BA810 A15858-001 BA81010A AD1881 RJ-11 82801AA 82802AB IT8761E TUSB2046 OM09829 - Datasheet Archive

 

Intel Desktop Board BA810 Technical Product Specification March 2000 Order Number A15858-001 The Intel® Desktop Board BA810

 

® Intel Desktop Board BA810 BA810 Technical Product Specification March 2000 Order Number A15858-001 A15858-001 The Intel® Desktop Board BA810 BA810 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board BA810 BA810 Specification Update. Revision History Revision -001 Revision History First Release of the Specification Date Intel® Desktop Board BA810 BA810 Technical Product March 2000 This product specification applies to only standard BA810 BA810 boards with BIOS identifier BA81010A BA81010A.86A. Changes to this specification will be published in the Intel Desktop Board BA810 BA810 Specification Update before being incorporated into a revision of this document. Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The Intel® Desktop Board BA810 BA810 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333. Third-party brands and names are the property of their respective owners. Copyright © 2000, Intel Corporation. All Rights Reserved. Preface This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the BA810 BA810 board. It describes the standard BA810 BA810 board product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences. What This Document Contains Chapter 1 2 3 4 5 Description A description of the hardware used on this board A map of the resources of the board The features supported by the BIOS Setup program The contents of the BIOS Setup program's menus and submenus A description of the BIOS error messages, beep codes, and POST codes Typographical Conventions This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type. Notes, Cautions, and Warnings NOTE Notes call attention to important information. CAUTION Cautions are included to help you avoid damaging hardware or losing data. WARNING Warnings indicate conditions which, if not observed, can cause personal injury. iii Intel Desktop Board BA810 BA810 Technical Product Specification Other Common Notation # Used after a signal name to identify an active-low signal (such as USBP0#). (NxnX) When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area. KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) MB Megabit (1,048,576 bits) GB Gigabyte (1,073,741,824 bytes) xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. iv Megabyte (1,048,576 bytes) Mbit This symbol is used to indicate third-party brands and names that are the property of their respective owners. Contents 1 Board Description 1.1 Overview . 10 1.1.1 Feature Summary. 10 1.1.2 Board Layout. 11 1.1.3 Block Diagram . 12 1.2 Online Support. 13 1.3 Design Specifications . 13 1.4 Processor . 16 1.5 System Memory. 17 1.6 Intel® 810 Chipset. 18 1.6.1 Direct AGP . 19 1.6.2 USB. 19 1.6.3 USB Hub . 20 1.6.4 IDE Support. 20 1.6.5 Real-Time Clock, CMOS SRAM, and Battery . 20 1.7 I/O Controller . 21 1.8 Serial Port. 21 1.9 Graphics Subsystem. 22 1.10 Audio Subsystem. 23 1.10.1 AD1881 AD1881 Analog Codec . 24 1.10.2 Audio Connectors. 24 1.11 Modem Subsystem . 25 1.11.1 Software Modem . 25 1.11.2 Modem Codec. 25 1.11.3 Modem AT Commands and S-Register Settings . 25 1.11.4 Modem Specifications . 26 1.12 Power Management Features. 27 1.12.1 ACPI. 27 1.12.2 APM . 29 1.12.3 Hardware Support . 30 2 Technical Reference 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 Introduction. 35 Memory Map. 35 I/O Map. 36 DMA Channels . 37 PCI Configuration Space Map . 38 Interrupts . 38 PCI Interrupt Routing Map . 39 Connectors . 40 2.8.1 Back Panel I/O Connectors . 41 2.8.2 Internal I/O Connectors . 44 2.8.3 External I/O Connectors . 48 Jumper Block. 51 v Intel Desktop Board BA810 BA810 Technical Product Specification 2.10 Mechanical Considerations. 53 2.10.1 FlexATX Form Factor . 53 2.10.2 I/O Shield . 54 2.11 Electrical Considerations . 55 2.11.1 Power Consumption . 55 2.11.2 Power Supply Considerations. 55 2.11.3 Fan Power Requirements. 56 2.12 Thermal Considerations. 57 2.13 Reliability . 58 2.14 Environmental. 59 2.15 Regulatory Compliance . 59 2.15.1 Safety Regulations . 59 2.15.2 EMC Regulations . 60 2.15.3 Telecommunications Regulations. 60 2.15.4 Telecommunications Regulatory Information. 61 2.15.5 Certification Markings . 64 3 Overview of BIOS Features 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 Introduction. 65 BIOS Flash Memory Organization . 66 Resource Configuration . 67 3.3.1 PCI Autoconfiguration. 67 3.3.2 PCI IDE Support. 67 System Management BIOS (SMBIOS) . 68 BIOS Updates. 69 3.5.1 Language Support. 69 3.5.2 Custom Splash Screen. 69 Recovering BIOS Data . 70 Boot Options. 71 3.7.1 Booting from CD-ROM . 71 3.7.2 Booting Without Attached Devices . 71 USB Legacy Support . 72 BIOS Security Features . 73 4 BIOS Setup Program 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 vi Introduction. 75 Maintenance Menu . 76 Main Menu. 77 Advanced Menu. 78 4.4.1 Boot Configuration Submenu. 79 4.4.2 Peripheral Configuration Submenu. 80 4.4.3 IDE Configuration . 81 4.4.4 Diskette Configuration Submenu . 83 4.4.5 Event Log Configuration . 84 Security Menu. 85 Power Menu . 86 Boot Menu . 87 Exit Menu . 88 Contents 5 Error Messages and Beep Codes 5.1 5.2 5.3 5.4 BIOS Error Messages. 89 Bus Initialization Checkpoints . 91 Speaker . 92 BIOS Beep Codes . 93 Figures 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Board Components. 11 Block Diagram . 12 Intel 810 Chipset Block Diagram. 18 Block Diagram of Audio Subsystem with AD1881 AD1881 Analog Codec. 23 Location of Standby Power Indicator LED. 32 Back Panel I/O Connectors. 41 Internal I/O Connectors. 44 External I/O Connectors . 48 Location of the Jumper Block. 51 Board Dimensions . 53 I/O Shield Dimensions . 54 High Temperature Zones . 57 Memory Map of the Flash Memory Device. 66 Tables 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. Feature Summary. 10 Specifications . 13 Supported Processors . 16 System Memory Configuration. 17 Supported Graphics Refresh Rates . 22 Modem Specifications. 26 Effects of Pressing the Power Switch . 27 Power States and Targeted System Power . 28 ACPI Wake Up Devices and Events . 29 APM Wake Up Devices and Events. 30 Fan Connector Descriptions . 31 System Memory Map. 35 I/O Map. 36 DMA Channels . 37 PCI Configuration Space Map . 38 Interrupts . 38 PCI Interrupt Routing Map . 39 USB Connectors. 42 VGA Port Connector . 42 Audio Line Out Connector. 43 Mic In Connector . 43 RJ-11 RJ-11 Telephone Jack. 43 Processor Fan Connector (J5J1) . 45 Power Connector (J7G3) . 45 Diskette Drive Connector (J7D1) . 46 vii Intel Desktop Board BA810 BA810 Technical Product Specification 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. 47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. viii IDE Connector (J7B1). 47 Chassis Fan Connector (J1A1) . 47 USB Port Connector (J7G1) . 49 Front Panel Connector (J7G2) . 49 Serial Port Connector (J7C1). 49 States for a Single-colored Power LED. 50 States for a Dual-colored Power LED . 50 BIOS Setup Configuration Jumper Settings (J6A1). 52 Power Usage . 55 Chassis Fan (J1A1) DC Power Requirements . 56 Thermal Considerations for Components. 58 Board Environmental Specifications . 59 Safety Regulations. 59 EMC Regulations. 60 Telecommunications Regulations . 60 Supervisor and User Password Functions . 73 BIOS Setup Program Menu Bar. 75 BIOS Setup Program Function Keys. 76 Maintenance Menu . 76 Main Menu. 77 Advanced Menu. 78 Boot Configuration Submenu. 79 Peripheral Configuration Submenu . 80 IDE Device Configuration. 81 Primary IDE Master/Slave Submenus. 82 Diskette Configurations Submenu. 