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AN10365

Catalog Datasheet MFG & Type PDF Document Tags

AN10365

Abstract: Lead Free reflow soldering profile BGA 20050524 Application note AN10365_1 Contact information For additional information, please visit , AN10365 Surface mount reflow soldering description Rev. 01 - 24 May 2005 Application note , application note provides guidelines for the board mounting of IC packages. AN10365 Philips , : sales.addresses@www.semiconductors.philips.com AN10365 Application note © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 01 - 24 May 2005 2 of 26 AN10365 Philips Semiconductors Surface mount reflow
Philips Semiconductors
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Lead Free reflow soldering profile BGA philips pb-free products HVQFN48 Solder Paste, Indium, Type 3 SSOP20 Cu3Sn

Cu3Sn

Abstract: Solder Paste, Indium, Type 3 sales office addresses, please send an email to: sales.addresses@www.semiconductors.philips.com AN10365_2 , , provided that they are in accordance with the specifications. AN10365_2 Application note , of a PCB footprint, as found on the Philips Semiconductors web site. AN10365_2 Application , (SSOP20) AN10365_2 Application note © Koninklijke Philips Electronics N.V. 2006. All rights , . AN10365_2 Application note © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev
Philips Semiconductors
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SSOP20 LAND PATTERN SOT266-1 LAND PATTERN Solder Paste Indium reflow process control Solder Paste, Indium 5.1, Type 3

Cu3Sn

Abstract: Cu6Sn5 : salesaddresses@nxp.com AN10365_3 Application note © NXP B.V. 2008. All rights reserved. Rev. 03 - 22 April , . AN10365_3 Application note © NXP B.V. 2008. All rights reserved. Rev. 03 - 22 April 2008 3 of , shows an example of a PCB footprint, as found on the NXP Semiconductors web site. AN10365_3 , 001aaf255 Fig 2. PCB footprint for the SOT266-1 package (SSOP20) AN10365_3 Application note , resist defined and partially Cu defined. AN10365_3 Application note © NXP B.V. 2008. All rights
NXP Semiconductors
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Cu6Sn5 J-STD-020D

Cu3Sn

Abstract: ipc 610 non-wetting AN10365 Surface mount reflow soldering Rev. 6 - 30 July 2012 Application note Document , . NXP Semiconductors AN10365 Surface mount reflow soldering description Revision history Rev 06 , ://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com AN10365 All , . Application note Rev. 6 - 30 July 2012 2 of 31 NXP Semiconductors AN10365 Surface mount reflow , from bottom, via encroached from bottom AN10365 All information provided in this document is
NXP Semiconductors
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ipc 610 non-wetting

AN10365

Abstract: ipc 610D For sales office addresses, please send an email to: salesaddresses@nxp.com AN10365_4 Application , from bottom AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 , site. AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 August , (SSOP20) AN10365_4 Application note © NXP B.V. 2009. All rights reserved. Rev. 04 - 13 August , resist defined and partially Cu defined. AN10365_4 Application note © NXP B.V. 2009. All rights
NXP Semiconductors
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ipc 610D JEDEC J-STD-033b.1 JEDEC J-STD-033b J-STD-033b.1 SOD882 remark um sod

UN-D1400

Abstract: WLCSP stencil design AN10365 (Surface mount reflow soldering description). AN10439 NXP Semiconductors Wafer Level , reflow soldering processes will be provided by reference to application note AN10365 (Surface mount reflow soldering description). It is strongly recommended to read AN10365 prior to, or in conjunction , . Assembly process The application note AN10365 describes the surface mounting assembly process. WLCSPs are , cannot be reused. Please take notice of chapter 'Inspection and repair' in application note AN10365 to
NXP Semiconductors
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UN-D1400 WLCSP stencil design Service Manual smd rework station IEC60286 WLCSP chip mount EIA541

WLCSP flip chip

Abstract: IP3338CX24 note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , components For further information on temperature profiles, refer to application note AN10365 "Surface , . To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow
NXP Semiconductors
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IP3338CX24 WLCSP flip chip IP3337CX18

AN10439

Abstract: ip4064cx8lf_ip4364cx8lf_1 in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering
NXP Semiconductors
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IP4064CX8LF ip4064cx8lf_ip4364cx8lf_1 IP4064CX8/LF IP4364CX8/LF IEC61000-4-2 IP4364CX8LF

IP5311CX5/LF

Abstract: WLCSP flip chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave , application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off , AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning Cleaning can be done after reflow
NXP Semiconductors
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IP5311CX5 IP5311CX5/LF

WLCSP18

Abstract: AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning
NXP Semiconductors
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WLCSP18 IP4337CX18/LF IP4337CX18LF

IP4338CX24

Abstract: AN10439 note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off between the , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning
NXP Semiconductors
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IP4338CX24 IP4338CX24/LF IP4338CX24LF

IP3338CX24

Abstract: AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning
NXP Semiconductors
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wlcsp inspection

Abstract: note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this , AN10365 "Surface mount reflow soldering description". 8.3.1 Stand off The stand off between the , application note AN10365 "Surface mount reflow soldering description". 8.3.4 Cleaning Cleaning can be
NXP Semiconductors
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wlcsp inspection IP4060CX16/LF IP4060CX16LF

