NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN (SEALED TYPE) ROUND PIN TYPE SEALED IC , DIMENSIONS 1. The specification of the sealed IC socket are the same as the round pin type IC socket. 2. , (Polyester resin) ORDERING INFORMATION AXS 1 1 11: Round PIN type sealed IC sockets , high bonding strength. 3. High reliability sockets with round pin contacts and a 4-point contact , Sealing tape is bonded to the top surface of the IC socket. The sealing tape is peeled off before IC ... | Original |
2 pages, |
Socket IC 24 pin AXS110811 AXS111411 AXS111611 AXS111811 AXS112011 AXS112211 AXS112411 AXS112471 AXS112811 AXS113211 AXS113611 IC Ultrasonic AXS110819 datasheet abstract |
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| Abstract: , round pin type IC socket. Dimension is same as 16 contacts, round pin type IC socket. 17.78±0.1 , 20 contacts, round pin type IC socket. 2.54±0.05 5.08±0.05 22.86±0.1 NOTES 1. , AXS1 DESIGNED FOR PRINTED CIRCUIT BOARD SIGNAL RELAYS ROUND PIN TYPE SOCKETS FOR PC BOARD , DS21 socket AXS10DS21 AXS10DS21 8 DS Relay 2 Form C Single Side Stable Type 1 Coil Latching Type , match the terminal layout of signal relays. 2. The use of round pin contacts with a 4point contact ... | Original |
2 pages, |
TQ41 tq-relay megger DS21 HP4338B DS22 AXS10DS21 Matsushita relay Relay Matsushita datasheet abstract |
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| Abstract: conductive, testing will not reveal the insertion error. Round pin type IC socket 8. Compliance with , flux rises. Round pin type IC socket 6. Solder "blow holes" are eliminated by unique socket , , preventing blowholes from forming on soldered areas. Short wiping distance Round pin type IC socket , force uIC socket Round pin type IC socket · Comparison of single-pin insertion force of uIC , socket, and there was less variance as well. 1 3 2 Stroke (mm) uIC socket Round pin type IC ... | Original |
4 pages, |
AXS204011K AXS200611K AXS200811K AXS201411K AXS201611K AXS201811K AXS202011K AXS202411K AXS202471K AXS202811K AXS203211K datasheet abstract |
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| Abstract: error. Round pin type IC socket 8. Compliance with RoHS' Directive Environmentally friendly, the , uIC socket Insert molding construction preventing flux rises. Round pin type IC socket 6. , Short wiping distance Round pin type IC socket All Rights Reserved © COPYRIGHT Matsushita , insertion force (70% of round pin force) 0 Removal force uIC socket Round pin type IC socket · , 3 2 Stroke (mm) uIC socket Round pin type IC socket 30 Quantity · Comparison of overall ... | Original |
4 pages, |
AXS204011K AXS200611K AXS200811K AXS201411K AXS201611K AXS201811K AXS202011K AXS202411K AXS202471K AXS202811K AXS203211K datasheet abstract |
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| Abstract: , chromium, PBB and PBDE are not used. ROUND PIN TYPE IC SOCKETS CONSTRUCTION OF CONTACT ORDERING INFORMATION AXS 10: Round PIN type IC sockets 08: 8 contacts 14: 14 contacts , AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the , socket with round pin external contacts constructed with 4 point internal contacts. Because of the , entrance of solder flux. Because of the round pin construction and sufficient distance being provided ... | Original |
4 pages, |
AXS103611 AXS100811 AXS101411 AXS101611 AXS101811 AXS102011 AXS102211 AXS102411 AXS102471 AXS102811 AXS103211 axs103221 datasheet abstract |
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| Abstract: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of , IC socket with round pin external contacts constructed with 4 point internal contacts. Because of , PIN TYPE IC SOCKETS CONSTRUCTION OF CONTACT ORDERING INFORMATION AXS 1 0 10: Round PIN type IC sockets 08: 8 contacts 14: 14 contacts 20: 20 contacts 22: 22 , extended periods.) Economical type (Extremely resistant to fretting with IC) 8 14 16 18 20 22 ... | Original |
4 pages, |
AXS103611 AXS100811 AXS101411 AXS101611 AXS101811 AXS102011 AXS102211 AXS102411 AXS102471 AXS102811 AXS103211 datasheet abstract |
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| Abstract: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. , - x x X X 95 Device Type B = Ball Grid Device Material C = std. socket for L = Land Grid , footprint and pads as required by the BGA, or any other IC package the socket was designed for (except if , Clamshell retainer from the socket base prior to soldering the sockets to the PCB. This will avoid socket , remove and reassemble the Clamshell retainer from the socket base can be obtained from E-tec. c) Pick ... | Original |