83 Event Log Configuration Submenu . 84 Security Menu. 85 Power Menu . 86 Boot Menu . 87 Exit Menu . 88 BIOS Error Messages. 89 Bus Initialization Checkpoints . 91 Upper Nibble High Byte Functions . 91 Lower Nibble High Byte Functions . 92 Beep Codes. 93 1 Board Description What This Chapter Contains 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 Overview . 10 Online Support. 13 Design Specifications . 13 Processor . 16 System Memory. 17 Intel® 810 Chipset. 18 I/O Controller . 21 Serial Port. 21 Graphics Subsystem. 22 Audio Subsystem. 23 Modem Subsystem . 25 Power Management Features. 27 9 Intel Desktop Board BA810 BA810 Technical Product Specification 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the BA810 BA810 board's major features. Table 1. Feature Summary Form Factor FlexATX (9.0 inches by 7.2 inches) Processor Support for either an: · Intel® Pentium® III processor with 256 KB L2 cache (in an FCPGA package) · Intel® CeleronTM processor with 128 KB L2 cache (in a PPGA package) Memory · One 22° 168-pin dual inline memory module (DIMM) socket · Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM) · Support for a serial presence detect (SPD) or a non-SPD DIMM Chipset Intel® 810 Chipset, consisting of: · Intel® 82810 Graphics/Memory Controller Hub (GMCH) · Intel® 82801AA 82801AA I/O Controller Hub (ICH) · Intel® 82802AB 82802AB 4 Mbit Firmware Hub (FWH) Instantly Available PC · Support for PCI Local Bus Specification, Revision 2.2 · Suspend-to-RAM support · Wake from USB Accelerated Graphics Port (AGP) Video · Intel 82810 GMCH graphics support · 4 MB display cache Audio Audio Codec '97 (AC'97) compatible audio subsystem, consisting of the following: · Intel 82801AA 82801AA ICH (AC link output) · Analog Devices AD1881 AD1881 analog codec I/O Controller IT8761E IT8761E Low Pin Count (LPC) I/O controller Onboard modem · Motorola SM56 AC-L (AC link) software modem · Silicon Laboratories Si3038 family MC '97 modem codec TUSB2046 TUSB2046 USB Hub Peripheral Interfaces BIOS · · · · · Intel/AMI BIOS stored in an Intel 82802AB 82802AB 4 Mbit Firmware Hub (FWH) · Support for Advanced Configuration and Power Interface (ACPI), Advanced Power Management (APM), Plug and Play, and SMBIOS Four universal serial bus (USB) ports One IDE interface with Ultra DMA support One diskette drive interface One 9-pin serial port connector NOTE The BA810 BA810 board is designed to support only USB-aware operating systems. For information about The board's compliance level with ACPI, APM, Plug and Play, and SMBIOS 10 Refer to Table 2, page 13 Board Description 1.1.2 Board Layout Figure 1 shows the location of the major components on the board. A B Q P O C D E N M L F G K J I H OM09829 OM09829 A B C D E F G H I Back panel connectors Intel 82810 Graphics Memory Controller Hub (GMCH) Processor socket Battery 22 DIMM socket Speaker USB hub Front panel connector Power connector J K Diskette drive connector IT8761E IT8761E I/O controller L M N O P Q IDE connector Intel 82801AA 82801AA I/O Controller Hub (ICH) Intel 82802AB 82802AB Firmware Hub (FWH) 4 MB display cache AD1881 AD1881 analog codec Modem codec devices Figure 1. Board Components 11 Intel Desktop Board BA810 BA810 Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board. USB Bus Primary IDE Port 1 ATA-33/66 ATA-33/66 Port 2 Processor Socket 66/100 MHz System Bus Port 3 USB Hub Controller Port 4 810 Chipset 100 MHz SDRAM Bus 82810 Graphics Memory Controller Hub (GMCH) AHA Bus DIMM Socket VGA Port 82802AB 82802AB Firmware Hub (FWH) 82801AA 82801AA I/O Controller Hub (ICH) LPC Bus Display Interface Diskette Drive Connector 100 MHz 4 MB Display Cache LPC I/O Controller Analog Codec AC Link Modem Codec Serial Port Connector Line Out Mic In RJ-11 RJ-11 Connector OM09131 OM09131 Figure 2. Block Diagram 12 Board Description 1.2 Online Support Find information about Intel® desktop boards under "Product Info" or "Customer Support" at these World Wide Web sites: http://www.intel.com/design/motherbd 1.3 Design Specifications Table 2 lists the specifications applicable to the BA810 BA810 board. Table 2. Specifications Version, Revision Date, and Ownership The specification is available from. Audio Codec `97 Version 2.1, May 22, 1998, Intel Corporation. http://developer.intel.com/ ial/scalableplatforms/ audio/index.htm ACPI Advanced Configuration and Power Interface Specification Version 1.0b, February 2, 1999, Intel Corporation, Microsoft Corporation, and Toshiba Corporation. http://www.teleport.com/ ~acpi/ AGP Accelerated Graphics Port Interface Specification Version 2.0, May 4, 1998, Intel Corporation. http://www.intel.com/ technology/agp/ agp_index.htm AMI BIOS American Megatrends BIOS Specification AMIBIOS 99, June 1999, American Megatrends, Inc. http://www.ami.com/ amibios/bios.platforms. desktop.html APM Advanced Power Management Specification Version 1.2, February, 1996, Intel Corporation and Microsoft Corporation. http://www.microsoft.com/ hwdev/busbios/ amp_12.htm ATAPI Information Technology AT Attachment with Packet Interface Extensions T13/1153D T13/1153D Version 18, August 19, 1998, Contact: T13 Chair, Seagate Technology. T13 Anonymous FTP Site: ftp://fission.dt.wdc.com/ x3t13/project/ d1153r18.pdf ATX ATX Specification Revision 2.01, February 1997, Intel Corporation. http://developer.intel.com/ design/motherbd/atx.htm El Torito Bootable CD-ROM Format Specification Version 1.0, January 25, 1995, Phoenix Technologies Ltd. and IBM Corporation. the Phoenix Technologies Web site at: http://www.ptltd.com/ techs/specs.html Description Specification Title AC `97 continued 13 Intel Desktop Board BA810 BA810 Technical Product Specification Table 2. Specifications (continued) Version, Revision Date, and Ownership The specification is available from. FlexATX addendum Addendum version 1.0 to the microATX Specification version 1.0, March 12, 1999, Intel Corporation. http://www.teleport.com/ ~ffsupprt/spec/ FlexATXaddn1_0.pdf Intel Celeron Processor January 2000, Intel Corporation. http://developer.intel.com/ design/intarch/celeron/ nodoc.htm Intel Celeron Processor Specification Update Version 22, February 2000, Intel Corporation. http://developer.intel.com/ design/intarch/celeron/ nodoc.htm Pentium III Processor for the PGA370 PGA370 Socket January 2000, Intel Corporation. http://developer.intel.com/ design/intarch/pentiumiii/ nodoc.htm Pentium III Processor Specification Update Version 13, February 2000, Intel Corporation. http://developer.intel.com/ design/intarch/pentiumiii/ nodoc.htm LPC Low Pin Count Interface Specification Version 1.0, September 29, 1997, Intel Corporation. http://www.intel.com/ design/chipsets/industry/ lpc.htm MicroATX microATX Motherboard Interface Specification Version 1.0, December 1997, Intel Corporation. http://www.teleport.com/ ~ffsupprt/spec/ microatxspecs.htm SFX Power Supply Design Guide Version 1.1, February 1998, Intel Corporation. http://www.teleport.com/ ~ffsupprt/spec/ microatxspecs.htm PCI Bus Power Management Interface Specification Version 1.1, December 18, 1998, PCI Special Interest Group. http://www.pcisig.com/ tech/availspecs.html#5 PCI Local Bus Specification Version 2.2, December 18, 1998, PCI Special Interest Group. http://www.pcisig.com/ tech/availspecs.html#5 Plug and Play Plug and Play BIOS Specification Version 1.0a, May 5, 1994, Compaq Computer Corp., Phoenix Technologies Ltd., and Intel Corporation. http://www.microsoft.com/ hwdev/respec/ pnpspecs.htm SDRAM DIMM (64-and 72-bit) PC SDRAM Unbuffered DIMM Specification Revision 1.0, February 1998, Intel Corporation. http://www.intel.com/ design/chipsets/memory/ pcsdram/spec/index.htm PC SDRAM Serial Presence Detect (SPD) Specification Revision 