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	BGA PACKAGE TOP MARK	Altera Corporation	CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT	8.51 Kb,  1 Pages.

Fulltext Datasheet Results		1 - 50 of about 474 for BGA PACKAGE..
	First line: BGA PACKAGE TOP MARK intel PRLIMINARY Mechanical Specification Package Revision: Abstract: .. 2.0. EASY BGA PACKAGE SCHEMATICS: SILICON DAISY CHAIN EVALUATION UNITS .. Top View - Plastic Backside Complete Ink Mark Not Shown. Bottom View - Ball Side Up. Y. A. A1. A2. D. A. B. C. D. E. F ..  Tags: BGA PACKAGE TOP MARK intel   datasheet abstract..	71.6 Kb	7 Pages	Original
	First line: FR4 epoxy Substrate FR4 substrate PROCESS CHANGE NOTIFICATION PCN0407 UFBGA PACKAGE SUBSTRATE CHANGE Change Description: substrate Lead Ultra FineLine BGA® package assembled Sharp will change from polyimide tape glass epoxy FR4. This change does affect form, fit, function. Abstract: .. The substrate for the 88 Lead Ultra FineLine BGA ® package assembled by Sharp will change from .. Beginning with the top mark date code of 0431, customers may receive the UFBGA package ..  Tags: FR4 substrate Substrate FR4 epoxy   PCN0407	7.59 Kb	1 Pages	Original
	First line: BGA PACKAGE thermal profile BGA and QFP Package A5825-01 bga Shipping Trays land pattern BGA 0.75 Plastic Ball Grid Array (PBGA) Packaging Introduction plastic ball grid array (PBGA) become most popular packaging alternatives high devices industry. advantages over other high leadcount (greater than Abstract: .. ball pitch typically 1.27 mm of a BGA over a QFP or PQFP, the overall package and board assembly .. the BGA package, the only way to ensure Pin 1 is located in proper position is from the top by using ..  Tags: land pattern BGA 0.75 bga Shipping Trays A5825-01 BGA PACKAGE thermal profile SMD databook  moisture sensitive handling and packaging  material data sheet for ball grid array packaging  BGA OUTLINE DRAWING  BGA and QFP Package mounting  BGA and QFP Package  ball grid array packaging   datasheet abstract..	523.09 Kb	28 Pages	Original
	First line: GS8322Z18B-200I* GS8322Z18/36/72(B/E/C)-xxxV 119, Commercial Temp Industrial Temp Features Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLTM ZBTTM SRAMs core power supply supply User-configurable Pipeline Fl Abstract: .. GS8322Z72C-xxxV GS8322Z72C-xxxV Pad Out—209-Bump 209-Bump BGA—Top View Package C 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A .. Not all vendors offer this option, however most mark the pin VDD or VDDQ on pipelined parts and ..  Tags: GS8322Z18B-200I* GS8322Z36GE  29525   GS8322Z18 36 72	962.91 Kb	39 Pages	Original
	First line: hot air bga BGA and QFP Package BGA PACKAGE thermal profile Applications Notes Surface Mount Assembly Amkor/Anam PBGA SuperBGA® Packages Paul Mescher October, 1995 amkor anam 1347 Alma School Road Chandler, 85224 Abstract: .. impinge on the top of the package. Backside heating is a common feature of all BGA rework tools as .. Such approaches will not work for BGA packages. If the process used to rework the package is not ..  Tags: BGA PACKAGE thermal profile BGA and QFP Package hot air bga Amkor Technology pbga moisture   datasheet abstract..	363.69 Kb	19 Pages	Original
	First line: altera EPM7032B altera top marking CUSTOMER ADVISORY ADV0601 Rev01 ADDITION ASSEMBLY PLANT FBGA PACKAGES Change Description: Amkor, Philippines, will added additional assembly source Altera® FineLine BGA® (FBGA) Ultra FineLine (UBGA) packages using BT-based substrates. This will affect curre Abstract: .. as an additional assembly source for Altera ® FineLine BGA ® FBGA and Ultra FineLine BGA UBGA .. Beginning with top mark date code of 0619, products assembled by Amkor, Philippines, will ..  Tags: altera top marking altera EPM7032B   ADV0601	18.32 Kb	4 Pages	Original
