NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: M32 M20 99x99 98x98 25 KN3.9x9.5 130 121 113.5 95 90 47 20 92x92 90x90 0.5 2.7 2.5 ... | Original |
1 pages, |
DVHZLWKPHWULFNQRFNRXWVDQG73 DVHZLWKPHWULFNQRFNRXWVDQG73 abstract |
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| Abstract: ��5 20.5 25 76.6 51.6 27.1 10.5 M32 M20 99x99 98x98 25 KN3.9x9.5 130 121 113.5 95 90 ... | Original |
1 pages, |
DVHZLWKPHWULFNQRFNRXWVDQG73 DVHZLWKPHWULFNQRFNRXWVDQG73 abstract |
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| Abstract: ] 3.9 [0.15] 3 [0.12] 99x99 98x98 130 [5.12] 121 [4.77 ] 113.5 [4.47] 95.5 [3.76] 90 [3.54 , ] 20 CAD files available at www.fiboxusa.com 98x98 MNX PC 150L 7.1 x 5.1 UL Type 1, 4, 4X , 98x98 25 [0.98"] 130 [5.12"] 121 [4.77"] 113.5 [4.47"] 95 [3.74"] 90 [3.54"] KN3.9x9.5 47 [1.85" ... | Original |
26 pages, |
E75645 datasheet abstract |
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| Abstract: SUNON SPECIFICATION FOR APPROVAL CUSTOMER MOTOR TYPE MODEL NO P/N DESCRIPTION DIMENSIONS SUNON SPEC. NO. APPROVAL NO. APPROVED BY (AUTHORIZED) TC014-06001 TC014-06001 WATURBO CPU COOLER 98X98X80 mm C03000010G-00 C03000010G-00 DRAWN CHECKED APPROVED SPEC. NO C03000010G-00 C03000010G-00 ISSUED DATE 07.18. 2006 r / / •• .'P < / n ^ fyLir EDITION 2 REVISION DATE 08. 24. 2006 SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD. 12FL., 120 CHUNG CHENG 1ST RD., TEL:886-7-7163069(41 LINI KAOHSIUNG, TAIWAN, R. O. C. FAX:886-7-7163086~89 SUNON WATURBO ... | OCR Scan |
9 pages, |
12FL 945P LGA775 material declaration amd MOTHERBOARD asus NVIDIA geforce CPU COOLER cpu Intel pentium ASUS P5LD2 X23-7762 Sunon 120 x 120 x 25 fans sunon fan 4 pin p5ld2 775 motherboard TC014-06001 TC014-06001 abstract |
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| Abstract: Hola1 H A H Pin heatsinks art. no. B ICK S 45 x 45 x 20 WLF . 45 x 45 weight: 36 g art. no. C D ICK S 50 x 50 x 20 WLF . 50 x 50 weight: 43 g art. no. E F ICK S 50 x 50 x 25 WLF . 50 x 50 weight: 49 g art. no. G H ICK S 98 x 98 x 45 WLF . 98 x 98 weight: 301.3 g I K L M H H H Thermal conduct. foil WLFT 404/405 Thermal conductive glue Thermal conductive paste Processor overview E5 E 14 E 12 B2-7 ... | Original |
1 pages, |
Heatsinks datasheet abstract |
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| Abstract: PROCESS CPD07 CPD07 Central General Purpose Rectifier TM Semiconductor Corp. 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 10.4 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization Au - 5,000Ã... Back Side Metalization Au - 2,000Ã... GEOMETRY GROSS DIE PER 4 INCH WAFER 1,170 PRINCIPAL DEVICE TYPES CR6A2GPP Series BACKSIDE CATHODE 145 Adams Avenue Hauppaug ... | Original |
2 pages, |
CPD07 CPD07 abstract |
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| Abstract: PROCESS CPD18 CPD18 Central Ultra Fast Rectifier TM Semiconductor Corp. 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 12.2 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization Au - 5,000Ã... Back Side Metalization Au - 2,000Ã... GEOMETRY GROSS DIE PER 4 INCH WAFER 1,170 PRINCIPAL DEVICE TYPES 1N5807 1N5807 thru 1N5811 1N5811 UES1301 UES1301 thru UES1306 UES1306 UES1401 UES1401 thru UES1403 UES1403 CUDD ... | Original |
2 pages, |
UES1403 UES1401 UES1306 UES1301 CUDD8-02 CPD18 1N5811 1N5807 CPD18 abstract |
