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AE15 Datasheet

Part Manufacturer Description PDF Type
AE15 N/A Semiconductor Devices, Diode, and SCR Datasheet Catalog Scan
AE150 N/A Shortform Semicon, Diode, and SCR Datasheets Scan
AE150 N/A Semiconductor Devices, Diode, and SCR Datasheet Catalog Scan

AE15

Catalog Datasheet MFG & Type PDF Document Tags

AE80

Abstract: AE13 SURFACE MOUNT CRYSTALS CRYSTALS TAPE AND REEL SPECIFICATIONS · TAPE SPECIFICATIONS (millimeters) MODEL FC FD FE/FH/FL FM FPX FQA FSM FST/FSR FUE HC49SD HC49SSD FSP A Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 B 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 C 12.0 8.0 8.0 8.0 12.0 8.0 8.0 8.0 12.0 12.0 12.0 8.0 D 11.5 7.5 7.5 5.5 11.5 5.5 7.5 7.5 11.5 11.5 11.5 7.5 E 24.0 16.0 16.0 12.0 24.0
Fox Electronics
Original
AE80 AE13 ae100 AE23 AE330 AE250

F4100

Abstract: F4200 SURFACE MOUNT OSCILLATORS OSCILLATORS TAPE AND REEL SPECIFICATIONS TAPE SPECIFICATIONS (millimeters) MODEL FSO-2 KFO90AT F3345/F3355 F3400/F3410 F4100 F4200 F5000/F5100(VCXO) F5500 FOX739/59 RTC72423 FOX305 FOX312 FOX801 A Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 Æ1.5 B 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 4.0 C 12.0 12.0 8.0 8.0 8.0 8.0 12.0 12.0 16.0 16.0 12.0 8.0 12.0 D 11.5 11.5 7.5 5.5 7.5 5.5
Fox Electronics
Original
F5000

M-Bond AE-10 Adhesive Kit

Abstract: M-BOND AE-10 AND AE-15 M-Bond AE-10 and AE-15 Vishay Micro-Measurements Protective Coatings FEATURES · Thin, hard , coatings because of low vapor-transmission rate. AE-15 is superior but requires heat cure. Single coating , sealing concrete. CHARACTERISTICS Cure Requirements: AE-10 minimum cure 6 hours at +75°F [+24°C]; AE-15 , M-Bond AE-10 and M-Bond AE-15. Operating Temperature Range: ­100° to +200°F [­75° to +95°C]. Shelf , ; AE-15 is 1-1/2 hours at +75°F [+24°C]. PACKAGING OPTIONS Kit: 6 mixing jars AE Resin [10 g] ea
Vishay Micro-Measurements
Original
M-Bond AE-10 Adhesive Kit M-BOND AE-10 AND AE-15 M-BOND AE-10 ADHESIVE ae-10 vishay AE10 AS 15 f

M-Bond AE-10 Adhesive Kit

Abstract: M-BOND AE-10 -10, AE-15 and GA-2 Adhesive Systems GENERAL DESCRIPTION MIXING INSTRUCTIONS AND ADHESIVE CHARACTERISTICS The three adhesives described in this bulletin, MBond AE- 10, AE-15, and GA-2, are all 100 , high-elongation strain measurements. Strain Gage Applications with M-Bond AE-10, AE-15 and GA-2 Adhesive System , -Apr-05 www.vishaymg.com Instruction Bulletin B-137 Vishay Micro-Measurements C. M-Bond AE-15 Adhesive Kit AE-15 , strain gage transducers, where zero shift and hysteresis must be minimized. The AE-15 system is also
Vishay Micro-Measurements
Original
GT-14 bulletin B137 TT-605 M-BOND 200 safety data M-Bond AE-15 Adhesive Kit Strain Gage adhesive paper dropper

M-BOND GA-2

Abstract: M-BOND AE-10 AND AE-15 M-Bond AE-15 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND AE-15 INSTALLATION: · · · · · · · · · CSM Degreaser or GC-6 Isopropyl Alcohol Silicon-Carbide Paper M-Prep Conditioner A M-Prep Neutralizer 5A GSP-1 Gauze Sponges CSP-1 Cotton Applicators PCT-2A Cellophane Tape HSC Spring Clamp GT-14 Pressure Pads and Backup Plates DESCRIPTION , with M-Bond AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit. www.vishaymg.com 22
Vishay Micro-Measurements
Original
M-BOND GA-2 rods