	First line: nitto hc100 Denko PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FBGA PACKAGES FROM MALAYSIA Change Description: Nitto Denko HC100-XJ series mold compound being added additional mold compound choice Altera® FineLine BGA® packages assembled Malaysia. This change does affect form Abstract: .. In addition to supporting Pb free and green package requirements, Nitto Denko’s HC100-XJAA HC100-XJAA .. with HC100-XJ HC100-XJ series mold compound starting with top mark date codes of 0507. Altera maintains ..  Tags: Denko nitto hc100   PCN0415	8.61 Kb	2 Pages	Original
	First line: x-ray tube datasheet 026 superior Natural gas engines AS 108-120 144 QFP body size drawing of a geometrical isometric sheet Vantis provides programmable logic devices (PLDs) wide range packages. These packages provide benefits such high power dissipation capability, small footprint, high I/O. This s Abstract: .. The shape of the leads on leaded surface-mount packages, which includes all but the BGA package .. top ejector mark or separate. 8. The heatsink center line is aligned to the package body’s ..  Tags: drawing of a geometrical isometric sheet 144 QFP body size AS 108-120 superior Natural gas engines x-ray tube datasheet 026 QFP Shipping Trays  PLASTIC PACKAGE MOISTURE INDUCED CRACKING  PL84 tube  PD302*  moisture sensitive handling and packaging   datasheet abstract..	759.27 Kb	48 Pages	Original
	First line: tube pl84 die electric sealer AS 108-120 144 QFP body size EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES Vantis provides programmable logic devices (PLDs) wide range packages. These packages provide benefits such high power dissipation capability, small footprint, high I/O. This section provides details Abstract: .. The shape of the leads on leaded surface-mount packages, which includes all but the BGA package .. top ejector mark or separate. 8. The heatsink center line is aligned to the package body’s ..  Tags: EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES 144 QFP body size AS 108-120 die electric sealer tube pl84 thermoelectric material  PL84 tube  PD302*  latest Infrared-Sensor  finger print sensor WITH FPGA pdf   datasheet abstract..	1096.88 Kb	48 Pages	Original
	First line: bt 600 c PROCESS CHANGE NOTIFICATION PCN0517 INTRODUCING KINSUS SUBSTRATE PACKAGES Change Description: Altera introducing Kinsus BT-based EBGA substrate additional substrate source Altera's ball grid array (BGA) cavity-down packages. Kinsus fully qualified substrate supplier which used Altera® F Abstract: .. Package Pin Product Line. 600. EPF10K100A EPF10K100A EPF10K130E EPF10K130E EPF10K200E EPF10K200E EPF10K200S EPF10K200S . BGA. 652. EP20K400 EP20K400 .. Beginning with the top-mark date code of 0625, products assembled with the Kinsus BT ..  Tags: bt 600 c   PCN0517	66.3 Kb	3 Pages	Original
	First line: Product Preview 119- 209-Bump Commercial Temp Industrial Temp Features Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLTM ZBTTM SRAMs +10%/-10% core power supply supply User-configurable Pipeline Flow Through Abstract: .. 119- or 209-bump 209-bump BGA package • Pb-Free 119- and 209-bump 209-bump BGA packages available. Functional .. GS8642ZV72C GS8642ZV72C Pad Out–209-Bump 209-Bump BGA—Top View. 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A E3 A DQB DQB A. B DQG ..  Tags:   GS8642ZV18	794.82 Kb	32 Pages	Original
