ADS7844 SBAS100A 20-LEAD MAX147 ADS7844E ADS7844EB ADS7844N QSOP-20 SSOP-20 - Datasheet Archive

 

784 4 ADS7844 ADS 784 4 SBAS100A ­ JANUARY 1998 ­ REVISED OCTOBER 2003 12-Bit, 8-Channel Serial Output Sampling

 

ADS 784 4 ADS7844 ADS7844 ADS 784 4 SBAS100A SBAS100A ­ JANUARY 1998 ­ REVISED OCTOBER 2003 12-Bit, 8-Channel Serial Output Sampling ANALOG-TO-DIGITAL CONVERTER FEATURES DESCRIPTION q SINGLE SUPPLY: 2.7V to 5V The ADS7844 ADS7844 is an 8-channel, 12-bit sampling analog-todigital converter (ADC) with a synchronous serial interface. Typical power dissipation is 3mW at a 200kHz throughput rate and a +5V supply. The reference voltage (VREF) can be varied between 100mV and VCC, providing a corresponding input voltage range of 0V to VREF. The device includes a shutdown mode that reduces power dissipation to under 1µW. The ADS7844 ADS7844 is ensured down to 2.7V operation. q 8-CHANNEL SINGLE-ENDED OR 4-CHANNEL DIFFERENTIAL INPUT q UP TO 200kHz CONVERSION RATE q q q q q ±1 LSB MAX INL AND DNL NO MISSING CODES 72dB SINAD SERIAL INTERFACE 20-LEAD 20-LEAD QSOP AND 20-LEAD 20-LEAD SSOP PACKAGES q ALTERNATE SOURCE FOR MAX147 MAX147 Low power, high speed, and onboard multiplexer make the ADS7844 ADS7844 ideal for battery-operated systems such as personal digital assistants, portable multichannel data loggers, and measurement equipment. The serial interface also provides low-cost isolation for remote data acquisition. The ADS7844 ADS7844 is available in a 20-lead QSOP package and the MAX147 MAX147 equivalent 20-lead SSOP package and is ensured over the ­40°C to +85°C temperature range. APPLICATIONS q q q q q DATA ACQUISITION TEST AND MEASUREMENT INDUSTRIAL PROCESS CONTROL PERSONAL DIGITAL ASSISTANTS BATTERY-POWERED SYSTEMS CH0 SAR CH1 DCLK CH2 CH3 CH4 Eight Channel Multiplexer CS Comparator Serial Interface and Control CH5 CH6 CDAC CH7 COM SHDN DIN DOUT BUSY VREF Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 1998-2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com SPECIFICATION: +5V At TA = ­40°C to +85°C, +VCC = +5V, VREF = +5V, fSAMPLE = 200kHz, and fCLK = 16 · fSAMPLE = 3.2MHz, unless otherwise noted. ADS7844E ADS7844E, N PARAMETER ANALOG INPUT Full-Scale Input Span Absolute Input Range CONDITIONS MIN Positive Input - Negative Input Positive Input Negative Input TYP 0 ­0.2 ­0.2 MAX UNITS V V V pF µA 12 12 ±0.8 0.15 0.1 30 70 SAMPLING DYNAMICS Conversion Time Acquisition Time Throughput Rate Multiplexer Settling Time Aperture Delay Aperture Jitter TYP 25 ±1 SYSTEM PERFORMANCE Resolution No Missing Codes Integral Linearity Error Differential Linearity Error Offset Error Offset Error Match Gain Error Gain Error Match Noise Power Supply Rejection ±2 ±0.5 ±3 1.0 ±4 1.0 ±1 ±1 ±3 12 Bits Bits LSB(1) LSB LSB LSB LSB LSB µVrms dB 500 30 100 Clk Cycles Clk Cycles kHz ns ns ps ­76 71 76 120 ­78 72 78 dB dB dB dB 3 200 VIN VIN VIN VIN REFERENCE INPUT Range Resistance Input Current = = = = 5VPP 5VPP 5VPP 5VPP at at at at 10kHz 10kHz 10kHz 50kHz 0.1 +VCC DCLK Static 5 45 2.5 0.001 fSAMPLE = 12.5kHz DCLK Static DIGITAL INPUT/OUTPUT Logic Family Logic Levels VIH VIL VOH VOL Data Format POWER SUPPLY REQUIREMENTS +VCC Quiescent Current MIN VREF +VCC +0.2 +1.25 Capacitance Leakage Current DYNAMIC CHARACTERISTICS Total Harmonic Distortion(2) Signal-to-(Noise + Distortion) Spurious Free Dynamic Range Channel-to-Channel Isolation ADS7844EB ADS7844EB, NB MAX 100 3 3.0 ­0.3 3.5 5.5 +0.8 4.75 550 300 fSAMPLE = 12.5kHz Power-Down Mode(3), CS = +VCC TEMPERATURE RANGE Specified Performance ­40 V V V V 5.25 900 V µA µA µA mW °C 3 4.5 Power Dissipation 0.4 Straight Binary Specified Performance V G µA µA µA CMOS | IIH | +5µA | IIL | +5µA IOH = ­250µA IOL = 250µA +85 Same specifications as ADS7844E ADS7844E, ADS7844N ADS7844N. NOTE: (1) LSB means Least Significant Bit. With VREF equal to +5.0V, one LSB is 1.22mV. (2) First five harmonics of the test frequency. (3) Auto power-down mode (PD1 = PD0 = 0) active or SHDN = GND. 2 ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A SPECIFICATION: +2.7V At TA = ­40°C to +85°C, +VCC = +2.7V, VREF = +2.5V, fSAMPLE = 125kHz, and fCLK = 16 · fSAMPLE = 2MHz, unless otherwise noted. ADS7844E ADS7844E, N PARAMETER ANALOG INPUT Full-Scale Input Span Absolute Input Range CONDITIONS MIN Positive Input - Negative Input Positive Input Negative Input TYP 0 ­0.2 ­0.2 MAX UNITS V V V pF µA 12 12 ±0.8 0.15 0.1 30 70 SAMPLING DYNAMICS Conversion Time Acquisition Time Throughput Rate Multiplexer Settling Time Aperture Delay Aperture Jitter TYP 25 ±1 SYSTEM PERFORMANCE Resolution No Missing Codes Integral Linearity Error Differential Linearity Error Offset Error Offset Error Match Gain Error Gain Error Match Noise Power Supply Rejection ±2 ±0.5 ±3 1.0 ±4 1.0 ±1 ±1 ±3 12 Bits Bits LSB(1) LSB LSB LSB LSB LSB µVrms dB 500 30 100 Clk Cycles Clk Cycles kHz ns ns ps ­75 71 78 100 ­77 72 80 dB dB dB dB 3 125 VIN VIN VIN VIN REFERENCE INPUT Range Resistance Input Current = = = = 2.5VPP 2.5VPP 2.5VPP 2.5VPP at at at at 10kHz 10kHz 10kHz 50kHz 0.1 +VCC DCLK Static 5 13 2.5 0.001 fSAMPLE = 12.5kHz DCLK Static DIGITAL INPUT/OUTPUT Logic Family Logic Levels VIH VIL VOH VOL Data Format POWER SUPPLY REQUIREMENTS +VCC Quiescent Current MIN VREF +VCC +0.2 +0.2 Capacitance Leakage Current DYNAMIC CHARACTERISTICS Total Harmonic Distortion(2) Signal-to-(Noise + Distortion) Spurious Free Dynamic Range Channel-to-Channel Isolation ADS7844EB ADS7844EB, NB MAX 40 3 +VCC · 0.7 ­0.3 +VCC · 0.8 5.5 +0.8 2.7 280 220 fSAMPLE = 12.5kHz Power-Down Mode(3), CS = +VCC TEMPERATURE RANGE Specified Performance ­40 V V V V 3.6 650 +85 3 1.8 Power Dissipation 0.4 Straight Binary Specified Performance V G µA µA µA CMOS | IIH | +5µA | IIL | +5µA IOH = ­250µA IOL = 250µA V µA µA µA mW °C Same specifications as ADS7844E ADS7844E, ADS7844N ADS7844N. NOTE: (1) LSB means Least Significant Bit. With VREF equal to +2.5V, one LSB is 610mV. (2) First five harmonics of the test frequency. (3) Auto power-down mode (PD1 = PD0 = 0) active or SHDN = GND. ADS7844 ADS7844 SBAS100A SBAS100A www.ti.com 3 PACKAGE/ORDERING INFORMATION(1) MINIMUM RELATIVE ACCURACY (LSB) SPECIFIED TEMPERATURE RANGE PACKAGE-LEAD PACKAGE DESIGNATOR ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ±2 " " " ±1 " " " PRODUCT MAXIMUM GAIN ERROR (LSB) ±4 " " " ±3 " " " ­40°C to +85°C " " " ­40°C to +85°C " " " QSOP-20 QSOP-20 " SSOP-20 SSOP-20 " QSOP-20 QSOP-20 " SSOP-20 SSOP-20 " DBQ " DB " DBQ " DB " ADS7844E ADS7844E ADS7844E/2K5 ADS7844E/2K5 ADS7844N ADS7844N ADS7844N/1K ADS7844N/1K ADS7844EB ADS7844EB ADS7844EB/2K5 ADS7844EB/2K5 ADS7844NB ADS7844NB ADS7844NB/1K ADS7844NB/1K Rails, 56 Tape and Reel, 2500 Rails, 68 Tape and Reel,1000 Rails, 56 Tape and Reel, 2500 Rails, 68 Tape and Reel, 1000 ADS7844E ADS7844E " ADS7844N ADS7844N " ADS7844EB ADS7844EB " ADS7844NB ADS7844NB " NOTES: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet. PIN DESCRIPTIONS PIN CONFIGURATION Top View PIN CH0 1 20 CH1 2 19 DCLK CH2 3 18 CS CH3 4 17 DIN CH4 5 16 BUSY DESCRIPTION 1 2 3 4 5 6 7 8 9 +VCC NAME CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM Analog Input Channel 0. Analog Input Channel 1. Analog Input Channel 2. Analog Input Channel 3. Analog Input Channel 4. Analog Input Channel 5. Analog Input Channel 6. Analog Input Channel 7. Ground reference for analog inputs. Sets zero code voltage in single ended mode. Connect this pin to ground or ground reference point. Shutdown. When LOW, the device enters a very low power shutdown mode. Voltage Reference Input. See Specification Table for ranges. Power Supply, 2.7V to 5V. Ground Ground Serial Data Output. Data is shifted on the falling edge of DCLK. This output is high impedance when CS is high. Busy Output. Busy goes low when the DIN control bits are being read and also when the device is converting. The Output is high impedance when CS is High. Serial Data Input. If CS is LOW, data is latched on rising edge of DCLK. Chip Select Input. Active LOW. Data will not be clocked into DIN unless CS is low. When CS is high DOUT is high impedance. External Clock Input. The clock speed determines the conversion rate by the equation fCLK = 16 · fSAMPLE. Power Supply ADS7844 ADS7844 CH5 6 15 DOUT CH6 7 14 GND 10 SHDN CH7 8 13 GND 11 VREF COM 9 12 +VCC SHDN 10 11 VREF 12 13 14 15 +VCC GND GND DOUT 16 BUSY 17 DIN 18 CS 19 CLK 20 +VCC (1) ABSOLUTE MAXIMUM RATINGS +VCC to GND . ­0.3V to +6V Analog Inputs to GND . ­0.3V to +VCC + 0.3V Digital Inputs to GND . ­0.3V to +6V Power Dissipation . 