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Part : K18X6MMTX-PN-PF-STL-Z-BLK Supplier : - Manufacturer : Bisco Industries Stock : 377 Best Price : - Price Each : -
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8x6mm

Catalog Datasheet MFG & Type PDF Document Tags

W25R128FV

Abstract: W25Q128JV , Enhanced3 2.7V - 3.6V 104 SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm , SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) P UD ,  300mil, WSON8 8X6mm P N W25Q256JV Dual/Quad-SPI, QPI, DTR, Enhanced3 2.7V - 3.6V 104 SOIC16 300mil, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) UD UD , 6X5mm, WSON8 8X6mm, TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil W25Q128FW
Winbond Electronics
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W25R128FV W25Q128JV W25R128F W25Q80BVSSIG W978H6KB W25Q128F
Abstract: (Ø8x6mm) 2-Electrode Gas Discharge Tubes 5KA / 3KA Fast Delivery Time 1:Dimension(mm) 2:Main Applications â'¢PCI Cards protection â'¢Telephone/Fax/Modem protection â'¢single line protection â'¢ADSL/XDSL Splitter,Power Supply â'¢Surge Protection Device/Surge Protector 3:Features â'¢100% Lead-Free(RoHs Compliant ) â'¢Non-Radioactive â'¢Low capacitance (≤1pF) â'¢Fast Response-time,High , (Ø8x6mm) Gas Discharge Tubes 5 Electrical Characteristics Impulse Spark-over Voltage Impulse HUAAN
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HA2R75C HA2R90C HA2R150C HA2R230C HA2R250C HA2R300C

25X32AVSIG

Abstract: FEATURES10 -MIL . 5 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM , ). 41 8-Contact 8x6mm WSON (Package Code ZE , -pin SOIC 208-mil ­ 16-pin SOIC 300-mil ­ 8-pad WSON 6x5-mm (1) ­ 8-pad WSON 8x6-mm Note 1 ­ Special , -mil (Package Code SS) 4 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM Figure 1b. W25X32A Pad Assignments, 8
Winbond Electronics
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25X32AVSIG FEATURES10 32M-BIT 300-MIL

NS2R-90A1-M

Abstract: NS2R-230A1-M 2- . , , . Medium-Duty Types 10KA / 10A ø 8x6mm 20KA / 10A ø 8x6mm NS2R-75A-M NS2R-75A1-M NS2R-90A-M NS2R-90A1-M NS2R-145A-M NS2R-145A1-M NS2R-230A-M NS2R-230A1-M NS2R-250A-M NS2R-250A1-M NS2R-350A-M NS2R-350A1-M NS2R-470A-M NS2R-470A1-M NS2R-600A-M NS2R-600A1-M 10/1000µ 50, 1 , , s 300 ,5 8/20µs, , , , 75 < 650 100 10 10 52 90 < 700 100 10 10 52 145 < 700 100 10 10 52 230 < 750 100 10 / 20 10 135 250 < 800 100
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NS2R 8x6mm 1010 230A1 600A1 250A1

winband

Abstract: W25X40BV , SOIC8 208mil, SOIC16 300mil, WSON 6X5mm,PDIP8 300mll SOIC8 208mil,SOIC16 300mil,WSON 6X5mm, WSON 8X6mm, PDIP8 300mll SOIC8 1 SOmll, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON 8X6mm SOIC8 208mil, SOIC16 300mll, WSON 8X6mm,PDIP8 300mll SOIC8 208mil, SOIC16 300mll, WSON 8X6mm, PDIP8 300mll SOIC16 300mil, WSON 8X6mm S(Q2/'10) S(Q3/'10) S(Q2/'10) S (Q2/'10) â  Status: P= Mass Production, S=Samples, UD=Under , , WSON 8X6mm EOL Recommend W25Q32BV Y W25X32AV 32M-bit (4MB) 16,384 pages, 4KB sectors, 64KB blocks, Dual
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winband W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm

W25Q10EW

Abstract: W25Q 300mil, SD=TSSOP8 173mil, ZP or P=WSON8 6x5mm, ZE or E=WSON8 8x6mm, TC or C=TFBGA24 8x6mm (4x6 Matrix), TB or B=TFBGA24 8X6mm (5X5 Matrix), UX=USON8 2x3mm, UU=USON8 4x3mm, XG=XSON8 4x4m, BY=WLBGA. KGD
Winbond Electronics
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W25Q10EW W25Q w25q10 W25Q64FW 512K- 256M- 104MH 416MH 50M-B Q2-2014
Abstract: ShenZhen HuaXinAn Electronics Co.,Ltd (Ø8x6mm) 2-Electrode Gas Discharge Tubes 5KA Fast Delivery Time 1:Dimension(mm) 2R600C 2:Main Applications â'¢PCI Cards protection â'¢Telephone/Fax/Modem protection â'¢single line protection â'¢ADSL/XDSL Splitter,Power Supply â'¢Surge Protection Device/Surge Protector Photo 3:Features â'¢100% Lead-Free(RoHs Compliant , discharge www.huaandz.com Table continues on next page ShenZhen HuaXinAn Electronics Co.,Ltd (Ø8x6mm HUAAN
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2R75C 2R90C 2R150C 2R230C 2R250C 2R300C