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| Abstract: PROCESS CPD18 CPD18 Ultra Fast Rectifier 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 12.2 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization Au - 5,000Ã... Back Side Metalization Au - 2,000Ã... GEOMETRY GROSS DIE PER 4 INCH WAFER 1,170 PRINCIPAL DEVICE TYPES 1N5807 1N5807 thru 1N5811 1N5811 UES1301 UES1301 thru UES1306 UES1306 UES1401 UES1401 thru UES1403 UES1403 CUDD8-02 CUDD8-02 Series BACKSIDE CATHODE 145 Ada ... | Original |
2 pages, |
UES1403 UES1401 UES1306 UES1301 CUDD8-02 CPD18 1N5811 1N5807 CPD18 abstract |
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| Abstract: PROCESS CPD26 CPD26 Central Fast Recovery Rectifier TM Semiconductor Corp. 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 98 x 98 MILS Die Thickness 10.6 MILS Anode Bonding Pad Area 82.5 x 82.5 MILS Top Side Metalization Au - 5,000Ã... Back Side Metalization Au - 2,000Ã... GEOMETRY GROSS DIE PER 4 INCH WAFER 1,170 PRINCIPAL DEVICE TYPES CR6AF1GPP Series BACKSIDE CATHODE 145 Adams Avenue Hauppauge ... | Original |
2 pages, |
CPD26 CPD26 abstract |
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| Abstract: Non-Metallic: Polycarbonate and ABS QLINE® E Spec-00410 C PH (763) (763) 422-2600 422-2211 FX Non-Metallic Polycarbonate and ABS QLINE® E QLINE® E, Type 4X QLINE® E Enclosures house larger controls, provide additional sizerange options and offer greater internal mounting flexibility than smaller QLINE products. Featuring contoured bodies with flush cover screws, they are functional in corrosive environments and can withstand occasional submersion. The ABS series shares the same feat ... | Original |
6 pages, |
E61997 datasheet abstract |
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| Abstract: Cree® TR2436TM TR2436TM LEDs Data Sheet CxxxTR2436-Sxx00 Cree's TRTM LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree's proprietary device technology and silicon carbide substrates to deliver superior value for the LCD sideview market. The TR LEDs are among the brightest in the sideview market while delivering a low forward voltage resulting in a very bright and highly efficient solution for the 0.4-mm, 0.6-mm and 0.8-mm sideview m ... | Original |
6 pages, |
TR2436TM TR-27TM TR-27 TR-24 OS4000 TR2436TM abstract |
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| Abstract: TR300TM TR300TM LEDs CxxxTR3041-Sxx00 Data Sheet Cree's TRTM LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree's proprietary device technology and silicon carbide substrates to deliver superior value for the LCD sideview market. The TR LEDs are among the brightest in the sideview market while delivering a low forward voltage resulting in a very bright and highly efficient solution for the 0.6-mm and 0.8-mm sideview market. The desi ... | Original |
5 pages, |
TR300 TR30 TR-30 OS4000 C460 TR300TM TR300TM abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| => X_95, - o grave X_96 => X_96, - u circumflex X_97 => X_97, - u grave X_98 => X_98, - y umlaut X_99 => X_99, - O umlaut X_9A => X_9A, - U umlaut X_A0 => X_EA, - u circumflex X_97 => X_EB, - u grave X_98 => X_98, - y umlaut X , X_97 => X_97, X_A7 => X_A7, X_B7 => X_B7, X_88 => X_88, X_98 => X_98, X_A8 => X_A8, X_B8 www.datasheetarchive.com/download/79262054-393174ZC/mplabc30v2_05.tgz |
Microchip | 09/11/2006 | 27045.95 Kb | TGZ | mplabc30v2_05.tgz |