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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA FLAT PACK Stress Solderability Abstract: .. Solderability 30 240 883 M2003 0 0.00. Temp Cycle 100 10,000 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA METAL Stress Solderability Temp Abstract: .. Solderability 420 3,360 883 M2003 0 0.00. Temp Cycle 2,300 662,500 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA CerDIP / SIDEBRAZE Stress Solderability Temp Abstract: .. Solderability 105 840 883 M2003 0 0.00. Temp Cycle 500 130,000 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: 5962-8684501IA 5962-8684501PA 5962-8686101XA 5962-8686101XC 5962-8686102XA 5962-8686102XC 5962-8687701GA 5962-8687702GA 5962-8688201XC 5962-8688202XC 5962-8688203XC 5962-8757801GA Abstract: .. 8601402CA 8601402IA AD580JH AD580KH AD580LH AD580MH AD580SH AD580SH/883 AD580TH AD580TH/883 AD580UH AD580UH/883 AD581JH AD581KH AD581LH AD581S/883 AD581TH AD581TH/883 AD581UH/883 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA METAL Stress LEAD Solderability Abstract: .. LEAD INT 121 378 883 M2004 0 0.00. Solderability 170 1440 883 M2003 0 0.00. Temp Cycle 1400 445,000 -65C-150C 0 0.00 .. datasheet abstract.. |
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First line: ROM / HDD Connectors Series 0.8mm Pitch Position Plug ORDERING CODE Series 0.8mm Pitch Abstract: .. 14 5600 050 000 883. ORDERING CODE. 24 5600 050 100 883. ORDERING CODE .. datasheet abstract.. |
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First line: Military Products InfoCard Microcircuit Part Numbering System Stock Class Designator Microcircuits Last Abstract: .. Class Designator or Quality Level 1.2.1, MIL-STD-883 .. M. MIL-M-38510 .. B or S. Rad Hard Identifier. Last 2 Digits of FY in Which the Dwg No was. Assigned .. datasheet abstract.. |
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First line: SGYT103 December CROSS REFERENCE GUIDE Texas Instruments Military Semiconductors through program MIL-PRF-38535 Abstract: .. DM54LS00E/883 SNJ54LS00FK JM38510/30001B2A. DM54LS00W-MLS SNJ54LS00W JM38510/30001BDA. DM54LS00W/883 SNJ54LS00W JM38510/30001BDA. JD54LS02B2A SNJ54LS02FK JM38510/30301B2A. DM54LS04W .. datasheet abstract.. |
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First line: PARALLEL EEPROM AT-A-GLANCE STANDARD VOLT Product AT28C16 AT28C16E AT28C17 AT28C17E AT28C64 AT28C64E Abstract: .. MILITARY-GENERIC MIL-STD 883 Operating. Product Density Organization Voltage Speed ns Pkgs. AT28C256 256K 32K x 8 4.5 - 5.5 150, 200 D,F,L,U. note 1 AT28C256E 256K 32K x 8 4.5 - 5.5 150, 200 D,F,L .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA CerDIP / SIDEBRAZE Stress SALT ATMOSPHERE Abstract: .. Solderability 315 2,760 883 M2003 0 0.00. Temp Cycle 50 50,000 -65C-150C 0 0.00 .. datasheet abstract.. |
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First line: Worldwide www.national.com www.national.com / mil National Elantec Cross-Reference Guide National Elantec Cross-Reference Guide Mil / Aero Abstract: .. EL2001J/883 CLC109AJ-QML Low Power Wideband Buffer 8-pin CERDIP 8-pin CERDIP No Greater gain bandwidth. EL2001AJ/883 CLC109AJ-QML Low Power Wideband Buffer 8-pin CERDIP 8-pin CERDIP No Greater .. datasheet abstract.. |
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3 Pages 
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First line: August Dear Vishay-Siliconix Customer PCN02012 aware Vishay-Siliconix metal gate fabrication process identified Abstract: .. 77052012A DG408AZ/883. 38510 Parts. JM38510/19001BXC NOT AVAILABLE JM38510/19003BXC NOT AVAILABLE JM38510/19007BEA 5962-9204201MEA JM38510/19007BEC 5962-9204201MEC JM38510/19008BEA .. datasheet abstract.. |