1.2B, November 1999, Intel Corporation. http://www.intel.com/ design/chipsets/memory/ pcsdram/spec/index.htm Description Specification Title FlexATX Intel Celeron Processor Intel Pentium III Processor PCI continued 14 Board Description Table 2. Specifications (continued) Version, Revision Date, and Ownership The specification is available from. System Management BIOS Version 2.3.1 March 16, 1999, American Megatrends Inc., Award Software International Inc., Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation. ftp://download.intel.com/ ial/wfm/smbios.pdf UHCI Universal Host Controller Interface Design Guide Version 1.1, March 1996, Intel Corporation. http://developer.intel.com/ design/USB/UHCI11D.htm USB Universal Serial Bus Specification Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC. http://www.usb.org/ developers/docs.html WfM Wired for Management Baseline Version 2.0, December 18, 1998, Intel Corporation. http://developer.intel.com/ ial/WfM/wfmspecs.htm Description Specification Title SMBIOS 15 Intel Desktop Board BA810 BA810 Technical Product Specification 1.4 Processor CAUTION The board supports processors that draw a maximum of 19.4 A. Using a processor that draws more than 19.4 A can damage the processor, the board, and the power supply. See the processor's data sheet for current usage requirements. The board supports a single Celeron processor or a single Pentium III processor as shown in Table 3. The system bus frequency is automatically selected. Table 3. Supported Processors Type Designation System Bus Frequency L2 Cache Size Pentium III processor in a FCPGA package 500E, 550E, 600E, 650, 700, 750, and 800 100 MHz 256 KB Celeron processor in a PPGA package 333, 366, 400, 433, 466, 500, 533, 566, and 600 66 MHz 128 KB All supported onboard memory can be cached, up to the cachability limit of the processor. For information about Table 2, page 13 Intel Pentium III processor datasheets and specification updates Table 2, page 13 Processor support for the BA810 BA810 board 16 Refer to Intel Celeron processor datasheets and specification updates http://support.intel.com/support/ motherboards/desktop Board Description 1.5 System Memory CAUTION To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should be populated with a DIMM that supports the Serial Presence Detect (SPD) data structure. If your memory module does not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation; however, the DIMM may not function at the determined frequency. CAUTION Because the main system memory is also used as video memory, the board requires a 100 MHz SDRAM DIMM even though the system bus frequency may be 66 MHz. It is highly recommended that an SPD DIMM be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted. The board has one 22º DIMM socket. The minimum memory size is 32 MB and the maximum memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency. The board supports the following memory features: · 3.3 V, 168-pin DIMM with gold-plated contacts · 100 MHz SDRAM · Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMM) · Non-ECC (64-bit) memory · Unbuffered single- or double-sided DIMM The board is designed to support a DIMM in the configurations listed in Table 4 below. Table 4. System Memory Configuration DIMM Size Non-ECC Configuration 32 MB 4 Mbit x 64 64 MB 8 Mbit x 64 128 MB 16 Mbit x 64 256 MB 32 Mbit x 64 For information about Refer to The PC Serial Presence Detect Specification Table 2, page 13 Obtaining copies of PC SDRAM specifications Table 2, page 13 17 Intel Desktop Board BA810 BA810 Technical Product Specification 1.6 Intel® 810 Chipset The Intel 810 chipset consists of the following devices: · 82810 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture (AHA) bus. · 82801AA 82801AA I/O Controller Hub (ICH) with AHA bus supports ATA-33 ATA-33 and ATA-66 ATA-66 devices, Suspend-to-RAM, and Wake from USB. · 82802AB 82802AB Firmware Hub (FWH). The chipset provides the system, memory, display, and I/O interfaces shown in Figure 3. 66/100 MHz System Bus ATA-33/66 ATA-33/66 USB 810 Chipset 82810 Graphics Memory Controller Hub (GMCH) 100 MHz SDRAM Bus AHA Bus 82801AA 82801AA I/O Controller Hub (ICH) Display Cache 82802AB 82802AB Firmware Hub (FWH) LPC Bus Display Interface AC Link OM09235 OM09235 Figure 3. Intel 810 Chipset Block Diagram For information about http://developer.intel.com The resources used by the chipset Chapter 2 The chipset's compliance with ACPI and AC `97 18 Refer to The Intel 810 chipset Table 2, page 13 Board Description 1.6.1 Direct AGP Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphicsintensive applications, such as 3D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features: · Pipelined memory read and write operations that hide memory access latency · Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency For information about Refer to The location of the VGA port connector Figure 6, page 41 Obtaining the Accelerated Graphics Port Interface Specification Table 2, page 13 1.6.2 USB The board has an onboard USB hub and four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two of the USB ports are implemented with stacked back panel connectors. The other two ports are routed to the front panel connector; accessing these ports requires a cable from the panel connector to the front of the chassis. The board fully supports UHCI and uses UHCI-compatible software drivers. USB features include: · Self-identifying peripherals that can be plugged in while the computer is running · Automatic mapping of function to driver and configuration · Support for isochronous and asynchronous transfer types over the same set of wires · Support for up to 127 physical devices · Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other applications · Error-handling and fault-recovery mechanisms built into the protocol NOTE Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices. For information about Refer to The location of the USB connectors on the back panel Figure 6, page 41 The signal names of the USB connectors Table 18, page 42 The location of the front panel USB connector Figure 8, page 48 The signal names of the front panel USB connector Table 28, page 49 The USB and UHCI specifications Table 2, page 13 19 Intel Desktop Board BA810 BA810 Technical Product Specification 1.6.3 USB Hub The TUSB2046 TUSB2046 USB hub provides the following features: · Universal Serial Bus version 1.1 compliant · One upstream port and three downstream ports · All downstream ports support full-speed and low-speed operations · Suspend and resume operations support For information about Refer to The TUSB2046 TUSB2046 USB Hub http://www.ti.com 1.6.4 IDE Support The board has one bus-mastering IDE interface. This interface supports: · ATAPI devices (such as CD-ROM drives) · ATA devices using the transfer modes listed in Table 50 on page 82 The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS. The board supports laser servo (LS-120 LS-120) diskette technology through its IDE interface. The LS-120 LS-120 drive can be configured as a boot device by setting the BIOS Setup program's Boot menu to one of the following: · ARMD-FDD (ATAPI removable media device ­ floppy disk drive) · ARMD-HDD (ATAPI removable media device ­ hard disk drive) For information about Refer to The location of the IDE connector Figure 7, page 44 The signal names of the IDE connector Table 26, page 47 BIOS Setup program's Boot menu Table 55, page 87 1.6.5 Real-Time Clock, CMOS SRAM, and Battery The real-time clock is compatible with DS1287 DS1287 and MC146818 MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use. A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied. The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program. 