NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Type | Ordering |
| AE15 | N/A | Semiconductor Devices, Diode, and SCR Datasheet Catalog |
1 pages, |
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| AE150 | N/A | Semiconductor Devices, Diode, and SCR Datasheet Catalog |
1 pages, |
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| AE150 | N/A | Shortform Semicon, Diode, and SCR Datasheets |
1 pages, |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: SURFACE MOUNT CRYSTALS CRYSTALS TAPE AND REEL SPECIFICATIONS · TAPE SPECIFICATIONS (millimeters) MODEL FC FD FE/FH/FL FM FPX FQA FSM FST/FSR FUE HC49SD HC49SD HC49SSD HC49SSD FSP A Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 B 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 C 12.0 8.0 8.0 8.0 12.0 8.0 8.0 8.0 12.0 12.0 12.0 8.0 D 11.5 7.5 7.5 5.5 11.5 5.5 7.5 7.5 11.5 11.5 11.5 7.5 E 24.0 16.0 16.0 12.0 24.0 12.0 ... | Original |
1 pages, |
HC49SSD HC49SD AE80 AE23 AE330 AE13 datasheet abstract |
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| Abstract: M-Bond AE-10 AE-10 and AE-15 Vishay Micro-Measurements Protective Coatings FEATURES · Thin, hard , coatings because of low vapor-transmission rate. AE-15 is superior but requires heat cure. Single coating , ]; AE-15 is 6 hours at +125°F [+50°C]. To accelerate cure at higher temperatures, see cure schedules for M-Bond AE-10 AE-10 and M-Bond AE-15. Operating Temperature Range: Â100° to +200°F [Â75° to +95°C]. Shelf , ; AE-15 is 1-1/2 hours at +75°F [+24°C]. PACKAGING OPTIONS Kit: 6 mixing jars AE Resin [10 g] ea 1 ... | Original |
1 pages, |
M-BOND 200 curing bottle packaging M-BOND AE-10 AND AE-15 AE-10 M-Bond AE-10 Adhesive Kit M-BOND AE-10 AE-15 AE-10 abstract |
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| Abstract: M-Bond AE-15 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND AE-15 INSTALLATION: · · · · · · · · · CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges CSP-1 Cotton Applicators PCT-2A Cellophane Tape HSC Spring Clamp GT-14 GT-14 Pressure Pads and Backup Plates DESCRIPTION , with M-Bond AE-10 AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit. www.vishaymg.com 22 ... | Original |
1 pages, |
rods GT-14 AE-10 AE-15 AE-15 abstract |
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| Abstract: , AE-15 and GA-2 Adhesive Systems GENERAL DESCRIPTION MIXING INSTRUCTIONS AND ADHESIVE CHARACTERISTICS The three adhesives described in this bulletin, MBond AE- 10, AE-15, and GA-2, are all , high-elongation strain measurements. Strain Gage Applications with M-Bond AE-10 AE-10, AE-15 and GA-2 Adhesive System , 5-Apr-05 www.vishaymg.com Instruction Bulletin B-137 B-137 Vishay Micro-Measurements C. M-Bond AE-15 Adhesive Kit AE-15 requires moderately elevated curing temperatures, and is recommended for critical ... | Original |
4 pages, |
Strain Gage adhesive paper strain gage PCT-2M GT-14 AE-10 M-BOND AE-10 dropper TT-605 M-Bond AE-10 Adhesive Kit B-137 AE-15 B-137 abstract |
