NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: PHY QT2225 QT2225 Power Supply -XAUI PHY -XAUI PHY 1.2V 900 BGA 15x15 9.9-10.57 Gbps 1.2V, 1.8V 1300 BGA 13x13 C L/R 9.9-10.57 Gbps 1.2V, 1.8V 1300 BGA 13x13 C L/R 4 x3.125 Gbps -XAUI PHY 1.2V 900 BGA 13x13 C L/R 9.9-10.57 Gbps 1.2V, 1.8V 2600 BGA 23x23 C L/R 9.9-10.57 Gbps 1.2V, 1.8V 2600 BGA 23x23 C L/R ... | Original |
47 pages, |
S3485 S1221 AMCC VOLTA-192 S19237 rubicon S1217 S4882 S1217 AMCC QT2022 QT2032 TOSA ROsa S19258 BGA 23X23 S19233 S19262 datasheet abstract |
|
|||
| Abstract: FPN 3.3X3.3 BGA 17x17 MINIMELF FPN 3X3 BGA 13.5x5.5 BGA 19x19 BGA 21X21 21X21 BGA 23x23 , temperature constraints required by Lead-free soldering. c. BGA packages and Flip-Chip For the products , the attached roadmap. For SnAgCu finishing (BGA) the compatibility is not fully guaranteed (soldering , family) Package family BGA Big BGA Small CDIP Diodes DPAK HiQuad Metal Cans PDIPs PLCCs PSO , Package Family Macro Package Package Family Macro Package BGA 27x27 BGA big CDIP F/S 24 ... | Original |
14 pages, |
pqfp 14x20 upsd STD-020C smd marking code sot-23 infineon AN2033 psd3xx SMD Marking Code 380 SOT 23 SMD E4 sot TSOP 14X20 TQFP 14X20 HiQuad package Infineon technology roadmap HEPTAWATT SMD MLD-MIC/05/943 MLD-MIC/05/943 abstract |
|
|||
| Abstract: 19x19 BGA 21X21 21X21 BGA 23x23 DPAK HiQuad BGA 3.5X4.0 BGA 3x3 DPAK QFN FPN 4X4 HI-QUAD , meet the higher soldering temperature constraints required by Lead-free soldering. c. BGA packages , will implement its conversion schedule, as per the attached roadmap. For SnAgCu finishing (BGA) the , (by package family) Package family BGA Big BGA Small CDIP Diodes DPAK HiQuad Metal Cans , Family Macro Package Package Family Macro Package Package Family Macro Package BGA ... | Original |
12 pages, |
AN2036 JEDEC DO-216aa JESD97 AN2035 POWERSsO36 smd diode marking code TO3 SMD E4 sot smd marking code stmicroelectronics STD-020C STMICROELECTRONICS MSL STMICROELECTRONICS MSL SO-8 AN2034 HEPTAWATT SMD CRP/04/744 CRP/04/744 abstract |
|
|||
| Abstract: 1.2 V, 1.8 V 1500 BGA 13x13 K L/R QT2225 QT2225 Dual 1G/10GE 1G/10GE Serial-to-XAUI PHY/EDC for SFP+, XFP and 10GBASE-KR 10GBASE-KR 1.25 Gbps 9.9-10.52 Gbps 1.2 V, 1.8 V 3000 BGA 23x23 K L/R , BGA 23x23 K L/R K = 0C to +80C L = Leaded; R = RoHS Compliant 1 2 Transport Products , Gbps 1.2 V 900 BGA 15x15 K L/R Data Rate Power Supply QT2025 QT2025 1G/10GE 1G/10GE Serial-to-XAUI PHY/EDC for SFP+, XFP and 10GBASE-KR 10GBASE-KR 1.25 Gbps 9.9-10.52 Gbps 1.2 V, 1.8 V 1500 BGA ... | Original |
40 pages, |
Auto-Negotiation 10Gbase kr amcc qt2025 QT2032 S3485 OC-192 framer mapper s19227 G.975.1 S1217 AMCC S19263 sfp reference qt2025-1 S19233 QT2022 QT2025-1 S10124 QT2022/QT2032 QT2025 QT2022/QT2032 abstract |
|
|||
| Abstract: Temperature Range - 0ºC - 70ºC (commercial) Package - 324 pin BGA, 23x23 mm, 1.00 mm ball spacing Telephony ... | Original |
20 pages, |
VOCODERS voip voip AC498-DSP EPON ONU AC5012 AC488 AC49012 codec voip AC495E AC495 VOIP PROCESSORS ac494e data sheet AC48x AC491L datasheet abstract |
|
|||
| Abstract: Technical portal and online community for Design Engineers - www.element-14.com 717 Semiconductor Hardware & Thermal Management Page Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . . DIL Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DIMM Memory Sockets . . . . . . . . . . . . . . . . . . . . . Heatsinks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Extruded . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC/Microprocessor ... | Original |
38 pages, |
PGA zif socket 478 cooler clip LGA 1366 Socket PIN diagram LGA 1366 Socket diagram 840-AG11D-LF h128 transistor 723 ic WLFT 405 application DA 3807 transistor 2218 smd DIP ic 74 hc 59581 648-0562211-A01 702 transistor smd code datasheet abstract |
|
|||
| Abstract: ; 0.060" thick. 0.770" 1 0.128" 2 Side View 3 Description: BGA DUT Adaptor 505 position BGA ZIF Socket (0.05" centers, 23X23 array) to 22X22 22X22 PGA base array (484 position, 0.1" center). , 2.618" 2.600" BGA A1 PGA 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G 2 4 6 8 10 12 14 16 18 20 22 1 3 5 7 9 11 13 15 17 19 21 23 A B C D E F G H J K L M N P R T U V W Y AA AB AC 2.606" H J K L M 2.600" N P R ... | Original |
1 pages, |
DT-BGA505A-P-Z-01 23X23 22X22 BGA zif socket BGA 23X23 datasheet abstract |
|
|||
| Abstract: mm Pitch * 22x22 Array (4 Row Perim) * 36 Thermal Balls * 23x23 mm Body Size * 0.5 mm Package Pad * 0.6 mm Solder Ball Diam. = Test Board Trace = BGA Package Trace = Freescale Internal Use Only. Do , Semiconductor, Inc. 2004 * 1.0 mm Pitch * 22x22 Array (4 Row Perim) * 36 Thermal Balls * 23x23 mm Body ... | Original |
2 pages, |
Solder Balls PBGA 23X23 324 PBGA 23x23 BGA 23X23 datasheet abstract |
