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Part : BK0603TM241-T Supplier : TAIYO YUDEN Manufacturer : Avnet Stock : - Best Price : $0.0101 Price Each : $0.0393
Part : BK0603TM800-T Supplier : TAIYO YUDEN Manufacturer : Avnet Stock : - Best Price : $0.0101 Price Each : $0.0393
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Part : LV5603T-MPB-E Supplier : SANYO Electric Manufacturer : Rochester Electronics Stock : 956 Best Price : - Price Each : -
Part : BK0603TM121-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 13,380 Best Price : $0.0564 Price Each : $0.0564
Part : BK0603TM241-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 15,000 Best Price : $0.0806 Price Each : $0.0806
Part : BK0603TM601-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 15,000 Best Price : $0.0734 Price Each : $0.0734
Part : BK0603TM800-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 14,928 Best Price : $0.0806 Price Each : $0.0806
Part : BKP0603TM220-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 15,000 Best Price : $0.0551 Price Each : $0.0551
Part : BKP0603TM330-T Supplier : TAIYO YUDEN Manufacturer : Chip1Stop Stock : 14,955 Best Price : $0.0506 Price Each : $0.0506
Part : TSM-106-03-T-MT Supplier : Samtec Manufacturer : Farnell element14 Stock : - Best Price : £0.59 Price Each : £0.85
Part : TSM-116-03-T-MT Supplier : Samtec Manufacturer : Farnell element14 Stock : - Best Price : £1.52 Price Each : £2.28
Part : TSM-126-03-T-MT Supplier : Samtec Manufacturer : Farnell element14 Stock : - Best Price : £2.48 Price Each : £3.71
Part : BK0603TM241-T Supplier : TAIYO YUDEN Manufacturer : Master Electronics Stock : 75,000 Best Price : $0.0340 Price Each : $0.0560
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603TM

Catalog Datasheet MFG & Type PDF Document Tags

heat and mass transfer

Abstract: Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603TM and PowerPC 604TM , /Ceramic-Ball-Grid Array: The Motorola PowerPC 603TM and PowerPC 604TM RISC Microprocessors: Gary B. Kromann page 1 , Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603TM and PowerPC 604TM RISC , PowerPC 603TM and PowerPC 604TM RISC Microprocessors: Gary B. Kromann page 3 of 7 400 , : The Motorola PowerPC 603TM and PowerPC 604TM RISC Microprocessors: Gary B. Kromann page 4 of 7
Motorola
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heat and mass transfer 601TM 620TM 133MH

Coffin-Manson Equation

Abstract: PP266 Motorola's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array , 's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect , Motorola's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect , 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology , range of 5 to 10°C. Thus, the allowable die-junction Motorola's PowerPC 603TM and PowerPC 604TM RISC
Motorola
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Coffin-Manson Equation PP266 CHN 841 CBGA CBGA 255 motorola metal package case 603 MOTOROLA PC603 PC604

Coffin-Manson Equation

Abstract: 44th Freescale Semiconductor, Inc. Motorola's PowerPC 603TM and PowerPC 604TM RISC Microprocessor , Motorola's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect , 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology , 's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect , . Motorola's PowerPC 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect
Freescale Semiconductor
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44th land pattern BGA c4 freescale

ibm rev 1.5 MANUAL

Abstract: manual ibm rev 1.5 M PR 603HSU-03 (IBM Order N u m b e r) M P C 6 0 3 E C /D (M o to ro la O rd er N u m b e r ) 5/95 REV 2 PowerPC Advance Information P o w e r P C 603TM R I S C M i c r o p r o c e s s o r Hardware Specifications The PowerPC 603 microprocessor is an implementation of the PowerPCTM family of reduced instruction set computer (RISC) microprocessors. This document contains pertinent physical characteristics of the 603. For functional characteristics of the processor, refer to the PowerPC 603 RISC
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ibm rev 1.5 MANUAL manual ibm rev 1.5 ibm rev 1.3 MANUAL PPC603 instruction set IBM REV 2.7 ibm rev 1.5 MPC603 PPC603
Abstract: : The term `603' is used as an abbreviation for `PowerPC 603TM' . Figure 6. Motorola Part Number Key -
OCR Scan

Die Attach epoxy stamping

Abstract: U.S.A Eurotherm Controls : The Motorola PowerPC 603TM and PowerPC 604TM RISC Microprocessors 1 1 2 John Parry , Harvey , Microprocessor PowerPC 603TM Microprocessor PowerPC 602TM Microprocessor Figure 1. The PowerPC , 603TM and PowerPC 604TM RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology , 4) Thermal Management of a C4/Ceramic-Ball-Grid Array: The Motorola PowerPC 603TM and PowerPC 604TM , Temperature Rise on CeramicBall-Grid Array to Board Interconnection Reliability: Motorola PowerPC 603TM and
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Die Attach epoxy stamping U.S.A Eurotherm Controls flotherm MODEL Eurotherm 461 R14103 340814B00068

silicon carbide

Abstract: LX1992 UPSC203, 403, 603TM feature a maximum current rating of 4 amps-600 volts with a forward voltage drop of
Microsemi
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LX1992 silicon carbide UPR802 UPR804 UPR806 UPSC200 LX1992TM UPR802TM UPR804TM UPR806TM

laptop mother board voltage details

Abstract: cpu fan pin data circuit in mother board Motorola's PowerPC 603TM and PowerPC 604TM microprocessor-based desktop system. The goal was to assess a , 601TM, PowerPC 602TM, PowerPC 603TM, PowerPC 603eTM, PowerPC 604TM, PowerPC 604eTM, and the PowerPC
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laptop mother board voltage details cpu fan pin data circuit in mother board laptop MOTHERBOARD Chip Level MANUAL free circuit diagram of laptop motherboard do eurotherm drives 601 manual ic laptop motherboard