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| Abstract: M-Bond AE-15 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND AE-15 INSTALLATION: · CSM Degreaser or GC-6 Isopropyl Alcohol · Silicon-Carbide Paper · M-Prep Conditioner A RoHS · M-Prep Neutralizer 5A COMPLIANT · GSP-1 Gauze Sponges · CSP-1 Cotton Applicators · PCT-2M Gage Installation Tape · HSC Spring Clamp · GT-14 GT-14 Pressure Pads and Backup Plates , Applications with M-Bond AE-10 AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit. ... | Original |
2 pages, |
M-Bond AE-10 Adhesive Kit M-BOND AE-10 M-BOND 200 GT-14 AE-10 PCT-2M GT-14 pressure pads AE-15 AE-15 abstract |
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| Abstract: B-137 B-137, "Strain Gage Applications with M-Bond AE-10 AE-10, AE-15, and GA-2 Adhesive Systems," included in each ... | Original |
1 pages, |
Vishay Conditioner A viscosity M-Prep Conditioner A GT-14 AE-10 M-BOND GA-2 "Strain Gage" M-Bond AE-10 Adhesive Kit M-BOND AE-10 datasheet abstract |
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| Abstract: AE-15 are also suitable where in-service temperatures will not exceed +200°F [+95°C]. M-Bond 200 is , temperatures are necessary, M-Bond AE-10 AE-10 and AE-15 are recommended. When in-service environmental conditions ... | Original |
3 pages, |
3140 RTV AE-10 CD-23-10A CD-23-50A M-BOND AE-10 M-COAT D M-BOND 200 M-BOND AE-10 AND AE-15 CD-02-10A CRACK DETECTION PATTERNS CD-02-25A RTV 3140 CD-02-50A CD-02 CD-02 CD-02 abstract |
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| Abstract: over the widest operating temperature range. However, M-Bond AE-10 AE-10 and AE-15 are also suitable where , cure temperatures are necessary, M-Bond AE-10 AE-10 and AE-15 are recommended. When in-service ... | Original |
2 pages, |
RTV 3140 M-BOND AE-10 AND AE-15 M-BOND AE-10 AE-10 CRACK CRACK DETECTION PATTERNS CD-02-50A CD-02 CD-02 abstract |
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| Abstract: M-Bond AE-10 AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit. Document Number: 11011 ... | Original |
1 pages, |
GT-14 AE-10 "Strain Gage" M-Bond AE-10 Adhesive Kit M-BOND 200 M-BOND AE-10 AE-10 abstract |
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| Abstract: : Instruction Bulletin B-137 B-137, "Strain Gage Applications with M-Bond AE-10 AE-10, AE-15, and GA-2 Adhesive Systems," ... | Original |
2 pages, |
Vishay Conditioner A M-BOND AE-10 GT-14 AE-10 datasheet abstract |
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| Abstract: OKI 2008 10 1 OKI OKI OKI 2008 10 1 OKI 193-8550 550-1 http://www.okisemi.com/jp/ J2G0010-17-41 J2G0010-17-41 1998 1 MSM514256C/CL MSM514256C/CL q 1997 5 ¡ MSM514256C/CL MSM514256C/CL 262,144-WordÃ-4-Bit DYNAMIC RAM n MSM514256C/CLCMOS262 MSM514256C/CLCMOS262,144Ã-4 41CMOS 41CMOS 20DIP26/20SOJ20ZIP 20DIP26/20SOJ20ZIP L n l 262,144-Ã-4 l 5V±10 l TTL l TTL l 5128ms51264msL- l l CASRASRAS l 20300milDIP 26/20300milSOJ DIP20-P-300-2 DIP20-P-300-2.54-W1MSM514256C/CL-xxRS SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 MSM514256C/CL-xxJS 20400milZIP ... | Original |
18 pages, |
ZIP20 MSM514256 DIP20 msm514256c datasheet abstract |
