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Part Manufacturer Description PDF & SAMPLES
EP9312 Cirrus Logic SPECIALTY CONSUMER CIRCUIT, PBGA352, PLASTIC, BGA-352
EP9307-IR Cirrus Logic 32-BIT, 184MHz, RISC PROCESSOR, PBGA272, MO-151BAL-2, TFBGA-272
EP9307-CR Cirrus Logic 32-BIT, 200MHz, RISC PROCESSOR, PBGA272, MO-151BAL-2, TFBGA-272
EP9312-CB Cirrus Logic RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 27 X 27 MM, PLASTIC, BGA-352
EP9312-IB Cirrus Logic 32-BIT, 184MHz, RISC PROCESSOR, PBGA352, 27 X 27 MM, PLASTIC, BGA-352
CS61884-IB Cirrus Logic DATACOM, PCM TRANSCEIVER, PBGA160, FBGA-160

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Part : AZ15/16-B1-2053 BALL LATCH Supplier : Schmersal Manufacturer : Farnell element14 Stock : 7 Best Price : £13.46 Price Each : £13.46
Part : TMDSCCSUBALLN01-P. Supplier : Texas Instruments Manufacturer : Farnell element14 Stock : - Best Price : £101.72 Price Each : £111.66
Part : TMDSCCSUBALLN01D-P Supplier : Texas Instruments Manufacturer : Farnell element14 Stock : 10 Best Price : £84.10 Price Each : £84.10
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Ball Datasheet

Part Manufacturer Description PDF Type
Ballast Controllers NXP Semiconductors AN10971 - TL applications with NXP ballast controllers Original
BALL LIGHTNING AND PLASMA COHESION N/A App Note: BALL LIGHTNING AND PLASMA COHESION Original
BAWG06EE-UAF20B-EP03-K Balluff Analog Sensors Original
BAW-M08EI-UAD15B-BP0.2-GS04 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M08EI-UAD15B-BP05 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MF2-UAC40F-BP0.2-GS04 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MF2-UAC40F-BP05 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MG2-IAC20B-BP0.2-GS04 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MG2-IAC20B-BP05 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MG2-UAC20B-BP0.2-GS04 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MG2-UAC20B-BP05 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M12MI-UAC20B-S04G Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18ME-UAC50B-BP0.2-GS04 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18ME-UAC50B-BP05 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18ME-UAC50B-S04G Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAWM18ME-UAE50B-SO4G-K Balluff Analog Sensors Original
BAW-M18MG-UAC80F-S04G Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18MI2-UAC50B-BP05-002 Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18MI-IAC50B-S04G Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
BAW-M18MI-ICC50B-S04G Balluff Proximity Sensor, Inductive, 15V to 30V DC Supply Original
Showing first 20 results.

Ball

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: -12SE LFE2-12SE LFE2-20SE LFE2-20SE LFE2-20SE LFE2-20SE LFE2-35SE 81-ball csBGA 121-ball csBGA 132-ball csBGA CB196 CB284 84-pin QFNS 100-pin TQFP 81-ball csBGA 121-ball csBGA 225-ball ucBGA 84-pin QFNS 132-ball csBGA 100-pin TQFP 36-ball ucBGA 49-ball ucBGA 81-ball ucBGA 144-pin TQFP 256-ball , fpBGA 484 fpBGA 672 fpBGA 1156 fpBGA 672 fpBGA 1156 fpBGA 144 pin TQFP 256 ball fpBGA 144 pin TQFP 208 pin PQFP 256 ball fpBGA 484 ball fpBGA 208 pin PQFP 256 ball fpBGA 484 ball fpBGA 672 Lattice Semiconductor
Original
DS4102-PM300N ICEPROGM1050-01 DS4102N-28P2SAB 02-B272/5256V DS4102-B388/5384V PA-T128/5256VE
