500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices

BGA OUTLINE DRAWING

Catalog Datasheet MFG & Type PDF Document Tags

PB1107

Abstract: BGA OUTLINE DRAWING Side View Coplanarity not to exceed 0.12mm 49-Ball Chip Array BGA Outline Drawing 17.00 NOM , exceed 0.15mm 208-Ball Fine Pitch BGA Outline Drawing Lattice Semiconductor Home Page: http , counts from 144 to over 500. Package outline drawings for the 49-Ball Chip Array BGA and 208-Ball Fine , Pitch BGA Packages Introduction Lattice Semiconductor has announced the availability of advanced Chip Array and Fine Pitch BGA (ball grid array) packages for its ISP logic devices. The first Lattice
Lattice Semiconductor
Original

MARKING CODE AA4

Abstract: rise mp6 .36 FIGURE 16. BGA OUTLINE DRAWING .37 FIGURE 16. BGA OUTLINE DRAWING ( FIGURE 16. BGA OUTLINE DRAWING (CONTINUED , .37 4.1 387 BALL BGA MECHANICAL DRAWING , Technology with 3.3V I/O and 2.0V Core · Low Profile 387-Terminal BGA Package 2 TM All rights
Rise Technology
Original

BU-6474XB

Abstract: BU-64840R3 Corporation Make Sure the next Card you purchase has. Figure 1: Micro-ACE TE BGA Outline Drawing Figure 2: Micro-ACE BGA Outline Drawing BOTTOM VIEW BOTTOM VIEW .815 [20.70] (MAX) SQUARE , are the world's smallest extended temperature range MIL-STD-1553 terminals. With a BGA package body , Micro-ACE verison is available in a 128-ball BGA package, rated for -40°C to +85°C operation. The , -Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant Logic Signals (PCI
Data Device
Original
BU-6474XB BU-64840R3 BU-64860B3 BU-6174 BU-6184 BU-6181 BU-64863B8-600 1-800-DDC-5757 A5976

bu61740b

Abstract: BU-61860B Device Corporation Make Sure the next Card you purchase has. Figure 1: Micro-Ace TE BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) Figure 2: Micro-Ace BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) .065 [1.65] (TYP) 18 17 16 15 14 , MIL-STD-1553 terminals. With a BGA package body of 0.64in², the Micro-ACE TE and PCI Micro-ACE TE are , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128-ball BGA package, rated for
Data Device
Original
bu61740b BU-61860B DDC total ace 1553 chip pcb footprint BU-61740B BU-BU-64863B 61840B

STANAG 3838

Abstract: BU-BU-64863B Make Sure the next Card you purchase has. Figure 1: Micro-ACE TE BGA Outline Drawing BOTTOM VIEW .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) Figure 2: Micro-ACE BGA Outline Drawing BOTTOM VIEW , MIL-STD-1553 terminals. With a BGA package body of 0.64in², the Micro-ACE TE and PCI Micro-ACE TE are , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128-ball BGA package, rated for , 324-Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant Logic
Data Device
Original
STANAG 3838 BU-61860B3-601

STANAG 3838

Abstract: BU-61740B3 µ-Ace BGA Outline Drawing Figure 1 0.140 [3.58] (MAX) .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP , Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest MIL-STD-1553 terminal , World's Smallest MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum Footprint Size , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 120 225 330 540 40 mA mA
Data Device
Original
BU-61740B3 BU-61740B3/61840B3/61860B3 128-B BU-6186

BU6184

Abstract: vram 64k µ-Ace BGA Outline Drawing Figure 1 0.140 [3.58] (MAX) .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP , Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest MIL-STD-1553 terminal , World's Smallest MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum Footprint Size , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 120 225 330 540 40 mA mA
Data Device
Original
BU6184 vram 64k BU-61840B3