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First line: Worldwide Atmel Sales Managers Representatives Distributors From Forrest Huff EPLD Tactical Marketing Abstract: .. This includes military temperature, Mil-STD-883 and DESC marked products. Commercial grade and industrial grade plastic versions will still be offered. Usage of low-voltage military programmable .. datasheet abstract.. |
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First line: Introduction Product Listing Each Standard Microcircuit Drawing SMD part number that Atmel Abstract: .. SMD part number that Atmel supplies corresponds to an Atmel /883 part num-ber. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable standard .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PowerPAKr TSSOP-16 Stress HAST Abstract: .. Solderability 20 N/A 883 M2003 0 0.00. Temp Cycle 163 81,500 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TSSOP14 STRESS HAST Pressure Abstract: .. Solderability 45 360 883 M2003 0 0.00. Temp Cycle 185 82900 - 65 °C to 150 °C 0 0.00. .. datasheet abstract.. |
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First line: ADVANCE Features uppo rsil.c ESIG nical Fast Acquisition Power INFORMATIONww.int Sample Hold Abstract: .. HA5351/883 Fast Acquisition, Low Power Sample and Hold Amplifier. Description The HA5351/883 is a fast acquisition, wide bandwidth sam-ple/hold amplifier built with the Intersil HBC-10 BiCMOS .. datasheet abstract.. |
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First line: ADVANCE Features DESI Fast Acquisition Power INFORMATION Sample Hold Amplifier Description HA5351 / 883 Abstract: .. HA5351/883 Fast Acquisition, Low Power Sample and Hold Amplifier. Description The HA5351/883 is a fast acquisition, wide bandwidth sam-ple/hold amplifier built with the Harris HBC-10 BiCMOS .. datasheet abstract.. |
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First line: Abstract: .. /883 JM38510/ 5962. Analog Signal Processing. Arrays, Transistor. NPNs 5 , 8GHz HFA3127 -9474901. Buffers. Buffer, 110MHz, 1300V/μs HA-5002 /883 -8963601. COMPARATORS. Quad, Precision HA-4902 .. datasheet abstract.. |
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First line: SPACE-LEVEL CERAMIC SURFACE-MOUNT PACKAGE available from National ceramic / hermetic surface-mount package Ceramic SOIC Abstract: .. CURRENTLY AVAILABLE DEVICES CLC420AWG-QML LM119WG/883 LM2940WG-15/883 LM6165WG/883. CLC430AWG-QML LM124AWG/883 LM2941WG/883 LM6172AMWG-QML. DS16F95WG/883 LM124WG/883 LM2990WG5 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TO-92 P-J Stress BOND Abstract: .. DIE PUNCH 30 MIL-STD-883 0 0.00. HAST 330 100 hrs 130C, 85%RH 0 0.00. Pressure Pot 330 96 hrs, 168 hrs 121, 15 PSIG 0 0.00. Solder DUNK 60 260C, 10 SEC 0 0.00. Solderability 60 8 hrs 883 M2003 0 0.00. Temp Cycle .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TO-263 P-J Stress BOND Abstract: .. DIE PUNCH 15 MIL-STD-883 0 0.00. HAST 165 100 hrs 130C, 85%RH 0 0.00. Pressure Pot 165 96 hrs, 168 hrs 121, 15 PSIG 0 0.00. Solder DUNK 45 260C, 10 SEC 0 0.00. Solderability 45 8 hrs 883 M2003 0 0.00. Temp Cycle .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TO-220 P-J Stress BOND Abstract: .. DIE PUNCH 45 MIL-STD-883 0 0.00. HAST 495 100 hrs 130C, 85%RH 0 0.00. Pressure Pot 495 96 hrs, 168 hrs 121, 15 PSIG 0 0.00. Solder DUNK 135 260C, 10 SEC 0 0.00. Solderability 135 8 hrs 883 M2003 0 0.00. Temp Cycle .. datasheet abstract.. |
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First line: Abstract: .. 7883/883. 499:&4 /;/13/&"5’/+"3/+$/+%/4& +;/;883. 9*<;/;8/;3. " $%%%#" & = !"#$%&’ 1, # > 9 %’& : * 4$ +$ + $ ? 1 +$ + ? 1 #’+$ + # ? %$ ’ @ !"# $%&’ :AB * # = * 1, # 2 +,$ 20 > & ’ .. datasheet abstract.. |
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First line: ADVANCE INFORMATION Features A-534 Supp sil.co hnica w.int 88-IN 1Description HA5352 / 883 Fast Abstract: .. HA5352/883 Fast Acquisition Dual Sample and Hold Amplifier. Description The HA5352/883 is a fast acquisition, wide bandwidth Dual Sample and Hold amplifier built with the Intersil HBC-10 BiCMOS .. datasheet abstract.. |
