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Part : A58255-000 Supplier : TE Connectivity Manufacturer : Avnet Stock : - Best Price : $842.0668 Price Each : $1,358.1160
Part : A58-25 Supplier : Honeywell Manufacturer : Master Electronics Stock : 6 Best Price : $28.26 Price Each : $40.78
Part : A58255-000 Supplier : TE Connectivity Manufacturer : Sager Stock : - Best Price : $983.96 Price Each : $1366.61
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A5825-01

Catalog Datasheet MFG & Type PDF Document Tags

pcb warpage in ipc standard

Abstract: Intel reflow soldering profile BGA Misregistration (A4470-01) Mounting Pad Solder Ball A5825-01 1998 Packaging Databook 14-17
Intel
Original
pcb warpage in ipc standard Intel reflow soldering profile BGA a5764 Intel reflow soldering profile BGA LEAD FREE corner relief carrier tape

Intel reflow soldering profile BGA

Abstract: A5832 . Figure 14-20. Ball to Pad Placement Misregistration (A4470-01) Mounting Pad Solder Ball A5825-01
Intel
Original
A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate A7459-01 Lead Free reflow soldering profile BGA

PBGA 256 reflow profile

Abstract: Intel reflow soldering profile BGA Solder Ball A5825-01 1999 Packaging Databook 14-21 Plastic Ball Grid Array (PBGA) Packaging
Intel
Original
PBGA 256 reflow profile bga 196 land pattern BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile BGA and QFP Package BGA OUTLINE DRAWING