BAL99/BAV99/BAW56/BAV70 DS-221906 UL94-V0 MIL-STD-750 100OHM BAL99 BAV99 BAW56

BAL99/BAV99/BAW56/BAV70 Formosa MS List List. 1 Package

SMD Switching Diode BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 Formosa MS List List. 1 Package outline. 2 Features. 2 Mechanical data. 2 Maximum ratings . 2 Rating and characteristic curves. 3 Pinning information. 4 Marking. 4 Suggested solder pad layout. 4 Packing information. 5 Reel packing. 6 Suggested thermal profiles for soldering processes. 6 High reliability test capabilities.7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 Issued Date DS-221906 DS-221906 2008/02/10 Revised Date Revision 2009/02/10 B Page. 7 Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 350mW Surface Mount Switching Diode-75V Package outline Features 0.014 (0.35) (B) 0.020 (0.51) .084(2.10) .068(1.70) 0.108 (2.70) 0.124 (3.10) 0.042 (1.05) · Fast speed switching. · For general purpose switching application. · High conductance. · Silicon epitaxial planar chip. · Lead-free parts meet RoHS requirments. 0.034 (0.85) SOT-23 (C) (A) 0.072 (1.80) 0.024 (0.61) 0.047 (1.19) 0.012 (0.30) 0.120 (3.00) Mechanical data · Epoxy:UL94-V0 UL94-V0 rated flame retardant · Case : Molded plastic, SOT-23 · Terminals : Solder plated, solderable per 0.059 (1.47) 0.002 (0.05) R 0.05 (0.002) 0.01 (0.25) 0.084 (2.10) 0.035 (0.88) MIL-STD-750 MIL-STD-750, Method 2026 Dimensions in inches and (millimeters) · Polarity : Indicated by cathode band · Mounting Position : Any · Weight : Approximated 0.008 gram Maximum ratings (AT T =25 C unless otherwise noted) o A PARAMETER Symbol BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 t p = 1 us Non-Repetitive Peak Forward Surge Current V V RM Forward Continuous Current mW 75 100 V IF Non-Repetitive Peak Reverse current 350 VR Maximum Reverse Voltage 200 mA at t = 1. 0 uS at t = 1. 0 mS 2 I FSM Reverse Leakage Current A 1 at t = 1. 0 S Minimum Reverse Breakdown Voltage at I BR = 2.5 uAdc 0.5 V BR 75 uA 25 at VR = 20V at IF = 1.0mA uA 30 IR V 50 at VR = 75V, TJ = 150oC at VR = 25V, TJ = 150oC Forward Voltage UNIT P TOT Power Dissipation nA 0.715 at IF = 10mA 0.855 VF at IF = 50mA V 1.0 at IF = 150mA 1.25 Capacitance(V F = VR = 0V, f = 1.0MHz) CT Reverse Recovery Time(IF = IR = 10mA, IRR = 1mAdc, RL = 100OHM 100OHM) T rr 6 Thermal Resistance(junction to ambient) Cj 357 Operating Temperature Range Tj Storage Temperature Range http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 2.0 nS o C/W -55 ~ +150 o C -65 ~ +175 T STG o C Document ID Page 2 pF Issued Date DS-221906 DS-221906 2008/02/10 Revised Date Revision 2009/02/10 B Page. 7 Rating and characteristic curves for each diode (BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70) FIG.3 - TYPICAL REVERSE FIG.1-TYPICAL FORWARD CHARACTERISTICS CHARACTERISTICS TJ=25 C 1000 100 REVERSE CURRENT, (nA) INSTANTANEOUS FORWARD CURRENT,(mA) 1000 TJ=25 C Pulse Width 300us 1% Duty Cycle 10 Scattering Limit Scattering Limit 100 10 1.0 1 0.1 0 .4 .8 1.2 1.6 1 2.0 10 100 REVERSE VOLTAGE FORWARD VOLT AGE,(V) FIG.2 - TYPICAL DIODE CAPACITANCE 3.5 DIODE CAPACITANCE,(pF) 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1 820 OHM +10V 10 100 1000 REVERSE VOLTAGE,(V) 2K 100uH 0.1 uF IF tr tp t 0.1 uF t tr 10% DUT 50 OHM OUTPUT PULSE GENERATOR 50 OHM INPUT SAMPLING OSCILLOSCOPE 90% IR(REC)=1 mA VR OUTPUT PULSE (IF=IR=10mA;measured at iR(REC)=1mA) Notes : 1. A2.0 Kohm variable resistor adjusted for a forward Current (IF) of 10mA. 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. 3. tp >> trr. Recovery Time Equivalent Test Circuit http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 Issued Date DS-221906 DS-221906 2008/02/10 Revised Date Revision 2009/02/10 B Page. 7 SMD Switching Diode BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 Formosa MS Pinning information Type number Symbol Marking code A BAL99 BAL99 B L4, A6 C A BAV99 BAV99 B JG, A7 C A BAW56 BAW56 B JC, A1 C A BAV70 BAV70 B JA, A4 C Suggested solder pad layout SOT-23 0.037(0.95) 0.037(0.95) 0.079(2.0) 0.035(0.90) 0.031(0.80) Dimensions in inches and (millimeters) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 Issued Date DS-221906 DS-221906 2008/02/10 Revised Date Revision 2009/02/10 B Page. 7 Formosa MS SMD Switching Diode BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOT-23 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 3.15 2.77 1.22 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 Issued Date DS-221906 DS-221906 2008/02/10 Revised Date Revision 2009/02/10 B Page. 7 SMD Switching Diode BAL99/BAV99/BAW56/BAV70 BAL99/BAV99/BAW56/BAV70 Formosa MS Reel packing PACKAGE SOT-23 7" REEL (pcs) COMPONENT SPACING (m/m) BOX (pcs) 3000 REEL SIZE 4.0 30,000 REEL DIA, (m/m) INNER BOX (m/m) 183*183*123 178 CARTON SIZE (m/m) APPROX. GROSS WEIGHT (kg) CARTON (pcs) 382*262*387 11.6 240,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 oC~35 oC Humidity=65%±15% 2.Reflow soldering of surface-mount devices Critical Zone T L to T P tt P TP Ramp-up TL tt L Temperature T smax T smin TS tt s Preheat 25 Ramp-down T t25 oC to Peak Wave Soldering IR Reflow Time 3.Flow (wave)soldering (solder dipping) Profile Feature Soldering Condition Average ramp-up rate(T L to TP )