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First line: ADVANCE DESI INFORMATION HA5352 / 883 Fast Acquisition Dual Sample Hold Amplifier Description HA5352 / 883 Abstract: .. HA5352/883 Fast Acquisition Dual Sample and Hold Amplifier. Description The HA5352/883 is a fast acquisition, wide bandwidth Dual Sample and Hold amplifier built with the Harris HBC-10 BiCMOS .. datasheet abstract.. |
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First line: MILITARY AEROSPACE DESIGN / PROCESS CHANGE NOTIFICATION Listing GIDEP GIDEP Category Issued This advise Abstract: .. Q1FY99 Military Division Obsolescence [S] MA98021 09/10/98 Standard 883/JAN B FAST Processing MA98022 09/17/98 Removal of Wafer Backside Metalization - Analog [S] MA98023 10/14/98 11C90 .. datasheet abstract.. |
564.8 Kb |
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First line: Aero Analog Surface Mount Products March Aero Analog Surface Mount Products General Abstract: .. Both rugged packages meet the rigorous screening requirements of MIL-STD-883 and MIL-M-38510. These packages are ideal in applications where space limi-tations require extremely small .. datasheet abstract.. |
255.15 Kb |
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First line: Package Reliability Vishay Siliconix Environmental Package Testing Data PowerPAK ChipFET Stress BOND Abstract: .. Solderability 90 720 883 M2003 0 0.00. Temp Cycle 330 330,000 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA Cerquad Stress HAST Pressure Abstract: .. Solderability 30 240 883 M2003 0 0.00. Temp Cycle 110 55,000 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TSSOP 8-LEAD SOLDER PROCESS Abstract: .. Solderability 135 13,200 883 M2003 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA TO-92 Stress BOND HAST Abstract: .. Solderability 605 4,840 883 M2003 0 0.00. Temp Cycle 4,245 1,668,750 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC-75A Stress HAST Pressure Abstract: .. Solderability 195 1,485 883 M2003 0 0.00. Temp Cycle 1,610 570,000 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PLCC Stress HAST Pressure Abstract: .. Solderability 165 1,440 883 M2003 0 0.00. Temp Cycle 1,175 432,500 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA 1206-8 ChipFET Stress BOND Abstract: .. Solderability 15 120 883 M2003 0 0.00. Temp Cycle 320 187,500 −65C−150C 0 0.00 .. datasheet abstract.. |
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First line: Abstract: .. 78839,883. . .36,,’:&,/ %’,%"3,% ,. %993333,3388;33 < =*>9933398. 3. "!#$%&’ $ /+!# $ 4 .. datasheet abstract.. |
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First line: hytek Microsystems MIL-D-83532 LISTED DIGITAL DELAY hytek Microsystems Springs Carson City 883-0820 Abstract: .. hyte k. Microsystem s. hyte k Microsystem s 40 0Ho tSpring sRd .Carso nCit yN V8970 6 702 883-082 0Fa x-082 7www.hytek.co m. MIL-D-8353 2. JA NLISTE D. DIGITA LDELA YL INE S 12/9 7. hyte k. Microsystem s. hyte .. datasheet abstract.. |
306.12 Kb |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SQFP 48-64 LEAD Stress Abstract: .. Solderability 225 1,800 883 M2003 0 0.00. Temp Cycle 890 697,500 -65C-150C 0 0.00. Thermal Shock 950 95,000 -60C-150C 0 0.00 .. datasheet abstract.. |
22.67 Kb |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA SC-75A Stress HAST Pressure Abstract: .. Solderability 45 360 883 M2003 0 0.00. Temp Cycle 365 185,000 -65C-150C 0 0.00 .. datasheet abstract.. |
22.28 Kb |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA PLCC Stress HAST Pressure Abstract: .. Solderability 45 360 883 M2003 0 0.00. Temp Cycle 200 200,000 -65C-150C 0 0.00. Thermal Shock 300 30,000 -60C-150C 0 0.00 .. datasheet abstract.. |
