ADI-6051 AD5290 AD5764 TQFP-32 SSOP-48 MSOP-10 ADG1408 AD7657 AD7658 AD7328 - Datasheet Archive
2/15/05 12:01 PM Page 1 A d v e r t o r i a l · Digital Potentiometer: The AD5290 delivers an unbeatable Products
ADI-6051 ADI-6051_V6 2/15/05 12:01 PM Page 1 A d v e r t o r i a l · Digital Potentiometer: The AD5290 AD5290 delivers an unbeatable Products Announced A series on engineering better performance and lower costs in new designs, by Analog Devices. A Whole New Value Equation for Industrial Designs State-of-the-art analog and mixed signal ICs, particularly those manufactured on submicron CMOS, have brought significant size, cost, and power advantages to a wide variety of applications, with one notable exception-industrial. The high voltage requirements of sensors and actuators cannot be affordably met with most of today's ICs. The continual decrease in smaller geometry CMOS power supplies and the shift to single supplies have caused industrial engineers to add more discrete circuitry around new state-of-the-art ICs, adding board area and costs to each design. However, breakthrough technology has finally brought submicron innovation to the 10 V world. Crucial to iCMOS was the development of a manufacturing process that would enable the growth of thicker gate oxide. This breakthrough permitted tooling switches capable of handling high voltages that can be fabricated in close proximity to conventional 30 V BiCMOS Legacy Transistor 5 V devices. Thus, multiple supply voltages, whether they are 5 V, 16 V, 24 V, or 30 V, can be isolated from the substrate and from each other. Smaller Sizes, More Integration As depicted in Figure 1, the real estate has diminished considerably-a major contributor to placing the numerous components available Figure 1. The iCMOS process on the chip. iCMOS is a completely modular A new process from Analog enables more functionality and multiple voltages on-chip manufacturing process, meaning the perfor, Devices called iCMOSTM for indus- with submicron geometry. mance and robustness of each of its large trial CMOS, changes all that. It suite of available devices are not simply the combines the performance and result of traditional trade-offs to achieve integration. cost advantages of low and high voltage CMOS, high voltage bipolars, and DMOS processes in a submiHere is what this new process brings to each of the devices cron technology. This process allows users to put as much as that are the basis of industrial applications: 30 V across a chip. Analog Devices' researchers With regard to both converters and amplifier products, the concluded that there was a need to combine the cost benefits process has been optimized for noise, matching, linearity, of submicron CMOS with a suite of high voltage, high and stability. In addition, specific to amplifiers, it improves performance analog devices on a single chip to achieve breakthroughs in accuracy, power, signal chain integration, and noise/power ratio and reduces offset and offset drift. It also associated cost benefits that were previously unattainable reduces 1/f noise and output settling time. As for references, using existing IC processes. they are now fully bipolar, which means Submicron higher accuracy and lower temperature Process Engineering advantages coefficients. The developers of iCMOS wanted to create a truly modular have come iCMOS enables analog-to-digital converters process that would produce both high and low voltage devices for a wide variety of applications, requiring that they develop to the 10 V (ADCs) with software-selectable inputs allowing wide input ranges from 2.5 V to specialized epitaxy and photolithographic masks that would world. 10 V, while providing 85% less power work seamlessly together in many different configurations. consumption than existing solutions. iCMOS digital-to-analog This challenge was especially acute for the bipolar transistors, converters (DACs) can provide industry-leading performance which have requirements that ordinarily influence in packages that are 30% smaller. In addition, iCMOS multithe surrounding devices. But the designers of iCMOS were plexers exhibit low RON and RON variation (5 maximum), in able to overcome this obstacle in such a way that the 16-lead TSOP (thin small outline packages). overall performance of the devices was not compromised. The first 15 iCMOS products have been announced, and there are more on the way. They are emerging as breakthrough products in their own right, thanks to significant improvements over the competition in accuracy, power, footprint, and total cost. Examples of Specific Products Tooled in this Technology: · DAC: The AD5764 AD5764 quad 16-bit DAC offers three times more accuracy while using 50% less board space. Some of the features included are an on-chip precision reference as well as reference buffers, a precision amplifier, temperature sensor, and an extended programmable output range. (See Figure 2.) 80 mm2 TQFP-32 TQFP-32 VS. 160 mm2 SSOP-48 SSOP-48 combination of features and performance in a compact MSOP-10 MSOP-10 package and can be operated from a single-supply up to 30 V or dual-supply up to 15 V. · Switches and Multiplexers: These devices operate at 15 V while delivering industry-leading performance in very small packaging. For example, the ADG1408 ADG1408, 8:1 mux exhibits an on resistance that is 85% lower than its closest competitor. Value Proposition Individually and collectively, the analog and mixed-signal ICs made on the innovative iCMOS process enable new value metrics for high voltage, industrial ICs. · Dramatic Power Reduction: The capability to employ multiple voltages on a single substrate enables direct sampling onto a high impedance capacitive array. Accompanied by the integration of on-chip, low noise amplifiers capable of driving high voltage outputs, these features combine to reduce component power consumption by as much as 85%. · Smaller Footprint: iCMOS ICs are typically 30% AD5764 AD5764 CLOSEST COMPETITOR Figure 2. The quad 16-bit DAC (AD5764 AD5764) cuts board space in half, and has triple the accuracy of the closest competitor. 30 V iCMOS Transistor to 75% smaller than other high voltage parts. In addition, the inclusion of auxiliary components, such as on-chip memory and on-chip signal conditioning, reduces board space even further while equaling the performance level of off-chip, standalone components. · Less Complexity, in Much Less Time: The integration of high voltage components onto iCMOS products eliminates the need to surround low voltage components with complex external circuitry, resulting in simplified design and shorter design time. Figure 3. A comparison of a 14-bit ADC (AD7657 AD7657) and a 12-bit ADC (AD7658 AD7658) demonstrating up to a 60% power reduction and up to twice the accuracy of the competition. In summary, the submicron geometry, in concert with all the other attributes of iCMOS described above, enables the integration of more of the signal chain without compromising performance. Finally, state-of-the-art IC technology is available for applications such as factory automation, process control, and instrumentation. The newly available size, cost, and power advantages enables an entirely new value standard for the 10 V world. · ADCs: The AD7328 AD7328 1 MSPS, 8-channel, 12-bit ADC reduces power consumption by 60%, as compared to competitive products. The AD7656 AD7656 16-bit ADC offers simultaneous sampling on six channels and twice the accuracy of comparable devices. (See Figure 3 for more ADCs.) · Amplifier: The AD8661 AD8661 precision rail-to-rail amplifier features the lowest offset voltage, noise, and input bias current in its class. Available in a 3 mm 3 mm LFCSP and a narrow SOIC-8, it is 70% smaller than the competition. Author Profile: Leo McHugh has been with Analog Devices for 18 years, and as marketing manager, has been a contributor to numerous product and technology introductions. He can be reached at firstname.lastname@example.org.