AL1608L- AL1608 AR-001A AL16081N0DL- AL16081N2DL- AL16081N5DL- AL16081N8DL- - Datasheet Archive

 

PAGE: 1 REF : 20080424-A PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608L- ABC'S ITEM NO. CONFIGURATION & DIMENSIONS

 

SPECIFICATION FOR APPROVAL PAGE: 1 REF : 20080424-A PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608L- AL1608L- ABC'S ITEM NO. CONFIGURATION & DIMENSIONS A D C H D G I B I ( PCB Pattern ) Unit : m/m Series A B C D G H I AL1608 AL1608 1.60±0.10 0.80±0.10 0.45±0.10 0.30±0.20 0.9 0.9 0.6 SCHEMATIC DIAGRAM MATERIALS a b c aBodyCeramic bInternal conductorCu cTerminal electrodeCu/Ni/Sn dRemarkProducts comply with RoHS' requirements GENERAL SPECIFICATION aStorage temp.-40 - +105 bOperating temp.-55 - +125 Peak Temp260 max. Max time above 230 50sec max. Max time above 200 70sec max. cTerminal strength Temperature Rising Area Type F ( kgf ) Time ( sec ) Preheat Area +4.0 / sec max. F 150 ~ 200 / 60 ~ 120sec Reflow Area +2.0 ~ 4.0 / sec max. Forced Cooling Area -(1.0 ~ 5.0) / sec max. Peak Temperature: 260 250 AL1608 AL1608 0.5 30±5 dSolderability Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5 Flux : Rosin Dip time : 4±1 seconds AR-001A AR-001A Temperature ( ) 50sec max. 230 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 2 PROD. NAME ABC'S DWG NO. THIN FILM CHIP INDUCTOR AL1608L- AL1608L- ABC'S ITEM NO. ELECTRICAL CHARACTERISITCS DWG No. AL16081N0DL- AL16081N0DL- AL16081N2DL- AL16081N2DL- AL16081N5DL- AL16081N5DL- AL16081N8DL- AL16081N8DL- AL16082N2DL- AL16082N2DL- AL16082N7DL- AL16082N7DL- AL16083N3DL- AL16083N3DL- AL16083N9DL- AL16083N9DL- AL16084N7DL- AL16084N7DL- AL16085N6DL- AL16085N6DL- AL16086N8DL- AL16086N8DL- AL16088N2DL- AL16088N2DL- AL160810NJL- AL160810NJL- AL160812NJL- AL160812NJL- AL160815NJL- AL160815NJL- AL160818NJL- AL160818NJL- AL160822NJL- AL160822NJL- AL160827NJL- AL160827NJL- AL160833NJL- AL160833NJL- AL160839NJL- AL160839NJL- AL160847NJL- AL160847NJL- AL160856NJL- AL160856NJL- AL160868NJL- AL160868NJL- AL1608R10JL- AL1608R10JL- Inductance Q Test Freq. ( nH ) 1.0±0.3 1.2±0.3 1.5±0.3 1.8±0.3 2.2±0.3 2.7±0.3 3.3±0.3 3.9±0.3 4.7±0.3 5.6±0.3 6.8±0.3 8.2±0.3 10.0±5 % 12.0±5 % 15.0±5 % 18.0±5 % 22.0±5 % 27.0±5 % 33.0±5 % 39.0±5 % 47.0±5 % 56.0±5 % 68.0±5 % 100.0±5 % min 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 ( MHz ) 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 300 1). Packaging Information. ABulk BTaping Reel 2)."":Reference code 3). ToleranceB±0.1 C±0.2 D±0.3 G±2% J±5% AR-001A AR-001A SRF ( GHz ) min 13.0 13.0 10.0 10.0 8.0 6.0 6.0 6.0 5.0 5.0 5.0 4.0 4.0 3.0 3.0 2.0 2.0 2.0 1.5 1.5 1.5 1.0 1.0 1.0 DC Resistance () max 0.35 0.35 0.35 0.35 0.35 0.45 0.45 0.45 0.55 0.65 0.75 0.95 0.95 1.05 1.35 1.65 1.95 2.35 2.75 3.00 3.00 5.00 5.00 7.50 Rated Current ( mA ) max 800 800 800 300 300 300 300 300 300 300 300 300 300 300 300 300 250 250 250 200 200 150 150 100 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 3 PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608L- AL1608L- ABC'S ITEM NO. PACKAGING INFORMATION ( 1 ) Configuration T Cover Tape N A B 2.0±0.5 C C D G Emobossed Carrier Carrier tape width : D P:4 m/m 4 m/m End Start Leader no component 200 m/m min. Trailer no component 400 m/m min. Components User direction of feed Unit:m/m ( 2 ) Dimensions Style A 07 - 08 178 B 21±0.8 C D 13 8 G 10 +0 N 50 -0 T 12.5 ( 3 ) Q'TY & G.W. Per pcakage Inner : Reel Series AL1608 AL1608 AR-001A AR-001A Outer : Carton Q'TY (pcs) G.W. (gw) Style Q'TY (pcs) G.W. (Kg) Size (cm) 5,000 90 07 - 08 250,000 7.0 41 x 39 x 22 SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 4 PROD. ABC'S DWG NO. THIN FILM CHIP INDUCTOR NAME AL1608L- AL1608L- ABC'S ITEM NO. DWGING NUMBER EXPRESSION A L 1 6 0 8 Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1Product Classification LLead Free Standard products comply with RoHS' requirements 1 ~ 9Lead Free Special products comply with RoHS' requirements Appendix code 2Package Information Code Inner package Inner package Q'TY A T.B.D. B AR-001A AR-001A T.B.D. T / R ( Reel package ) 5000 pcs Remark SPECIFICATION FOR APPROVAL REF : 20080424-A PAGE: 5 PROD. ABC'S DWG No. THIN FILM CHIP INDUCTOR NAME AL1608L- AL1608L- ABC'S ITEM No. RELIABILITY TEST Test item Solderability Thermal shock test ( Temp. cycle ) Specification Test condition More than 95% of the terminal electrode Shall be covered With fresh solder. Preheat : 155 / 4 hours. Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 235±5 Flux : Rosin Dip time : 5±0.5 seconds Electrical oharacteristics shall not change more than ±20% Room temp. 15 minutes -55 30 minutes Room temp. 15 minutes +125 Total : 50 cycles Humidity Test Temperature : 40±2 Humidity : 90±5% Time : 1000 hours High temp. Resistance test Temperature : 125±5 Applied current : Per spec. Time : 96 hours AR-001A AR-001A 30 minutes