	First line: qfn 4x4 tray dimension QFN tray qfn 4x4 qfn 3x3 tray dimension PEAK TRAY QFN 4x4 NBSG14 2.5V/3.3V SiGe Differential Clock/Data Driver with RSECL* Outputs NBSG14 1-to-4 clock/data distribution chip, optimized ultra-low skew jitter. Inputs incorporate internal termination resistors accept NECL (Negati Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: PEAK TRAY QFN 4x4 qfn 3x3 tray dimension QFN tray qfn 4x4 qfn 4x4 tray dimension tolerancing a bga   NBSG14	354.12 Kb	12 Pages	Original
	First line: 26020 Preliminary GS8644Z18/36E-xxxV Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLTM ZBTTM SRAMs core power supply supply User-configurable Pipeline Flow Through mode mode user-selectable high/low output d Abstract: .. -down • JEDEC-standard 165-bump 165-bump BGA package • RoHS-compliant 165-bump 165-bump BGA package available .. 165 Bump BGA—x18 Common I/O—Top View. 1 2 3 4 5 6 7 8 9 10 11. A NC A E1 BB NC E3 CKE ADV A A A A. B NC A E2 NC BA CK W G ..  Tags: 26020 GS8644Z36E-166I*  33525  30525  2301*   GS8644Z18 36E-xxxV	734.31 Kb	30 Pages	Original
	First line: 5 ball csp drawing transistor b 1238 tray datasheet bga 8x9 Micro Ball Grid Array (µBGA) Package Micro Ball Grid Array (µBGA*) Package Introduction Abstract: .. Top View - Silicon Backside Complete Ink Mark Not Shown Bottom View - Bump Side Up. Seating .. Package Body Length 32 Mb E 9.690 9.790 9.890 1 0.3815 0.3854 0.3894. Package Body Length 64 Mb ..  Tags: tray datasheet bga 8x9 transistor b 1238 5 ball csp drawing TSOP 1238  -F/SCR Manual, General electric databook   datasheet abstract..	139.54 Kb	20 Pages	Original
	First line: BGA and QFP Package land pattern BGA 0.75 (LF)BGA APPLICATION NOTE INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Application Note Abstract: .. The LF BGA package owes much of its popularity to the fact the component is self aligning, i.e. .. for an LF BGA package is larger than for a QFP with a comparable amount of input and outputs. The ..  Tags: BGA and QFP Package SOT518  SOT512  SOT488  SOT479  SOT478  LFBGA*  land pattern BGA 0.75  BGA OUTLINE DRAWING   AN01026	76.26 Kb	13 Pages	Original
	First line: QFP PACKAGE thermal resistance die down land pattern for TSOPÂ TSOP 86 land pattern BGA and QFP Package BAV 235 Packages Thermal Characteristics Abstract: .. to the inside top of the package, for optimal heat transfer to the ambient air. For most packages .. In-line mark inspection for mark quality and package orientation is used to ensure shipping ..  Tags: BAV 235 BGA and QFP Package TSOP 86 land pattern land pattern for TSOPÂ QFP PACKAGE thermal resistance die down TQ160 Package  rotron 026*  leadframe C7025  ipc-SM-786A*  C7025   datasheet abstract..	681.18 Kb	22 Pages	Original
	First line: quartz 32khz DS32kHz 32.768kHz Temperature-Compensated Crystal Oscillator DS32kHz temperature-compensated crystal oscillator (TCXO) with output frequency 32.768kHz. This device addresses applications requiring better timekeeping accuracy, used drive input most Dallas Semiconductor real-time clocks ( Abstract: .. Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL .. PIN-PACKAGE TOP MARK* DS32KHZ DS32KHZ /DIP 0oC to +70oC 70oC 14 DIP DS32KHZ DS32KHZ . DS32KHZN DS32KHZN /DIP -40oC -40oC to +85oC 85oC 14 ..  Tags: quartz 32khz   DS32kHz DS32kHz-N	435.97 Kb	10 Pages	Original
