NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: SPECIFICATION CONTENTS PAGE 1.0. EASY BGA PACKAGE DRAWING AND DIMENSIONS . 3 2.0. EASY BGA PACKAGE SCHEMATICS: SILICON DAISY CHAIN EVALUATION UNITS . 4 3.0. EASY BGA PACKAGE SCHEMATICS: 16-MB 16-MB INTEL® FAST BOOT BLOCK MEMORY . 5 , BGA PACKAGE SCHEMATICS: 16-MB 16-MB INTEL® FAST BOOT BLOCK MEMORY 1 2 3 4 5 6 7 8 , E PRELIMINARY Mechanical Specification for Easy BGA Package March 1999 Revision: 2.0 ... | Original |
7 pages, |
intel BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK BGA PACKAGE TOP MARK intel datasheet abstract |
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| Abstract: Side Down drawing) 10/12/99 6.0 Added 3 Volt Intel® StrataFlashTM Memory Easy BGA Package , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and Dimensions . 1 2.0 Easy BGA Package Schematics: Silicon , . 2 3.0 Easy BGA Package Media Information . 3 3.1 3.2 3.3 3.4 Carrier Tape Diagram and Dimensions for Easy BGA Package ... | Original |
10 pages, |
BGA package tray 64 BGA PACKAGE TOP MARK 28F160F3 144 bga BGA PACKAGE TOP MARK intel datasheet abstract |
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| Abstract: Scale Package Drawing and Dimensions. 1 2.0 Intel® Stacked-CSP Package Media , Dimensions for Intel® Stacked-CSP Package . 5 Injection Molded Thin JEDEC Tray Parameters for Intel® Stacked-CSP Package , Media and Socket Ordering Information for Easy BGA Package. 8 Note: Please refer to , ® Stacked Chip Scale Package Drawing and Dimensions A1 Index Mark A1 e S2 S1 A B C D E ... | Original |
14 pages, |
28F1602C3 Intel Stacked CSP intel h2 socket 28F1604C3 806804 28F3204C3 BGA PACKAGE TOP MARK intel 28F3202C3 rd33708 datasheet abstract |
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| Abstract: BGA) Package Drawing and Dimensions for Intel® 1.8 Volt Wireless Flash Memory, GE28F320W18 GE28F320W18 , (VF BGA) Package Drawing and Dimensions for Intel® 1.8 Volt Wireless Flash Memory GE28F320W18 GE28F320W18 , uBGA* and VF BGA Chip Scale Package Mechanical and Shipping Media Specifications April 2001 , .12 Very-Thin, Fine-Pitch, BGA Package (VF BGA) Drawing and Dimensions, Very-Thin, Fine-Pitch, BGA Package (VF BGA) Drawing and Dimensions, 28F320B3 28F320B3_C and 28F320C3 28F320C3_C ... | Original |
34 pages, |
vf bga 28F016B3 28F160B3 28F160C3 28F320C3 28F640 28F800B3 5 ball csp drawing BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application datasheet abstract |
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| Abstract: . 13 Figures 1 Intel® 6300ESB 6300ESB I/O Controller Hub Package , BGA Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is , the geometric center of the top of the package case. The maximum component temperature specification , Packaging Technology The Intel 6300ESB 6300ESB ICH component is available in a 37.5 mm square package as shown in Appendix A, "Mechanical Drawings". Package information is also provided in the Intel® 6300ESB 6300ESB I/O ... | Original |
14 pages, |
6300ESB 6300ESB abstract |
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| Abstract: Intel® IXF1010 IXF1010 10-Port 100/1000 Mbps Ethernet Media Access Controller Specification Update July , INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A ... | Original |
15 pages, |
IXF1010 IXF1010 abstract |
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| Abstract: package." Thermal solutions should be designed to support the processor package. See the Intel® IXP2400 IXP2400 , Package Dimensionsa 1356 BGA Symbol Min Nomimal Max A 3.816 4.138 4.46 A1 , Package Dimensionsa (Continued) 1356 BGA Symbol Min Nomimal e 0.750 S2 a. 1.00 S1 , package. For reference, Intel uses strain gauges configured in a 60-mil stacked rectangular rosette with , Intel® IXP2400 IXP2400 Network Processor Electrical, Mechanical, and Thermal Specification (EMTS ... | Original |
18 pages, |
STRAIN GAUGE rosette strain gauge INTEL fcBGA PACKAGE thermal resistance fcBGA PACKAGE thermal resistance FCBGA diode B1205 BGA heatsink compressive force IXP2400 IXP2400 abstract |