NX2-00001

Abstract: "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , AN10365 "Surface mount reflow soldering description". 14.3.4 Cleaning Cleaning can be done after , complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 , temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16
NXP Semiconductors
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NX2-00001 LD6806

smd transistor 25H

Abstract: note AN10365 â'Surface mount reflow soldering descriptionâ'. Wave soldering is not suitable for , temperature profiles, refer to application note AN10365 â'Surface mount reflow soldering descriptionâ , shown in application note AN10365 â'Surface mount reflow soldering descriptionâ'. 14.3.4 Cleaning , Application Note AN10365 â'Surface mount reflow soldering descriptionâ'. 15.1 Introduction to soldering , Application Note AN10365 â'Surface mount reflow soldering descriptionâ'. 16. Mounting 16.1 PCB design
NXP Semiconductors
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smd transistor 25H

transistor SMD MOSFET 2033

Abstract: technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 â'Surface , AN10365 â'Surface mount reflow soldering descriptionâ'. 20. Soldering of WLCSP packages 20.1 , note AN10439 â'Wafer Level Chip Scale Packageâ' and in application note AN10365 â'Surface mount , information on temperature profiles, refer to application note AN10365 â'Surface mount reflow soldering , , use the solder profile shown in application note AN10365 â'Surface mount reflow soldering
NXP Semiconductors
Original
transistor SMD MOSFET 2033 PCF8883

NX2-00001

Abstract: smd transistor 25H "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , AN10365 "Surface mount reflow soldering description". 14.3.4 Cleaning Cleaning can be done after , complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 , temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16
NXP Semiconductors
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SD card footprint PCB

Abstract: wlcsp inspection application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount , For further information on temperature profiles, refer to application note AN10365 "Surface mount , the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering
NXP Semiconductors
Original
IP4350CX24 SD card footprint PCB IP4352CX24

IP5311CX5

Abstract: ip5311 AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All , AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The stand off between the , solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering
NXP Semiconductors
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ip5311

IP3088CX10

Abstract: CX20 Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , shown in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning
NXP Semiconductors
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IP3088CX10 CX20 WLCSP10 IP3088CX5 IP3088CX15 IP3088CX20 MIL-STD-883D

portable dvd player schematic diagram of video

Abstract: SA58672TK found in Application Note AN10365 "Surface mount reflow soldering description". 14.1 Introduction to , AN10365 "Surface mount reflow soldering description". 15. Soldering of WLCSP packages 15.1 , note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , application note AN10365 "Surface mount reflow soldering description". 15.3.1 Stand off The stand off , the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering
NXP Semiconductors
Original
HVSON10 portable dvd player schematic diagram of video SA58672TK class d power amplifier AUX0025 BLM21PG221SN1 SA58672
Abstract: technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount , AN10365 "Surface mount reflow soldering description". 15. Soldering of WLCSP packages 15.1 , note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , further information on temperature profiles, refer to application note AN10365 "Surface mount reflow , viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 NXP Semiconductors
Original

PCA9901

Abstract: JESD22-A114 in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow , components For further information on temperature profiles, refer to Application Note AN10365 "Surface , "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , For further information on temperature profiles, refer to application note AN10365 "Surface mount , , use the solder profile shown in application note AN10365 "Surface mount reflow soldering description
NXP Semiconductors
Original
PCA9901 JESD22-A114 JESD22-A115 JESD78
Abstract: technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount , AN10365 "Surface mount reflow soldering description". 15. Soldering of WLCSP packages 15.1 , note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 NXP Semiconductors
Original
Abstract: ' and in application note AN10365 â'Surface mount reflow soldering descriptionâ'. Wave soldering is , application note AN10365 â'Surface mount reflow soldering descriptionâ'. 10.3.1 Stand off The stand off , AN10365 â'Surface mount reflow soldering descriptionâ'. 10.3.4 Cleaning Cleaning can be done after -
Original
IP4340CX15
Abstract: note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , AN10365 "Surface mount reflow soldering description". 10.3.1 Stand off The stand off between the , profile shown in application note AN10365 "Surface mount reflow soldering description". 10.3.4 Cleaning Philips Semiconductors
Original

SA58672TK

Abstract: SA58672UK technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount , AN10365 "Surface mount reflow soldering description". 15. Soldering of WLCSP packages 15.1 , note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow , application note AN10365 "Surface mount reflow soldering description". 15.3.1 Stand off The stand off , the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering
NXP Semiconductors
Original
SA58672UK MO-229 MPZ1608S221A ipod repair

NX2-00001

Abstract: found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 , information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering , AN10365 "Surface mount reflow soldering description". 14.3.4 Cleaning Cleaning can be done after , complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 , temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16
NXP Semiconductors
Original
Abstract: technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount , For further information on temperature profiles, refer to Application Note AN10365 "Surface mount , Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave , to application note AN10365 "Surface mount reflow soldering description". 19.3.1 Stand off The , solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering NXP Semiconductors
Original

wlcsp inspection

Abstract: IP4064CX8 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering , to application note AN10365 "Surface mount reflow soldering description". 9.3.1 Stand off The , shown in application note AN10365 "Surface mount reflow soldering description". 9.3.4 Cleaning
NXP Semiconductors
Original
IP4064CX8 IP4364CX8 IP4366CX8
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