	First line: die electric sealer BGA and QFP Package ipc-sm-786A QFP PACKAGE thermal resistance die down JEDEC Package Code MS-026-AED Packages Thermal Characteristics Abstract: .. to the inside top of the package, for optimal heat transfer to the ambient air. For most packages .. In-line mark inspection for mark quality and package orientation is used to ensure shipping ..  Tags: JEDEC Package Code MS-026-AED QFP PACKAGE thermal resistance die down BGA and QFP Package die electric sealer QFP Shipping Trays  leadframe C7025  ipc-sm-786A  C7025  786A  28 pin ic base socket round pin type lead   datasheet abstract..	201.31 Kb	20 Pages	Original
	First line: 119-bump 165-bump Commercial Temp Industrial Temp Features Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLTM ZBTTM SRAMs +10%/-10% core power supply supply User-configurable Pipeline Flow Through mode mode u Abstract: .. GS882ZV36B GS882ZV36B Pad Out—119-Bump 119-Bump BGA—Top View Package B 1 2 3 4 5 6 7. A VDDQ A A NC A A V DDQ. B NC E2 A ADV A E 3 .. Not all vendors offer this option, however most mark Bump 5R as VDD or VDDQ on pipelined parts ..  Tags:   datasheet abstract..	614.02 Kb	33 Pages	Original
	First line: DS4000 Digitally Controlled (DC)-TCXO ASSIGNMENT (Top View) GNDOSC N.C. VOSC Abstract: .. PIN-PACKAGE TOP MARK. FREQUENCY DESIGNATOR MHz DS4000A0 DS4000A0 /BGA 12 BGA DS4000A0 DS4000A0 10.00000. DS4000CW DS4000CW /BGA 12 BGA DS4000CW DS4000CW 12.80000. DS4000D0BGA 12 BGA DS4000D0 DS4000D0 13.00000. DS4000EC DS4000EC /BGA 12 BGA DS4000EC DS4000EC ..  Tags:   DS4000	242.67 Kb	14 Pages	Original
	First line: DS4000 Digitally Controlled (DC)-TCXO Aging 1.0ppm Year Frequency Stability ±1.0ppm from -40°C +85°C Frequency Versus Supply Stability ±1.0ppm Volt Base Frequency Digitally Tunable ±6.0ppm Fixed-Frequency Output Division Base Frequency Output Temperature Measurements fro Abstract: .. PIN-PACKAGE TOP MARK. FREQUENCY DESIGNATOR MHz DS4000A0 DS4000A0 /WBGA 0 °C to +70 °C 12 BGA DS4000A0 DS4000A0 10.00000. DS4000A0-N DS4000A0-N /WBGA -40 °C to +85 °C 12 BGA DS4000A0-N DS4000A0-N 10.00000. DS4000CW DS4000CW /WBGA 0 °C to +70 °C 12 ..  Tags: DS4000   DS4000	168.62 Kb	15 Pages	Original
	First line: QFN PACKAGE thermal resistance NBSG14 2.5V/3.3VSiGe Differential Clock/Data Driver with RSECL* Outputs http://onsemi.com Description MARKING DIAGRAMS* NBSG14 1-to-4 clock/data distribution chip, optimized ultra-low skew jitter. Inputs incorporate internal termination resistors accept NECL (Negative Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: QFN PACKAGE thermal resistance   NBSG14	384.54 Kb	13 Pages	Original
	First line: Product Preview 119- 209-Bump Commercial Temp Industrial Temp Features Turn Around) functionality allows zero wait Read-Write-Read utilization; fully pin-compatible with both pipelined flow through NtRAMTM, NoBLTM ZBTTM SRAMs +10%/-10% core power supply supply User-configurable Pipeline Flow Through Abstract: .. 119- or 209-bump 209-bump BGA package • Pb-Free 119- and 209-bump 209-bump BGA packages available. Functional .. GS8642Z72C GS8642Z72C Pad Out–209-Bump 209-Bump BGA—Top View. 1 2 3 4 5 6 7 8 9 10 11. A DQG DQG A E2 A ADV A E3 A DQB DQB A. B DQG ..  Tags: GS8642Z36B   GS8642Z18	861.81 Kb	34 Pages	Original
	First line: 80960RP SERIES INTELLIGENT MICROPROCESSOR Abstract: .. 80960RP 80960RP 352L 352L +36 Ground Balls BGA Package Diagram Top and Side View .. Alternatively, mark and fmark instructions can generate trace events explicitly in the ..  Tags:   datasheet abstract..	678.73 Kb	66 Pages	Original