250mW Maximum Junction Temperature . +150°C Operating Temperature Range . ­40°C to +85°C Storage Temperature Range . ­65°C to +150°C Lead Temperature (soldering, 10s) . +300°C NOTE: (1) Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4 ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A TYPICAL PERFORMANCE CURVES:+5V At TA = +25°C, +VCC = +5V, VREF = +5V, fSAMPLE = 200kHz, and fCLK = 16 · fSAMPLE = 3.2MHz, unless otherwise noted. FREQUENCY SPECTRUM (4096 Point FFT; fIN = 1,123Hz, ­0.2dB) FREQUENCY SPECTRUM (4096 Point FFT; fIN = 10.3kHz, ­0.2dB) ­20 ­40 ­40 Amplitude (dB) 0 ­20 Amplitude (dB) 0 ­60 ­80 ­60 ­80 ­100 ­100 ­120 ­120 0 25 50 75 0 100 25 50 75 100 Frequency (kHz) Frequency (kHz) SIGNAL-TO-NOISE RATIO AND SIGNAL-TO(NOISE+DISTORTION) vs INPUT FREQUENCY SPURIOUS FREE DYNAMIC RANGE AND TOTAL HARMONIC DISTORTION vs INPUT FREQUENCY 74 ­85 85 SNR SFDR SINAD 71 THD 75 ­75 70 ­70 70 69 ­65 100 65 68 1 10 1 100 10 Input Frequency (kHz) Input Frequency (kHz) EFFECTIVE NUMBER OF BITS vs INPUT FREQUENCY CHANGE IN SIGNAL-TO-(NOISE+DISTORTION) vs TEMPERATURE 0.6 0.4 11.8 Delta from +25°C (dB) Effective Number of Bits 12.0 11.6 11.4 11.2 0.2 0.0 ­0.2 ­0.4 fIN = 10kHz, ­0.2dB 11.0 ­0.6 1 10 ­40 100 ADS7844 ADS7844 SBAS100A SBAS100A ­20 0 20 40 60 80 100 Temperature (°C) Input Frequency (kHz) www.ti.com 5 THD (dB) ­80 80 72 SFDR (dB) SNR and SINAD (dB) 73 TYPICAL PERFORMANCE CURVES:+2.7V At TA = +25°C, +VCC = +2.7V, VREF = +2.5V, fSAMPLE = 125kHz, and fCLK = 16 · fSAMPLE = 2MHz, unless otherwise noted. FREQUENCY SPECTRUM (4096 Point FFT; fIN = 10.6kHz, ­0.2dB) FREQUENCY SPECTRUM (4096 Point FFT; fIN = 1,129Hz, ­0.2dB) ­20 ­40 ­40 Amplitude (dB) 0 ­20 ­60 ­80 ­100 ­60 ­80 ­100 ­120 ­120 0 15.6 31.3 46.9 62.5 0 15.6 31.3 46.9 62.5 Frequency (kHz) Frequency (kHz) SIGNAL-TO-NOISE RATIO AND SIGNAL-TO(NOISE+DISTORTION) vs INPUT FREQUENCY SPURIOUS FREE DYNAMIC RANGE AND TOTAL HARMONIC DISTORTION vs INPUT FREQUENCY 90 78 SNR 85 74 ­85 SFDR 80 70 SFDR (dB) SNR and SINAD (dB) ­90 66 SINAD ­80 75 ­75 70 ­70 THD ­65 ­60 55 58 65 60 62 ­55 50 54 1 10 Input Frequency (kHz) ­50 1 100 10 100 Input Frequency (kHz) EFFECTIVE NUMBER OF BITS vs INPUT FREQUENCY CHANGE IN SIGNAL-TO-(NOISE+DISTORTION) vs TEMPERATURE 12.0 0.4 11.5 0.2 Delta from +25°C (dB) Effective Number of Bits fIN = 10kHz, ­0.2dB 11.0 10.5 10.0 ­0.2 ­0.4 ­0.6 9.5 ­0.8 9.0 1 10 100 ­40 ­20 0 20 40 60 80 100 Temperature (°C) Input Frequency (kHz) 6 0.0 ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A THD (dB) Amplitude (dB) 0 TYPICAL PERFORMANCE CURVES:+2.7V (CONT) At TA = +25°C, +VCC = +2.7V, VREF = +2.5V, fSAMPLE = 125kHz, and fCLK = 16 · fSAMPLE = 2MHz, unless otherwise noted. POWER DOWN SUPPLY CURRENT vs TEMPERATURE SUPPLY CURRENT vs TEMPERATURE 120 Supply Current (nA) 140 350 Supply Current (µA) 400 300 250 200 100 80 60 40 150 20 100 ­40 ­20 0 20 40 60 80 ­40 100 ­20 0 INTEGRAL LINEARITY ERROR vs CODE 60 80 100 0.75 0.50 0.50 DLE (LSB) 1.00 0.75 ILE (LSB) 40 DIFFERENTIAL LINEARITY ERROR vs CODE 1.00 0.25 0.00 ­0.25 0.25 0.00 ­0.25 ­0.50 ­0.50 ­0.75 ­0.75 ­1.00 000H ­1.00 000H FFFH 800H 800H Output Code FFFH Output Code CHANGE IN GAIN vs TEMPERATURE CHANGE IN OFFSET vs TEMPERATURE 0.6 0.10 0.4 Delta from +25°C (LSB) 0.15 Delta from +25°C (LSB) 20 Temperature (°C) Temperature (°C) 0.05 0.00 ­0.05 0.2 0.0 ­0.2 ­0.4 ­0.10 ­0.6 ­0.15 ­40 ­20 0 20 40 60 80 ­40 100 ADS7844 ADS7844 SBAS100A SBAS100A ­20 0 20 40 60 80 100 Temperature (°C) Temperature (°C) www.ti.com 7 TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C, +VCC = +2.7V, VREF = +2.5V, fSAMPLE = 125kHz, and fCLK = 16 · fSAMPLE = 2MHz, unless otherwise noted. REFERENCE CURRENT vs TEMPERATURE REFERENCE CURRENT vs SAMPLE RATE 16 Reference Current (µA) 18 12 Reference Current (µA) 14 10 8 6 4 14 12 10 8 2 6 0 0 25 50 75 100 ­40 125 ­20 0 20 40 60 80 100 Temperature (°C) Sample Rate (kHz) MAXIMUM SAMPLE RATE vs +VCC SUPPLY CURRENT vs +VCC 1M 320 300 Sample Rate (Hz) Supply Current (µA) fSAMPLE = 12.5kHz 280 VREF = +VCC 260 240 220 100k 10k VREF = +VCC 200 1k 180 2 2.5 3 3.5 4 4.5 2 5 8 2.5 3 3.5 4 4.5 5 +VCC (V) +VCC (V) ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A THEORY OF OPERATION ANALOG INPUT Figure 2 shows a block diagram of the input multiplexer on the ADS7844 ADS7844. The differential input of the converter is derived from one of the eight inputs in reference to the COM pin or four of the eight inputs. Table I and Table II show the relationship between the A2, A1, A0, and SGL/DIF control bits and the configuration of the analog multiplexer. The control bits are provided serially via the DIN pin, see the Digital Interface section of this data sheet for more details. The ADS7844 ADS7844 is a classic successive approximation register (SAR) analog-to-digital (A/D) converter. The architecture is based on capacitive redistribution which inherently includes a sample/hold function. The converter is fabricated on a 0.6µs CMOS process. The basic operation of the ADS7844 ADS7844 is shown in Figure 1. The device requires an external reference and an external clock. It operates from a single supply of 2.7V to 5.25V. The external reference can be any voltage between 100mV and +VCC. The value of the reference voltage directly sets the input range of the converter. The average reference input current depends on the conversion rate of the ADS7844 ADS7844. When the converter enters the hold mode, the voltage difference between the +IN and ­IN inputs (see Figure 2) is captured on the internal capacitor array. The voltage on the ­IN input is limited between ­0.2V and 1.25V, allowing the input to reject small signals which are common to both the +IN and ­IN input. The +IN input has a range of ­0.2V to +VCC + 0.2V. The analog input to the converter is differential and is provided via an eight-channel multiplexer. The input can be provided in reference to a voltage on the COM pin (which is generally ground) or differentially by using four of the eight input channels (CH0 - CH7). The particular configuration is selectable via the digital interface. A2 A1 A0 0 0 0 1 0 0 0 0 1 1 0 1 1 1 0 0 1 1 1 1 A0 CH0 CH1 0 0 +IN ­IN 0 0 1 ­IN 0 1 0 ­IN 0 1 1 ­IN 1 0 0 ­IN 1 A1 0 ­IN 0 A2 ­IN 1 0 The input current on the analog inputs depends on the conversion rate of the device. During the sample period, the source must charge the internal sampling capacitor (typi- 1 0 1 ­IN 1 1 0 ­IN 1 1 1 CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 COM +IN +IN +IN +IN +IN +IN +IN +IN TABLE I. Single-Ended Channel Selection (SGL/DIF HIGH). CH3 +IN CH4 CH5 +IN CH6 CH7 +IN ­IN CH2 ­IN ­IN ­IN ­IN +IN +IN ­IN +IN ­IN +IN TABLE II. Differential Channel Control (SGL/DIF LOW). +2.7V to +5V ADS7844 ADS7844 0.1µF 1µF to 10µF 1 +VCC 20 2 CH1 DCLK 19 3 CH2 CS 18 Chip Select 4 CH3 DIN 17 Serial Data In 5 CH4 BUSY 16 6 CH5 DOUT 15 7 CH6 GND 14 8 CH7 GND 13 9 Single-ended or differential analog inputs CH0 COM +VCC 12 10 SHDN Serial/Conversion Clock Serial Data Out VREF 11 1µF to 10µF FIGURE 1. Basic Operation of the ADS7844 ADS7844. ADS7844 ADS7844 SBAS100A SBAS100A www.ti.com 9 Likewise, the noise or uncertainty of the digitized output will increase with lower LSB size. With a reference voltage of 100mV, the LSB size is 24µV. This level is below the internal noise of the device. As a result, the digital output code will not be stable and vary around a mean value by a number of LSBs. The distribution of output codes will be gaussian and the noise can be reduced by simply averaging consecutive conversion results or applying a digital filter. A2-A0 (shown 000B)(1) CH0 CH1 CH2 CH3 CH4 CH5 CH6 CH7 +IN Converter -IN With a lower reference voltage, care should be taken to provide a clean layout including adequate bypassing, a clean (low noise, low ripple) power supply, a low-noise