PCT-2M

Abstract: GT-14 pressure pads M-Bond AE-15 Vishay Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND AE-15 INSTALLATION: · CSM Degreaser or GC-6 Isopropyl Alcohol · Silicon-Carbide Paper · M-Prep Conditioner A RoHS · M-Prep Neutralizer 5A COMPLIANT · GSP-1 Gauze Sponges · CSP-1 Cotton Applicators · PCT-2M Gage Installation Tape · HSC Spring Clamp · GT-14 Pressure Pads and Backup Plates , Applications with M-Bond AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit
Vishay Micro-Measurements
Original
PCT-2M GT-14 pressure pads M-BOND 200
Abstract: M-Bond AE-15 Micro-Measurements Strain Gage Adhesive OTHER ACCESSORIES USED IN AN M-BOND AE-15 INSTALLATION: ï'· CSM Degreaser or GC-6 Isopropyl Alcohol ï'· Silicon-Carbide Paper ï'· M-Prep Conditioner A ï'· M-Prep Neutralizer 5A ï'· GSP-1 Gauze Sponges ï'· CSP-1 Cotton Applicators ï'· PCT-2M Gage Installation Tape ï'· HSC Spring Clamp ï'· GT-14 Pressure Pads and Backup Plates DESCRIPTION , Bulletin B-137, â'Strain Gage Applications with M-Bond AE-10, AE-15, and GA-2 Adhesive Systemsâ Vishay Micro-Measurements
Original

CD-02-50A

Abstract: RTV 3140 AE-15 are also suitable where in-service temperatures will not exceed +200°F [+95°C]. M-Bond 200 is , temperatures are necessary, M-Bond AE-10 and AE-15 are recommended. When in-service environmental conditions
Vishay Micro-Measurements
Original
CD-02-50A CD-23-50A RTV 3140 CD-02-25A M-BOND 600 CD-23-10A CD-02-10A

CD-23-10A

Abstract: CRACK DETECTION PATTERNS over the widest operating temperature range. However, M-Bond AE-10 and AE-15 are also suitable where , cure temperatures are necessary, M-Bond AE-10 and AE-15 are recommended. When in-service
Vishay Micro-Measurements
Original
CD-23-15A CRACK DETECTION PATTERNS M-COAT 43B CRACK CRACK PROPAGATION PATTERNS CD-02 CD-02-15A CD-02-20A CD-23-20A CD-23-25A

6E23

Abstract: ZF steering division of the 48MHz clock (USB_48MHZ_C [AE15]). The Real Time Clock resets its value when power off , Checklist Clocks The ZFx86 needs both SYSCLK_C (pin A20) and USB_48MHZ_C (pin AE15) to operate. In , Clock inputs: 32KHZ_C (AE01) 32KHZC_C (AF01) USB_48MHZ_C (AE15) SYSCLK_C (A20) USB
ZF Micro Solutions
Original
6E23 ZF steering 13v03 AF14 AE01 STF201 ZFMS-AN-0005 EN-0001 RS232
Abstract: performance over the widest operating temperature range. However, M-Bond AE-10 and AE-15 are also suitable , -10 and AE-15 are recommended. When in-service environmental conditions are not extreme, a softer Vishay Micro-Measurements
Original

tetra-etch

Abstract: MR1-350-130 . M-Bond AE-15 2-Component, 100%-Solids Epoxy , 3145 RTV M-Bond AE-10 & AE-15 M-Bond 43-B M-Bond GA-61 Barrier E Barrier J II Barrier WD , -10 . M-Bond AE-10, Used as Protective Coating . M-Bond AE-15 . M-Bond AE-15, Used as Protective Coating . M-Bond GA
Vishay Micro-Measurements
Original
tetra-etch MR1-350-130 Gore tetra etch 430-FST 136-awp 134-AWP VSE-DB0065-0707

mini-din 9

Abstract: MDIN03J MiniDIN Series (J) Solder Jack, Assembly Type Specifications Æ5.5 Æ15.0 Insulation Resistance: 50MW min. at 500 V DC Withstanding Voltage: 500 V AC for 1 minute Contact Resistance: 30mW max. Rating : 1A max. at 100 V AC Operating Temp. Range:-55°C to +85°C Mating Cycles: 1000 min. at 10-20 times per minute (no electrical load) Materials and Finish 38.0 53.5 Receptacle Shell Dim. 3­8 pins Æ9.00 mm 9 pins Æ10.00 mm 6 Pins Housing: PVC Shell: Bronze, Nickel Plated
Yamaichi Electronics
Original
MDIN06J MDIN03J MDIN04J MDIN07J MDIN08J MDIN05J mini-din 9

M-BOND AE-10

Abstract: M-Bond AE-10 Adhesive Kit M-Bond AE-10, AE-15, and GA-2 Adhesive Systems", included in each kit. Document Number: 11011
Vishay Micro-Measurements
Original

M-BOND AE-10

Abstract: M-Bond AE-10 Adhesive Kit B-137, "Strain Gage Applications with M-Bond AE-10, AE-15, and GA-2 Adhesive Systems," included in
Vishay Micro-Measurements
Original
viscosity Vishay Conditioner A M-Prep Conditioner A

