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A5825-01

Catalog Datasheet Results Type PDF Document Tags
Abstract: Misregistration (A4470-01 A4470-01) Mounting Pad Solder Ball A5825-01 1998 Packaging Databook 14-17 ... Original
datasheet

26 pages,
525.36 Kb

JEDEC bga 63 tray bga 196 land pattern corner relief carrier tape fine BGA thermal profile "BGA Rework Practices", a5764 Intel reflow soldering profile BGA pcb warpage in ipc standard datasheet abstract
datasheet frame
Abstract: A5825-01 14-24 2000 Packaging Databook Ball Grid Array (BGA) Packaging Most common placement ... Original
datasheet

32 pages,
684.75 Kb

pcb warpage in ipc standard a5764 BGA 256 PACKAGE thermal resistance BGA PROFILING cte table epoxy substrate fine BGA thermal profile A4470-01 land pattern BGA 196 Lead Free reflow soldering profile BGA Intel BGA JEDEC bga 63 tray Intel reflow soldering profile BGA datasheet abstract
datasheet frame
Abstract: Solder Ball A5825-01 1999 Packaging Databook 14-21 Plastic Ball Grid Array (PBGA) Packaging ... Original
datasheet

28 pages,
523.09 Kb

land pattern BGA 0,50 BGA 23 x 23 array Lead Free reflow soldering profile BGA motherboard repair Chip level outline of the heat slug for JEDEC A584 QFP PACKAGE thermal resistance die down BGA Solder Ball 1mm BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays datasheet abstract
datasheet frame