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AN-1112 Datasheet

Part Manufacturer Description PDF Type
AN-1112 National Semiconductor Application Note 1112 Micro SMD Wafer Level Chip Scale Package Original
AN1112 STMicroelectronics THREE-PHASE MOTOR CONTROL BY USING ST52X301 Original

AN-1112

Catalog Datasheet MFG & Type PDF Document Tags

AN-1112

Abstract: 0.3mm pitch BGA . 13 micro SMD micro SMD AN-1112 © National Semiconductor Corporation AN100926-26-JP 1 AN-1112 micro SMD CSP (WLCSP) 1. 2. I/O 3. 4. 0.3mm 0.4mm , Table 1 3 www.national.com/jpn/ AN-1112 micro SMD AN-1112 , / AN-1112 AN-1112 ( ) TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices , ± 10 FIGURE 6. Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com/jpn/ AN-1112
National Semiconductor
Original
0.3mm pitch BGA 0.3mm pitch csp package ALIVH SMD CODE AN-1112 national

AN-1112

Abstract: AN1112 AN-1112 © 2006 AN100926 www.national.com AN-1112 10092650 4 2x2 5 2x1x2 , < 0.05 0.35 www.national.com 2 AN-1112 · · · · · · 10092605 NSMD 0.175 , 0.025 mm 0.34+0.0/-0.04 mm 0.24 ± 0.02 mm · · · 3 www.national.com AN-1112 · , °C Micro SMD 4 AN-1112 10092649 10092645 5 www.national.com AN-1112 0/32 0/32 , 13/288 0/102 25/288 AN-1112 · · 10092638 0/8 0/8 0/8 0/8 0/8 0/8
National Semiconductor
Original
J-STD-020

0.3mm pitch csp package

Abstract: 0.3mm pitch package bga . 13 micro SMD micro SMD AN-1112 © National Semiconductor Corporation AN100926-26-JP 1 AN-1112 micro SMD CSP (WLCSP) 1. 2. I/O 3. 4. 0.3mm 0.4mm , Table 1 3 www.national.com/jpn/ AN-1112 micro SMD AN-1112 , / AN-1112 AN-1112 ( ) TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices , ± 10 FIGURE 6. Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com/jpn/ AN-1112
National Semiconductor
Original
0.3mm pitch package bga jp smd code micro pitch BGA ic micro

smd A9

Abstract: SMD A8 © National Semiconductor Corporation 1 Printed in Japan NSJ 9/2000 AN-1112 AN-1112 micro , " http://www.national.com 2 AN-1112 SMT micro SMD PCB 2 1 , SMT 3 http:/www.national.com AN-1112 NSMD SMD PCB NSMD PCB , 0.140 mm http://www.national.com 4 AN-1112 micro SMD , micro SMD PCB 20% http:/www.national.com AN-1112 micro SMD SMT
National Semiconductor
Original
IPC-SM-785 smd A9 SMD A8 smd a10 smd a7 smd a5 M0-211JEDEC M0-211 16PCB JESD51-3 M0-211-FXBGA

ALIVH

Abstract: 0.3mm pitch csp package . 13 micro SMD National Semiconductor Application Note 1112 2007 12 micro SMD AN-1112 © National Semiconductor Corporation AN100926-25-JP 1 AN-1112 micro SMD CSP (WLCSP) 1 , . 30m 30m Table 1 3 www.national.com/jpn/ AN-1112 micro SMD ( ) AN-1112 , . Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package 5 www.national.com/jpn/ AN-1112 ( ) AN-1112 ( ) TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices TABLE 4
National Semiconductor
Original
ALIVH PCB wlcsp SMT SMD Devices 185M

ALIVH

Abstract: WLCSP smt . 13 Micro SMD Wafer Level Chip Scale Package Micro SMD Wafer Level Chip Scale Package AN-1112 © 2009 National Semiconductor Corporation 100926 www.national.com AN-1112 Introduction , AN-1112 Bump Size Options AN-1112 TABLE 1. Recommended PCB Pad Geometry 0.5 mm Pitch , . Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package 5 www.national.com AN-1112 , in respective product qualification reports. AN-1112 TABLE 3. Temperature Cycling of 0.5 mm
National Semiconductor
Original
250 B 340 smd Transistor WLCSP stencil design national semiconductor pb-free marking MARKING CODE SMD IC 250 micro solder ball 9221 MARKING

IRS2304

Abstract: IR2304 Application Note AN-1112 IRS2304 and IR2304 Comparison By Jason Nguyen, Min Fang, David New , configuration which operates up to 600 V. www.irf.com AN-1112 1 Block Diagrams The IRS2304 and , Recommended Operating Conditions. www.irf.com AN-1112 2 Static Electrical Characteristics High , . www.irf.com AN-1112 3 IRS2304 5 High Level Output Voltage (V) High Level Output Voltage (V , ) Figure 12A. Low Level Output Voltage vs.Tem perature (Io = 2m A) www.irf.com AN-1112 4 0.20
International Rectifier
Original
floating mosfet driver