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| Abstract: J2G0010-17-41 J2G0010-17-41 1998 1 MSM514256C/CL MSM514256C/CL q 1997 5 ¡ MSM514256C/CL MSM514256C/CL 262,144-WordÃ-4-Bit DYNAMIC RAM n MSM514256C/CLCMOS262 MSM514256C/CLCMOS262,144Ã-4 41CMOS 41CMOS 20DIP26/20SOJ20ZIP 20DIP26/20SOJ20ZIP L n l 262,144-Ã-4 l 5V±10 l TTL l TTL l 5128ms51264msL- l l CASRASRAS l 20300milDIP 26/20300milSOJ DIP20-P-300-2 DIP20-P-300-2.54-W1MSM514256C/CL-xxRS SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 MSM514256C/CL-xxJS 20400milZIP ZIP20-P-400-1 ZIP20-P-400-1.27 MSM514256C/CL-xxZS xx n tAA tCAC tOEA tRAC MSM514256C/CL-45 MSM514256C/CL-45 45ns 24ns 14 ... | Original |
17 pages, |
ZIP20 MSM514256 DIP20 J2G00101741 MSM514256C/CL J2G00101741 abstract |
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| Abstract: ¡ MSM51V4400D/DL MSM51V4400D/DL q J2G0119-17-51 J2G0119-17-51 MSM51V4400D/DL MSM51V4400D/DL 1,048,576-WordÃ-4-Bit DYNAMIC RAM n MSM51V4400D/DLCMOS1 MSM51V4400D/DLCMOS1,048,576Ã-4 41CMOS 41CMOS 26/20SOJ26/20TSOP 26/20SOJ26/20TSOP L n l 1,048,576-Ã-4 l 3.3V±0.3V l LVTTL l LVTTL l 1,02416ms1,024128msL- l l CASRASRAS l l 26/20300milSOJ SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 MSM51V4400D/DL-xxSJ 26/20300milTSOP TSOPII26/20-P-300-1 TSOPII26/20-P-300-1.27-K MSM51V4400D/DL-xxTS-K xx n tAA tCAC tOEA tRAC MSM51V4400D/DL-60 MSM51V4400D/DL-60 60ns 30ns 15ns 15ns 110ns 252mW M ... | Original |
9 pages, |
MSM51V4400 MSM51V4400D MSM51V4400D/DL MSM51V4400D/DL abstract |
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| Abstract: OKI 2008 10 1 OKI OKI OKI 2008 10 1 OKI 193-8550 550-1 http://www.okisemi.com/jp/ ¡ MSM51V4400D/DL MSM51V4400D/DL q J2G0119-17-51 J2G0119-17-51 MSM51V4400D/DL MSM51V4400D/DL 1,048,576-WordÃ-4-Bit DYNAMIC RAM n MSM51V4400D/DLCMOS1 MSM51V4400D/DLCMOS1,048,576Ã-4 41CMOS 41CMOS 26/20SOJ26/20TSOP 26/20SOJ26/20TSOP L n l 1,048,576-Ã-4 l 3.3V±0.3V l LVTTL l LVTTL l 1,02416ms1,024128msL- l l CASRASRAS l l 26/20300milSOJ SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 MSM51V4400D/DL-xxSJ 26/20300milTSOP TSOPII26/20-P-300-1 TSOPII26/20-P-300-1.27-K MSM51V4400D/D MSM51V4400D/D ... | Original |
10 pages, |
MSM51V4400 datasheet abstract |
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| Abstract: J2G0023-17-41 J2G0023-17-41 1998 1 MSM514400D/DL MSM514400D/DL q 1997 5 ¡ MSM514400D/DL MSM514400D/DL 1,048,576-WordÃ-4-Bit DYNAMIC RAM s MSM514400D/DLCMOS1 MSM514400D/DLCMOS1,048,576Ã-4 41CMOS 41CMOS 26/20SOJ20ZIP26/20TSOP 26/20SOJ20ZIP26/20TSOP L s l 1,048,576-Ã-4 l 5V±10 l TTL l TTL l 1,024/16ms1,024128msL- l l CASRASRAS l l 26/20300milSOJ SOJ26/20-P-300-1 SOJ26/20-P-300-1.27 MSM514400D/DL-xxSJ 20400milZIP ZIP20-P-400-1 ZIP20-P-400-1.27 MSM514400D/DL-xxZS xx s tAA tCAC tOEA tRAC MSM514400D MSM514400D ... | Original |
17 pages, |
ZIP20 MSM514400 J2G00231741 MSM514400D/DL J2G00231741 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| No abstract text available www.datasheetarchive.com/download/63047635-676675ZC/ae.15m250k.jpg |
User Photos | 23/05/2012 | 18.78 Kb | JPG | ae.15m250k.jpg |