	First line: 7512 pin diodes in micro semi data sheet FBGA User's Guide -XO\ IROORZLQJ GRFXPHQW UHIHUV 6SDQVLRQ PHPRU\ SURGXFWV WKDW RIIHUHG ERWK $GYDQFHG 0LFUR 'HYLFHV )XMLWVX $OWKRXJK GRFXPHQW PDUNHG ZLWK QDPH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO RIIHUHG FXVWRPHUV ERWK $0' )XMLW Abstract: .. Fortified BGA 80-Ball 80-Ball Board Layout Top View . . . . . . . . . . . . 27. Chapter 6: Package Physical .. It is pertinent to compare the results at low PPM cumulative percentage failure mark. Hence ..  Tags: 7512 pin diodes in micro semi data sheet SMD MARKING CODE h5 fluke 52 k/j Thermocouple smd transistor marking ey transistor smd G46  Theta JC of FBGA  smd mark code zzz  pcb thermal Design guide trace theta layout  pcb thermal Design guide trace theta  PCB design for very fine pitch csp package  outline of the heat sink for FBGA with JEDEC stan  MCP Technology Trend  marking code E5 SMD ic  marking 31e  jk type thermocouple   datasheet abstract..	2370.83 Kb	97 Pages	Original
	First line: JS28F160C3BD70* js28f320c3td70 ph28f320c3td70* JS28F320C3BD70* JS28F160C3BD70 Intel® Advanced+ Boot Block Flash Memory (C3) 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Abstract: .. -Ball Easy BGA packages — 48-TSOP 48-TSOP package â–  ETOXTM VIII 0.13 μm Flash Technology — 8, 16, 32 .. Change IPPD test conditions clarification Section 4.3 μBGA package top side mark ..  Tags: js28f320c3td70 JS28F160C3BD70* TE28F640C3TC80  TE28F640C3BC80  TE28F320C3BD70  RC28F640C3TC80*  RC28F160C3TD70  PH28F320C3TD70*  PH28F320C3BD70  ph28f160c3bd70*  PC28F320C3BD70  JS28F320C3BD70*  JS28F160C3BD70   datasheet abstract..	685.29 Kb	72 Pages	Original
	First line: 2.1 to 5.1 home theatre circuit diagram MF CAPACITOR 165 mf 1 HP25 DSP5301/D Rev. 11/2002 24-Bit Digital Signal Processor Abstract: .. MAP-BGA 3-2. TQFP Package Description. 3.2 TQFP Package Description Top and bottom views of .. Top View Orientation Mark. 105. NC NC. HAD11 HAD11 HAD10 HAD10 HAD9 HAD8. HC0 HAD7 HAD6 HAD5 HAD4 GNDH. VCCH HAD3 ..  Tags: 1 HP25 MF CAPACITOR 165 mf 2.1 to 5.1 home theatre circuit diagram hp42  "bus strobe" 1993   DSP56301	1117.6 Kb	132 Pages	Original
	First line: transistor tip 1050 QFN PACKAGE thermal resistance PEAK TRAY QFN 4x4 sg 421 BGA 31 x 31 tray NBSG11 2.5V/3.3VSiGe Differential Clock Driver with RSECL* Outputs ALYWG Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489−01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: BGA 31 x 31 tray sg 421 PEAK TRAY QFN 4x4 QFN PACKAGE thermal resistance transistor tip 1050   NBSG11	161.56 Kb	12 Pages	Original
	First line: AT91RM9200-QI-002 AT91RM9200-CJ AT91RM9200 block diagram AT91RM9200-CI-002Â AT91RM9200-CJ-002 Incorporates ARM920TTM ARM® Thumb® Processor MIPS MHz, Memory Management Unit 16-KByte Data Cache, 16-KByte Instruction Cache, Write Buffer In-circuit Emulator including Debug Communication Channel Abstract: .. 256-ball 256-ball BGA package are extended compared to the 208-lead 208-lead PQFP package. The features that are .. 256-ball 256-ball BGA Pinout Top View 5. Power Considerations. 5.1 Power Supplies. The AT91RM9200 AT91RM9200 has ..  Tags: AT91RM9200-CJ-002 AT91RM9200-CI-002Â AT91RM9200 block diagram AT91RM9200-CJ AT91RM9200-QI-002 PAGE Memory Management Unit  AT91RM9200 SDRAM  at91RM9200   ARM920TTM ISO7816	350.03 Kb	38 Pages	Original
	First line: PXA27x core developers guide blackberry mobile phone motorola g18 gsm datasheet PXA270 G770* sumitomo Intel® PXA270 Processor Electrical, Mechanical, Thermal Specification Abstract: .. , RemoteExpress, Shiva, SmartDie, Solutions960 Solutions960 , Sound Mark, StorageExpress, The Computer .. VF-BGA Intel ® PXA270 PXA270 Processor Package, top view ..3-1 3-2 13x13mm 13x13mm VF ..  Tags: G770* sumitomo motorola g18 gsm datasheet blackberry mobile phone PXA27x core developers guide xscale PXA270  Wireless markup language abstract  VOICE RECORDER IC  SA-1111  PXA27x Processor Family Electrical, Mechanical,  PXA27x Processor design  PXA27X*  pxa270 user guide  PXA270 jtag flash programming  PXA270 guide  PXA270*   PXA270	1959.43 Kb	126 Pages	Original