reference, and a low-noise input signal. Because the LSB size is lower, the converter will also be more sensitive to nearby digital signals and electromagnetic interference. The voltage into the VREF input is not buffered and directly drives the capacitor digital-to-analog converter (CDAC) portion of the ADS7844 ADS7844. Typically, the input current is 13µA with a 2.5V reference. This value will vary by microamps depending on the result of the conversion. The reference current diminishes directly with both conversion rate and reference voltage. As the current from the reference is drawn on each bit decision, clocking the converter more quickly during a given conversion period will not reduce overall current drain from the reference. COM NOTE: (1) See Truth Tables, Table 1, and Table 2 for address coding. DIGITAL INTERFACE SGL/DIF (shown HIGH) FIGURE 2. Simplified Diagram of the Analog Input. cally 25pF). After the capacitor has been fully charged, there is no further input current. The rate of charge transfer from the analog source to the converter is a function of conversion rate. REFERENCE INPUT The external reference sets the analog input range. The ADS7844 ADS7844 will operate with a reference in the range of 100mV to +VCC. Keep in mind that the analog input is the difference between the +IN input and the ­IN input as shown in Figure 2. For example, in the single-ended mode, a 1.25V reference, and with the COM pin grounded, the selected input channel (CH0 - CH7) will properly digitize a signal in the range of 0V to 1.25V. If the COM pin is connected to 0.5V, the input range on the selected channel is 0.5V to 1.75V. There are several critical items concerning the reference input and its wide voltage range. As the reference voltage is reduced, the analog voltage weight of each digital output code is also reduced. This is often referred to as the LSB (least significant bit) size and is equal to the reference voltage divided by 4096. Any offset or gain error inherent in the A/D converter will appear to increase, in terms of LSB size, as the reference voltage is reduced. For example, if the offset of a given converter is 2 LSBs with a 2.5V reference, then it will typically be 10 LSBs with a 0.5V reference. In each case, the actual offset of the device is the same, 1.22mV. 10 Figure 3 shows the typical operation of the ADS7844 ADS7844's digital interface. This diagram assumes that the source of the digital signals is a microcontroller or digital signal processor with a basic serial interface (note that the digital inputs are over-voltage tolerant up to 5.5V, regardless of +VCC). Each communication between the processor and the converter consists of eight clock cycles. One complete conversion can be accomplished with three serial communications, for a total of 24 clock cycles on the DCLK input. The first eight clock cycles are used to provide the control byte via the DIN pin. When the converter has enough information about the following conversion to set the input multiplexer appropriately, it enters the acquisition (sample) mode. After three more clock cycles, the control byte is complete and the converter enters the conversion mode. At this point, the input sample/hold goes into the hold mode. The next twelve clock cycles accomplish the actual analogto-digital conversion. A thirteenth clock cycle is needed for the last bit of the conversion result. Three more clock cycles are needed to complete the last byte (DOUT will be LOW). These will be ignored by the converter. Control Byte Also shown in Figure 3 is the placement and order of the control bits within the control byte. Tables III and IV give detailed information about these bits. The first bit, the `S' bit, must always be HIGH and indicates the start of the control byte. The ADS7844 ADS7844 will ignore inputs on the DIN pin until the start bit is detected. The next three bits (A2 - A0) select the active input channel or channels of the input multiplexer (see Tables I and II and Figure 2). ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 S A2 A1 A0 - SGL/DIF PD1 The SGL/DIF bit controls the multiplexer input mode: either single-ended (HIGH) or differential (LOW). In single-ended mode, the selected input channel is referenced to the COM pin. In differential mode, the two selected inputs provide a differential input. See Tables I and II and Figure 2 for more information. The last two bits (PD1 - PD0) select the powerdown mode as shown in Table V. If both inputs are HIGH, the device is always powered up. If both inputs are LOW, the device enters a power-down mode between conversions. When a new conversion is initiated, the device will resume normal operation instantly-no delay is needed to allow the device to power up and the very first conversion will be valid. Bit 0 (LSB) PD0 TABLE III. Order of the Control Bits in the Control Byte. BIT NAME 7 DESCRIPTION S 6-4 Start Bit. Control byte starts with first HIGH bit on DIN. A new control byte starts with every 15th clock cycle. A2 - A0 Channel Select Bits. Along with the SGL/DIF bit, these bits control the setting of the multiplexer input as detailed in Tables I and II. 3 - 2 SGL/DIF 1-0 Not Used. PD1 - PD0 16-Clocks per Conversion Single-Ended/Differential Select Bit. Along with bits A2 - A0, this bit controls the setting of the multiplexer input as detailed in Tables I and II. The control bits for conversion n+1 can be overlapped with conversion `n' to allow for a conversion every 16 clock cycles, as shown in Figure 4. This figure also shows possible serial communication occurring with other serial peripherals between each byte transfer between the processor and the converter. This is possible provided that each conversion completes within 1.6ms of starting. Otherwise, the signal that has been captured on the input sample/hold may droop enough to affect the conversion result. In addition, the ADS7844 ADS7844 is fully powered while other serial communications are taking place. Power-Down Mode Select Bits. See Table V for details. TABLE IV. Descriptions of the Control Bits within the Control Byte. CS tACQ DCLK DIN 1 S 8 A2 A1 A0 8 1 1 8 SGL/ PD1 PD0 DIF (START) Idle Acquire Conversion Idle BUSY DOUT 11 10 9 8 7 6 5 4 3 2 1 (MSB) 0 Zero Filled. (LSB) FIGURE 3. Conversion Timing, 24-Clocks per Conversion, 8-Bit Bus Interface. No DCLK delay required with dedicated serial port. CS DCLK 1 DIN 8 1 8 S 1 8 1 S CONTROL BITS CONTROL BITS BUSY DOUT 11 10 9 8 7 6 5 4 3 2 1 0 11 10 9 FIGURE 4. Conversion Timing, 16-Clocks per Conversion, 8-bit Bus Interface. No DCLK delay required with dedicated serial port. ADS7844 ADS7844 SBAS100A SBAS100A www.ti.com 11 PD1 PD0 0 0 Description SYMBOL DESCRIPTION MIN Power-down between conversions. When each conversion is finished, the converter enters a low power mode. At the start of the next conversion, the device instantly powers up to full power. There is no need for additional delays to assure full operation and the very first conversion is valid. tACQ Acquisition Time 1.5 TYP MAX UNITS tDS DIN Valid Prior to DCLK Rising 100 ns tDH DIN Hold After DCLK HIGH 10 ns µs tDO DCLK Falling to DOUT Valid 200 ns tDV CS Falling to DOUT Enabled 200 ns 200 ns 0 1 Reserved for future use. tTR CS Rising to DOUT Disabled 1 0 Reserved for future use. tCSS CS Falling to First DCLK Rising 100 ns tCSH CS Rising to DCLK Ignored 0 ns tCH DCLK HIGH 200 ns tCL DCLK LOW 200 tBD DCLK Falling to BUSY Rising 200 ns tBDV CS Falling to BUSY Enabled 200 ns tBTR CS Rising to BUSY Disabled 200 ns 1 1 No power-down between conversions, device always powered. TABLE V. Power-Down Selection. Digital Timing ns TABLE VI. Timing Specifications (+VCC = +2.7V to 3.6V, TA = ­40°C to +85°C, CLOAD = 50pF). Figure 5 and Tables VI and VII provide detailed timing for the digital interface of the ADS7844 ADS7844. SYMBOL DESCRIPTION MIN tACQ Acquisition Time 900 tDS DIN Valid Prior to DCLK Rising 50 ns tDH DIN Hold After DCLK HIGH 10 ns 15-Clocks per Conversion Figure 6 provides the fastest way to clock the ADS7844 ADS7844. This method will not work with the serial interface of most microcontrollers and digital signal processors