BU-61860

Abstract: bc 352 b Corporation µ-Ace BGA Outline Drawing Figure 1 0.120 0.140 (3.05) [3.58] (MAX) .815 [20.70] (MAX , FEATURES Smallest Complete 1553 Terminal 128-Ball Plastic BGA Package 0.120 inch Max Height Enhanced , inches DESCRIPTION The µ-ACE (Micro-ACE) plastic BGA is the industry's smallest complete MIL-STD , BOTTOM VIEW Smallest Complete MIL-STD-1553 Terminal 128-Ball Plastic BGA 0.815 X 0.815 inch Maximum , CHARACTERISTICS Size 128-Ball BGA Package 16.0 12.0 10.0 20.0 MHz MHz MHz MHz 66 174 282 390 25 120
Data Device
Original
BU-61860 bc 352 b MIL-STD-883

MN-6186X-001

Abstract: BU-69092 BGA Outline Drawing *A 12 EQ. SP. @ 0.0394 (1.00) = .473 (12) (TOL NONCUM) (TYP) 24 23 22 21 20 19 , plastic BGA package with direct and/or transformer coupled 1553 connections inside. Key Features · 1 , Small Package: - 312 Ball BGA (1.1 in. x 0.6 in.) (27.9 mm x 15.2 mm) - 0.185" (4.7 mm) Max Height · , 13 matrix) BGA package, and is rated for -40°C to +100°C operation. The required isolation transformers (with "Transformer Coupled" output ratios) are integrated within the plastic BGA package, and the
Data Device
Original
MN-6186X-001 BU-69092 BU-64843T BU648 MN-69092SX-002 BU-648 MIL-STD-1760 DO-254 AN/B-37 BU-69066S0-XX0 AS9100 PB-BU-64843T-7

BU-64843B8

Abstract: BU-64863B8-E02 µ-Ace TE BGA Outline Drawing Figure 1 .815 [20.70] (MAX) SQUARE .670 [17.02] (TYP) 0.015 [0.38] (REF , Range: -40°C to +100°C · Thermally Enhanced (TE) BGA package · Options for 3.3 volt only, 5.0 volt only , -1553 terminals. With a BGA package body of 0.64in2, the Micro-ACE TE and PCI Micro-ACE TE are ideal for extended , Die (0JB,) Note 3 324 Ball BGA Operating Thermal Balls Temperature -40 Operating Junction Temperature , Body Size 324 ball BGA 15 +100 +150 +150 +300 °C/W °C °C °C °C 0.18 0.31 0.71 1.08 1.83 W W
Data Device
Original
BU-64843B8 BU-64863B8-E02 BU-64860B3-E02 BU-65863B8-E02 BU-64840B3-E02 BU-64840B3 BU-6484XB 6486XB 6584XB 6586XB BU-65843B8 BU-65863B8

639X

Abstract: LGA 1150 hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 7 x 12 , Outline for µBGA (Micro Ball Grid Array) and TFBGA (Thin Fine Pitch BGA) 6.39 x 6.37 mm Po Ko D , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5
STMicroelectronics
Original
639X LGA 1150
Abstract: Outline for BGA (Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm Ko D BALL "A1" REFERENCE , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 7 x 12 , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , Ko D1 P USER DIRECTION OF FEED AI00652 Drawing is not to scale. Table 3. Carrier Tape STMicroelectronics
Original

LGA 1150

Abstract: measured as true position of pocket, not pocket hole. Figure 4. Carrier Tape Outline for BGA (Ball Grid , Outline for LFBGA (Low Profile Fine Pitch BGA) 8 x 9 mm Ko D BALL "A1" Po REFERENCE T E , pocket, not pocket hole. Figure 6. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA) 7 x 12 , (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , AI00652 Drawing is not to scale. Table 3. Carrier Tape Constant Dimensions Tape Size Ao, Bo, Ko
STMicroelectronics
Original