20 Board Description NOTE If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS RAM at power on. NOTE The recommended method of accessing the date in systems with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value. For information about Refer to Proper date access in systems with Intel desktop boards http://support.intel.com/support/year2000/ 1.7 I/O Controller The IT8761E IT8761E I/O controller provides the following features: · Low pin count (LPC) interface · One serial port · Plug and Play compatible register set · Support for SERIRQ protocol · Supports System Management Interrupt (SMI) · Interface for one 1.2 MB, 1.44 MB, or 2.88 MB diskette drive · Fan monitoring The BIOS Setup program provides configuration options for the I/O controller. For information about Refer to The IT8761E IT8761E I/O controller http://www.iteusa.com 1.8 Serial Port The board has one 9-pin serial port connector. This is not accessible through the back panel. The serial port's NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec with BIOS support. The serial port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h). For information about Refer to The location of the serial port connector Figure 8, page 48 The signal names of the serial port connector Table 30, page 49 21 Intel Desktop Board BA810 BA810 Technical Product Specification 1.9 Graphics Subsystem The graphics subsystem provides the following features: · Intel 82810 GMCH graphics support, including: Integrated 2D and 3D graphics engines Integrated hardware motion compression engine Integrated 230 MHz DAC · 4 MB of SDRAM display cache, 100 MHz display cache for 66/100 MHz system bus processor Table 5 lists the refresh rates supported by the graphics subsystem. Supported graphics refresh rates may vary depending on BIOS and video driver version used. Table 5. Supported Graphics Refresh Rates Resolution Available Refresh Rates (Hz) 640 x 200 x 16 colors 70 640 x 350 x 16 colors 70 640 x 400 x 256 colors 60, 70, 75, 85 640 x 400 x 64 K colors 60, 70, 75, 85 640 x 400 x 16 M colors 70 640 x 480 x 16 colors 60, 72, 75, 85 640 x 480 x 256 colors 60, 70, 72, 75, 85 640 x 480 x 32 K colors 60, 75, 85 640 x 480 x 64 K colors 60, 70, 72, 75, 85 800 x 600 x 256 colors 60, 75, 85 800 x 600 x 32 K colors 60, 70, 72, 75, 85 800 x 600 x 64 K colors 60, 70, 72, 75, 85 800 x 600 x 16 M colors 60, 70, 72, 75, 85 1024 x 768 x 256 colors 60, 70, 75, 85 1024 x 768 x 32 K colors 60, 75, 85 1024 x 768 x 64 K colors 60, 70, 72, 75, 85 1024 x 768 x 16 M colors 60, 70, 72, 75, 85 1056 x 800 x 16 colors 70 1280 x 1024 x 256 colors 60, 70, 72, 75, 85 1280 x 1024 x 32 K colors 60, 75, 85 1280 x 1024 x 64 K colors 60, 70, 72, 75 1280 x 1024 x 16 M colors 60, 70, 72, 75, 85 For information about Refer to Obtaining graphics software and utilities 22 60, 70, 72, 75, 85 640 x 480 x 16 M colors Board Description 1.10 Audio Subsystem The board includes an Audio Codec `97 (AC `97) compatible SoundMAX audio subsystem consisting of the these devices: · Intel 82801AA 82801AA ICH (AC link output) · Analog Devices AD1881 AD1881 analog codec Figure 4 is a block diagram of the audio subsystem. 82801AA 82801AA I/O Controller Hub (ICH) AC Link AD1881 AD1881 Analog Codec Line Out Mic In OM09234 OM09234 Figure 4. Block Diagram of Audio Subsystem with AD1881 AD1881 Analog Codec Features of the audio subsystem include: · Independent channels for PCM in, PCM out, and Mic in · 16-bit stereo I/O up to 48 kHz · Multiple sample rates For information about Refer to Obtaining audio software and utilities 23 Intel Desktop Board BA810 BA810 Technical Product Specification 1.10.1 AD1881 AD1881 Analog Codec The AD1881 AD1881 is a fully AC `97 compliant codec. The codec's features include: · 16-bit stereo full-duplex codec · CD-quality audio · Stereo line level output · Power management support · Full duplex variable sampling rate (7 kHz to 48 kHz) with 1 Hz resolution · Phat Stereo 3D stereo enhancement For information about Refer to The audio subsystem's compliance with AC `97 Table 2, page 13 1.10.2 Audio Connectors The audio connectors, located on the back panel, include the following: · Line out · Mic in NOTE CD-ROM digital audio signals are routed through the IDE interface. For information about Figure 6, page 41 The signal names of the back panel audio connectors 24 Refer to The location of the back panel audio connectors Section 2.8.1, page 41 Board Description 1.11 Modem Subsystem The modem subsystem consists of the following: · Motorola SM56 AC-L (AC link) software modem · Silicon Laboratories Si3038 family MC `97 modem codec · RJ-11 RJ-11 connector 1.11.1 Software Modem The Motorola SM56 AC-L Software Modem is a Host Signal Processing (HSP) based modem with both controller and datapump functions executed by the processor. The software driver works with the Intel 82801AA 82801AA ICH's integrated AC-Link and the companion Si3038 family MC `97 modem codec. 1.11.2 Modem Codec The Silicon Laboratories Si3038 family consists of the following components: · Si3014 Direct Access Arrangement (DAA) device (with a phone line interface) · Si3024 (AC `97 interface) Together, these devices provide a programmable line interface to meet international telephone line requirements. The Si3038 family complies with international regulatory requirements and the AC`97/MC 97/MC`97 Interface Specification, Revision 2.1. 1.11.3 Modem AT Commands and S-Register Settings Information on AT commands and S-register settings can be found in the Online SM56 User's Guide. The User's Guide can be accessed by clicking on the Motorola SM56 Modem icon on the desktop tray next to the time icon. Command information is available for the following: · AT and AT& commands · AT commands - basics · AT#UD Unimodem diagnostic command · AT% and AT\ commands · AT* commands · AT+ commands · ATS (S-register) commands 25 Intel Desktop Board BA810 BA810 Technical Product Specification 1.11.4 Modem Specifications Table 6 summarizes the modem's features and capabilities. Table 6. Modem Specifications Error Correction V.90 and K56flex (up to 56 Kbps receive) V.34 (33,600 bps - 2,400 bps) V.32bis (14,400 bps - 4,800 bps) V.32 (9,600 bps - 4,800 bps) V.22bis (2,400 bps - 1,200 bps) V.22 (1,200 bps) V.23 (75/1,200 - 600 bps) V.21 (300 bps) Bell 212A (1,200 bps) Bell 103 (300 bps) V.42, LAP-M and MNP 2-4 Data Compression V.42bis and MNP 5 Fax Modem Group III, Class 1 Class 1 fax error correction mode V.17 (14,400/12,000 bps) V.29 (9,600/7,200 bps) V.27ter (4,800/2,400 bps) V.21 (300 bps) Answering Machine Enhanced Caller ID (U.S. and Canada) 8 kHz PCM and IMA ADPCM Concurrent DTMF detection Voice/Silence detection V.80 sync access mode interface Transparent and framed sub-modes Voice call first supports Intel Video Phone with Intel® ProShare® technology V.8 automode negotiation V.8 PRIME and V.8bis Adaptive rate renegotiation Automatically adjusts speeds up and down to accommodate changing line conditions AT&V, AT#UD- Call setup and phone line quality statistics Real-time modem status with connect rate and retrain indication Last disconnect reason Local Analog Loopback (LAL)-Hardware board check Tone detections: Dial tone, second dial tone Ring back, busy Data/Fax answering tones DTMF Supports name and number Distinctive Ring Distinguish among data, fax, and voice Windows Familiar Windows tabular interface Easy to use on-line user's guide Real-time modem status Flexible international country configuration Essential product support information Data Modem Video Phone Ready Modem Adaptive Connection Support Extensive Diagnostics Support Other Telephony Features 26 98 SE Control Panel Applet Board Description 1.12 Power Management Features Power management is implemented at several levels, including: · Advanced Configuration and Power Interface (ACPI) · Advanced Power Management (APM) · Hardware support: 1.12.1 Power connector Fan connectors Instantly Available technology Wake on Ring Resume on Ring Wake from USB ACPI If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires the support of an operating system that provides full ACPI functionality. ACPI features include: · Plug and Play (including bus and device enumeration) functionality normally contained in the BIOS · Power management control of individual devices, video displays, and hard disk drives · Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping state, and less than 5-watt system operation in the Suspend to Disk sleeping state · A Soft-off feature that enables the operating system to power off the computer · Support for multiple wake up events (see Table 9 on page 29) · Support for a front panel power and sleep mode switch. Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 7. Effects of Pressing the Power Switch If the system is in this state. .and the power switch is pressed for .the system enters this state Off (ACPI G2/S5 state) Less than four seconds Power on On (ACPI G0 state) Less than four seconds Soft off/Suspend On (ACPI G0 state) More than four seconds Fail safe power off Sleep (ACPI G1 state) Less than four seconds Wake up Sleep (ACPI G1 state) More than four seconds Power off For information about Refer to The board's compliance level with ACPI Table 2, page 13 27 Intel Desktop Board BA810 BA810 Technical Product Specification 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 8. Power States and Targeted System Power Global States Sleeping States CPU States Device States Targeted System Power* G0 ­ working state. S0 ­ working. C0 ­ working. D0 ­ working state. Full power > 30 W. G1 ­ sleeping state. S1 ­ CPU stopped. C1 ­ stop grant. D1, D2, D3 ­ device specification specific. 5 W < power < 30 W. G1 ­ sleeping state. S3 ­ Suspend-toRAM. Context saved to RAM. No power. D3 ­ no power except for wake up logic. Power < 5W. * G2/S5 S5 ­ Soft off. Context not saved. Cold boot is required. No power. D3 ­ no power except for wake up logic. Power < 5 W. * G3 ­ mechanical off. No power to the system. No power. D3 ­ no power for wake up logic, except when provided by battery or external source. No power to the system so that service can be performed. AC power is disconnected from the computer. * * 28 Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis' power supply. Dependent on the standby power consumption of wake-up devices used in the system. Board Description 1.12.1.2 Wake Up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states. Table 9. ACPI Wake Up Devices and Events These devices/events can wake up the computer. .from this state Power switch S3, S5 RTC alarm* S1, S3 Modem S1, S3 USB S1, S3 * 1.12.1.3 Unattended Wake Mode ­ display will be video BIOS ID string only Plug and Play In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure onboard devices that do not have other hardware standards for enumeration and configuration. PCI devices on the board, for example, are not enumerated by ACPI. 1.12.2 APM APM makes it possible for the computer to enter an energy saving standby mode. The standby mode can be initiated in the following ways: · Time-out period specified in the BIOS Setup program · Suspend/Resume switch connected to the front panel sleep connector · From the operating system, such as the Suspend menu item in Windows 98 SE In standby mode, the board can reduce power consumption by spinning down hard drives, and reducing power to or turning off VESA DPMS-compliant monitors. Power-management mode can be enabled or disabled in the BIOS Setup program. While in standby mode, the system retains the ability to respond to external interrupts and service requests, such as incoming faxes or network messages. Any keyboard or mouse activity brings the system out of standby mode and immediately restores power to the monitor. The BIOS enables APM by default, but the operating system must support an APM driver for the power-management features to work. For example, Windows 98 SE supports the powermanagement features upon detecting that APM is enabled in the BIOS. 29 Intel Desktop Board BA810 BA810 Technical Product Specification Table 10 lists the devices or specific events that can wake the computer from specific states. Table 10. APM Wake Up Devices and Events These devices/events can wake up the computer. .from this state Power switch Soft-off RTC alarm* Soft-off, suspend Modem Soft-off, suspend USB Suspend * Unattended Wake Mode ­ display will be video BIOS string only For information about Refer to Enabling or disabling power management in the BIOS Setup program Section 4.6, page 86 The board's compliance level with APM Table 2, page 13 1.12.3 Hardware Support CAUTION If Instantly Available technology feature is used, ensure that the power supply provides adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.2 on page 55 for additional information. The board provides several hardware features that support power management, including: · Power connector · Fan connectors · Instantly Available technology · Wake on Ring · Resume on Ring · Wake from USB Instantly Available technology requires power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements. Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the ACPI or APM state being used. NOTE The use of Wake on Ring, Resume on Ring, and Wake from USB technologies from an ACPI state require the support of an operating system and a peripheral device that provides full ACPI functionality. 30 Board Description 1.12.3.1 Power Connector When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control. With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off). For information about Refer to The location of the power connector Figure 7, page 44 The signal names of the power connector Table 24, page 45 The ATX specification Table 2, page 13 1.12.3.2 Fan Connectors The board has two fan connectors. The functions of these connectors are described in Table 11. Table 11. Fan Connector Descriptions Connector Function Processor fan Provides +12 V DC for a processor fan or active fan heatsink. Chassis fan Provides +12 V DC for a system or chassis fan. For information about Refer to The location of the fan connectors Figure 7, page 44 The signal names of the processor fan connector Table 23, page 45 The signal names of the chassis fan connector Table 27, page 47 31 Intel Desktop Board BA810 BA810 Technical Product Specification 1.12.3.3 Instantly Available Technology CAUTION For Instantly Available technology, the 5-V standby line for the power supply must be capable of delivering adequate standby current. Failure to provide adequate standby current when using this feature can damage the power supply. Refer to Section 2.11.2 on page 55 for additional information. Instantly Available technology enables the board to enter the ACPI S3 (Suspend-to-RAM) state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, the fans are off, and the power LED is amber). When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 29 lists the devices and events that can wake the computer from the S3 state. The use of Instantly Available technology requires: · Operating system support · PCI 2.2 compliant devices and drivers The optional standby power indicator LED (located between the power connector and the DIMM socket) provides an indication that standby power is still present, even when the computer appears