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Part : AA1-B0-54-616-3G1-C Supplier : Carling Technologies Manufacturer : Avnet Stock : - Best Price : $11.4892 Price Each : $20.0758
Part : ATF-36163-G Supplier : Broadcom Manufacturer : RS Components Stock : 1,455 Best Price : £0.50 Price Each : £0.79
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616 3g

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: H) Millimeters (L × W × H) Weight - 1.0 x 0.5 x 0.243 25.4 x 12.7 x 6.16 3g - Note Bel Fuse
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V7BA-06A1AL V7BA-06A1A0 ESR 10mOhm Capacitor 3300uF 10V TR-332 V7BA-06A1A
Abstract: ) Weight - 1.0 x 0.5 x 0.243 25.4 x 12.7 x 6.16 3g - Note: All specifications are typical at Bel Fuse
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VRBA-06A1A VRBA-06A1AL VRBA-06A1A0 2002/95/EC
Abstract: - 1.0 x 0.5 x 0.243 25.4 x 12.7 x 6.16 3g - Note: All specifications are typical at 25 °C Bel Fuse
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c3266 SR-332
Abstract: ) Weight 1.0 x 0.5 x 0.243 25.4 x 12.7 x 6.16 3g 280 kHz 92% 90% 88% 85% 83% 71% 300 kHz 135 °C 3,266,517 Bel Fuse
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Abstract: - 1 x 0.5 x 0.243 25.4 x12.7 x 6.16 3g - Note: All specifications are typical at 25 Bel Fuse
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V7BA-06A2AL V7BA-06A2A0 V7BA-06A2A
Abstract: x 12.7 x 6.16 3g - Note: All specifications are typical at 25 °C unless otherwise stated Bel Fuse
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Abstract: x12.7 x 6.16 3g 87% 85% 82% 80% 68% 250 kHz 0.7525 V 90% 88% 85% 83% 71% 300 kHz 135 °C 3,266,517 Bel Fuse
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VRBA-06A2A VRBA-06A2AL VRBA-06A2A0
Abstract: - 1 x 0.5 x 0.243 25.4 x12.7 x 6.16 3g - Note: All specifications are typical at 25 °C Bel Fuse
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Abstract: 1 x 0.5 x 0.243 25.4 x12.7 x 6.16 3g - Note: All specifications are typical at 25 °C unless Bel Fuse
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Abstract: Infineon X-GOLD 616 is a cellular system on chip comprising of the 2G/3G digital and analogue baseband , Infineon's 3rd generation 3G baseband solution and is taking the next step in bringing enhanced modem , Shared-SDRAM, Dual-Ported-SDRAM The processing of the 2G/3G cellular protocol stack is handled by an , Infineon's SMARTiTMUE RF engine heralds lowest PCB footprint, below 700mm2 for triple band 3G and quad , 2xI2S ­­ SD/MMC card interface Product Brief X-GOLDTM 616 High Performance Modem Solution for Infineon Technologies
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X-GOLDTM616 MSC33 ARM1176 Infineon X-GOLD 616 XGOLD616 infineon x-gold tx 2G 3g modem ic B153-H9337-X-X-7600 NB08-1293
Abstract: +,-6'6+B-16#19;%&6'6#29;()* +B-?J #31;1#29; (12 I1#30; + =4#26;3B45#28;F$ $4#26;36#24;#20;42$3 +B-6'6C2(6+6!!!6C2(6+16 , #29;(6+16+B-6'6#30;6+ *NQG 6 #31; 1#30; 6 FR M#25;#24;">E2"#28;F$#22;"414#16;E#26;F#26; # class="hl">6+16+B-6'6#30;6+ *SQG 6 #29;17#30; 6 FR ; # ; +,-6'6//#30;#30;6+16+B-6'6#30;6+16#19;%&6'6#29;()* 3,-. 6 6 (1#30; #21;8 = ; $4#26;3C3#21;E#26;#26;326B34"4$36#24;#28;223F#26; +,-6'6#30; Eupec
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FZ400R33KL2C 32F326 32F4B6 626PD
Abstract: +,-6'6+B-16#19;%&6'6#29;()* +B-?J #31;1#29; (12 , #29;(6+16+B-6'6#30;6+ *NQG 6 @I1#30; 6 FR M#25;#24;">E2"#28;F$#22;"414#16;E#26;F#26; # class="hl">6+16+B-6'6#30;6+ *SQG 6 (1#31;#30; 6 FR ; # ; +,-6'6//#30;#30;6+16+B-6'6#30;6+16#19;%&6'6#29;()* 3,-. 6 6 (1#30; #21;7 = ; $4#26;3C3#21;E#26;#26;326B34"4$36#24;#28;223F#26; +,-6'6#30; Eupec
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RRUS-32 B66 FD800R33KL2C-K
Abstract: Product Brief 3G Basestation Processor 3GPP/UMTS Physical Channel Processing T h e 3 G b a , be enhanced with customized implementations. The 3G basestation processor enables design of flexible , 384 fingers, configurable as 6-16 finger RAKE receivers 9600 MOPS 16-bit embedded dataflow DSP array , resources Supports up to 12 uplink and downlink antenna ports Type Sales Code Package 3G , Tx Finger 3 CGU Tx Finger N Memory Mapped Peripheral 3G Basestation Processor 64 Infineon Technologies
