NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Type | Ordering |
| AN1112 | STMicroelectronics | THREE-PHASE MOTOR CONTROL BY USING ST52X301 |
22 pages, |
Original |  |
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| AN-1112 | National Semiconductor | Application Note 1112 Micro SMD Wafer Level Chip Scale Package |
12 pages, |
Original | |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: AN-1112 © 2006 AN100926 AN100926 www.national.com AN-1112 10092650 4 2x2 5 2x1x2 , < 0.05 0.35 www.national.com 2 AN-1112 · · · · · · 10092605 NSMD 0.175 , 0.025 mm 0.34+0.0/-0.04 mm 0.24 ± 0.02 mm · · · 3 www.national.com AN-1112 · , Micro SMD 4 AN-1112 10092649 10092645 5 www.national.com AN-1112 0/32 0/32 , 13/288 0/102 25/288 AN-1112 · · 10092638 0/8 0/8 0/8 0/8 0/8 0/8 ... | Original |
12 pages, |
AN-1112 datasheet abstract |
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| Abstract: SMD-77 © National Semiconductor Corporation 1 Printed in Japan NSJ 9/2000 AN-1112 AN-1112 micro , http://www.national.com 2 AN-1112 SMT micro SMD PCB 2 1 , SMT 3 http:/www.national.com AN-1112 NSMD SMD PCB NSMD PCB , 0.140 mm http://www.national.com 4 AN-1112 micro SMD , micro SMD PCB 20% http:/www.national.com AN-1112 micro SMD SMT ... | Original |
12 pages, |
BGA-3000 m021-1 micro solder ball AN1112 SMD M0 smd a7 smd a5 smd a10 smd A9 SMD A8 datasheet abstract |
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| Abstract: . 13 micro SMD micro SMD AN-1112 © National Semiconductor Corporation AN100926-26-JP AN100926-26-JP 1 AN-1112 micro SMD CSP (WLCSP) 1. 2. I/O 3. 4. 0.3mm 0.4mm 0.5mm , Table 1 3 www.national.com/jpn/ AN-1112 micro SMD AN-1112 , / AN-1112 AN-1112 ( ) TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices , 10 FIGURE 6. Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com/jpn/ AN-1112 0.25mm ... | Original |
14 pages, |
AN100926-26-JP AN-1112 micro pitch BGA ic micro ALIVH jp smd code 0.3mm pitch package bga 0.3mm pitch BGA 0.3mm pitch csp package datasheet abstract |
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| Abstract: . 13 micro SMD micro SMD AN-1112 © National Semiconductor Corporation AN100926-26-JP AN100926-26-JP 1 AN-1112 micro SMD CSP (WLCSP) 1. 2. I/O 3. 4. 0.3mm 0.4mm 0.5mm , Table 1 3 www.national.com/jpn/ AN-1112 micro SMD AN-1112 , / AN-1112 AN-1112 ( ) TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices , 10 FIGURE 6. Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com/jpn/ AN-1112 0.25mm ... | Original |
14 pages, |
AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package datasheet abstract |
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| Abstract: AN-1112 © National Semiconductor Corporation AN100926-25-JP AN100926-25-JP 1 AN-1112 micro SMD CSP , www.national.com/jpn/ AN-1112 micro SMD ( ) AN-1112 ( ) TABLE 1. Recommended PCB Pad Geometr , mm Bump Package 5 www.national.com/jpn/ AN-1112 ( ) AN-1112 ( ) TABLE 3. , www.national.com/jpn/ AN-1112 - 0.25mm : 165 g ( ) AN-1112 ( ) FIGURE 7. Micro SMD 0.4 , / www.national.com/jpn/ 25mm 8 AN-1112 ( ) FIGURE 9. Board Deflection and Net Resistance (0.17 ... | Original |
13 pages, |
SMD Devices IPC-SM-785 AN-1112 ALIVH PCB 0.3mm pitch BGA 0.3mm pitch csp package ALIVH datasheet abstract |
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| Abstract: Application Note AN-1112 IRS2304 IRS2304 and IR2304 IR2304 Comparison By Jason Nguyen, Min Fang, David New , IGBT in the high side configuration which operates up to 600 V. www.irf.com AN-1112 1 , Conditions There are no changes in the Recommended Operating Conditions. www.irf.com AN-1112 2 , section. www.irf.com AN-1112 3 IRS2304 IRS2304 5 High Level Output Voltage (V) High Level , AN-1112 4 0.20 Low Level Output Voltage (V) Low Level Output Voltage (V) 2.0 M ax 1.5 ... | Original |
7 pages, |
AN-1112 IR2304 IRS2304 AN-1112 abstract |