Abstract: signal name on the ball. The page number listed gives the page in "Signal Functional Description" on page , , Y13Y22, AA13-AA22, and AB13-AB22 are also thermal balls. 50 A01 A02 GND A06 GND A10 , , and AB13-AB22 are also thermal balls. 50 PCI 42 V04 V13­V22 GND V31 GND , interface, and general purpose I/O. Technology: CMOS SA-12E 0.25 um (0.18 um Leff) Package: 35mm, 580-ball enhanced plastic ball grid array (E-PBGA) Power (typical): 2.3 W at 133 MHz, 2.9W at 200MHz, 3.4W at Applied Micro Circuits
Original
DS2011 0xE8010000 AMCC date code PPC405 PC-133
Abstract: balls. AA13AA22 AB13AB22 xxx PCI System 43 GND 45 [Gnt]PCIReq0 Halt 37 45 17 , : IBM CMOS 6SF 0.25 um (0.18 um Leff) Package: 580-ball (35mm) enhanced plastic ball grid array (E-PBGA , . . . . . . . . . . . 15 Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 35mm, 580-Ball E-PBGA Package . . . . . , 35mm, 580-Ball E-PBGA Package Top View A1 corner Note: All dimensions are in mm. Bottom View IBM
Original
AA13A CMOS-6SF E8010 PC-100 10/100M SA14-2557-00
Abstract: list-once for each signal name on the ball. The page number listed gives the page in "Signal Functional , of 17) Signal Name Ball GND GND Interface Group Page Power Note: Balls N13-N22 , balls. 51 A01 A02 GND A06 GND A10 GND A15 GND A20 GND A25 GND , ) Signal Name Ball GND GND Interface Group Page Power Note: Balls N13-N22, P13-P22, R13-R22, T13T22, U13-U22, V13-V22, W13-W22, Y13-Y22, AA13-AA22, and AB13-AB22 are also thermal balls. Applied Micro Circuits
Original
NPE405H-3BA266C NPE405H
Abstract: KDE1204PKB1 MS KDE1204PKB2 MS KDE1204PKB3 MS Bearing Volt RPM CFM Ball Ball Ball Ball Ball Ball Vapo Vapo Ball Ball Ball Ball Ball Ball Ball Ball Ball Ball Ball Vapo Vapo Ball Ball Ball Ball Ball Ball Ball Ball Ball Ball Ball Vapo Vapo Ball Ball Ball Ball Ball Vapo Vapo Ball Ball Vapo Ball Vapo Ball Vapo Vapo Vapo Ball Ball Ball Vapo Vapo Vapo Vapo Ball Ball Ball Ball 5 VDC 5 VDC 5 VDC 5 VDC 5 VDC 5 VDC 5 VDC 5 VDC 5 VDC 5 Sunon
Original
KDE1206PKv3 KDE1206PTV3 KDE1206PFV3 kde1205pfv3 KDE1206PFV1 sunon kde1206ptv3 25X25X10 B0502PFB1-8 B0502PFB2-8 B0502PFB3-8 B0502AFB1-8 B0502AFB2-8
Abstract: -20SE LFE2-20SE LFE2-20SE LFE2-35SE LFE2-35SE LFE2-50SE LFE2-50SE 81-ball csBGA 121-ball csBGA 132-ball csBGA CB196 CB284 84-pin QFNS 100-pin TQFP 81-ball csBGA 121-ball csBGA 225-ball ucBGA 84-pin QFNS 132-ball csBGA 100-pin TQFP 49-ball ucBGA 81-ball ucBGA 256 ftBGA 484 fpBGA 256 ftBGA 484 fpBGA 672 fpBGA 484 fpBGA 672 fpBGA 1156 fpBGA 484 fpBGA 672 fpBGA 1156 fpBGA 672 fpBGA 1156 fpBGA 144 pin TQFP 256 ball fpBGA 144 pin TQFP 208 pin PQFP 256 ball fpBGA 484 ball fpBGA 208 pin PQFP 256 ball fpBGA 484 ball fpBGA -
Original
lcmxo2-1200 LFE3-17EA LCMXO2 1200 LC4064 LFXP20C 22V10A T128/5256VE PA-LF256/5384VE DS4102-B272/5256V PA-LF388/5512VE PA-F484/LC51024 PA-F676/LC51024
Abstract: appear alphabetically multiple times in the list-once for each signal name on the ball. The page number , , Y13Y22, AA13-AA22, and AB13-AB22 are also thermal balls. 51 A01 A02 GND A06 GND A10 , , and AB13-AB22 are also thermal balls. 51 PCI 43 V04 V13­V22 GND V31 GND , interface, and general purpose I/O. Technology: CMOS SA-12E 0.25 um (0.18 um Leff) Package: 35mm, 580-ball enhanced plastic ball grid array (E-PBGA) Power (typical): 2.3 W at 133 MHz, 2.9W at 200MHz, 3.4W at Applied Micro Circuits
Original
AG03 AP2822 powerpc 405 powerpc 405gp
Abstract: 28F016B3_A 28F016C3 Ball# A1 A14 A14 D1 A17 A17 A2 A12 A12 D2 NC NC , Ball# A1 A13 D1 A16 A2 A11 D2 D14 A3 A8 D3 D5 A4 VPP D4 , 28F032B3_A 28F032C3 Ball # 28F032B3_A 28F032C3 Ball# A1 A14 D1 A17 A2 A12 D2 , D1 Ball # A1 28F800F3 28F160F3 VCCQ VCCQ Ball# A2 A12 A12 D2 DQ7 , . 4 2.1 48-Ball uBGA Package Silicon Daisy Chain Schematics Intel
Original