8 pages, |
qualitek TEC Driver bpw 50 3M Touch Systems 1072 Diode, SMD .65mm bga land pattern E-tec Interconnect datasheet abstract |
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| Abstract: Subgroup 2 5 Breakdown voltage, collector to base 3001 Cond. D IC = lOOuADC BVCBO 80 i I Vdc , 360mAdc End points for subgroups 7 and 8: Collector to base cutoff current 3036 Cond. D Vcb , : 1. The pin spacing permits insertion in any socket having a pin-circle diameter oi 0.200 inch and , maximum-width tab. figure 2 - Mechanical dimensions and outline oi type 2N2631 2N2631. 8 MIL-S- 19500/303(NAV Y) R1 , ins'd- diameter ny 7 8 incii lent. Tap 2 tw! :is> (i«.m ¡.round end. 5000 ohms 4-40 pf 0.005 uf 1 ... | OCR Scan |
12 pages, |
CLA transistor 2N263 2N2876 2N2631 jsw marking SJ 2036 MIL-S-19500 2N2631 abstract |
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| Abstract: Pin 14: Photocathode Base Pin Connections Figure 9 - Base Pin and Stem Lead Connections Lead 1 , transition. Figure 8 - Dimensional Outlines Return To Product Page IC - INTERNAL CONNECTION, DO NOT USE STEM LEADS 7, 8, & 14 ARE CLIPPED SHORT CATHODE LEAD IDENTIFIED BY DOT ON STEM GLASS Bottom , 5: Dynode No.5 Pin 6: Dynode No.6 Pin 7: Dynode No.7 Pin 8: Dynode No.8 Pin 9: Dynode No.9 Pin , : Dynode No.6 Lead 7: Clipped Short Lead 8: Clipped Short Lead 9: Dynode No.7 Lead 10: Dynode No.8 ... | Original |
8 pages, |
B270 TP136 S83021E AJ2283 S83021EM1 S83021EM2 S83021E abstract |
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| Abstract: ,40 ± 0,05) · IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through .015" x .023" (0,38 x 0 , Normal Force . 320 Grams (11.3 oz.) with .008" x .015" (0,20 x 0,38) IC lead (typ. , ) average with a .008" x .015" (0,20 x 0,38) dia. polished steel pin · "L" bent lead design achieves , vacuum pick and place surface area APPLICATION DIMENSIONS: · IC Pin Dimension Range: .008" x .015" , ) IC lead typ. Contact Retention . 340 Grams (12.0 oz.) minimum Solderability ... | Original |
25 pages, |
314AG19DC 520-AG10D-ES 224-AG30D 314-AG19DC 540-AG11D-ES 232-AG19DC Augat lsg DS2-324-1AR LSG-1AG14 ag40d 720-AG2D-ES Augat 824-AG11D 328-AG19DC LSG-1AG14-1 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| .010) M B M -A- -B- 8X D -T- R M J X 45 C0095 C0095 C0095 C0095 C0095 C0095 C0095 C0095 F NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED - DL201 DL201 DL201 DL201 REV 1 Packaging & Case Information 84-Pin PLCC CASE 780A-01 ISSUE A FN SUFFIX 160-Pin QFP CASE 864A-03 ISSUE C DH SUFFIX 181-Pin PGA CASE 795A-02 ISSUE A HI SUFFIX 128-Pin QFP CASE 862A-02 ISSUE B DD SUFFIX 224-Pin PGA CASE 823B-01 823B-01 823B-01 823B-01 ISSUE O KE SUFFIX 208-Pin QFP CASE 872A-01 ISSUE TBD DK SUFFIX PICTORIALS NOT TO SCALE 299-Pin PGA CASE 861A-01 ISSUE O HV SUFFIX 3 Packaging & Case Information 3 www.datasheetarchive.com/download/55885571-481534ZC/pdf.zip (PACKAGE.PDF) |
Motorola | 23/09/1996 | 2858.4 Kb | ZIP | pdf.zip |
| excellent Design Tools together with a cost-effective, code-efficient and pin-efficient 8-bit Architecture Multi-I/P Wakeup Package Types 4 COP8 Training 1997 PSG Applications Summit National Technical Number of timer interrupts sources; COP8 - 5 & 7; Motorola -3 & 1; Microchip - 3 Number of timer I/O pins time High repetition rate Large pulse width (i.e. non-50% duty cycle) IC Chip Problems COP8 Solutions status of pin 1997 PSG Applications Summit I/O Port Configuration Document Microsoft Word Document COP8 www.datasheetarchive.com/download/8189941-509713ZC/summit.ppt |
National | 22/09/1997 | 3461 Kb | PPT | summit.ppt |
| Document Part Number Description Price US $ MetaLink base unit ice for all COP8 devices, symbolic debugger /iceMaster base unit Debug Module Metalink based low cost ice. Target connector cables for debug module 20-Lead -Lead DIP ZIF Socket Host System Data Link (serial) 115.2K Baud Serial 9600 Baud Serial 115.2K Baud Performance Analyzer! Up to 15 Memory Areas Built-in Programmer DIP, SOIC, PLCC 40-Lead DIP ZIF Socket Host 20mA MIWU Yes (3 pins on 12C509 12C509 12C509 12C509) Timers 1 - 15 stage 1 - 8 bit with prescaler Hi Sp cap registers www.datasheetarchive.com/download/34649354-509712ZC/sea896.ppt |