to be off. Figure 5 shows the location of the standby power indicator LED. DS7F1 OM09830 OM09830 Figure 5. Location of Standby Power Indicator LED 32 Board Description 1.12.3.4 Wake on Ring The operation of Wake on Ring can be summarized as follows: · Wakes the computer from an ACPI S3 state or from APM soft-off mode · Requires two calls to access the computer: · 1.12.3.5 First call restores the computer from an ACPI S3 state or powers up the computer from APM soft-off mode Second call enables access (when the appropriate software is loaded) The onboard modem detects the incoming call through the AC `97 Wake Up feature Resume on Ring The operation of Resume on Ring can be summarized as follows: · Resumes operation from the ACPI S1 state or APM suspend mode · Requires only one call to access the computer · The onboard modem detects the incoming call through the AC `97 Wake Up feature 1.12.3.6 Wake from USB USB bus activity wakes the computer from an ACPI S1 or S3 state or APM suspend mode. NOTE Wake from USB requires the use of a USB peripheral that supports the Wake from USB feature. Wake from USB is not supported in APM soft-off mode. 33 Intel Desktop Board BA810 BA810 Technical Product Specification 34 2 Technical Reference What This Chapter Contains 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 2.11 2.12 2.13 2.14 2.15 Introduction. 35 Memory Map. 35 I/O Map. 36 DMA Channels . 37 PCI Configuration Space Map . 38 Interrupts . 38 PCI Interrupt Routing Map . 39 Connectors . 40 Jumper Block. 51 Mechanical Considerations. 53 Electrical Considerations . 55 Thermal Considerations. 57 Reliability . 58 Environmental. 59 Regulatory Compliance . 59 2.1 Introduction Sections 2.2 ­ 2.6 contain several standalone tables. Table 12 describes the system memory map, Table 13 shows the I/O map, Table 14 lists the DMA channels, Table 15 defines the PCI configuration space map, and Table 16 describes the interrupts. The remaining sections in this chapter are introduced by text found with their respective section headings. 2.2 Memory Map Table 12. System Memory Map Address Range (decimal) Address Range (hex) Size Description 1024 K ­ 262144 K 100000 ­ FFFFFFF 255 MB Extended memory 960 K ­ 1024 K F0000 F0000 ­ FFFFF 64 KB Runtime BIOS 896 K ­ 960 K E0000 E0000 ­ EFFFF 64 KB Reserved 800 K ­ 896 K C8000 C8000 ­ DFFFF 96 KB Available high DOS memory (open to PCI bus) 640 K ­ 800 K A0000 A0000 ­ C7FFF 160 KB Video memory and BIOS 639 K ­ 640 K 9FC00 9FC00 ­ 9FFFF 1 KB Extended BIOS data (movable by memory manager software) 512 K ­ 639 K 80000 ­ 9FBFF 127 KB Extended conventional memory 0 K ­ 512 K 00000 ­ 7FFFF 512 KB Conventional memory 35 Intel Desktop Board BA810 BA810 Technical Product Specification 2.3 I/O Map Table 13. I/O Map Address (hex) Size Description 0000 ­ 000F 16 bytes DMA controller 0020 ­ 0021 2 bytes Programmable Interrupt Controller (PIC) 0040 ­ 0043 4 bytes System timer 0060 1 byte Keyboard controller byte ­ reset IRQ 0061 1 byte System speaker 0064 1 byte Keyboard controller, CMD/STAT byte 0070 ­ 0071 2 bytes System CMOS / Real-Time Clock 0072 ­ 0073 2 bytes System CMOS 0080 ­ 008F 16 bytes DMA controller 0092 1 byte Fast A20 and PIC 00A0 ­ 00A1 2 bytes PIC 00C0 ­ 00DF 32 bytes DMA 00F0 1 byte Numeric data processor 01F0 ­ 01F7 8 bytes Primary IDE channel 1 8 bytes COM4/video (8514A) 1 8 bytes COM2 03B0 ­ 03BB 12 bytes Intel 82810 ­ Graphics/Memory Controller Hub (GMCH) 03C0 ­ 03DF 32 byte Intel 82810 ­ Graphics/Memory Controller Hub (GMCH) 03E8 ­ 03EF 8 bytes COM3 03F0 ­ 03F5 6 bytes Diskette channel 1 03F6 1 byte Primary IDE channel command port 02E8 ­ 02EF 02F8 ­ 02FF 03F8 ­ 03FF 8 bytes COM1 04D0 ­ 04D1 2 bytes Edge/level triggered PIC 4 bytes PCI configuration address register 0CF8 ­ 0CFB 0CF9 2 3 1 byte Turbo and reset control register 0CFC ­ 0CFF 4 bytes PCI configuration data register FFA0 ­ FFA7 8 bytes Primary bus master IDE registers 96 contiguous bytes starting on a 128-byte divisible boundary ICH (ACPI + TCO) 64 contiguous bytes starting on a 64-byte divisible boundary Onboard resources 256 contiguous bytes starting on a 256-byte divisible boundary ICH audio mixer 64 contiguous bytes starting on a 64-byte divisible boundary ICH audio bus master 256 contiguous bytes starting on a 256-byte divisible boundary ICH modem mixer continued 36 Technical Reference Table 13. I/O Map (continued) Address (hex) Size Description 16 contiguous bytes starting on a 16-byte divisible boundary ICH (SMBus) 32 contiguous bytes starting on a 32-byte divisible boundary ICH (USB) 4096 contiguous bytes starting on a 4096-byte divisible boundary Intel 82810 PCI Bridge Notes: 1. Default, but can be changed to another address range 2. Dword access only 3. Byte access only NOTE Some additional I/O addresses are not available due to ICH addresses aliasing. For information about ICH addressing, refer to the Web site at: / 2.4 DMA Channels Table 14. DMA Channels DMA Channel Number Data Width System Resource 0 8 or 16 bits Open 1 8 or 16 bits Open 2 8 or 16 bits Diskette drive 3 8 or 16 bits Open 4 Reserved - cascade channel 5 16 bits Open 6 16 bits Open 7 16 bits Open 37 Intel Desktop Board BA810 BA810 Technical Product Specification 2.5 PCI Configuration Space Map Table 15. PCI Configuration Space Map Bus Number (hex) Device Number (hex) Function Number (hex) Description 00 00 00 Memory controller of Intel 82810 component 00 01 00 Graphics controller of Intel 82810 component 00 1E 00 Link to PCI bridge 00 1F 00 PCI-to-LPC bridge 00 1F 01 IDE controller 00 1F 02 USB controller 00 1F 03 SMBus controller 00 1F 04 Reserved 00 1F 05 AC '97 audio controller 00 1F 06 AC '97 modem controller 2.6 Interrupts Table 16. Interrupts IRQ System Resource NMI I/O channel check 0 Reserved, interval timer 1 Reserved, keyboard buffer full 2 Reserved, cascade interrupt from slave PIC 3 User available 4 COM1* 5 User available 6 Diskette drive 7 User available 8 Real-Time Clock 9 Reserved for ICH system management bus 10 Audio / Modem 11 Video 12 User available 13 Reserved, math coprocessor 14 Primary IDE (if present, else user available) 15 Network / User available * 38 Default, but can be changed to another IRQ Technical Reference 2.7 PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus. In most cases, the small amount of latency added by interrupt sharing does not affect the operation or throughput of the devices. In some special cases where maximum performance is needed from a device, a PCI device should not share an interrupt with other PCI devices. PCI devices are categorized as follows to specify their interrupt grouping: · · · INTA: By default, all add-in devices that require only one interrupt are in this category. For almost all devices that require more than one interrupt, the first interrupt on the device is also classified as INTA. INTB: Generally, the second interrupt on add-in devices that require two or more interrupts is classified as INTB. (This is not an absolute requirement.) INTC and INTD: Generally, a third interrupt on add-in devices is classified as INTC and a fourth interrupt is classified as INTD. The ICH PCI-to-LPC bridge has four programmable interrupt request (PIRQ) input signals. Any PCI interrupt source connects to one of these PIRQ signals. Because there are only four signals, some PCI interrupt sources are mechanically tied together on the board and therefore share the same interrupt. Table 17 lists the PIRQ signals and shows how the signals are connected to the onboard PCI interrupt sources. Table 17. PCI Interrupt Routing Map ICH PIRQ Signal PCI Interrupt Source AGP Controller PIRQA PIRQB PIRQD INTA ICH Audio Controller INTB ICH Modem Controller INTB INTD ICH USB Controller SM Bus PIRQC INTB NOTE The ICH can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5, 7, 9, 10, 11, 14, and 15). Typically, a device that does not share a PIRQ line will have a unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or more of the PIRQ lines to be connected to the same IRQ signal. 