28F008S3 28F800B3 28F160B3 8275 intel intel d 8275 Intel 8275 intel i7 INTEL 56BALL block diagram of Intel 8275 CG-041493 US035751 US040001
Abstract: vibration/shock applications and with small or non-spherical solder balls. The purpose of the retainer clip , applications and with small or non-spherical solder balls. The purpose of the retainer clip feature is to , vibration/shock applications and with small or non-spherical solder balls. The purpose of the retainer clip , vibration/shock applications and with small or non-spherical solder balls. The purpose of the retainer clip , to the solder balls â'¢ Flat contact head that provides for minimum solder ball deformation â 3M Electronic Solutions
Original
Abstract: Lead-Free 176-Pin TQFP Lead-Free 208-Ball fpBGA Lead-Free 100-Pin TQFP Lead-Free 176-Pin TQFP Lead-Free 208-Ball fpBGA Lead-Free 100-Pin TQFP Lead-Free 176-Pin TQFP Lead-Free 208-Ball fpBGA Lead-Free , Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lead-Free 256-Ball fpBGA Lattice Semiconductor
Original
GAL16V8D-25LJN M4A3-64/32-12VNI LC4512V M4A5-64/32-10VNC48 LC4256V-75T176C lx64ev-3f100c GAL16LV8 GAL16V8 GAL22V10 GAL22V10AV GAL16LV8D-3LJ GAL16LV8D-5LJ
Abstract: LFE2-6SE 144 pin TQFP 256 ball fpBGA 144 pin TQFP 208 pin PQFP 256 ball fpBGA 484 ball fpBGA 208 pin PQFP 256 ball fpBGA 484 ball fpBGA 672 ball fpBGA 484 ball fpBGA 672 ball fpBGA 484 ball fpBGA 672 ball fpBGA 672 ball fpBGA 900 ball fpBGA PN-TN144/E2 PN-FN256/E2 PN-TN144/E2 PN-QN208 , . LatticeECP2MS Device LFE2M20SE LFE2M35SE LFE2M50SE LFE2M70SE LFE2M100SE Package 256 ball fpBGA 484 ball fpBGA 256 ball fpBGA 484 ball fpBGA 672 ball fpBGA 484 ball fpBGA 672 ball fpBGA 900 Lattice Semiconductor
Original
im4a3-64 lattice im4a3 im4a3 im4a3-128 im4a3-192 lfe3-35ea DS4102- DS4102-PM300
Abstract: 56-Ball array uBGA package SDC and 28F640/320J5 product pinouts to reflect removal of balls I2 and , 28F016B3_A 28F016C3 Ball# A1 A14 A14 D1 A17 A17 A2 A12 A12 D2 NC NC , Ball# A1 A13 D1 A16 A2 A11 D2 D14 A3 A8 D3 D5 A4 VPP D4 , 28F032B3_A 28F032C3 Ball # 28F032B3_A 28F032C3 Ball# A1 A14 D1 A17 A2 A12 D2 , 28F800F3 28F160F3 VCCQ VCCQ Ball# A2 A12 A12 D2 DQ7 DQ7 A3 No Ball(1 Intel
Original
INTEL 28F640 2k36e Intel 8275 Block diagram a5 gnd 28F008B3 28F016S3 28F640J5 12E-0810-C13 28F160C3 12E-0607-C13 NP291-04812-G4-BF-P NP291-04808-G4-BF-P
Abstract: signal name on the ball. The page number listed gives the page in "Signal Functional Description" on , balls. 53 Preliminary PowerNP NPe405H Embedded Processor Data Sheet Signals Listed , , V13-V22, W13-W22, Y13-Y22, AA13-AA22, and AB13-AB22 are also thermal balls. AP34 [Gnt]PCIReq0 , Leff) Package: 35mm, 580-ball enhanced plastic ball grid array (E-PBGA) Power (typical): 1.8W at , . . . . . . . . . . 16 Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . IBM
Original
track ball ap08 BUS49 SA14-2557-08
Abstract: alphabetically multiple times in the list- once for each signal name on the ball. The page number listed gives , , Y13-Y22, AA13-AA22, and AB13-AB22 are also thermal balls. 52 Interface Group Page 17 Preliminary , thermal balls. Interface Group Page 52 18 Preliminary PowerNP NPe405H Embedded Processor Data , interface, and general purpose I/O. Technology: IBM CMOS SA-12E 0.25 um (0.18 um Leff) Package: 35mm, 580-ball enhanced plastic ball grid array (E-PBGA) Power (typical): 2.3W at 133MHz, 2.9W at 200MHz, 3.4W at 266MHz Applied Micro Circuits
Original
AH-02 EBC33 EPBGA GPIO014 SA14-2557-12