91SS12-2

Abstract: 92SS12-2 HONEYWELL INC/ MICRO TMD D ^~4SSlfi3G 0ÜDT375 Tr ~ r-c 9SS Analog position sensors MOUNTING DIMENSIONS 7.6 .3 0 (For reference only) -$ M A X Æ.15 .02 as. ? FEATURES · Three pin in-line p rinted circuit board terminals · Standard .100" mounting centers · Thin ceramic package · Laser trimmed thick film resistors min imize sensitivity variations and com pensates fo r temperature variations · Tight specifications on output as func tion o f magnetic induction NOTE: Calibrated
-
OCR Scan
91SS12-2 93SS12-2 92SS12-2 12VDC
Abstract: 1 7 1 1234566789182ABC712DEE82712BAF#16;#17;2#18;8277 7 7 #25;5#21;#26;#30;5C#27;#27;#23;#31;D5 #28;#26;#21;#24;5C#29;#23;#31;D5 #19;#19;5 1#19;5 #25;5#25;#26;#27;5C#27;#28;#23;#29;D5 5 5 5 5 5 5 5 #19; 5 1 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 3AA5A23$#19;53#17;25#30;#20;%5A6FB#23;5 5 5 5 &2EB"85'5#30;#23;#22;#22;5A(#19;5 5 5 $E#18;2F#19;E6F#19;53#17;25EF5EF#16;"2#19;55 5 C#18;EAAE#18;282#17;#19;D#23;5 #20;5C#21;#22;#21;#23;#24;D5 #30;5#21;#26;#30;5C#24;#25;#23;#28;D5 #21;#26;#30;5 C#21;#30;#23;#29;D5 5 5 5 5 #30;5 #29;#26;#21;#24;55 C#24;#21;#23;#31;D5 !#23;#21;#27;#27;55 5 #20;1A5 5 #30;5 #25;#26;#21;#24;55 C#28;#28;#23;#24;D5 #25;5#21;#28;#26;#21;#24;5C#21;#22;#22;D5 5 5 5 #21;#26;#27;5 C#25;#23;#30;D5 AE15 1#19;5 5 #19; C"9D5 1 5 5 Excelitas Technologies
Original
1CDA87 15C36 565C36 12345EF1785 2F85C3 12345678178596A83B25C49D5

diode b1c SMD

Abstract: NB b6 smd transistor : Instruction Bulletin B-137, "Strain Gage Applications with M-Bond AE-10, AE-15, and GA-2 Adhesive Systems,"
Fox Electronics
Original
diode b1c SMD NB b6 smd transistor diode bb4 7g diode F4 3J smd b1c smd diode S6 6D 16M15C

M-BOND AE-10

Abstract: M-Bond AE-10 Adhesive Kit * -.1 9 0 ± .0 1 0 [4.83mm ± 0 .25 ] Æ15 ±.010 - rpjamm ±.0.23] 145
Vishay Micro-Measurements
Original
Abstract: M-Bond AE-10 and AE-15 Vishay Micro-Measurements Protective Coatings FEATURES · Thin, hard , coatings because of low vapor-transmission rate. AE-15 is superior but requires heat cure. Single coating , sealing concrete. CHARACTERISTICS Cure Requirements: AE-10 minimum cure 6 hours at +75°F [+24°C]; AE-15 , M-Bond AE-10 and M-Bond AE-15. Operating Temperature Range: ­100° to +200°F [­75° to +95°C]. Shelf , ; AE-15 is 1-1/2 hours at +75°F [+24°C]. PACKAGING OPTIONS Kit: 6 mixing jars AE Resin [10 g] ea -
OCR Scan
IL-R-22097 MIL-R-22097

DIP20

Abstract: MSM514256 -10, AE-15 and GA-2 Adhesive Systems GENERAL DESCRIPTION MIXING INSTRUCTIONS AND ADHESIVE CHARACTERISTICS The three adhesives described in this bulletin, MBond AE- 10, AE-15, and GA-2, are all 100 , high-elongation strain measurements. Strain Gage Applications with M-Bond AE-10, AE-15 and GA-2 Adhesive System , -Apr-05 www.vishaymg.com Instruction Bulletin B-137 Vishay Micro-Measurements C. M-Bond AE-15 Adhesive Kit AE-15 , strain gage transducers, where zero shift and hysteresis must be minimized. The AE-15 system is also
OKI Electric Industry
Original
DIP20 MSM514256 ZIP20 J2G0010-17-41 MSM514256C/CL 144-W MSM514256C/CLCMOS262 41CMOS 20DIP26/20SOJ20ZIP
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