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BGA PACKAGE TOP MARK

Altera Corporation

CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT

8.51 Kb, 1 Pages.

Contextual Datasheet Results		1 - 50 of about 10000+ for BGA PACKAGE..
	First line: CUSTOMER ADVISORY PACKAGE MARK ENHANCEMENT Altera will begin marking one-line internal traceability Abstract: .. Altera Corporation 12/15/00 ADV0012. CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT. Altera will begin marking a one-line internal traceability code on all BGA packages beginning January .. datasheet abstract..	8.51 Kb	1 Pages

	First line: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE MARK ENHANCEMENT Change Description Altera will begin Abstract: .. Altera Corporation 2/4/02 ADV0201. CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT. Change Description: Altera will begin marking the assembly lot number and a one-line internal .. datasheet abstract..	6.98 Kb	1 Pages

	First line: µBGA Chip Scale Package Mechanical Shipping Media Specifications April Document Number 290661-022 Abstract: .. -Thin, Fine-Pitch, BGA Package VF BGA Daisy Chain Package Schematic for GE28FSDC56 Removed .. Top View - Bumps Down. Ball A1 Indicator. A. B. C. D. E. 1 2 3 4 5 6 7 8. E. D. Complete Ink Mark Not Shown. 8 7 6 5 4 3 2 1 .. datasheet abstract..	351.62 Kb	34 Pages

	First line: Preliminary Mechanical Shipping Media Information Easy Packages Document Number 298049-007 Information this Abstract: .. 3.1 Carrier Tape Diagram and Dimensions for Easy BGA Package ..3 3 .. Top View - Plastic Backside Complete Ink Mark Not Shown. Bottom View - Ball Side Up. Y. A. A1. A2. D. A. B. C. D. E. F .. datasheet abstract..	77.3 Kb	10 Pages

	First line: Virtex-4 FPGA Packaging Pinout Specification UG075 v3.3 September Xilinx disclosing this user Abstract: .. • FF1152 Flip-Chip Fine-Pitch BGA Package. FX100, FX60, and FX40 devices are available in this .. Some Virtex-4 LX and SX Step 1 devices do not have the 1 marked on the package top mark. 2. FX Step 0 .. datasheet abstract..	2717.41 Kb	286 Pages

	First line: GS8322Z18 B / E / GS8322Z36 B / E / GS8322Z72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. GS8322Z72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A E3 A DQB .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	577.23 Kb	40 Pages

	First line: GS8322Z18 / 36 / 72 B / E / C -xxxV Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. GS8322Z72C-xxxV Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	571.87 Kb	39 Pages

	First line: Ball Grid Array BGA Packaging Introduction plastic ball grid array PBGA become Abstract: .. ball pitch typically 1.27 mm of a BGA over a QFP or PQFP, the overall package and board assembly .. Die Top View. F1. F2 D. E. Ball Grid Array BGA Packaging. 14-16 2000 Packaging Databook. 14.5 Package .. datasheet abstract..	684.75 Kb	32 Pages

	First line: MicroStar BGAt Packaging Reference Guide Literature Number SSYZ015B Third Edition September MicroStar Abstract: .. MicroStar BGA Packaging Reference Guide. In addition to device/package testing, board-level .. GHZ 151 TOP VIEW DAISY CHAIN NET LIST. GHZ 151 PIN ASSIGNMENT NET LIST. V. INDEX MARK A. 15 14 13 12. 11 10 .. datasheet abstract..	1358.25 Kb	64 Pages

	First line: Device Package User Guide Guide Subtitle optional UG112 v3.2 March optional Xilinx Abstract: .. top mark. 1C-ES The ES indicates an Engineering Sample. 16 www.xilinx.com Device Package User .. matte Sn lead finish for lead-frame packages and SnAgCu solder balls for BGA packages. In .. datasheet abstract..	4619.88 Kb	122 Pages

	First line: This version Apr. Previous version Jun. PACKAGE INFORMATION PACKAGE OUTLINES DIMENSIONS This Abstract: .. the seating plane and the top of the package body. A1 Stand-off height Height between the seating .. Surface Mounting Type Package: The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ PLCC , and BGA .. datasheet abstract..	353.72 Kb	17 Pages

