NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Assembly Materials Underfill: Namics U8439-1 U8439-1 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0 , : NAU-8 E679FGBR/ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63/Pb37 (Standard) Substrate , Die Bump: 95Pb5Sn Assembly Materials Underfill: Namics U8439-1 U8439-1 E679FGBR/ABFGX3/AUS703 , /ABFGX3/AUS703 Solder Balls: Sn96.5/Ag3.0/Cu0.5 (RoHS), Sn63/Pb37 (Standard) Substrate ... | Original |
4 pages, |
datasheet of AUS703 dcl-4 E679FGBR of AUS703 shin-etsu shinetsu X23-7772-4 DCL5 u843 AUS703 thermal Sn96 DCL4 ABF-GX3 BR115 A1006-03 A1006-03 abstract |
|
|||
| Abstract: : Namics U8439-1 U8439-1 NAU8 Substrate: E679FGBR/ABFGX3/AUS703 E679FGBR/ABF-GX3/AUS703 Assembly ... | Original |
4 pages, |
80KSW0002AR amkor JESD22-A104 namics a118 A0904-03 X2377 shinetsu e-679fg Ablestik underfill NAU-8 underfill ABF-GX3 X23-7772 U8439-1 A0904-03 abstract |
|
|||
| Abstract: Immersion Gold) Build-Up Material ABF-GX3 ABF-SH9K Item Alternate Kyocera Substrate 0.8 mm LFSOP (Lead-free Solder-On-Pad) SnAgCu ABF-GX3 Products Affected Table 2 lists the products ... | Original |
4 pages, |
PCN0715 marking ic 2008 EP1S60 altera SOP top marking ABF-GX3 PCN0715 abstract |
|
|||