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| Abstract: : AN-1112 Note 5: (TA-MAX) (TJ-MAX-OP 125 , ( ) micro SMD AN-1112 micro SMD NSMD ( ) AN-1112 LM2758 LM2758 12 300 ... | Original |
12 pages, |
LM2758 JESD51-7 B3 6 pin SMD AN-1112 U125 1W led 3.6V LM2758 abstract |
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| Abstract: Wafer Level Chip Scale Package AN-1112 © 2002 National Semiconductor Corporation AN100926 AN100926 www.national.com AN-1112 Introduction to MICRO SMD Micro SMD is a wafer level CSP (WLCSP) with the , particle size range) or finer solder paste for printing. 3 www.national.com AN-1112 Surface Mount Assembly Considerations AN-1112 Stencil Printing Process · · (Continued) TABLE , Profile per IPC-SM-785 IPC-SM-785 www.national.com 4 AN-1112 Qualification (Continued) 10092645 ... | Original |
8 pages, |
solder joint reliability IPC-SM-785 AN-1112 datasheet abstract |
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| Abstract: : HP437B HP437B Application note 1112: www.maxim-ic.com/an1112 More Information For technical support , (PDF) Data Sheet AN1112, AN 1112, APP1112 APP1112, Appnote1112, Appnote 1112 Copyright © by Maxim ... | Original |
2 pages, |
MAX2383 HP8561E APP1112 AN1112 HP437B HP8753E REP037 REP037 abstract |
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| Abstract: space-reduction and for best RF performance. www.maxim-ic.com/an1112 Page 1 of 2 Measured Results VGC , Free Sample www.maxim-ic.com/an1112 Page 2 of 2 ... | Original |
2 pages, |
MAX2383 HP8753E HP8561E AN1112 REP037 REP037 abstract |
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| Abstract: Note 1 exists. wg 50ppm/ micro SMD micro SMD AN-1112 , micro SMD AN-1112 LM431 LM431 micro SMD LED www.national.com/jpn/ 10 ... | Original |
13 pages, |
transistor smd marking BA sot-23 LM431 SOT-23 transistor smd marking BA regulator smd marking smd TRANSISTOR marking T1 smd transistor A1 sot-23 smd transistor 431 transistor smd sot-23 marking BA lm 431 smd smd transistor A1 3 PIN lm431 circuit application smd transistor M3 sot23 LM431 LM431 LM431 abstract |
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| Abstract: AN-1112 © 2010 National Semiconductor Corporation 100926 www.national.com AN-1112 , stand-off. A 1 oz. (30 micron) or greater copper thickness causes a www.national.com AN-1112 Bump Size Options AN-1112 3. lower effective solder joint stand-off, which may compromise solder , www.national.com AN-1112 4. AN-1112 TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices , Wave 10092666 FIGURE 6. Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com AN-1112 - ... | Original |
16 pages, |
MARKING CODE SMD IC JESD51-3 AN-1112 250 B 340 smd Transistor ALIVH datasheet abstract |
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| Abstract: AN-1112 © 2010 National Semiconductor Corporation 100926 www.national.com AN-1112 , stand-off. A 1 oz. (30 micron) or greater copper thickness causes a www.national.com AN-1112 Bump Size Options AN-1112 3. lower effective solder joint stand-off, which may compromise solder , AN-1112 4. AN-1112 TABLE 3. Temperature Cycling of 0.5 mm Pitch micro SMD Devices Micro SMD , Micro SMD 0.5 mm Pitch, 30 Bumps 7 www.national.com AN-1112 - 0.265 mm and 0.240 mm diameter ... | Original |
16 pages, |
joint JESD51-3 AN-1112 ALIVH PCB AN1112 ALIVH datasheet abstract |
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| Abstract: ( ) Table 2 TABLE 2. Suggested Capacitors and Suppliers micro SMD micro SMD AN-1112 , ( ) AN-1112 LM8801 LM8801 Figure 4 FIGURE 4. LM8801 LM8801 Board Layout (Top View) 1. LM8801 LM8801 8.26mil 7mil 7mil (AN-1112 micro SMD ) LM8801 LM8801 2 2 2. LM8801 LM8801 ... | Original |
15 pages, |
MIPSZ2012D0R5 LM8801 AN-1112 6 PIN PWM SMD JMK105BJ225MV-F CL05A475MQ5NRNC LM8801 abstract |