39 Intel Desktop Board BA810 BA810 Technical Product Specification 2.8 Connectors CAUTION Only the back panel I/O connectors of this board have overcurrent protection. The internal board connectors are not overcurrent protected, and should connect only to devices inside the computer chassis, such as fans and internal peripherals. Do not use these connectors for powering devices external to the computer chassis. A fault in the load presented by the external devices could cause damage to the computer, the interconnecting cable, and the external devices themselves. This section describes the board's connectors. The connectors can be divided into the following groups: · Back panel I/O connectors (see page 41) USB (2) · · VGA Audio line out Mic in RJ-11 RJ-11 telephone jack Internal I/O connectors (see page 44) Fans (2) Power Diskette drive IDE External I/O connectors (see page 48) USB ports Front panel (Power/Sleep/Message waiting LED, power switch, hard drive activity LED, reset switch, and infrared port) Serial port 40 Technical Reference 2.8.1 Back Panel I/O Connectors Figure 6 shows the location of the back panel connectors. D AB C E F OM09831 OM09831 Item Description For more information, see. A USB port 0 (ICH) Table 18, page 42 B USB port 1 (USB hub) Table 18, page 42 C VGA port Table 19, page 42 D Audio line out Table 20, page 43 E Mic in Table 21, page 43 F RJ-11 RJ-11 telephone jack Table 22, page 43 Figure 6. Back Panel I/O Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality may occur if passive (non-amplified) speakers are connected to this output. 41 Intel Desktop Board BA810 BA810 Technical Product Specification Table 18. USB Connectors Pin Signal Name 1 +5 V (fused) 2 USBP0# / USBP1# 3 USBP0 / USBP1 4 Ground Table 19. VGA Port Connector Pin 1 Red 2 Green 3 Blue 4 No connect 5 Ground 6 Ground 7 Ground 8 Ground 9 Fused VCC 10 Ground 11 No connect 12 MONID1 13 HSYNC 14 VSYNC 15 42 Signal Name MONID2 Technical Reference Table 20. Pin Audio Line Out Connector Signal Name Tip Audio left out Ring Audio right out Sleeve Ground Table 21. Mic In Connector Pin Signal Name Tip Microphone in Ring Mic bias voltage Sleeve Ground Table 22. RJ-11 RJ-11 Telephone Jack Pin 1 No connect 2 Tip 3 Ring 4 Signal Name No connect NOTE To comply with regulatory information a 26 AWG or larger telecommunication line cord must be used. 43 Intel Desktop Board BA810 BA810 Technical Product Specification 2.8.2 Internal I/O Connectors Figure 7 shows the location of the internal connectors. 1 E A 1 2 40 39 D 1 33 1 11 1 20 2 10 34 C B OM09832 OM09832 Item Description Reference Designator For more information, see. A Processor fan J5J1 Table 23, page 45 B Power J7G3 Table 24, page 45 C Diskette drive J7D1 Table 25, page 46 D IDE J7B1 Table 26, page 47 E Chassis fan J1A1 Table 27, page 47 Figure 7. Internal I/O Connectors For information about Refer to The power connector 44 Section 1.12.3.1, page 31 The functions of the fan connectors Section 1.12.3.2, page 31 Technical Reference Table 23. Processor Fan Connector (J5J1) Pin Signal Name 1 Ground 2 +12 V 3 FAN_TACH1 Table 24. Power Connector (J7G3) Pin Signal Name Pin Signal Name 1 +3.3 V 11 +3.3 V 2 +3.3 V 12 -12 V 3 Ground 13 Ground 4 +5 V 14 PS-ON# (power supply remote on/off) 5 Ground 15 Ground 6 +5 V 16 Ground 7 Ground 17 Ground 8 PWRGD (Power Good) 18 -5 V 9 +5 VSB 19 +5 V 10 +12 V 20 +5 V 45 Intel Desktop Board BA810 BA810 Technical Product Specification Table 25. Diskette Drive Connector (J7D1) Pin Signal Pin Signal 1 Ground 2 DENSEL 3 Ground 4 No connect 5 Key 6 FDEDIN 7 Ground 8 FDINDX# (Index) 9 Ground 10 FDM00 FDM00# (Motor Enable A) 11 Ground 12 No connect 13 Ground 14 FDDS0# (Drive Select A) 15 16 No connect No connect 18 FDDIR# (Stepper Motor Direction) 19 Ground 20 FDSTEP# (Step Pulse) 21 Ground 22 FDWD# (Write Data) 23 Ground 24 FDWE# (Write Enable) 25 Ground 26 FDTRK0# (Track 0) 27 No connect 28 FDWPD# (Write Protect) 29 Ground 30 FDRDATA# (Read Data) 31 Ground 32 FDHEAD# (Side 1 Select) 33 46 Ground 17 Ground 34 DSKCHG# (Diskette Change) Technical Reference Table 26. IDE Connector (J7B1) Pin Signal Name Pin Signal Name 1 Reset IDE 2 Ground 3 Data 7 4 Data 8 5 Data 6 6 Data 9 7 Data 5 8 Data 10 9 Data 4 10 Data 11 11 Data 3 12 Data 12 13 Data 2 14 Data 13 15 Data 1 16 Data 14 17 Data 0 18 Data 15 19 Ground 20 Key 21 DDRQ0 22 Ground 23 I/O Write# 24 Ground 25 I/O Read# 26 Ground 27 IOCHRDY 28 Ground 29 DDACK0# 30 Ground 31 IRQ 14 32 Reserved 33 DAG1 (Address 1) 34 DMA66 DMA66_DETECT 35 DAG0 (Address 0) 36 DAG2 (Address 2) 37 Chip Select 1P# 38 Chip Select 3P# 39 Activity# 40 Ground Table 27. Chassis Fan Connector (J1A1) Pin Signal Name 1 Ground 2 +12 V 3 Ground 47 Intel Desktop Board BA810 BA810 Technical Product Specification 2.8.3 External I/O Connectors Figure 8 shows the location of the external connectors. A 2 1 2 1 2 1 10 7 18 17 8 9 C B OM09833 OM09833 Item Description Reference Designator For more information, see. A USB port J7G1 Table 28, page 49 B Front panel J7G2 Table 29, page 49 C Serial port J7C1 Table 30, page 49 Figure 8. External I/O Connectors 48 Technical Reference Table 28. USB Port Connector (J7G1) Pin Signal Name Pin Signal Name 1 VREG_USB2_PWR 2 VREG_USB2_PW 3 USB_DM3 4 USB_DM4 5 USB_DP3 6 USB_DP4 7 Ground 8 Ground 9 Key (no pin) 10 No connect Table 29. Front Panel Connector (J7G2) Pin Signal In/Out Description Pin Signal In/Out Hard Drive Activity LED Description Power LED 1 HD_PWR Out Hard disk LED pull-up (330 ) to +5 V 2 HDR_BLNK_GRN Out Front panel green LED 3 HDA# Out Hard disk active LED 4 HDR_BLNK_YEL Front panel yellow LED 5 GND Ground 6 SW_ON# 7 FP_RESET# Front panel Reset button 8 GND 9 +5 V Power 10 N/C 11 N/C Not connected 12 GND 13 GND Ground 14 (Pin removed) 15 N/C Not connected 16 +5 V 17 +5 V Power 18 N/C Reset Switch In On / Off Switch Miscellaneous Table 30. Out Out In Front panel power switch Ground Miscellaneous In Not connected Ground Not connected Out Power Not connected Serial Port Connector (J7C1) Pin Signal Name Pin Signal Name 1 DCD (Data Carrier Detect) 2 DSR (Data Set Ready) 3 SIN # (Serial Data In) 4 RTS (Request to Send) 5 SOUT # (Serial Data Out) 6 CTS (Clear to Send) 7 DTR (Data Terminal Ready) 8 RI (Ring Indicator) 9 Ground 10 Key (no pin) 49 Intel Desktop Board BA810 BA810 Technical Product Specification 2.8.3.1 Power / Sleep / Message Waiting LED Connector Pins 2 and 4 of the front panel connector can be connected to a single- or dual-colored LED. Table 31 shows the possible states for a single-colored LED. Table 32 shows the possible states for a dual-colored LED. Table 31. States for a Single-colored Power LED LED State Description Off Power off Steady Green Running Blinking Green Running/message waiting Table 32. States for a Dual-colored Power LED LED State Power off Steady Green Running Blinking Green Running/Message waiting Steady Yellow Sleeping Blinking Yellow Description Off Sleeping/Message waiting NOTE To use the message waiting function, ACPI must be enabled in the operating system and a messagecapturing application must be invoked. 2.8.3.2 Power Switch Connector Pins 6 and 8 of the front panel connector can be connected to a front panel power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal. 2.8.3.3 Hard Drive Activity LED Connector Pins 1 and 3 of the front panel connector can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. For the LED to function properly, an IDE drive must be connected to the onboard IDE interface. 