w25q32b

Abstract: W25X32BV -MIL . 5 PAD CONFIGURATION WSON 6X5-MM / WSON 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM . 5 , ) . 39 8-Contact 8x6mm WSON (Package Code ZE , operating range Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 6x5mm (1) ­ 8-pad WSON 8x6mm ­ 16-pin SOIC 300-mil Note 1: WSON-8 8x6mm is a special order package, please contact Winbond for
Winbond Electronics
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W25X32BV w25q32b 208mH

W25Q64cv

Abstract: 25Q64CVSIG -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 72 8-Pad WSON 8x6mm (Package Code ZE
Winbond Electronics
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W25Q64cv 25Q64CVSIG 25q64cvf 25Q64CVFIG 936KB W25Q64CVT W25Q64CV 64M-BIT
Abstract: contact WSON (6x5mm) (JK) - 8 contact WSON (8x6mm) (JL) - 24 balls BGA (8x6mm) (JG) - All Pb-free , ) 5 SI (SO0) 8-pin WSON 6x5mm 8-pin WSON 8x6mm EL EA 8-pin SOIC 208mil 8-Pin SOIC 8 Integrated Silicon Solution
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IS25CQ064 160/200MH IS25CQ064-JKLI IS25CQ064-JLLI IS25CQ064-JGLI IS25CQ064-JMLA1
Abstract: -MIL . 5 4. PAD CONFIGURATION WSON 8X6-MM . 5 5. PIN DESCRIPTION SOIC 208-MIL, WSON 8X6-MM , . 38 12.1 12.2 8-Contact 8x6mm WSON (Package Code ZE , â'" 8-pin SOIC 208-mil â'" 8-pad WSON 8x6-mm â'" 16-pin SOIC 300-mil ï'· Software and Hardware , 1a. W25X64BV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM Winbond Electronics
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W25Q64BV

W25Q64

Abstract: 3017h -MIL . 5 PAD CONFIGURATION WSON 8X6-MM , -MIL . 6 PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, WSON 8X6-MM , ) . 40 8-Contact 8x6mm WSON (Package Code ZE , Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 8x6-mm ­ 8-pin PDIP 300-mil ­ 16-pin SOIC , , 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM Figure 1b. W25X64BV Pad
Winbond Electronics
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W25Q64 3017h W25X64BVSFIG TRAY DIMENSIONS SOIC16 WINBOND W25X64BV
Abstract: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . , -mil. 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6-mm (Package Code ZE Winbond Electronics
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W25Q32BV

Abstract: WINBOND 25Q32BVSIG -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 71 8-Pad WSON 8x6-mm (Package Code ZE
Winbond Electronics
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WINBOND 25Q32BVSIG WINBOND 25Q32BVAIG WINBOND W25Q32BVSSIG 25q32bvsig W25Q32BV application note land pattern for vsop 8 pins

W25Q128BV

Abstract: 25Q128BVFG . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pad Configuration WSON 8x6-mm . 6 Pad Description WSON 8x6-mm , -mil . 7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 Ball Description TFBGA 8x6-mm , . 66 8-Pad WSON 8x6-mm (Package Code E
Winbond Electronics
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W25Q128BV 25Q128BVFG JESD216 w25q128 25Q128 25Q128BVEG 128M-BIT

W25Q128FW

Abstract: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm . 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm , -mil. 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 85 10.3 8-Pad WSON 8x6-mm (Package Code E
Winbond Electronics
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WINBOND 25Q64CVSIG

Abstract: Winbond 25Q64CVIG -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 71 8-Pad WSON 8x6mm (Package Code ZE
Winbond Electronics
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WINBOND 25Q64CVSIG Winbond 25Q64CVIG WSON 8x6mm land pattern land pattern for vsop 60 pins WINBOND APPLICATION NOTE w25q64c
Abstract: (JM) - 8 contact WSON (8x6mm) (JL) - 24 balls BGA (6x8mm) (JG) - All Pb-free packages are RoHS , 8-pin WSON (8x6mm) EL EA HOLD#(IO3) N O T R 16-Pin SOIC 300mil 24 - Ball Integrated Silicon Solution
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IS25CQ256 IS25CQ256-JMLI 32768K IS25CQ256-JLLI IS25CQ256-JGLI 24-BGA