as they are generally not capable of providing 15 clock cycles per serial transfer. However, this method could be used with field programmable gate arrays (FPGAs) or application specific integrated circuits (ASICs). Note that this effectively increases the maximum conversion rate of the converter beyond the values given in the specification tables, which assume 16 clock cycles per conversion. TYP MAX UNITS ns tDO DCLK Falling to DOUT Valid 100 ns tDV CS Falling to DOUT Enabled 70 ns 70 ns tTR CS Rising to DOUT Disabled tCSS CS Falling to First DCLK Rising 50 ns tCSH CS Rising to DCLK Ignored 0 ns tCH DCLK HIGH 150 ns tCL DCLK LOW 150 tBD DCLK Falling to BUSY Rising 100 ns tBDV CS Falling to BUSY Enabled 70 ns tBTR CS Rising to BUSY Disabled 70 ns ns TABLE VII. Timing Specifications (+VCC = +4.75V to +5.25V, TA = ­40°C to +85°C, CLOAD = 50pF). CS tCSS tCL tCH tBD tBD tD0 tCSH DCLK tDH tDS DIN PD0 tBDV tBTR BUSY tDV tTR DOUT 11 10 FIGURE 5. Detailed Timing Diagram. CS DCLK 15 1 DIN S A2 A1 A0 SGL/ PD1 PD0 DIF 1 S 15 SGL/ PD1 PD0 DIF A2 A1 A0 1 S A2 5 4 A1 A0 BUSY DOUT 11 10 9 8 7 6 5 4 3 2 1 0 11 10 9 8 7 6 3 2 FIGURE 6. Maximum Conversion Rate, 15-Clocks per Conversion. 12 ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A Data Format FS = Full-Scale Voltage = VREF 1 LSB = VREF/4096 VREF/4096 1 LSB 1000 fCLK = 16 · fSAMPLE Supply Current (µA) The ADS7844 ADS7844 output data is in straight binary format as shown in Figure 7. This figure shows the ideal output code for the given input voltage and does not include the effects of offset, gain, or noise. 100 fCLK = 2MHz 10 TA = 25°C +VCC = +2.7V VREF = +2.5V PD1 = PD0 = 0 11.111 Output Code 11.110 1 11.101 1k 10k 100k 1M fSAMPLE (Hz) 00.010 FIGURE 8. Supply Current vs Directly Scaling the Frequency of DCLK with Sample Rate or Keeping DCLK at the Maximum Possible Frequency. 00.001 00.000 FS ­ 1 LSB 0V Input Voltage(1) (V) 14 Note 1: Voltage at converter input, after multiplexer: +IN­(­IN). See Figure 2. POWER DISSIPATION There are three power modes for the ADS7844 ADS7844: full power (PD1 - PD0 = 11B), auto power-down (PD1 - PD0 = 00B), and shutdown (SHDN LOW). The affects of these modes varies depending on how the ADS7844 ADS7844 is being operated. For example, at full conversion rate and 16 clocks per conversion, there is very little difference between full power mode and auto power-down. Likewise, if the device has entered auto power-down, a shutdown (SHDN LOW) will not lower power dissipation. When operating at full-speed and 16-clocks per conversion (as shown in Figure 4), the ADS7844 ADS7844 spends most of its time acquiring or converting. There is little time for auto powerdown, assuming that this mode is active. Thus, the difference between full power mode and auto power-down is negligible. If the conversion rate is decreased by simply slowing the frequency of the DCLK input, the two modes remain approximately equal. However, if the DCLK frequency is kept at the maximum rate during a conversion, but conversion are simply done less often, then the difference between the two modes is dramatic. Figure 8 shows the difference between reducing the DCLK frequency ("scaling" DCLK to match the conversion rate) or maintaining DCLK at the highest frequency and reducing the number of conversion per second. In the later case, the converter spends an increasing percentage of its time in power-down mode (assuming the auto power-down mode is active). If DCLK is active and CS is LOW while the ADS7844 ADS7844 is in auto power-down mode, the device will continue to dissipate some power in the digital logic. The power can be reduced to a minimum by keeping CS HIGH. The differences in supply current for these two cases are shown in Figure 9. Supply Current (µA) FIGURE 7. Ideal Input Voltages and Output Codes. 