	First line: Intel Flash Memory Chip Scale Package Users Guide Complete Reference Guide Information Abstract: .. While offering a larger ball pitch as compared to other CSPs, the Easy BGA package maintains .. then attached to the μBGA package. Mark Laser mark is then performed on the top of the μBGA .. datasheet abstract..	3751.96 Kb	72 Pages

	First line: MicroStar BGAt Packaging Reference Guide Literature Number SSYZ015A Second Edition September MicroStar Abstract: .. MicroStar BGA is a trademark of Texas Instruments Incorporated. GJK 80 TOP VIEW DAISY CHAIN NET .. INDEX MARK. J2‐K2 J3‐H3 K3‐J4 K4‐H4 K5‐J5 H5‐K6 J6‐H6 K7‐J7 H7‐K8 J8‐K9. Appendix B Package Data .. datasheet abstract..	1104.14 Kb	52 Pages

	First line: Application Report SZZA028A November 8-Bit Linear Logic Families 20-Ball 0.65-mm Pitch Very-Thin Abstract: .. .65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann ..  Package, Top View 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 20-Pin Function .. datasheet abstract..	220.98 Kb	18 Pages

	First line: GS8322ZV18 B / E / GS8322ZV36 B / E / GS8322ZV72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. GS8322ZV72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A E3 A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	963.99 Kb	39 Pages

	First line: GS8322Z18 / 36 / 72 B / E / C -xxxV Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. GS8322Z72C-xxxV Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	962.91 Kb	39 Pages

	First line: Preliminary GS8644ZV18 B / E / GS8644ZV36 B / E / GS8644ZV72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero Abstract: .. GS8644ZV72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQ G DQG A E2 A ADV A E3 A DQ .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	863.61 Kb	38 Pages

	First line: High Contents Contents What Ball Grid Varieties NECs Advantages Photographs Line-up Characteristics Abstract: .. NEC BGA family. Attachment 2. Daisy Chain Layout Package, PCB: Top View 119pin PBGA. 225pin .. NEC BGA family. Package, PCB: Top View 576pin 1 Metal TBGA. 696pin 1 Metal TBGA. PKG PWB. 30. 1 A AK. 30. A .. datasheet abstract..	2282.36 Kb	40 Pages

	First line: Applications Notes Surface Mount Assembly Amkor / Anam PBGA SuperBGA Packages Paul Mescher October Abstract: .. impinge on the top of the package. Backside heating is a common feature of all BGA rework tools as .. Such approaches will not work for BGA packages. If the process used to rework the package is not .. datasheet abstract..	363.69 Kb	19 Pages

	First line: GS8321Z18 / 32 / 36E-250 / 225 / 200 / 166 / 150 / 133 165-Bump FP-BGA Commercial Temp Industrial Temp Features User-configurable Pipeline Flow Through Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark Pin 14 as VDD or VDDQ on pipelined parts and .. datasheet abstract..	735.93 Kb	34 Pages

	First line: CONTENTS STANDARDIZATION PACKAGES EIAJ Standards JEDEC Standards Standards NAMES NECS PACKAGES PACKAGE Abstract: .. Package Dimensions of Ball Grid Array BGA 1997.05. ED-7304-1 Measuring Method for Package .. from mounting surface to base surface Height of package from base plane to top of package Width .. datasheet abstract..	188.74 Kb	42 Pages

	First line: GS8321Z18 / 32 / 36E-xxxV 165-Bump FP-BGA Commercial Temp Industrial Temp Features User-configurable Pipeline Flow Through Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark Pin 14 as VDD or VDDQ on pipelined parts and .. datasheet abstract..	505.04 Kb	32 Pages

	First line: GS8321Z18 / 32 / 36E-xxxV 165-Bump FP-BGA Commercial Temp Industrial Temp Features User-configurable Pipeline Flow Through Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark Pin 14 as VDD or VDDQ on pipelined parts and .. datasheet abstract..	727.24 Kb	32 Pages

	First line: GS8322Z18 B / E / GS8322Z36 B / E / GS8322Z72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. GS8322Z72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQ G DQG A E2 A ADV A E3 A DQ B .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	751.86 Kb	38 Pages

	First line: Product Preview GS8644ZV18 B / E / GS8644ZV36 B / E / GS8644ZV72 C 119- 165- 209-Pin Commercial Temp Industrial Temp Features Turn Abstract: .. GS8644ZV72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQ G DQG A E2 A ADV A E3 A DQ .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	766.25 Kb	37 Pages