25q64fvsig

Abstract: WINBOND 25Q64FVSIG -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 9 Ball Description TFBGA 8x6-mm , ) . 81 8-Pad WSON 8x6-mm (Package Code ZE
Winbond Electronics
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W25Q64FV 25q64fvsig WINBOND 25Q64FVSIG 25Q64FVAIG 25q64fv 25Q64FVFIG

WINBOND 25Q64CVSIG

Abstract: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . , -mil. 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6mm (Package Code ZE
Winbond Electronics
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winbond 25x16

Abstract: 25X16AVSIG -MIL. 5 5. PAD CONFIGURATION WSON 6X5-MM & 8X6-MM , -MIL . 6 7. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5 / 8X6-MM , ) . 43 14.5 8-Contact 8x6mm WSON (Package Code ZE , -pad WSON 8x6-mm (X32, X64) · Data Transfer up to 150M-bits / second ­ Clock operation to 75MHz ­ Fast , -MM & 8X6-MM Figure 1c. W25X16/16A/32/64 Pad Assignments, 8-pad WSON 6x5-mm, 8x6-mm (Package Code ZP
Winbond Electronics
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W25X32 W25X64 winbond 25x16 25X16AVSIG 25X32VSIG 25x16vsig 25x16 W25X16 W25X16A 16M-BIT 150-MIL
Abstract: . 6 3.1 3.2 Pad Description WSON 8x6-mm , -mil. 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 3.6 4. Pad Configuration WSON 8x6-mm . 6 Ball Description TFBGA 8x6-mm , ) . 68 9.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array Winbond Electronics
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25q64fvsig

Abstract: 25q64fv -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 9 Ball Description TFBGA 8x6-mm , ) . 81 8-Pad WSON 8x6-mm (Package Code ZE
Winbond Electronics
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25q64 25q64f 25q64fva W25Q64FVSSIQ W25Q64FVSSIG W25Q64f
Abstract: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300 , -mil . 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6mm (Package Code ZE Winbond Electronics
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W25Q64FV

Abstract: 25q64fvsig Configuration WSON 6x5-mm / 8X6-mm. 6 Pin , -mil. 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm and PDIP 300-mil . 7 Pin , -mil. 8 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 9 Ball Description TFBGA 8x6-mm , ) . 82 8-Pad WSON 8x6-mm (Package Code ZE
Winbond Electronics
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winbond w25q64fv W 25Q64FVSIG 25Q64FVS s4 43a marking 25b 1F00FFh
Abstract: ShenZhen HuaXinAn Electronics co.,LTD 2R230 - 2R-230 Gas Discharge Tubes 1:Dimension(Ø8x6mm) 10KA Fast Delivery Time 2R1000 Photo 2:Main Applications â'¢PCI Cards protection â'¢Telephone/Fax/Modem protection â'¢single line protection â'¢ADSL/XDSL Splitter,Power Supply â'¢Surge Protection Device/Surge Protector 3:Features â'¢100% Lead-Free(RoHs Compliant ) â'¢Non-Radioactive â'¢Low capacitance (≤1pF) â'¢Fast Response-time,High Insulation Resistance. â'¢Small size :Ø8x6(mm HUAAN
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2R150 2R250 2R300 2R350 2R400 2R420
Abstract: HuaXinAn Electronics 2R400 - 2R-400 Gas Discharge Tubes 1:Dimension(Ø8x6mm) 10KA Fast Delivery Time 2R1000 Photo 2:Main Applications â'¢PCI Cards protection â'¢Telephone/Fax/Modem protection â'¢single line protection â'¢ADSL/XDSL Splitter,Power Supply â'¢Surge Protection Device/Surge Protector 3:Features â'¢100% Lead-Free(RoHs Compliant ) â'¢Non-Radioactive â'¢Low capacitance (≤1pF) â'¢Fast Response-time,High Insulation Resistance. â'¢Small size :Ø8x6(mm) 4 HUAAN
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2R470 2R500 2R600 2R800 100PCS

25q32bv

Abstract: WINBOND 25Q32BVAIG . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 3.4 Pin Description SOIC 208-mil, WSON 6x5/8x6-mm and PDIP 300 , -mil . 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 72 9.4 8-Pad WSON 8x6mm (Package Code ZE
Winbond Electronics
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25q32bv 25Q32BVAIG 25Q32 A15-12 W25Q32BVSSIG 25q32BVS
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