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| View Online Download Receive via Email LP2980 LP2980 LP2980 LP2980 AN-1112 View Online Download Receive via Email LP2981 LP2981 LP2981 LP2981 AN-1112 Email LP2982 LP2982 LP2982 LP2982 AN-1112 Application Note 1112 Micro SMD Wafer Level AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package 4057 View www.datasheetarchive.com/files/national/htm/nsc00956-v2.htm |
National | 14/09/2000 | 21.98 Kb | HTM | nsc00956-v2.htm |
| Receive via Email LM4872 LM4872 LM4872 LM4872 AN-1112 Application Note 1112 Micro SMD Wafer LM4877 LM4877 LM4877 LM4877 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package www.datasheetarchive.com/files/national/htm/nsc00835-v2.htm |
National | 14/09/2000 | 12.6 Kb | HTM | nsc00835-v2.htm |
| Email LM4872 LM4872 LM4872 LM4872 AN-1112 Application Note 1112 Micro SMD Wafer Level Download Receive via Email LM4877 LM4877 LM4877 LM4877 AN-1112 Application Note 1112 www.datasheetarchive.com/files/national/htm/nsc01216.htm |
National | 28/06/2001 | 15.81 Kb | HTM | nsc01216.htm |
| Download Receive via Email LM4872 LM4872 LM4872 LM4872 AN-1112 Application Note 1112 Email LM4877 LM4877 LM4877 LM4877 AN-1112 Application Note 1112 Micro SMD Wafer Level www.datasheetarchive.com/files/national/htm/nsc00258.htm |
National | 01/11/2002 | 14.59 Kb | HTM | nsc00258.htm |
| Receive via Email LM4872 LM4872 LM4872 LM4872 AN-1112 Application Note 1112 Micro SMD Wafer LM4877 LM4877 LM4877 LM4877 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package www.datasheetarchive.com/files/national/htm/nsc01170-v3.htm |
National | 16/08/2002 | 13.51 Kb | HTM | nsc01170-v3.htm |
| LM4872 LM4872 LM4872 LM4872 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package 321 View Online Download Receive via Email LM4877 LM4877 LM4877 LM4877 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package 321 View Online www.datasheetarchive.com/files/national/boomeraudiopoweramplifiers_6v_3w.html |
National | 25/09/2003 | 6.64 Kb | HTML | boomeraudiopoweramplifiers_6v_3w.html |
| LP2980 LP2980 LP2980 LP2980 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package Email LP2981 LP2981 LP2981 LP2981 AN-1112 Application Note 1112 Micro SMD Wafer Level AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package 620 View Download Receive via Email LP2985 LP2985 LP2985 LP2985 AN-1112 Application Note 1112 www.datasheetarchive.com/files/national/htm/nsc01311-v5.htm |
National | 16/08/2002 | 26.84 Kb | HTM | nsc01311-v5.htm |
| AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package 317 View LP2981 LP2981 LP2981 LP2981 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package View Online Download Receive via Email LP2982 LP2982 LP2982 LP2982 AN-1112 Email LP2985 LP2985 LP2985 LP2985 AN-1112 Application Note 1112 Micro SMD Wafer Level www.datasheetarchive.com/files/national/htm/nsc00419.htm |
National | 01/11/2002 | 29.37 Kb | HTM | nsc00419.htm |
| Email LP2980 LP2980 LP2980 LP2980 AN-1112 Application Note 1112 Micro SMD Wafer Level Download Receive via Email LP2981 LP2981 LP2981 LP2981 AN-1112 Application Note 1112 LP2982 LP2982 LP2982 LP2982 AN-1112 Application Note 1112 Micro SMD Wafer Level Chip Scale Package View Online Download Receive via Email LP2985 LP2985 LP2985 LP2985 AN-1112 www.datasheetarchive.com/files/national/htm/nsc01343.htm |
National | 28/06/2001 | 34.06 Kb | HTM | nsc01343.htm |
| ST | THREE-PHASE MOTOR CONTROL BY USING ST52X301 ST52X301 ST52X301 ST52X301 AN1112 THREE-PHASE MOTOR CONTROL BY USING ST52X301 ST52X301 ST52X301 ST52X301 Document Number: 6416 Date Update: 18/01/99 Pages: 22 The document is available in the following formats: Portable Document Format and Raw Text Format www.datasheetarchive.com/files/stmicroelectronics/stonline/books/all/6416-v2.htm |
STMicroelectronics | 14/06/1999 | 0.86 Kb | HTM | 6416-v2.htm |