10 8 6 CS LOW (GND) 4 2 CS HIGH (+VCC) 0 0.09 0.00 1k 10k 100k 1M fSAMPLE (Hz) FIGURE 9. Supply Current vs State of CS. Operating the ADS7844 ADS7844 in auto power-down mode will result in the lowest power dissipation, and there is no conversion time "penalty" on power-up. The very first conversion will be valid. SHDN can be used to force an immediate power-down. LAYOUT For optimum performance, care should be taken with the physical layout of the ADS7844 ADS7844 circuitry. This is particularly true if the reference voltage is low and/or the conversion rate is high. The basic SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections, and digital inputs that occur just prior to latching the output of the analog comparator. Thus, during any single conversion for an n-bit SAR converter, there are n "windows" in which large external transient voltages can easily affect the conversion result. Such glitches might originate from switching power supplies, nearby digital logic, and ADS7844 ADS7844 SBAS100A SBAS100A TA = 25°C +VCC = +2.7V VREF = +2.5V fCLK = 16 · fSAMPLE PD1 = PD0 = 0 12 www.ti.com 13 high power devices. The degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external event. The error can change if the external event changes in time with respect to the DCLK input. With this in mind, power to the ADS7844 ADS7844 should be clean and well bypassed. A 0.1µF ceramic bypass capacitor should be placed as close to the device as possible. In addition, a 1µF to 10µF capacitor and a 5 or 10 series resistor may be used to lowpass filter a noisy supply. The reference should be similarly bypassed with a 0.1µF capacitor. Again, a series resistor and large capacitor can be used to lowpass filter the reference voltage. If the reference voltage originates from an op amp, make sure that it can drive the bypass capacitor without oscillation (the series resistor can help in this case). The ADS7844 ADS7844 draws very little current from the reference on average, but it does place larger demands on the reference circuitry over short periods of time (on each rising edge of DCLK during a conversion). 14 The ADS7844 ADS7844 architecture offers no inherent rejection of noise or voltage variation in regards to the reference input. This is of particular concern when the reference input is tied to the power supply. Any noise and ripple from the supply will appear directly in the digital results. While high frequency noise can be filtered out as discussed in the previous paragraph, voltage variation due to line frequency (50Hz or 60Hz) can be difficult to remove. The GND pin should be connected to a clean ground point. In many cases, this will be the "analog" ground. Avoid connections which are too near the grounding point of a microcontroller or digital signal processor. If needed, run a ground trace directly from the converter to the power supply entry point. The ideal layout will include an analog ground plane dedicated to the converter and associated analog circuitry. ADS7844 ADS7844 www.ti.com SBAS100A SBAS100A PACKAGE OPTION ADDENDUM www.ti.com 3-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty ADS7844E ADS7844E ACTIVE SSOP/ QSOP DBQ 20 ADS7844E/2K5 ADS7844E/2K5 ACTIVE SSOP/ QSOP DBQ ADS7844E/2K5G4 ADS7844E/2K5G4 ACTIVE SSOP/ QSOP ADS7844EB ADS7844EB ACTIVE ADS7844EB/2K5 ADS7844EB/2K5 56 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SSOP/ QSOP DBQ 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844EB/2K5G4 ADS7844EB/2K5G4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844N ADS7844N ACTIVE SSOP DB 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844N/1K ADS7844N/1K ACTIVE SSOP DB 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844N/1KG4 ADS7844N/1KG4 ACTIVE SSOP DB 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844NB ADS7844NB ACTIVE SSOP DB 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ADS7844NB/1K ADS7844NB/1K ACTIVE SSOP DB 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 56 68 68 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO002E MSSO002E ­ JANUARY 1995 ­ REVISED DECEMBER 2001 DB (R-PDSO-G*) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°­8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS * 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. 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