|
|||
| Abstract: Description: Giga-snaP BGA SMT Land Socket 529 position BGA surface mount land pattern to terminal pins (0.8mm centers, 23x23 array) Tolerances: diameters �03mm [�001"], PCB perimeters �13mm [�005"], PCB ... | Original |
1 pages, |
LS-BGA529D-61 bga 529 BGA 23X23 datasheet abstract |
|
|||
| Abstract: (min.). Description: Giga-snaP BGA SMT Land Socket 304 position BGA surface mount land pattern to terminal pins (1.27mm [0.050"] centers, 23x23 array) Tolerances: diameters ±0.03mm [±0.001"], PCB ... | Original |
1 pages, |
LS-BGA304A-31 BGA 23X23 datasheet abstract |
|
|||
| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
|||||
| MiniBGA 23x23 PBGA 23x23 PBGA 256 Mini-BGA 256 Mini-BGA 256-PBGA 256-PBGA 256-PBGA 256-PBGA 160 Mini-BGA, 169-PBGA 169-PBGA 169-PBGA 169-PBGA, 176 LQFP 160 Mini-BGA~,~169-PBGA 169-PBGA 169-PBGA 169-PBGA~,~176 LQFP ADSP-BF532 ADSP-BF532 ADSP-BF532 ADSP-BF532 .8-1.2 0.8-1.2 Yes Yes 160 Mini-BGA, 169-PBGA 169-PBGA 169-PBGA 169-PBGA, 176 LQFP 160 Mini-BGA~,~169-PBGA 169-PBGA 169-PBGA 169-PBGA Yes Yes Yes Yes 0.8-1.2 0.8-1.2 Yes Yes 160 Mini-BGA, 169-PBGA 169-PBGA 169-PBGA 169-PBGA 160 Mini-BGA~,~169-PBGA 169-PBGA 169-PBGA 169-PBGA ADSP-BF534 ADSP-BF534 ADSP-BF534 ADSP-BF534 ADSP-BF534 ADSP-BF534 ADSP-BF534 ADSP-BF534 http www.datasheetarchive.com/download/91891688-29665ZC/31-v1.xml |
Analog Devices | 12/04/2005 | 23.01 Kb | XML | 31-v1.xml |
| Packages SOT741-1 ; plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 BGA376 plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm 02-01-14 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot741-1-v2.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot741-1-v2.html |
| Packages SOT711-1 ; plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm SOT711-1 BGA240 plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm 01-11-01 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot711-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot711-1-v1.html |
| Packages SOT712-1 ; plastic ball grid array package; 289 balls; body 23 x 23 x 1.75 mm SOT712-1 BGA289 plastic ball grid array package; 289 balls; body 23 x 23 x 1.75 mm 01-11-01 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot712-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot712-1-v1.html |
| Packages SOT710-1 ; plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 BGA217 plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm 01-11-01 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot710-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot710-1-v1.html |
| Packages Information on package SOT712-1 plastic ball grid array package; 289 balls; body 23 x 23 x 1.75 mm Outline drawing Package version Package name Package description Drawing issue date SOT712-1 BGA289 plastic ball grid array package; 289 balls; body 23 x 23 x 1.75 mm 1/24/2003 General package information Soldering www.datasheetarchive.com/files/philips/packages/sot712-1-v2.html |
Philips | 16/06/2005 | 1.9 Kb | HTML | sot712-1-v2.html |
| Packages Information on package SOT812-1 plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm Outline drawing Package version Package name Package description Drawing issue date SOT812-1 BGA288 plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm 5/15/2003 General package information Soldering www.datasheetarchive.com/files/philips/packages/sot812-1.html |
Philips | 16/06/2005 | 1.9 Kb | HTML | sot812-1.html |
| Packages Information on package SOT741-1 plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm Outline drawing Package version Package name Package description Drawing issue date SOT741-1 BGA376 plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm 02-01-14 General package information Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot741-1.html |
Philips | 24/04/2003 | 1.8 Kb | HTML | sot741-1.html |
| Packages Information on package SOT711-1 plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm Outline drawing Package version Package name Package description Drawing issue date SOT711-1 BGA240 plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm 11/1/2001 General package information Soldering www.datasheetarchive.com/files/philips/packages/sot711-1-v2.html |
Philips | 16/06/2005 | 1.9 Kb | HTML | sot711-1-v2.html |
| Packages Information on package SOT741-1 plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm Outline drawing Package version Package name Package description Drawing issue date SOT741-1 BGA376 plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm 1/14/2002 General package information Soldering www.datasheetarchive.com/files/philips/packages/sot741-1-v1.html |
Philips | 17/06/2005 | 1.9 Kb | HTML | sot741-1-v1.html |