40106 inverter Controller

Abstract: motor control inverter schematic diagram AN1112 APPLICATION NOTE Three-Phase Motor Control by using ST52x301 Authors: M. Di Guardo, G , Torque Speed Characteristics = constant January 1999 1/ 22 AN1112 - APPLICATION NOTE In , supply voltage. ® 3/ 22 AN1112 - APPLICATION NOTE Changing the frequency of the three , ® 5/ 22 AN1112 - APPLICATION NOTE In order to avoid cross conduction problems a delay, "dead , U4C 8 74HC08 9 1 0 7/ 22 ® AN1112 - APPLICATION NOTE Six step modulation S/W
STMicroelectronics
Original
40106 inverter Controller motor control inverter schematic diagram 40106 data sheet pwm variable frequency drive circuit diagram ST52x301 variable frequency drive circuit diagram

AN-1112

Abstract: ALIVH . 13 Micro SMD Wafer Level Chip Scale Package Micro SMD Wafer Level Chip Scale Package AN-1112 © 2010 National Semiconductor Corporation 100926 www.national.com AN-1112 Introduction , . A 1 oz. (30 micron) or greater copper thickness causes a www.national.com AN-1112 Bump Size Options AN-1112 3. lower effective solder joint stand-off, which may compromise solder , FIGURE 4. Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package 5 www.national.com AN-1112
National Semiconductor
Original
joint

AN-1112

Abstract: ALIVH . 13 Micro SMD Wafer Level Chip Scale Package Micro SMD Wafer Level Chip Scale Package AN-1112 © 2010 National Semiconductor Corporation 100926 www.national.com AN-1112 Introduction , . A 1 oz. (30 micron) or greater copper thickness causes a www.national.com AN-1112 Bump Size Options AN-1112 3. lower effective solder joint stand-off, which may compromise solder , www.national.com AN-1112 4. AN-1112 TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices
National Semiconductor
Original
PCB design for 0.2mm pitch csp package

AN-1112

Abstract: thick bga die size Wafer Level Chip Scale Package AN-1112 © 2002 National Semiconductor Corporation AN100926 www.national.com AN-1112 Introduction to MICRO SMD Micro SMD is a wafer level CSP (WLCSP) with the , solder paste for printing. 3 www.national.com AN-1112 Surface Mount Assembly Considerations AN-1112 Stencil Printing Process · · (Continued) TABLE 2. Recommended Stencil Apertures , per IPC-SM-785 www.national.com 4 AN-1112 Qualification (Continued) 10092645
National Semiconductor
Original
thick bga die size solder joint reliability Semiconductor smd marking BY Solder paste stencil life SMD 420

ALIVH

Abstract: national semiconductor pb-free marking . 12 Micro SMD Wafer Level Chip Scale Package Micro SMD Wafer Level Chip Scale Package AN-1112 © 2007 National Semiconductor Corporation 100926 www.national.com AN-1112 Introduction , . The recommended pad geometry is shown in Table 1. 3 www.national.com AN-1112 Bump Size Options AN-1112 TABLE 1. Recommended PCB Pad Geometry 0.5 mm Pitch Solder Ball Size Pad , . Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package 5 www.national.com AN-1112
National Semiconductor
Original
General Semiconductor smd gm

8 PIN SMD IC 211

Abstract: BGA-3000 coating, wafer sort testing, laser mark© 1999 National Semiconductor Corporation AN100926 AN-1112 ± 0.015 mm Tape & Reel Level 1 ± 0.015 mm Tape & Reel Level 1 www.national.com AN-1112 , Figure 4 shows details of tape cavity design for micro SMD 8 I/O. www.national.com 2 AN-1112 , pad geometry. 3 www.national.com AN-1112 AN100926-5 FIGURE 5. NSMD and SMD Pad , www.national.com 4 AN-1112 AN100926-22 AN100926-21 Stencil Layout Package Footprint FIGURE 7. Micro
National Semiconductor
Original
8 PIN SMD IC 211 BGA-3000 shaker SMD MARK A9 top mark smd A9

ALIVH

Abstract: HASL . 11 Micro SMD Wafer Level Chip Scale Package Micro SMD Wafer Level Chip Scale Package AN-1112 © 2005 National Semiconductor Corporation AN100926 www.national.com AN-1112 Introduction , AN-1112 Surface Mount Assembly Considerations AN-1112 Stencil Printing Process · Use laser , . www.national.com 4 AN-1112 Qualification (Continued) 10092649 FIGURE 3. Thermal cycling profile , . Impact of PCB Pad Size on Reliability for 0.17 mm Bump Package 5 www.national.com AN-1112
National Semiconductor
Original
HASL CSP-9-111C2 CSP-9-111S2