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| Abstract: Number 1 8 DOCUMENTATION CHANGES 82815EP 82815EP 544 BGA Ball-Out Package is Corrected Specification , MCH R Documentation Changes 1. 82815EP 82815EP 544 BGA Ball-Out Package is Corrected Reference Section 5.2, Package Information. Replace Figure 13 with the following correct 544 BGA ballout package , R Intel 815 Chipset Family: 82815EP 82815EP and 82815P 82815P Memory Controller Hub (MCH) Specification Update June 2001 ® Notice: The Intel 82815EP 82815EP and 82815P 82815P MCH may contain design defects or errors ... | Original |
15 pages, |
82801AA intel 82815P BGA SPEC 82801ba download Intel 815 FW82815 motherboard FW82815E ICH2 intel 815 processor cross reference 82815EP pentium III motherboard ISA intel 815ep intel 82815 Intel 815 FW82815 82815EP abstract |
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| Abstract: 0.13 u Technology Number 1 8 DOCUMENTATION CHANGES 82815 544 BGA Ball-Out Package Dimensions , signals (specifically H_ADS#) on the board, package, and die. The A-2 stepping of the Intel 815 chipset , GMCH Documentation Changes 1. 82815 544 BGA Ball-Out Package Dimensions Is Corrected Reference Section 5.2,Package Information, in the datasheet. Replace Figure 13 with the following correct 544 BGA , R Intel 815 Chipset Family: 82815 Graphics and Memory Controller Hub (GMCH) Specification ... | Original |
17 pages, |
82801AA 82815EP 82815G BGA SPEC 82815 82815EG 82801BA 82801AA intel pentium III motherboard ISA 82815 BGA PACKAGE TOP MARK intel marking a0 intel 82815 Intel 815 FW82815 FW82815 sl4df datasheet abstract |
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| Abstract: Clarifications 1. Package Dimensions (Bottom View) Figure 19, "Intel® 82865G 82865G GMCH Package Dimensions (Bottom , R Intel® 865G/865GV 865G/865GV Chipset Specification Update Intel® 82865G/82865GV 82865G/82865GV Graphics Memory Controller Hub (GMCH) January 2004 ® ® Notice: The Intel 82865G/Intel 82865GV 82865GV GMCH may contain , : 252515-003 ® R Intel 82865G/82865GV 82865G/82865GV GMCH INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL ... | Original |
17 pages, |
865GV RG82865g datasheet gmch SL743 FSB800 intel ddr problem 82865GV GMCH 82865GV Intel(R) 82865G Graphics Controller 82865G RG82865G SL743 RG82865GV RG82865G 865G/865GV 865G/865GV 82865G/82865GV 865G/865GV abstract |
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| Manufacturing Advantage Tips for the uBGA* Package - Device Placement - Topside Mark uBGA* Package: Device Placement The topside mark The picture below shows a top view of the uBGA package, and shows the Pin 1 Indictor dot located in the upper left corner of the device. This should be used for package orientation only , and should not be used for package location, since it has a very wide tolerance versus other package features. If you are only able to perform top vision alignment www.datasheetarchive.com/files/intel/design/quality/ubga/topside.htm |
Intel | 04/08/1998 | 2.55 Kb | HTM | topside.htm |
| Manufacturing Advantage Tips for the uBGA* Package - Device Placement - Topside Mark uBGA* Package: Device Placement The topside mark The picture below shows a top view of the uBGA package, and shows the Pin 1 Indictor dot located in the upper left corner of the device. This should be used for package orientation only , and should not be used for package location, since it has a very wide tolerance versus other package features. If you are only able to perform top vision alignment www.datasheetarchive.com/files/intel/design/quality/ubga/topside-v1.htm |
Intel | 30/04/1998 | 2.55 Kb | HTM | topside-v1.htm |
| /07/98 uBGA* Package Mark Change The mark diagram on all uBGA* packages will be changed. The Intel logo /16/99 Intel® StrataFlash Memory 64 Mb uBGA* Package To improve manufacturability, changes are being made to line of the device mark on the uBGA package. See figure 2. General devices, the top line of the mark diagram will be changed showing the device configuration. Customers will records are listed at the top of the index table. To search, scroll up or down the index table from this www.datasheetarchive.com/files/intel/products one/design/pcn/flash/index.htm |
Intel | 30/04/1999 | 11.53 Kb | HTM | index.htm |