| A 5 r mgc_symbol 6958231436b3.02.94.82.a0.05.00.00.00 1 2 1 0 V v 1 1 695823143737.02.94.82.a0.05.00.00.00 F f 1 "XRIP5B4Y0.smbl_1" O 1 R csduv 0 "$QLOGIC/RIPPER_LIBRARY/XRIP5B4Y0/part" 1 Eddm_part 69582315ae14.02.94.82.a0.05.00.00.00 tar:compress:www.datasheetarchive.com/files/quicklogic/thirdp/mentor/mentor.tz!/mentor.!/./ripper_library/xrip5b4y0/xrip5b4y0.mgc_symbol.attr |
QuickLogic | 26/02/1997 | 6387.15 Kb | TZ | mentor.tz |
| # NET " " LOC "AG14"; # RESET # NET " " LOC "AD15"; # UBIRST # NET " " LOC "AE15 www.datasheetarchive.com/download/27999354-995999ZC/xapp622.zip (trim.ucf) |
Xilinx | 18/06/2004 | 217.98 Kb | ZIP | xapp622.zip |
| PAD224 PAD224 PAD224 PAD224 AE14 pin PAD225 PAD225 PAD225 PAD225 pin PAD226 PAD226 PAD226 PAD226 AD14 pin PAD227 PAD227 PAD227 PAD227 AF15 pin PAD228 PAD228 PAD228 PAD228 AE15 pin PAD229 PAD229 PAD229 PAD229 pin PAD230 PAD230 PAD230 PAD230 AD15 pin www.datasheetarchive.com/download/70089650-986475ZC/wcd022ff.zip (5215b352.pkg) |
Xilinx | 13/07/1998 | 1903.63 Kb | ZIP | wcd022ff.zip |
| PAD224 PAD224 PAD224 PAD224 AE14 pin PAD225 PAD225 PAD225 PAD225 pin PAD226 PAD226 PAD226 PAD226 AD14 pin PAD227 PAD227 PAD227 PAD227 AF15 pin PAD228 PAD228 PAD228 PAD228 AE15 pin PAD229 PAD229 PAD229 PAD229 pin PAD230 PAD230 PAD230 PAD230 AD15 pin www.datasheetarchive.com/download/83416831-986477ZC/wcd02301.z |
Xilinx | 13/07/1998 | 2879.94 Kb | Z | wcd02301.z |
| PAD224 PAD224 PAD224 PAD224 AE14 pin PAD225 PAD225 PAD225 PAD225 pin PAD226 PAD226 PAD226 PAD226 AD14 pin PAD227 PAD227 PAD227 PAD227 AF15 pin PAD228 PAD228 PAD228 PAD228 AE15 pin PAD229 PAD229 PAD229 PAD229 pin PAD230 PAD230 PAD230 PAD230 AD15 pin www.datasheetarchive.com/download/29960019-986478ZC/wcd02302.z |
Xilinx | 13/07/1998 | 3033.65 Kb | Z | wcd02302.z |
| PAD224 PAD224 PAD224 PAD224 AE14 pin PAD225 PAD225 PAD225 PAD225 pin PAD226 PAD226 PAD226 PAD226 AD14 pin PAD227 PAD227 PAD227 PAD227 AF15 pin PAD228 PAD228 PAD228 PAD228 AE15 pin PAD229 PAD229 PAD229 PAD229 pin PAD230 PAD230 PAD230 PAD230 AD15 pin www.datasheetarchive.com/download/94870060-986592ZC/wcd02569.zip (5215b352.pkg) |
Xilinx | 12/02/1999 | 1903.63 Kb | ZIP | wcd02569.zip |
| AC5 AF9 , AE9 AD8 AC10 AE10 AD7 AD5 AF7 AF5 AE6 AC7 AD6 AF6 AE7 AC12 AE13 AE15 AD11 , G23 C www.datasheetarchive.com/download/54130208-847651ZC/evalc2.zip (ConsumerIIPC.txt) |
STMicroelectronics | 10/01/2001 | 346.67 Kb | ZIP | evalc2.zip |
| d031d2095576497d4323f5b4e27ffc7c48133f984794 d d6e8aa9416183ddb4694ea6bc910b90f48133f984794 6ae15b8c9f43b0c533abb002 www.datasheetarchive.com/download/40614468-919022ZC/sllm114.zip (CSD16413Q5A.lib) |
Texas Instruments | 06/08/2011 | 9.85 Kb | ZIP | sllm114.zip |
| " " LOC "AE15"; # SPARE - From MODE-DIP switch 4 IO4L73P IO4L73P IO4L73P IO4L73P # # Clock Control Signals 15"; # IO4L73N IO4L73N IO4L73N IO4L73N IO4L73N IO4L73N IO4L73N IO4L73N # NET " " LOC "AE15 www.datasheetarchive.com/download/27999354-995999ZC/xapp622.zip (xlvds_base.ucf) |
Xilinx | 18/06/2004 | 217.98 Kb | ZIP | xapp622.zip |
| Part | Manufacturer | Description | Shortform Datasheet | Ordering |
| AE150 | Saltt | Silicon Rectifier | |
| NTE Electronics Part | Industry Part |