	First line: 512Kx36,1Mx18 2.5V Synchronous SRAMs IDT71T75602 2.5V I/O, Burst Counter IDT71T75802 Pipelined Outputs 512K 36,1M memory configurations Supports high performance system speed CIock-to-Data Access) zbjtm Feature dead cycles between write read cycles Internally synchronized output buffer enable elimin Abstract: .. Top View B C D E F G H J K L M N P R T U 5313 tbl 25 Pin Configuration — 1M X 18,119 BGA<1'2> Top View A B C D E F G .. , indentation or other feature of the package bogy. mark uu5t be visible from top surface A ..  Tags: lfu 3sc   datasheet abstract..	1636.36 Kb	25 Pages	OCR Scan
	First line: MMC2080/2075/D Rev. 10/1999 MMC2080/2075 Abstract: .. Ball Grid Array BGA package, and Figure 5 on page 12 and Figure 6 on page 13 are top and bottom .. 5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. 12. e 12X ..  Tags:   MMC2080 2075	985.05 Kb	34 Pages	Original
	First line: *reed relay* BGA PACKAGE thermal resistance MEDER Series Reed Relay low-profile device made with ceramic case that exactly matches thermal coefficient expansion reed switch glass reed lead eliminate potential packaging stress. Capable switching with rise times digital operations, this leadless reed Abstract: .. DIMENSIONS Non-BGA Ceramic / thermoset molded package Patent pending Smallest in the .. Vertical scale: 150 mUnit/div referenced from the 0 unit mark. The vertical scale measures ..  Tags: BGA PACKAGE thermal resistance *reed relay*   datasheet abstract..	630.22 Kb	5 Pages	Original
	First line: 2.1 to 5.1 home theatre circuit diagram DSP5303/D Rev. 4/2003 24-Bit Digital Signal Processor Abstract: .. MAP-BGA 3-2. TQFP Package Description. 3.2 TQFP Package Description Top and bottom views of .. Orientation Mark on top side Notes: Because of size constraints in this figure, only one name ..  Tags: 2.1 to 5.1 home theatre circuit diagram   DSP56303	1117.11 Kb	112 Pages	Original
	First line: KM616FU1010A Family CMOS SRAM Super Power Voltage Full CMOS Static Abstract: .. : 1.0V Min • Three state output status and TTL Compatible • Package Type: 48-FP 48-FP BGA with 0.75mm 75mm .. PACKAGE DIMENSION. 6 5 4 3 2 1. A. B. C. D. E. F. G. H. C. B/2. B. C 1. B. C. Bottom View Top View. D E 2. E 1. E. C. Side View. 0 .8 0. /T y p ..  Tags:   KM616FU1010A	152.93 Kb	9 Pages	Original
	First line: KM616FS1010A Family CMOS SRAM Abstract: .. : 1.0V Min • Three state output status and TTL Compatible • Package Type: 48-FP 48-FP BGA with 0.75mm 75mm .. PACKAGE DIMENSION. 6 5 4 3 2 1. A. B. C. D. E. F. G. H. C. B/2. B. C 1. B. C. Bottom View Top View. D E 2. E 1. E. C. Side View. 0 .8 0. /T y p ..  Tags:   KM616FS1010A	173.03 Kb	9 Pages	Original
	First line: fcBGA PACKAGE thermal resistance NBSG11 2.5V/3.3VSiGe Differential Clock Driver with RSECL* Outputs http://onsemi.com Description MARKING DIAGRAMS* NBSG11 1-to-2 differential fanout buffer, optimized skew Ultra-Low JITTER. Inputs incorporate internal termination resistors accept NECL (Negative ECL), Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: fcBGA PACKAGE thermal resistance   NBSG11	119.65 Kb	12 Pages	Original
