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A5825-01

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: Misregistration (A4470-01 A4470-01) Mounting Pad Solder Ball A5825-01 1998 Packaging Databook 14-17 ... Intel
Original
datasheet

26 pages,
525.36 Kb

fine BGA thermal profile JEDEC bga 63 tray bga 196 land pattern BGA PROFILING leaded corner relief carrier tape "BGA Rework Practices", a5764 Intel reflow soldering profile BGA pcb warpage in ipc standard TEXT
datasheet frame
Abstract: . Figure 14-20. Ball to Pad Placement Misregistration (A4470-01 A4470-01) Mounting Pad Solder Ball A5825-01 ... Intel
Original
datasheet

32 pages,
684.75 Kb

pcb warpage in ipc standard a5764 A7459-01 BGA 256 PACKAGE thermal resistance BGA PROFILING cte table epoxy substrate fine BGA thermal profile land pattern BGA 196 Lead Free reflow soldering profile BGA A4470-01 Intel BGA JEDEC bga 63 tray A5832 Intel reflow soldering profile BGA TEXT
datasheet frame
Abstract: Solder Ball A5825-01 1999 Packaging Databook 14-21 Plastic Ball Grid Array (PBGA) Packaging ... Intel
Original
datasheet

28 pages,
523.09 Kb

BGA PACKAGE thermal resistance BGA Solder Ball 1mm diode databook fine BGA thermal profile Intel BGA intel MOTHERBOARD pcb design in land pattern BGA 0,50 A5825-01 tray matrix bga BGA and QFP Package BGA OUTLINE DRAWING land pattern BGA 0.75 bga Shipping Trays JEDEC bga 63 tray BGA PACKAGE thermal profile BGA PACKAGE TOP MARK intel bga 196 land pattern Intel reflow soldering profile BGA PBGA 256 reflow profile TEXT
datasheet frame