| background information why Intel chose the uBGA package as their CSP solution of choice for Flash memory provide escape routing designs for Intel Flash memory uBGA packages. These files can be downloaded information for Small Outline Packages (SOP) and uBGA* packages can be found in the packaging data section of Intel's web site. Small Outline Packages include 32L, 40L, 48L, and 56L Thin Small Outline Packages (TSOP), 44L Plastic Small Outline Packages (PSOP), and 56L Shrink Small Outline Packages (SSOP). The uBGA www.datasheetarchive.com/files/intel/design/flash/swtools/gloss.htm |
Intel | 01/02/1999 | 39.69 Kb | HTM | gloss.htm |
| background information why Intel chose the uBGA package as their CSP solution of choice for Flash memory provide escape routing designs for Intel Flash memory uBGA packages. These files can be downloaded information for Small Outline Packages (SOP) and uBGA* packages can be found in the packaging data section of Intel's web site. Small Outline Packages include 32L, 40L, 48L, and 56L Thin Small Outline Packages (TSOP), 44L Plastic Small Outline Packages (PSOP), and 56L Shrink Small Outline Packages (SSOP). The uBGA www.datasheetarchive.com/files/intel/products one/design/flash/swtools/gloss.htm |
Intel | 30/04/1999 | 40.07 Kb | HTM | gloss.htm |
| 03/04/99 Topside Mark Change for A80960JT/JC/JS A80960JT/JC/JS A80960JT/JC/JS A80960JT/JC/JS Products Assembled at Kyocera Intel will . Products listed in this document include all the specs, package types, and speeds except where noted. Intel records are listed at the top of the index table. To search, scroll up or down the index table from this 04/20/99 Rev 1: Product Discontinuance of 5V version of 80960JX 80960JX 80960JX 80960JX Intel is discontinuing the question will reflect the transition in ownership from Digital® to Intel®. Product Marking www.datasheetarchive.com/files/intel/products one/design/pcn/emb_ia/index.htm |
Intel | 30/04/1999 | 21.53 Kb | HTM | index.htm |
| Processor and Mobile Celeron Processor in the BGA1 and the mPGA1 Packages Revision 1 corrects the Microcode PPGA Package Intel is releasing two new production microcode updates, MU166502 MU166502 MU166502 MU166502 for the Intel® Celeron processor in the PPGA package and MU166009 MU166009 MU166009 MU166009 for the Intel Celeron processor in the SEPP package For Intel® Celeron Processors in PPGA Package Intel is introducing a new design for the clip used to attach the fan heatsink for the boxed Intel® Celeron processor in PPGA package to the motherboard www.datasheetarchive.com/files/intel/products one/design/pcn/ia/index.htm |
Intel | 30/04/1999 | 32.69 Kb | HTM | index.htm |
| use BSDL (Boundary Scan Description Language) files to create a Package for BGA + package_wire_width, -pac_width /2 + package_wire_width); // mark edge on pin 1 printf("SET WIRE for text file") { dlgLabel("Only BGA packages can auto generated #usage "Make Symbol, Device, Package or use Package in LBR\n" " " // * Xilinx BSM-Files // "port (" - without spaces // * Intel .bsdl www.datasheetarchive.com/download/49086154-299170ZC/eagle-m11-ger-4.15_3.tar |
Kaleidoscope | 08/06/2005 | 34930 Kb | TAR | eagle-m11-ger-4.15_3.tar |
| use BSDL (Boundary Scan Description Language) files to create a Package for BGA + package_wire_width, -pac_width /2 + package_wire_width); // mark edge on pin 1 printf("SET WIRE for text file") { dlgLabel("Only BGA packages can auto generated #usage "Make Symbol, Device, Package or use Package in LBR\n" " " // * Xilinx BSM-Files // "port (" - without spaces // * Intel .bsdl www.datasheetarchive.com/download/80892771-299169ZC/eagle-m11-eng-4.15.tar |
Kaleidoscope | 08/06/2005 | 34650 Kb | TAR | eagle-m11-eng-4.15.tar |
| use BSDL (Boundary Scan Description Language) files to create a Package for BGA + package_wire_width, -pac_width /2 + package_wire_width); // mark edge on pin 1 printf("SET WIRE for text file") { dlgLabel("Only BGA packages can auto generated #usage "Make Symbol, Device, Package or use Package in LBR\n" " " // * Xilinx BSM-Files // "port (" - without spaces // * Intel .bsdl www.datasheetarchive.com/download/73311805-299168ZC/eagle-lin-ger-4.15.tar |
Kaleidoscope | 08/06/2005 | 34450 Kb | TAR | eagle-lin-ger-4.15.tar |