SG-BGA-7090

Abstract: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB , Assembled 8.0mm + IC thickness 6 2 Epoxy Customer's BGA IC Side View (Section AA) 5 15.2mm Customer's Target PCB Scale: - SG-BGA-7090 Drawing Status: Released © 2007 IRONWOOD , www.ironwoodelectronics.com Drawing: J. Glab Date: 04/30/07 File: SG-BGA-7090 Dwg Modified: Rev: B All , notice. PAGE 1 OF 4 Recommended PCB Layout Top View +0.03mm - 0.08mm socket base outline
Ironwood Electronics
Original
DP110

SG-BGA-6236

Abstract: Customer's BGA IC Side View (Section AA) 5 15.2mm SG-BGA-6236 Drawing © 2007 IRONWOOD , GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB , www.ironwoodelectronics.com Customer's Target PCB Status: Released Scale: - Rev: A Drawing: J. Glab Date: 09 , socket base outline Recommended PCB Layout Top View 15.19mm 12.7mm Ø 0.43mm (x104) +0.03mm - 0.08mm socket base outline 15.19mm 12mm 0.8mm typ. 1.27mm typ. Target PCB
Ironwood Electronics
Original

handbook philips ic26 packaging

Abstract: AN01026 standard machines or materials. Philips Semiconductors offers several (LF)BGA outline versions with , specifications of, for example, the BGA substrates can change over time. 1.1 OUTLINE VERSIONS This , drawing in Data Handbook IC26: Integrated Circuit Packages. Table 1 PACKAGE NAME PHILIPS OUTLINE CODE , OUTLINE DIMENSIONS BGA256 SOT466-1 27 × 27 × 1.75 12 Philips Semiconductors BGA , APPLICATION INFORMATION AN01026 (LF)BGA APPLICATION NOTE ATO INNOVATION, PHILIPS
Philips Semiconductors
Original
BGA304 handbook philips ic26 packaging land pattern BGA 0.75 BGA OUTLINE DRAWING LR-735 stencil tension LFBGA144 BGA292 BGA316 BGA388 BGA492

IC 7109

Abstract: 7109 GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , 2 8 6 7 10 Side View (Section AA) 10 11 Customer's BGA IC SG-BGA-7109 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 5 , . Customer's Target PCB Status: Released Scale: - Rev: B Drawing: J. Glab Date: 10/05/07 , Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes
Ironwood Electronics
Original
IC 7109 7109 FR4/G10 5M-1994

SG-BGA-7051

Abstract: (Section AA) 10 11 Customer's BGA IC SG-BGA-7051 Drawing © 2005 IRONWOOD ELECTRONICS, INC , GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling , : B Drawing: H. Hansen Date: 5/10/05 File: SG-BGA-7051 Dwg Modified: 6/2/09, AE All , notice. PAGE 1 of 4 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Note: Full BGA pattern shown. Please adjust pattern according to
Ironwood Electronics
Original

90Pb 10Sn solder paste

Abstract: 97Pb Outline for Discussion · · · · · · Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability 2 Why BGA , 483 Pin CBGAs 10 Motorola 119 Pin, 14x22 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 11 Motorola 360 Pin, 25 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 12 Motorola 483 Pin, 29 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy
Motorola
Original
90Pb 10Sn solder paste 97Pb ceramic rework pcb warpage in ipc standard BGA Solder Ball collapse bga rework

ceramic rework

Abstract: CCGA Outline for Discussion · · · · · · Why BGA? CBGA Introduction and Package Description PC , Freescale Semiconductor 10 Motorola 119 Pin, 14x22 mm CBGA Case Outline Drawing Note: This is an uncontrolled copy 11 Freescale Semiconductor Motorola 360 Pin, 25 mm CBGA Case Outline Drawing Note , Outline Drawing Note: This is an uncontrolled copy 13 Freescale Semiconductor Incoming PCB , Semiconductor 2 Why BGA? · Advantages: ­ Higher Surface Mount Assembly Yield. » Coarse Pitches
Freescale Semiconductor
Original
CCGA 304-pin ltcc 360-Pin freescale C4 to BGA MPC107 BGA PROFILING
Showing first 20 results.