416 E : 208 - SOP C:8 K : 20 O , 2 3 4 5 13. Package Pin Wafer/CHIP BIZ = 0 (NONE) - SDIP B : 56 M : 24 Q : 42 T : 64 - LGA A : 88 J : 176 - DIP C:8 K : 20 M : 24 - LQFP C : 144 F : 216 J : 176 W : 80 , : 16 R : 48 - QFP A : 128 E : 208 T : 64 X : 100 C : 144 G : 256 U : 304 Z : 44 D
Samsung Electronics
Original
SecuCalm16 1Z89

secucalm

Abstract: HT80C51 : 64 - BGA A : 272 D : 153 G : 388 - PBGAH E : 918 B : 416 E : 208 - SOP C:8 K : 20 O , : 1.5M byte W : 144K byte 8. Version A~Z *1st Version X 9~10. Mask Option 11. " - " 12. Package Type A : SDIP C : CHIP BIZ E : LQFP G : BGA J : ETQFP L : ELP N : COB R : TSSOP S : SOP U , XXXXXX 1 2 3 4 5 13. Package Pin Wafer/CHIP BIZ = 0 (NONE) - SDIP B : 56 M : 24 Q : 42 T : 64 - LGA A : 88 J : 176 - DIP C:8 K : 20 M : 24 - LQFP C : 144 F : 216 J : 176 W
Samsung Electronics
Original
H285

spansion part marking

Abstract: Spansion S29GL256N (Varies by Package Type) [BGA] A = Standard Not Lead (Pb)-Free N = 110 nm, MirrorBitTM Technology , [Lead Frame] F = Standard Lead (Pb)-Free, Copper, Sn Package Type [Family] B = BGA [BGA] C = CSOP , . 3 BGA package marking omits leading "S29" and packing type designator from ordering part , 3. 2 TSOP package marking omits packing type designator from ordering part number. 3 BGA , designator from ordering part number. 3 BGA package marking omits leading "S29" and packing type
Spansion
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S29AL016D S29GL032M S29GL256N spansion part marking Spansion S29GL256N SPANSION s29al016d spansion top marking s29al016 S29AL016D70BAI010 S29AL016M S29JL032H S29GL064M S29GL128N

EIA and EIAJ standards 783

Abstract: EIA standards 783 cover tape Termination End of the package pins Tray Primary container used for QFP/TQFP/BGA , . Table 2. SLL Packages and Standard Quantities PACKAGE PINS QUANTITY PER TRAY MATRIX CONTAINER STANDARD QUANTITY PM PACKAGE TYPE 64 160 8 × 20 800 QFP PN 80 119 , 56 MicroStar Jr. BGA Jr 1.6 1.2 12 17.3 1.7 1.2 12 24 PMR 64 , PM (64) PK (3) KTE (3) KTG (5) KTP (2) MicroStar BGA GKE (96) GKF (114) MicroStar Jr
Texas Instruments
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SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 SKINNY DIP TCP PGA SHRINK-DIP BGA/LGA CSP Figure 1.1.1 Packaging Trend 2 PACKAGE , .) 80 60 Usage rate (%) 40 Surface mounting type package (SOP, QFP, SOJ, QFJ, BGA) 20 , package body in four directions, and can be mounted flat. The standard lead pitch is 1.27 mm (50 mil). BGA , circuit board (PCB). Quad Flat J-Leaded Package Ball Grid Array/Fine Pitch BGA Fine Pitch Land , 64 73 88 133 177 209 240 257 301 365 400 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS OKI
OKI Electric Industry
Original
LGA 1156 PIN OUT diagram QSJ-44403 LGA 1155 Socket PIN diagram LGA 1150 Socket PIN diagram IC107-26035-20-G REFLOW lga socket 1155 DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1

INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel µBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 , .12 Very-Thin, Fine-Pitch, BGA Package (VF BGA) Drawing and Dimensions, Very-Thin, Fine-Pitch, BGA Package (VF BGA) Drawing and Dimensions, 28F320B3_C and 28F320C3 , . 3 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Daisy Chain Schematics for GE28FSDCR46 . 4 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA) Package Drawing and Dimensions for Daisy Chain
Intel
Original
28F800B3 28F160B3 28F016B3 28F160C3 INTEL 28F640 BGA PACKAGE TOP MARK intel vf bga 298161 28F160C18 INTEL 28F640 application PS0213 28F008S3 RD33704SW RD33708SW RD33716SW

smd transistor mark E13

Abstract: Modified Coffin-Manson Equation Calculations . Figure 1. Packaging Trends Package trend (customer requirement) QFP 0.5 mm pitch BGA (ball grid , Fine pitch BGA (0.5, 0.8, 1.0 mm ball pitch) QFP-0.5 BGA Package size QFP-0.4 CSP Bare , 's MicroStar BGA package. Figure 2. Structure of TI's MicroStar BGA Conforms to JEDEC Outlines: MO-192 and , . MicroStar BGA Package Assembly Flow Same as QFP assembly Die attach Wire bond Encap Non-Ag paste Short loop X'fer mode Figure 3. MicroStar BGA Package Assembly Issues Substrate ­
Texas Instruments
Original
smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 BGA reflow guide P6K6 A10D10 SSYZ015B

SMD MARKING CODE 071 A01

Abstract: smd code 38P Shipment 6.2 Tube Dimensions 6.3 Tray Dimension Diagrams 6.4 Tape Dimension Sales Offices Information , Package 50 ­ BGA Ball Grid Array 1.5mm/1.27mm/ 1.0mm ­ DTP Dual Tape Carrier , To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods 2.1 Overview 2.2
Fujitsu
Original
SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 smd marking m05 pitch 0.4 QFP 256p LCC-18P-M04 LCC-28P-M03 LCC-18P-M03 LCC-32P-M02 LCC-44P-M02 LCC-68P-M02
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