	First line: spansion part "marking"Â spansion top marking fBGA package tray S71GL032A Based MCPs Stacked Multi-Chip Product (MCP) Flash Memory Megabit 16-bit) CMOS Volt-only Page Mode Flash Memory 16/8/4 Megabit (1M/512K/256K 16-bit) pSRAM Abstract: .. PACKAGE TYPE BA = Fine-pitch BGA Lead Pb -free compliant package BF = Fine-pitch BGA Lead Pb .. INDEX MARK. 10. 6. b. TOP VIEW. SIDE VIEW. CORNER. 56X. A1. A2 A. 0.15 M M C C. A B. 0.08. PIN A1. 12 S71GL032A S71GL032A Based ..  Tags: fBGA package tray spansion top marking spansion part "marking"Â Spansion MCP products   S71GL032A	152.6 Kb	10 Pages	Original
	First line: MDA 2500 t187* sac 187 datasheet computer motherboard circuit diagram g31 chipset sac 187 Intel® 460GX Chipet Dataheet Abstract: .. 12-8 256-pin 256-pin BGA Package Footprint, Top and Bottom View .. Index mark P. 1 2. 3 4. 5 6. 7 8. 9 10. 11 12. 13 14. 15 16. 17 18. 19 20. A B C D E F G H J K L M N P R T U V W Y. NOTE Each lead ..  Tags: computer motherboard circuit diagram g31 chipset t187* MDA 2500 sac 187  N04 U1  MAB 05 024  95 A B N05  460GX  41044  245481   datasheet abstract..	1320.65 Kb	184 Pages	Original
	First line: qfn 3x3 tray dimension NBSG53A 2.5V/3.3VSiGe Selectable Differential Clock Data Flip-Flop/Clock Divider with Reset OLS* NBSG53A multi-function differential flip-flop (DFF) fixed divide (DIV/2) clock generator. This part GigaCommTM family high performance Silicon Germanium products. strappable contro Abstract: .. PLASTIC 4 X 4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: qfn 3x3 tray dimension   NBSG53A	157.75 Kb	18 Pages	Original
	First line: K3P7V(U)1000B-FC Switchable organization 8,388,608 8(byte mode) 4,194,304 16(word mode) Fast access Time Random Access Time/Page Access Time 3.3V Operation 100/30ns(max.) 3.0V Operation 120/40ns(max.) words 16bytes page access Supply voltage single +3.3V/ single +3.0V VCCQ equal Temperature +70° Abstract: .. 48FP-BGA PIN CONFIGURATION TOP VIEW Note : See last page for package dimension. ABSOLUTE .. A1 Index Mark. Unit : mm 0.27. PACKAGE DIMENSIONS 48 FP-BGA ..  Tags:   datasheet abstract..	112.35 Kb	6 Pages	Original
	First line: diode e 1205 qfn 3x3 tray dimension NBSG86A 2.5V/3.3VSiGe Differential Smart Gate with Output Level Select NBSG86A multi-function differential Logic Gate which configured AND/NAND, OR/NOR, XOR/XNOR, MUX. This device part GigaCommTM family high performance Silicon Germanium products. device housed pr Abstract: .. PLASTIC 4 X 4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: diode e 1205 qfn 3x3 tray dimension   NBSG86A	135.64 Kb	14 Pages	Original
	First line: transistor marking A21 S71GL064N fBGA package tray S71GL064N* BFW transistors S71GL-N Based MCPs Stacked Multi-Chip Product (MCP) Flash Memory 64/32 Megabit (4/2 16-bit) CMOS Volt-only Page Mode Flash Memory 32/16/8/4 Megabit (2M/1M/512k/256k 16-bit) Pseudo Static Data Sheet (Advance Information) Abstract: .. package BH = Fine-pitch BGA Lead PB -free, Low-Halogen package. pSRAM / SRAM DENSITY B0 = 32 Mb .. INDEX MARK. 10. 6. b. TOP VIEW. SIDE VIEW. CORNER. 56X. A1. A2 A. 0.15 M M C C. A B. 0.08. PIN A1. 10 S71GL-N S71GL-N Based MCPs ..  Tags: BFW transistors S71GL064N* fBGA package tray S71GL064N transistor marking A21 S71GL032N80   S71GL-N	338.98 Kb	11 Pages	Original
	First line: BGA PACKAGE TOP MARK intel Intel 865 F Chipset PC MOTHERBOARD intel 815 circuit diagram intel 775 motherboard diagram celeron MOTHERBOARD CIRCUIT diagram Ultra-Low Voltage Intel® Celeron® Processor (0.13 Micro FC-BGA Package Abstract: .. 22 Micro FC-BGA Package – Top and Bottom Isometric Views .. Micro FC-BGA Package – Top and Bottom Isometric Views. Figure 23. Micro FC-BGA Package – Top and ..  Tags: celeron MOTHERBOARD CIRCUIT diagram intel 775 motherboard diagram PC MOTHERBOARD intel 815 circuit diagram Intel 865 F Chipset BGA PACKAGE TOP MARK intel intel 865  celeron 815 0.13  celeron 815  basic architecture of Pentium Processors  273804-002   datasheet abstract..	922.1 Kb	82 Pages	Original