	First line: Product Preview GS8644Z18 B / E / GS8644Z36 B / E / GS8644Z72 C 119- 165- 209-Pin Commercial Temp Industrial Temp Features Turn Abstract: .. GS8644Z72C Pad Out—209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQ G DQG A E2 A ADV A E3 A DQ B .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	776.18 Kb	39 Pages

	First line: Packages INTRODUCTION Vantis provides programmable logic devices PLDs wide range packages. These Abstract: .. The shape of the leads on leaded surface-mount packages, which includes all but the BGA package .. top ejector mark or separate. 8. The heatsink center line is aligned to the package body’s .. datasheet abstract..	1096.88 Kb	48 Pages

	First line: Preliminary GS8644Z18 B / E / GS8644Z36 B / E / GS8644Z72 C 119- 165- 209-Pin Commercial Temp Industrial Temp Features Turn Around Abstract: .. , 165- or 209-bump BGA package • RoHS-compliant 165-bump BGA package available. Functional .. 165 Bump BGA—x18 Common I/O—Top View. 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A E2 NC BA CK W G .. datasheet abstract..	971.58 Kb	40 Pages

	First line: V54C3128 16 / 80 / 40 4V BGA 128Mbit SDRAM VOLT PACKAGE PRELIMINARY CILETIV LESO System Frequency fCK Clock Abstract: .. BGA 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4. V54C3128 16/80/40 4V BGA Rev. 1 .. Temperature Mark B 6 7PC 7 8PC Std. L. 0°C to 70° C • Blank. 2 V54C3128 16/80/40 4V BGA Rev. 1.3 .. datasheet abstract..	467.16 Kb	45 Pages

	First line: GS8162Z18 / 36B B / D 119- 165-Bump Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	487.33 Kb	34 Pages

	First line: V54C3128 16 / 80 / 40 4V BGA 128Mbit SDRAM VOLT PACKAGE PRELIMINARY CILETIV LESOM System Frequency fCK Clock Abstract: .. BGA 128Mbit SDRAM 3.3 VOLT, BGA PACKAGE 8M X 16 16M X 8 32M X 4. V54C3128 16/80/40 4V BGA Rev. 1 .. Temperature Mark B 6 7PC 7 8PC Std. L. 0° C to 70° C • Blank. 2 V54C3128 16/80/40 4V BGA Rev. 1.2 .. datasheet abstract..	618.24 Kb	45 Pages

	First line: AND8075 / D Board Mounting Considerations FCBGA Packages Prepared Phill Celaya Packaging Manager Mark Abstract: .. Packages Prepared by: Phill Celaya, Packaging Manager Mark D. Barrera, Broadband Knowledge .. BGA Ball Grid Array packages are often the package of choice for optimizing device .. datasheet abstract..	56.35 Kb	8 Pages

	First line: GS8162Z18 B / D / GS8162Z36 B / D / GS8162Z72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A6 E1 BB NC E3 CKE ADV A17 A8 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	896.46 Kb	38 Pages

	First line: GS8162Z18 B / D / GS8162Z36 B / D / GS8162Z72 C Commercial Temp Industrial Temp Features Turn Around functionality allows zero wait Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A6 E1 BB NC E3 CKE ADV A17 A8 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	896.62 Kb	38 Pages

	First line: DS32kHz 32.768kHz Temperature-Compensated Crystal Oscillator www.maxim-ic.com GENERAL DESCRIPTION DS32kHz temperature-compensated crystal oscillator Abstract: .. Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL .. PIN-PACKAGE TOP MARK* DS32KHZ/DIP 0oC to +70oC 14 DIP DS32KHZ. DS32KHZN/DIP -40oC to +85oC 14 .. datasheet abstract..	183.9 Kb	8 Pages

	First line: Spartan-6 FPGA Packaging Pinouts Advance Product Specification optional UG385 v1.0 June optional Abstract: .. . . . . . . . 188 CSG225 Chip-Scale BGA Package Specifications 0.8 mm Pitch . . . . . . . . . . . . . 189 .. Package Marking. All Spartan-6 devices have package top-markings similar to the example shown .. datasheet abstract..	6246.27 Kb	204 Pages

	First line: Application Report SZZA029B 16-Bit Widebus Logic Families 56-Ball 0.65-mm Pitch Very Thin Abstract: .. Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ..  Package, Top and Bottom Views 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 48-Pin Function Pin .. datasheet abstract..	889.66 Kb	30 Pages