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3G HSDPA circuits diagram array antenna infineon 3gpp infineon pmb Infineon Technologies Morphics B134-H8387-X-0-7600
Abstract: =10mA 150° IT03197 15GHz ID =20 mA , -10 30° Hz> 3GH > Hz z> GH 0mA , 10000.0000 .616 120.9 1.431 -35.9 .166 -16.1 .364 153.2 11000.0000 .648 , -4.4 .283 172.2 10000.0000 .616 116.0 1.573 -35.0 .182 -12.1 .312 SANYO Electric
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2SK1645
Abstract: interface into one single chip. IPs have been developed for the next generation 3G terminals: · · · · , Insurgentes Sur 2376 604 Tel. +52 5 616 4801 Fax +52 5 616 4872 44550 Guadalajara 2347 Av. Mariano Otero , generation 3G terminals: · · · · · · High efficiency switched mode power supplies for longer talk , Solutions for Wireless 3G Cellular Phone IC Architecture Antenna Power Amplifier RF Front-End , Signal ASICs: Off-the-Shelf Solutions for Wireless 3G Cellular Phone IC Architecture Antenna Power STMicroelectronics
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ips battery charging bd ips DATASHEET OF IC 7401 Battery Charging Controller STW4000 st micro gauge driver 286-CJ33 BRMOBILE02/01
Abstract: baseband interface into one single chip. IPs have been developed for the next generation 3G terminals , Insurgentes Sur 2376 604 Tel. +52 5 616 4801 Fax +52 5 616 4872 44550 Guadalajara 2347 Av. Mariano Otero , Solutions Analog and Mixed-Signal ASICs: Off-the-Shelf Solutions for Wireless 3G Cellular Phone IC , baseband interface into one single chip. IPs have been developed for the next generation 3G terminals , Insurgentes Sur 2376 604 Tel. +52 5 616 4801 Fax +52 5 616 4872 44550 Guadalajara 2347 Av. Mariano Otero STMicroelectronics
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D 4515 IC 4071 ic or 4071 datasheet sim card switch ic Utah speaker FLMOBPHONE/0302
Abstract: 2G/3G convergence. BGSF18D board SP3T + SP5T antenna switch module with integrated SPI controller, 2 GSM-Tx and 6 WCDMA-TRx ports fro 2G/3G convergence. BGSF28D board A medium power RF SPDT , eval board 40 BGA 616 is a broadband MMIC amplifier, its input and output are matched to 50Ω. , single-ended microphone interface. BGF200 board Evaluation board for BGA 616. BGA 616 is one of our , . BGA616 board ESD & EMI protection BGA 616 BGA 616 eval board BGA614 board ESD & EMI Infineon Technologies
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540ESD BFP540ESD 460L3 BFR460L3 434MH BFP460
Abstract: bipolar-CMOS RF processes available today already meet the performance needs of 3G applications yet are still , 01070 Mexico City Col. Chimalistac, San Angel Insurgentes Sur 2376 604 Tel. +52 5 616 4801 Fax +52 5 616 4872 44550 Guadalajara 2347 Av. Mariano Otero Piso 5, of. "B" - Col. Verde Valle Tel. +52 3 , performance for both 2G and 3G applications. In the ST roadmap for RF BiCMOS technology a 0.25 micron , amplifier control circuit. ST's 0.35 micron RF technology has the performance needed for 3G but the STMicroelectronics
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6861
Abstract: grounds, tails & weld tabs A NO. OF PLUGS â'"02 â'"04 â'"06 â'"08 A B C (15,64) .616 , heights â'¢ Other PCB thicknesses Contact Samtec. Note: Designed to meet SMPTE 424M 3G SDI Samtec
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RF-13 04SEP14
Abstract: for GPRS and 3G mobile systems now represent 53 percent of total sales · Consumer Products , quarter shows Ericsson's clear lead in mobile Internet including 3G, which is beginning to take off. I am , ) 102,323 63,616 17,290 9,130 11,257 1,030 As shown in the table above, operating margins , announced last year have now been converted into commercial contracts. In the 3G market, Ericsson has been chosen as supplier in all four 3G agreements secured so far ­ and as the main supplier in three of the -
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9906A 9903A 9912a Ericsson GSM system
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