AN8839NSB MN6627XX SSOP028-P-0375 - Datasheet Archive
AN8839NSB CD-DA head amplifier IC for 3-beam system optical pick-up s Overview Unit: mm 1 0.3 7.2±0.3 9.3±0.3 0.8
ICs for Compact Disc/CD-ROM Player AN8839NSB AN8839NSB CD-DA head amplifier IC for 3-beam system optical pick-up s Overview Unit: mm 1 0.3 7.2±0.3 9.3±0.3 0.8 0.15 15 0.9 2.0±0.2 14 0.1±0.1 · Operating supply voltage VCC = 2.4 V to 5.5 V · Balance adjustment function built-in Focus error amp./tracking error amp. · OFTR/BDO detection · Standby function built in · APC amp. 11.6±0.3 ue pl d in an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur so a d t d e Pr od ty ni bo yp p c. u e e uc ne t l d tl ife t/s ate cy c/ st en in cl e fo st rm ag at e. io n. s Features (0.45) M Di ain sc te on na tin nc ue e/ d 28 0.3±0.1 The AN8839NSB AN8839NSB is a head amplifier IC for digital servo. It can configure an efficient CD system in combination with the MN6627XX MN6627XX series, and allows a fullautomatic adjustment of tracking balance-gain-offset and focus balance-gain-offset with fewer external parts. SSOP028-P-0375 SSOP028-P-0375 s Applications Pl ea M ai nt en an ce /D is co nt in · CD player 1 2 PDF 2 1 F E 8 F-ch. VCBA E-ch. B-ch. Subtraction Band gap 12 PDE RF B RFDET VCBA BDO 10 Subtraction CSBRT 3TENV 11 A-ch. OFTR OFTR detection CEA 5 A BDO detection ENV PDB PDA 4 RF detection 13 14 26 3 24 25 20 LDON GND VREF VCC FEOUT FEN N.C. AN8839NSB AN8839NSB ICs for Compact Disc/CD-ROM Player s Block Diagram 19 7 17 6 18 16 21 23 15 22 28 RFIN 9 LD LPD N.C. PDOWN N.C. TEOUT TEN 27 FBAL TBAL ICs for Compact Disc/CD-ROM Player AN8839NSB AN8839NSB s Pin Descriptions Pin No. Description Pin No. Description 1 Tracking signal input pin 1 15 NRFDET output pin 2 Tracking signal input pin 2 16 Power-down input pin 3 Power supply pin 17 OFTR output pin 4 Focus signal input pin 1 18 N.C. 5 Focus signal input pin 2 19 3TENV output pin 6 APC amp. input pin 20 N.C 7 APC amp. output pin 21 N.C 8 RF adding output pin 22 TE amp. input pin 9 Input pin for the detection circuits 23 TE amp. output pin 10 Capacitor connection pin for OFTR 24 FE amp. output pin 11 Capacitor connection pin for HPF amp. 25 FE amp. input pin 12 BDO output pin 26 VREF output pin 13 APC control pin 27 TBAL control pin 14 GND pin 28 FBAL control pin s Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage VCC 5.8 V Supply current ICC 20 mA PD 116 mW Topr -20 to +75 °C Tstg -55 to +125 °C Power dissipation Operating ambient temperature Storage temperature * * Note) *: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C. s Recommended Operating Range Parameter Supply voltage Symbol Range Unit VCC 2.4 to 5.5 V 3 AN8839NSB AN8839NSB ICs for Compact Disc/CD-ROM Player s Electrical Characteristics at Ta = 25°C Parameter Symbol Current consumption with no load ITOT Min Typ Max Unit VCC = 3 V 4.0 6.0 8.0 mA PDITOT VCC = 3 V 300 µA VCC = 3 V 1.37 1.50 1.63 V Focus error amp. output offset voltage VFO-OF VCC = 3 V -100 0 100 mV Focus error offset balance crosstalk amount VFO-OFB VCC = 3 V VFB = VREF ±0.375 V -120 0 120 mV No load current at power down VREF output pin VREF Conditions Focus error amplification Focus error amp. V-V conversion gain GFO1 VCC = 3 V VFB = VREF 10.7 13.2 15.7 dB Focus error amp. V-V conversion relative gain GFO2 VCC = 3 V VFB = VREF -1.5 0 1.5 dB Focus balance variable range 1-H BFO1-H VCC = 3 V VFB = VREF +0.375 V 1.29 1.49 1.69 Focus balance variable range 1-L BFO1-L VCC = 3 V VFB = VREF - 0.375 V 0.25 0.5 0.75 Focus balance variable range 2-H BFO2-H VCC = 3 V VFB = VREF +0.375 V 0.25 0.5 0.75 Focus balance variable range 2-L BFO2-L VCC = 3 V VFB = VREF - 0.375 V 1.29 1.49 1.69 Tracking error amplification Tracking error amp. output offset voltage VTR-OF VCC = 3 V -97 0 97 mV Tracking error offset balance crosstalk amount VTR-OFB VCC = 3 V VTB = VREF ±0.375V -120 0 120 mV RTR1 VCC = 3 V VTB = VREF 580 750 920 k Tracking error amp. I-V conversion relative gain RTR2 VCC = 3 V VTB = VREF -18 0 18 % Tracking balance variable range 1-H BTR1-H VCC = 3 V VTB = VREF +0.375 V 0.77 0.83 0.9 Tracking balance variable range 1-L BTR1-L VCC = 3 V VTB = VREF - 0.375 V 1.07 1.17 1.27 Tracking balance variable range 2-H BTR2-H VCC = 3 V VTB=VREF +0.375 V 1.07 1.17 1.27 Tracking balance variable range 2-L BTR2-L VCC = 3 V VTB = VREF - 0.375 V 0.77 0.83 0.9 TEMUTE operation 1 VTEM VCC = 3 V -125 0 125 mV Tracking error amp. I-V conversion gain 4 ICs for Compact Disc/CD-ROM Player AN8839NSB AN8839NSB s Electrical Characteristics at Ta = 25°C (continude) Parameter Symbol Conditions Min Typ Max Unit RF amplification RF amp. offset voltage VRF-OF VCC = 3 V -910 -710 -510 mV RF amp. transfer gain GRF VCC = 3 V 7.7 9.3 10.9 dB RF-amp. frequency characteristics * GRFF VCC = 3 V f = 500 kHz, 3 MHz -2.8 - 0.6 1.6 dB RF-amp. EQ characteristics * GEQ1 VCC = 3 V f = 500 kHz, 1.5 MHz - 0.8 1.0 2.9 dB RF-amp. capable drive current IRFO VCC = 3 V 220 µA VNRF VCC = 3 V, f = 500 kHz 88 132 176 mV[p-p] RFDET high-level VNRF-H VCC = 3 V, f = 500 kHz 2.6 V RFDET low-level VNRF-L VCC = 3 V, f = 500 kHz 0.4 V -63 -37 -11 mV RF detection RFDET det. operation BDO BDO detection level VBDO VCC = 3 V BDO high-level VBDO-H f = 5 kHz, 170 mV[p-p], VCC = 3 V 2.6 V BDO low-level VBDO-L f = 5 kHz, 170 mV[p-p], VCC = 3 V 0.4 V OFTR OFTR detection current ICSOFTR VCC = 3 V 1.03 1.45 1.87 µA OFTR high-level VOFT-H VCC = 3 V, f = 5 kHz, 700 mV[p-p] 2.6 V OFTR low-level VOFT-L VCC = 3 V, f = 5 kHz, 700 mV[p-p] 0.4 V VCC = 3 V 147 170 193 mV VENV-OF VCC = 3 V -125 0 125 mV LD APC APC operating voltage VAPC 3TENV ENV-amp. offset voltage CEA-ENV transfer characteristics GCENV VCC = 3 V 6 7.6 9.2 times CEA input impedance ZCEA VCC = 3 V 8.1 10.5 12.9 k ENV output impedance ZENV VCC = 3 V 8.1 10.5 12.9 k VOP-ENV VCC = 3 V, f = 800 kHz, AM modulation 70 100 130 mV[p-p] Focus error amp. dead zone width 1 XFEDZ1 VCC = 3 V VFB = VREF -10 0 10 mV Focus error amp. dead zone width 2 XFEDZ2 VCC = 3 V VFB = VREF -10 0 10 mV XFEDZ1 VCC = 3 V VFB = VREF -8 0 8 mV ENV amp. operation Focus error amp. Focus error amp. relative dead zone width Note) *: The values mentioned above are subject to change according to the state of a printed circuit board, a socket, etc. 5 AN8839NSB AN8839NSB ICs for Compact Disc/CD-ROM Player s Electrical Characteristics at Ta = 25°C (continued) Parameter Symbol Conditions Min Typ Max Unit Tracking error amplification Tracking error amp. dead zone width 1 XTEDZ1 VCC = 3 V VTB = VREF -10 0 10 mV Tracking error amp. dead zone width 2 XTEDZ2 VCC = 3 V VTB = VREF -10 0 10 mV Tracking error Amp. relative dead zone width XTEDZ VCC = 3 V VTB = VREF -8 0 8 mV Power down pin PDOWN pin high-level input voltage VCC = 3 V 2.2 V PDOWN pin low-level input voltage 6 VPD-H VPD-L VCC = 3 V 0.3 V ICs for Compact Disc/CD-ROM Player AN8839NSB AN8839NSB VCC LDON 13 GND VREF 26 14 FEOUT VCC 3 24 ENV 19 7 3TENV ENV 25 FEN 20 N.C s Application Circuit Example CEA 11 LD LD VCC OFTR 17 OFTR detection 6 CSBRT 10 18 Band gap VCC BDO 12 16 PD LPD N.C. PDOWN 21 BDO detection N.C. 23 TEOUT RFDET 15 RF detection Subtraction Subtraction 22 TEN 28 27 TBAL F-ch. VCBA E-ch. B-ch. 8 VCBA A-ch. RFIN 9 FBAL 1 PDF F F 2 PDE F E B 5 C B C D A D PDB E E PDA 4 A RF 7 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.