Abstract: ) FLSHPRO2SCSPC3A 830118 $383.68 (SCSP socket module for RD28F1604/3204C3 with F-Vccq on ball A10 , properly align the device solder balls with the socket's contacts. Inserts are additionally available from , Status GE28F008B3xA VFBGA 6x8 ball 2.0 GE28F160B3xC VFBGA 6x8 ball IFMPW2_2_SP2. exe GE28F160B3xD VFBGA 6x8 ball IFMPW2_2_SP18. Released exe GE28F320B3xC VFBGA 6x8 ball , 6x8 ball GE28F800B3xA VFBGA 6x8 ball GT28F016B3xA uBGA 6x8 ball GT28F160B3xA uBGA 6x8 ball Intel
Original
PF38F4050L0YBQ0 R2528 PF38F4050 RD48F4400 RD48F4400L0 Intel SCSP PXA26 FPRO2SCSP96Q FP2INSCSP2648 R26481X RD38F2230WWZDQ0 RD38F2240WWZBQ0
Abstract: alphabetically multiple times in the list-once for each signal name on the ball. The page number listed gives , security feature (PPC440EPx-S), and general purpose I/O. Technology: CMOS Cu-11, 0.13 m. Package: 35mm, 680-ball thermally enhanced plastic ball grid array (TE-PBGA). RoHS compliant package available. Typical power , . . . . . . . . . . . . . . . 5 Figure 3. 35mm, 680-Ball TE-PBGA Package . . . . . . . . . . . . . . , . . . . . . . . . . 20 Table 4. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . Applied Micro Circuits
Original
PPC440EPx-NpAfffTs AK07 PPC440EPx-SUA667T w34 transistor 440EP 667MH 166MH 10/100/1000M PPC440EP
Abstract: request. . Product Carriers per Package Type Package Type Fine-Pitch Ball Grid Array (FBGA , . Package Codes for Spansion Memory Products Package Code Description Fine-Pitch Ball Grid Array (FBGA) ALD Thin profile fine pitch ball grid array; wire bondable rigid substrate; solder ball , pitch ball grid array; wire bondable rigid substrate; solder ball terminals; 0.65 mm pitch; 15.00 mm x 15.00 mm body size, 1.1 mm maximum height ALJ Fine pitch ball grid array; wire bondable rigid Spansion
Original
SPANSION date code format spansion solder profile fBGA package tray 12 x 19 FBGA tray TRACE CODE ON BOX PACKING LABEL
Abstract: . Multiplexed signals appear alphabetically multiple times in the list-once for each signal name on the ball. , . Technology: CMOS Cu-11, 0.13 m. Package: 35mm, 680-ball thermally enhanced plastic ball grid array (TE-PBGA). , . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 680-Ball TE-PBGA Package . . . . . , . . . . . . 18 Table 4. JEDEC Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . , . Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applied Micro Circuits
Original
440GR PPC440GR PC440GR
Abstract: -12SE LFE2-12SE LFE2-12SE LFE2-20SE LFE2-20SE LFE2-20SE 81-ball csBGA 121-ball csBGA 132-ball csBGA CB196 CB284 84-pin QFNS 100-pin TQFP 81-ball csBGA 121-ball csBGA 225-ball ucBGA 84-pin QFNS 132-ball csBGA 100-pin TQFP 36-ball ucBGA 49-ball ucBGA 81-ball ucBGA 144-pin TQFP 256-ball caBGA 32-pin QFN 121-ball ucBGA 256 ftBGA 484 fpBGA 328 csBGA 256 ftBGA 484 fpBGA 672 fpBGA 484 fpBGA 672 fpBGA 1156 fpBGA 484 fpBGA 672 fpBGA 1156 fpBGA 672 fpBGA 1156 fpBGA 144 pin TQFP 256 ball fpBGA Lattice Semiconductor
Original
PN-Q208/5256V PA-T100/5256VE PA-F256/LC5768 PA-T128/LC5256B PA-Q208/LC5256B PA-F256/LC5256B
Abstract: ) ADSP-BF512BSWZ-3 300 400 -40 to +85 168-ball CSP_BGA 300 0 to 70 ADSP-BF512KBCZ-4 168-ball , -lead LQFP 400 168-ball CSP_BGA 300 0 to 70 ADSP-BF512KBCZ-4F4 168-ball CSP_BGA 400 0 , -40 to +85 ADSP-BF514BSWZ-4 176-lead LQFP 400 -40 to +85 ADSP-BF514KBCZ-3 168-ball CSP_BGA 300 0 to 70 ADSP-BF514KBCZ-4 168-ball CSP_BGA 400 0 to 70 ADSP-BF514KSWZ , ADSP-BF514BSWZ-4F4 176-lead LQFP 400 -40 to +85 ADSP-BF514KBCZ-3F4 168-ball CSP_BGA 300 0 to Analog Devices
Original
emmc spec ppi interface 1007 ppi 2120 ADSP-BF524KBCZ-4C2 e-mmc sk emmc G04492-5-10/08
Showing first 20 results.