	First line: 478 SOCKET PIN LAYOUT Intel® Pentium® Processor 478-Pin Socket (mPGA478) Design Guidelines Abstract: .. 478-Pin 478-Pin FC-PGA Package Top View .. This mark can be an ink mark or a laser mark but must be able to pass Environmental Requirements ..  Tags: 478 SOCKET PIN LAYOUT 478 SOCKET Intel socket 478 PIN LAYOUT PGA zif socket 478 manual mpga478b motherboard surface mount transistor A48  pentium 4 3.2  mpga479  mpga478b motherboard  mpga478b*  marking code V6 surface mount diode  marking code V6 33 surface mount diode  marking A70  intel h2 socket  GS12*  e14 socket   uPGA478	804.77 Kb	41 Pages	Original
	First line: lga 4x4 footprint qfn 4x4 tray dimension NBSG11MAG PEAK TRAY QFN 4x4 lga-16 4x4 NBSG11 2.5V/3.3VSiGe Differential Clock Driver with RSECL* Outputs http://onsemi.com Description MARKING DIAGRAMS* NBSG11 1-to-2 differential fanout buffer, optimized skew Ultra-Low JITTER. Inputs incorporate internal te Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: lga-16 4x4 PEAK TRAY QFN 4x4 NBSG11MAG qfn 4x4 tray dimension lga 4x4 footprint   NBSG11	127.78 Kb	13 Pages	Original
	First line: altera marking Code epf10k30a Unbiased HAST 130°C, 85 RH, 100 Hrs G770* sumitomo sumitomo g770 PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FBGA PACKAGES Change Description: Altera adopting Sumitomo G770 series mold compound standard mold material Altera® FineLine BGA® (FBGA) d Abstract: .. Altera ® FineLine BGA ® FBGA device packages. Devices in FBGA packages currently molded with .. with the Sumitomo G770 G770 series mold compound beginning with FBGA packages carrying a top mark ..  Tags: sumitomo g770 G770* sumitomo Unbiased HAST 130°C, 85 RH, 100 Hrs altera marking Code epf10k30a   PCN0515	32.77 Kb	6 Pages	Original
	First line: NBSG16MNR2 NBSG6 2.5V/3.3VSiGe Differential Receiver/Driver with RSECL* Outputs http://onsemi.com Description MARKING DIAGRAMS* Abstract: .. PLASTIC 4X4 mm BGA FLIP CHIP PACKAGE CASE 489-01 ISSUE O. 0.20. LASER MARK FOR PIN 1 .. ANY EFFECT OF MARK ON TOP SURFACE OF PACKAGE. DIM MIN MAX. MILLIMETERS. A 1.40 MAX. A1 0.25 0.35. A2 1 ..  Tags: NBSG16MNR2   NBSG16	139.59 Kb	12 Pages	Original
	First line: fsk modem x2 type ac capacitor E2A0013-16-X1 Semiconductor MSM7510 Semiconductor Full Duplex Modem ITU-T V.21 This version: Jan. 1998 MSM7510 Previous version: Nov. 1996 Abstract: .. Mount Type Package. The SOP, QFP, TSOP, SOJ, QFJ PLCC , SHP and BGA are surface mount type .. sales person for the product name, package name, pin number, package code and desired mounting ..  Tags: x2 type ac capacitor fsk modem MSM7512*  MSM7510GS-K  MF CAPACITOR  3.579545 MHz oscillator   MSM7510	118.96 Kb	12 Pages	Original
	First line: A64S06162A Document Title 16M(1M 16bit) Normal mode Page mode with Deep Power Down Static Random Access Memory Rev. History Initial issue Erase non-Pb-free package type Final version release Issue Date 2005 March 2007 Remark Preliminary Final Abstract: .. 48B Pb-Free Mini BGA 5 20 70 A64S06162AG-70F A64S06162AG-70F . Package Power Down Mode Standby Current Max. μA .. A1 INDEX MARK. 6 5 4 3 2 1. H G F E D C B A. C1 / 2. 0.10 - - Y. 0.30 0.25 0.20 E2. 0.90 - - E1. 1.20 - - E. 0.40 0.35 0.30 D. - 5 ..  Tags:   A64S06162A	133.48 Kb	14 Pages	Original
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