National | 07/05/1997 | 1339 Kb | PPT | sea896.ppt |
| are required for all Message-Based devices. These registers begin at an offset of 8 from the base }ifelse}bdf /min{2 copy gt{exch}if pop}bdf /max{2 copy lt{exch}if pop}bdf /dr{transform .25 sub round .25 add exch .25 sub round .25 add exch itransform}bdf /df currentflat def /tempstr 1 string def 0 currenttransfer {c1 1 index get absmax absmax absmax bc2 c1 1 get 1 exch put graystep div abs round dup 0 eq{pop 1}if }bdf /blackrp{cyanbuf blackbuf copy}bdf dup{ic mul ic sub 1 add}concatprocs exch dup{im mul im sub 1 add www.datasheetarchive.com/download/7010842-571093ZC/vxisem.ppt |
National Instruments | 19/12/1995 | 3051 Kb | PPT | vxisem.ppt |
| circuits implemented within com- ponents or assemblies. The information describes the type of compo- nent technical requirements components may contain dangerous substances. For in- formation on the types in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 6.3 Port 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24 7 Dedicated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 The External Bus Interface www.datasheetarchive.com/files/infineon/mc_data/dave/products/c165.dip!/c165/documents/m165.pdf |
Infineon | 01/02/2000 | 6765.42 Kb | DIP | c165.dip |
| circuits implemented within com- ponents or assemblies. The information describes the type of compo- nent technical requirements components may contain dangerous substances. For in- formation on the types in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 6.3 Port 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24 7 Dedicated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 The External Bus Interface www.datasheetarchive.com/files/infineon/mc_data/dave/products/c163.dip!/c163/documents/m165.pdf |
Infineon | 01/02/2000 | 5861.45 Kb | DIP | c163.dip |
| type of compo- nent and shall not be considered as assured characteristics. Terms of delivery and the types in question please contact your nearest Siemens Office, Semi- conductor Group. Siemens AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 Semiconductor Group I-1 6.3 Port 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24 7 Dedicated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 The External Bus Interface www.datasheetarchive.com/files/infineon/mc_data/dave/products/c161k.dip!/c161k/documents/m161.pdf |
Infineon | 01/02/2000 | 5245.97 Kb | DIP | c161k.dip |
| type of compo- nent and shall not be considered as assured characteristics. Terms of delivery and the types in question please contact your nearest Siemens Office, Semi- conductor Group. Siemens AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 Semiconductor Group I-1 6.3 Port 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24 7 Dedicated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 The External Bus Interface www.datasheetarchive.com/files/infineon/mc_data/dave/products/c161o.dip!/c161o/documents/m161.pdf |
Infineon | 01/02/2000 | 5365.62 Kb | DIP | c161o.dip |
| type of compo- nent and shall not be considered as assured characteristics. Terms of delivery and the types in question please contact your nearest Siemens Office, Semi- conductor Group. Siemens AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8 Semiconductor Group I-1 6.3 Port 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24 7 Dedicated Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 8 The External Bus Interface www.datasheetarchive.com/files/infineon/mc_data/dave/products/c161v.dip!/c161v/documents/m161.pdf |
Infineon | 01/02/2000 | 5198.98 Kb | DIP | c161v.dip |
| DRAM VGA VIP TV SYS ISA/IDE IPC 89 10 9 12 56 8 80 11 PC CLIENT PIN DESCRIPTION 18/233 Table 2 8Kbyte unified instruction and data cache with write back and write through capability. n Parallel Supports 4MB, 8MB, 16MB, 32MB single- sided and double-sided DRAM SIMMs. n Four quad-word write buffers for -charge time, and RAS to CAS delay. n 60, 70, 80 & 100ns DRAM speeds. n Memory hole between 1 MByte & 8 MByte fills. n Up to 64 x 64 bit graphics hardware cursor. n Up to 4MB long linear frame buffer. n 8-, 16 www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6375-v1.htm |
STMicroelectronics | 02/04/1999 | 468.89 Kb | HTM | 6375-v1.htm |