BGA-3000

Abstract: smd ic marking A9 JEDEC Registered Outline M0-211 [1]. www.national.com AN-1112 SMALLEST FOOTPRINT The micro SMD , the smallest conventional surface mount 8 lead package and AN-1112 I/O Density Comparison , AN-1112 AN100926-36 FIGURE 4. Micro SMD 8 bump Tape & Reel Design PRINTED CIRCUIT BOARD LAYOUT , www.national.com AN-1112 NSMD definition is preferred due to tighter control on the copper etch process , PCB & Stencil Layout www.national.com AN100926-28 Stencil laid over PCB 4 AN-1112
National Semiconductor
Original
smd ic marking A9 smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 HR 8790

IPC-SM-785

Abstract: stencil tension Wafer Level Chip Scale Package AN-1112 © 2003 National Semiconductor Corporation AN100926 www.national.com AN-1112 Introduction Micro SMD is a wafer level CSP (WLCSP) with the following features , solder paste for printing. 3 www.national.com AN-1112 Surface Mount Assembly Considerations AN-1112 Stencil Printing Process · (Continued) TABLE 2. Recommended Stencil Apertures , hold times. www.national.com 4 AN-1112 Qualification (Continued) 10092645 FIGURE
National Semiconductor
Original
stencil tension

IPC-SM-785

Abstract: stencil tension ) Shipping Media Moisture Sensitivity Level AN-1112 © 2001 National Semiconductor Corporation AN100926 www.national.com AN-1112 SURFACE MOUNT ASSEMBLY CONSIDERATIONS Printing solder paste on , cycle/hr Temperature Cycling Profile per IPC-SM-785 3 www.national.com AN-1112 COMPONENT PLACEMENT AN-1112 AN100926-45 FIGURE 4. Impact of PCB Pad Size on Reliability for 0.17 mm Bump , depending on materials and methods used in surface mount assembly. www.national.com 4 AN-1112
National Semiconductor
Original
GENERAL SEMICONDUCTOR MARKING UM PT100 bridge AN100926-46

CL05A475MQ5NRNC

Abstract: 6 PIN PWM SMD ( ) Table 2 TABLE 2. Suggested Capacitors and Suppliers micro SMD micro SMD AN-1112 , ( ) AN-1112 LM8801 Figure 4 FIGURE 4. LM8801 Board Layout (Top View) 1. LM8801 8.26mil 7mil 7mil (AN-1112 micro SMD ) LM8801 2 2 2. LM8801
National Semiconductor
Original
CL05A475MQ5NRNC 6 PIN PWM SMD JMK105BJ225MV-F PWM SMD SMD23 MIPSZ2012D0R5 DC/DC600 DS300822-01-JP TMD06LCA

CL05A475MQ5NRNC

Abstract: AN-1112 ( ) Table 2 TABLE 2. Suggested Capacitors and Suppliers micro SMD micro SMD AN-1112 , ( ) AN-1112 LM8801 Figure 4 FIGURE 4. LM8801 Board Layout (Top View) 1. LM8801 8.26mil 7mil 7mil (AN-1112 micro SMD ) LM8801 2 2 2. LM8801
National Semiconductor
Original

IPC-SM-785

Abstract: GENERAL SEMICONDUCTOR MARKING UM National Semiconductor Corporation AN100926 ± 0.015 Tape & Reel Level 1 Shipping Media AN-1112 ± 0.015 Tape & Reel Bump Coplanarity (mm) Level 1 www.national.com AN-1112 SURFACE , -785 3 www.national.com AN-1112 COMPONENT PLACEMENT AN-1112 AN100926-45 FIGURE 4 , used in surface mount assembly. www.national.com 4 AN-1112 AN100926-38 FIGURE 5. Pull , product 5 www.national.com AN-1112 MICRO SMD DO'S and DONT'S SMALL BUMP DO's Pad Dia
National Semiconductor
Original
micro solder ball BGA and CSP

HP437B

Abstract: HP8753E Application note 1112: www.maxim-ic.com/an1112 More Information For technical support: www.maxim-ic.com , Sheet AN1112, AN 1112, APP1112, Appnote1112, Appnote 1112 Copyright © by Maxim Integrated Products
Maxim Integrated Products
Original
MAX2383 HP8753E HP8561E HP437B MAX238 RF POWER DRIVER REP037 380MH 1950MH 2270MH 2580MH
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