2.8.3.4 Reset Switch Connector Pins 5 and 7 of the front panel connector can be connected to a momentary SPST type switch that is normally open. When the switch is closed, the board resets and runs the POST. 50 Technical Reference 2.9 Jumper Block CAUTION Do not move any jumpers with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 9 shows the location of the BIOS Setup jumper block. This 3-pin jumper block determines the BIOS Setup program's mode. Table 33 on page 52 describes the jumper settings for the three modes: normal, configure, and recovery. 1 J6A1 3 OM09834 OM09834 Figure 9. Location of the Jumper Block 51 Intel Desktop Board BA810 BA810 Technical Product Specification Table 33. BIOS Setup Configuration Jumper Settings (J6A1) Function/Mode Jumper Setting Normal 1-2 1 Configuration The BIOS uses current configuration information and passwords for booting. 3 Configure 2-3 1 After the POST runs, Setup runs automatically. The maintenance menu is displayed. 3 Recovery None 1 The BIOS attempts to recover the BIOS configuration. A recovery diskette is required. 3 For information about Section 4.1, page 75 The maintenance menu of the BIOS Setup program Section 4.2, page 76 BIOS recovery 52 Refer to How to access the BIOS Setup program Section 3.6, page 70 Technical Reference 2.10 Mechanical Considerations 2.10.1 FlexATX Form Factor 0.00 The board is designed to fit into an ATX- or microATX-form-factor chassis. Figure 10 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 9.0 inches by 7.2 inches (228.60 millimeters by 182.88 millimeters). Location of the I/O connectors and mounting holes is in compliance with the FlexATX addendum of the microATX specification (see Table 2, page 13). 0.40[10.16] 0.00 0.90[22.86] 6.10[154.94] 6.80[172.72] 0.75[19.05] 8.25[209.55] 1.80[45.72] 8.00[203.20] OM09835 OM09835 Figure 10. Board Dimensions 53 Intel Desktop Board BA810 BA810 Technical Product Specification 2.10.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing. Figure 11 shows the critical dimensions of the I/O shield. Dimensions are given in inches [millimeters]. For dimensions given to two decimal places, the tolerance is ±0.02 inches; for dimensions given to three decimal places, the tolerance is ±0.010 inches [0.254 millimeters]. The figure indicates the position of each cutout. Additional design considerations for I/O shields relative to chassis requirements are described in the ATX specification. See Table 2, page 13 for information about the ATX specification. 162.30 Ref [6.390] 20.00 ± .26[0.787] Typ. 1.55[0.061] Ref 0.00 159.20[6.267] 24.00[0.944] R 0.50 [0.019] Min Typ 2x Dia 8.50[0.334] 22.45[0.883] 0.699 [0.027] 12.027[0.473] 48.00 [1.889] Ref 11.801 [0.464] 0.00 17.366[0.683] 17.764 [0.669] 22.45[0.883] 44.90 [1.767] Right-end View 157.340[6.194] 155.790[6.133] 142.774[5.621] 133.646[5.261] 74.309[2.925] 15.00 ± .26 [0.590] Typ 53.890[2.121] 3.410[0.143] 4.960[0.195] 24.00[0.944] Pictorial View OM09224 OM09224 Figure 11. I/O Shield Dimensions 54 Technical Reference 2.11 Electrical Considerations 2.11.1 Power Consumption Table 34 lists voltage and current specifications for a computer that contains the board and the following: · 700 MHz Intel Pentium III processor with a 256 KB cache · 128 MB SDRAM · 3.5-inch diskette drive · 6.0 GB IDE hard disk drive · 34X IDE CD-ROM drive This information is provided only as a guide for calculating approximate power usage with additional resources added. Values for the Windows 98 SE desktop mode are measured at 640 x 480 x 256 colors and 60 Hz refresh rate. AC watts are measured with a typical 145 W power supply, nominal input voltage and frequency, with true RMS wattmeter at the line input. Table 34. Power Usage DC Current at: Mode AC Power +3.3 V +5 V +12 V -12 V +5 VSB Windows 98 SE ACPI S0 31 W 1.54 A 0.48 A 0.167 A -0.0162 A 0.196 A Windows 98 SE ACPI S1 26 W 1.50 A 0.38 A 0.167 A -0.0161 A 0.185 A Windows 98 SE ACPI S3 3W 0.0003 A -0.0003 A 0.0002 A 0.0001 A 0.180 A Windows 98 SE APM On 46 W 1.49 A 2.77 A 0.173 A -0.016 A 0.228 A Windows 98 SE APM 1* 33 W 1.43 A 2.75 A 0.173 A -0.016 A 0.228 A Windows 98 SE APM 2* 25 W 1.40 A 0.36 A 0.172 A -0.016 A 0.196 A * * 2.11.2 Video and hard drive timeout Start menu/Standby Power Supply Considerations System integrators should refer to the power usage values listed in Table 34 when selecting a power supply for use with this board. The power supply must comply with the following recommendations found in the ATX Specification (see Table 2, page 13): · The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2) · The current capability of the +5 VSB line (Section 4.2.1.2) · All timing parameters (Section 4.2.1.3) · All voltage tolerances (Section 4.2.2) 55 Intel Desktop Board BA810 BA810 Technical Product Specification 2.11.3 Fan Power Requirements Table 35 lists the maximum DC voltage and current requirements for the chassis fan when the board is in normal operating mode, sleep mode, or Suspend-to-RAM state. Power consumption is independent of the operating system used and other variables. Table 35. Chassis Fan (J1A1) DC Power Requirements Mode Voltage Maximum Current Normal (S0) +12 VDC 0.132 A (current limited) Sleep (S1) +12 VDC 0.132 A (current limited) Suspend-to-RAM (S3) 0.0 VDC 0.0 A For information about The location of the chassis fan connector Figure 7, page 44 The signal names of the chassis fan connector 56 Refer to Table 27, page 47 Technical Reference 2.12 Thermal Considerations CAUTION An ambient temperature that exceeds the board's maximum operating temperature by 5 oC to 10 oC could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. CAUTION The voltage regulator area can reach a temperature of up to 85 oC in an open chassis. System integrators should ensure that proper airflow is maintained in the voltage regulator area (item A in Figure 12). Failure to do so may result in damage to the voltage regulator circuit. Figure 12 shows the localized high temperature zones. A B C OM09836 OM09836 A Processor voltage regulator area B Processor C Intel 82810 GMCH Figure 12. High Temperature Zones 57 Intel Desktop Board BA810 BA810 Technical Product Specification Table 36 provides maximum component case temperatures for board components that could be sensitive to thermal changes. Case temperatures could be affected by the operating temperature, current load, or operating frequency. Maximum case temperatures are important when considering proper airflow to cool the board. Table 36. Thermal Considerations for Components Component Maximum Case Temperature Intel Pentium III processor, 100 MHz host bus frequency For processor case temperature, see processor datasheets and processor specification updates. Intel Celeron processor Intel 82810 GMCH 70 °C Intel 82801AA 82801AA ICH 70 °C For information about Refer to Intel Celeron processor datasheets and specification updates Table 2, page 13 Intel Pentium III processor datasheets and specification updates Table 2, page 13 2.13 Reliability The mean time between failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332 TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. MTBF data is calculated from predicted data at 55 ºC. Board MTBF: 153,873 hours 58 Technical Reference 2.14 Environmental Table 37 lists the environmental specifications for the board. Table 37. Board Environmental Specifications Parameter Specification Temperature Non-Operating -40 °C to +70 °C Operating 0 °C to +55 °C Unpackaged 30 g trapezoidal waveform Shock Velocity change of 170 inches/second Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)