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First line: DMOS High Reliability Products following products available with High Reliability processing test Abstract: .. with High Reliability processing per test methods and flows of MIL-STD-750 and MIL-STD-883. For ordering purposes, add the process flow prefix to the device number as shown in the following examples .. datasheet abstract.. |
6.98 Kb |
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First line: 0.5mm Pitch SERIES 0.5mm 0.5mm Pitch One-Touch Lock Type POS. / Ordering Code Abstract: .. 04 6298 0xx 883?注文コード/Ordering Code 極数NUMBER OF CONTACTS 883:Au 注 生産対応可能極数については、営業部にご確認願います。 極数?NO . OF ?POS. A?B?C 3 ?4 1.0 ?1.5 3 .. datasheet abstract.. |
68.2 Kb |
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First line: Package Reliability Vishay Siliconix ENVIRONMENTAL PACKAGE TESTING DATA Cerquad Stress BOND HAST Abstract: .. Salt Atmosphere 75 3,600 883 M1009 0 0.00. Solderability 150 1,200 883 M2003 0 0.00. Temp Cycle 628 418,750 -65C-150C 0 0.00. Thermal Shock 685 150,200 -60C-150C 0 0.00 .. datasheet abstract.. |
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First line: DIONICS INC. Rushmore Street Westbury Phone 997-7474 Fax 997-7479 Website www.dionics-usa.com Reliability Abstract: .. Mil 883 Method 2001 Cond A 5kg/Y1. 15 No Failure. Mechanical Shock. Mil 883 Method 2002 500g for 1mSec. 15 No Failure. Vibration. Mil 883 Method 2007 Cond A 20g @ 20 to 2000Hz. 15 No Failure. Moisture Resistance .. datasheet abstract.. |
20.83 Kb |
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First line: Introduction Product Listing Each Standardized Military Drawing SMD part number that Atmel Abstract: .. part number that Atmel supplies corresponds to an Atmel /883 part num-ber. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable stan-dardized .. datasheet abstract.. |
84.25 Kb |
12 Pages 
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First line: Introduction Product Listing Each Standardized Military Drawing SMD part number that Atmel Abstract: .. part number that Atmel supplies corresponds to an Atmel /883 part num-ber. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable stan-dardized .. datasheet abstract.. |
50.52 Kb |
12 Pages 
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First line: March EDGE Analysis HI5828 Dual 12-bit Digital Analog Converter with ISL5217 Quad Abstract: .. INTERSIL CORPORATION | Post Office Box 883 | Melbourne, FL 32902-0883 | 321-724-7000 | www.intersil.com. March 2001. EDGE Analysis of the HI5828, Dual 12-bit Digital to Analog Converter with the .. datasheet abstract.. |
267.34 Kb |
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First line: Military Ordering Information Introduction Lattice Semiconductor Corporation LSC offers most comprehensive line Abstract: .. ispLSI 1016-60LH/883 5962-9476201MXC 20 60 100 170 44-Pin JLCC. ispLSI 1024-60LH/883 5962-9476101MXC 20 60 135 220 68-Pin JLCC. ispLSI 1032-60LG/883 5962-9308501MXC 20 60 135 220 84-Pin CPGA .. datasheet abstract.. |
21.81 Kb |
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First line: 3.3V HCMOS Frequency Range Frequency Stability Temperature Range Operating Option Storage Input Abstract: .. MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2003 MIL-STD-883, Method 2007, Condition A MIL-STD-202, Method 215 MIL-STD-202, Method 210, Condition A,B or C. MIL-STD-883, Method .. datasheet abstract.. |
102.01 Kb |
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First line: Reeves FREQUENCY PRODUCTS CXO63HT Stratum Clock Oscillator CRYSTALS Features Year Stability CMOS / TTL Abstract: .. 25 cycles, -55 °C to +125°C per MIL-STD-883, Method 1010 Constant Acceleration: .. 5000g's, 0.5mS, 3 shocks per direction .. datasheet abstract.. |
785.77 Kb |
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