	First line: Rev. i960 Processor Design Guide November Order Number 273004-002 Information this document Abstract: .. done from either the top or the bottom of the BGA package. As there is no defining mark on the bottom of the BGA package, the only way to ensure Pin 1 is located in proper position is from the top by using .. datasheet abstract..	2488.98 Kb	118 Pages

	First line: Product Preview GS8322Z18 B / E / GS8322Z36 B / E / GS8322Z72 C Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. 165 Bump BGA—x18 Common I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	915.65 Kb	38 Pages

	First line: Product Preview GS8322ZV18 B / E / GS8322ZV36 B / E / GS8322ZV72 C Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. 165 Bump BGA—x18 Common I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	913.67 Kb	38 Pages

	First line: Preliminary GS8162ZV18A B / D / GS8162ZV36A B / D / GS8162ZV72A C Commercial Temp Industrial Temp Features Turn Around functionality allows zero Abstract: .. 165 Bump BGA—x36 Common I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A6 E1 BC BB E3 CKE ADV A17 A8 NC .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	878.82 Kb	36 Pages

	First line: Product Preview GS8644ZV18 B / E / GS8644ZV36 B / E / GS8644ZV72 C Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. 165 Bump BGA—x18 Common I/O—Top View Package E 1 2 3 4 5 6 7 8 9 10 11. A NC A E1BB NC E3 CKE ADV A A A A. B NC A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and .. datasheet abstract..	922.2 Kb	39 Pages

	First line: GS882Z18 / 36BB / D-333 / 300 / 250 / 200 / 150 119-bump 165-bump Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A17 A A18 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	517.49 Kb	35 Pages

	First line: GS8162Z18 / 36B B / D 119- 165-Bump Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. GS8162Z36B Pad Out—119-Bump BGA—Top View Package B 1 2 3 4 5 6 7. A VDDQ A A A A A VDDQ. B NC E2 A ADV A E3 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	778.07 Kb	34 Pages

	First line: NBSG14 2.5V / 3.3V SiGe Differential Clock / Data Driver with RSECL Outputs Reduced Swing Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 .. datasheet abstract..	354.12 Kb	12 Pages

	First line: Product Preview GS8642ZV18 B / GS8642ZV36 B / GS8642ZV72 C 119- 209-Bump Commercial Temp Industrial Temp Features Turn Around Abstract: .. 119- or 209-bump BGA package • Pb-Free 119- and 209-bump BGA packages available. Functional .. GS8642ZV72C Pad Out–209-Bump BGA—Top View. 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A E3 A DQB DQB A. B DQG .. datasheet abstract..	794.82 Kb	32 Pages

	First line: Preliminary GS8162Z18A B / D / GS8162Z36A B / D / GS8162Z72A C Commercial Temp Industrial Temp Features Turn Around functionality allows zero Abstract: .. 165 Bump BGA—x18 Commom I/O—Top View Package D 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A17 A A19 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts .. datasheet abstract..	1156.51 Kb	46 Pages

	First line: S71PL-J Based MCPs Data Sheet Retired Product S71PL-J Based MCPs Cover Sheet Abstract: .. Package Type BA = Fine-pitch BGA Lead Pb -free compliant package BF = Fine-pitch BGA Lead Pb .. INDEX MARK. 10. 6. b. TOP VIEW. SIDE VIEW. CORNER. 56X. A1. A2 A. 0.15 M M C C. A B. 0.08. PIN A1. 16 S71PL-J Based MCPs .. datasheet abstract..	531.87 Kb	22 Pages

	First line: Preliminary GS8644Z18 / 36E-xxxV 165-Bump Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. -down • JEDEC-standard 165-bump BGA package • RoHS-compliant 165-bump BGA package available .. 165 Bump BGA—x18 Common I/O—Top View. 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A E2 NC BA CK W G .. datasheet abstract..	734.31 Kb	30 Pages

	First line: Preliminary GS8644Z18 / 36E-xxxV 165-Bump Commercial Temp Industrial Temp Features Turn Around functionality allows Abstract: .. -down • JEDEC-standard 165-bump BGA package • RoHS-compliant 165-bump BGA package available .. 165 Bump BGA—x18 Common I/O—Top View. 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A E2 NC BA CK W G .. datasheet abstract..	734.32 Kb	29 Pages

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