Coffin-Manson Equation

Abstract: Modified Coffin-Manson Equation Calculations The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603TM and PowerPC 604TM Microprocessors and MPC105 Bridge/Memory Controller R. David Gerke Gary B. Kromann m Advanced Packaging Technology 6501 William Cannon Dr., OE55 Semiconductor Products Sector, Austin, Texas 78735 ABSTRACT To predict solder joint reliability of , the PowerPC 603TM and PowerPC 604TM RISC microprocessors. For the MPC105 PCI Bridge/Memory
Motorola
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Modified Coffin-Manson Equation Calculations IPC-SM-785 mpc 1414 tce 1994 thermal analysis on pcb IPC-SM785 SM-785

DATA59

Abstract: SONY PRELIMINARY SCM603256A4 PowerPC 603 256KB Secondary Cache Functional Block Diagram - SCM603256A4 Cache Module for PowerPC 603TM CPU Description The SCM603256A4 module belongs to a set of sec ondary caches intended for use with PowerPC 603 based systems. T he S C M 603256A 4 uses S o ny's 1M 32K x32 C XK77V 3211Q F low -Through S ynchronous Burst RAMs in plastic surface mount packages mounted on a m u ltila y e r epoxy la m in a te (F R -4 ) board. The SCM603256A4 uses two 8Kx8 wide 5V
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DATA59 ELF160HGC-3Z50 ISB31 SCM603256A5

Modified Coffin-Manson Equation Calculations

Abstract: Coffin-Manson Equation Freescale Semiconductor, Inc. The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603TM and PowerPC 604TM Microprocessors and MPC105 Bridge/Memory Controller R. David Gerke Freescale Semiconductor, Inc. Gary B. Kromann m Advanced Packaging Technology 6501 William Cannon Dr., OE55 Semiconductor Products , calculated for the 21mm ceramic ball-grid-array (CBGA), the package for the PowerPC 603TM and PowerPC
Freescale Semiconductor
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The PowerPC Microprocessor Family dram memory module 1993 laptop pcb circuits

Phoenix PPC

Abstract: powerpc 603 : PowerPC 603/603e Processor Family Variances Table 1 describes the differences between the PowerPC 603TM
Motorola
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Phoenix PPC powerpc 603

sh 604

Abstract: ABE 604 of the issues confronting the systems designer when the 603e or PowerPC 603TM processors are used to
Motorola
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MPC604 sh 604 ABE 604 RISC semaphore AN1294/D MPC603EUM/AD MPC603EUMAD/AD PID6-603

TEA 1732

Abstract: A09 N03 in the 603e-CSEO and CSE1. The XATS signal in the PowerPC 603TM microprocessor is replaced by the
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TEA 1732 A09 N03 888888P 1234567I

RISC semaphore

Abstract: MPC603 Freescale Semiconductor, Inc. Freescale Semiconductor AN1294/D (Freescale Order Number) 9/96 Application Note Multiprocessor Systems and the PowerPC 603e TM Microprocessor This application note describes some of the issues confronting the systems designer when the 603e or PowerPC 603TM processors are used to implement a multiprocessor system. Although the 603e (and the 603, unless otherwise noted) does not provide hardware support for multiprocessor system functions provided by the PowerPC
Freescale Semiconductor
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603E
Abstract: and CSE1. The XATS signal in the PowerPC 603TM microprocessor is replaced by the CSE1 signal in 603e -
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ABE 604

Abstract: MPC603 of the issues confronting the systems designer when the 603e or PowerPC 603TM processors are used to
Motorola
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SCANBE

Abstract: SCANBE ejector MVME2300 TM VME Processor Modules o PowerPC 603TM or PowerPC 604TM 32-bit microprocessor o L1 cache­16KB/16KB PowerPC 603 or 32KB/32KB PowerPC 604 o 16MB to 128MB of on-board ECC DRAM o Up to 1MB socketed Flash for on-board firmware or user-specified requirements o 4MB on-board Flash memory for userspecified requirements o On-board debug monitor with self-test diagnostics o Two 32/64-bit PMC expansion slots with front-panel and P2 I/O o 64-bit PCI expansion mezzanine connector o 8K x
Motorola
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SCANBE SCANBE ejector scanbe handle SCANBE connector mk48t59 MVME2304-0133 10/100M M2300-D6

sh 604

Abstract: ABE 604 Freescale Semiconductor, Inc. AN1294/D (Motorola Order Number) 9/96 Application Note Multiprocessor Systems and the PowerPC 603e TM Microprocessor This application note describes some of the issues confronting the systems designer when the 603e or PowerPC 603TM processors are used to implement a multiprocessor system. Although the 603e (and the 603, unless otherwise noted) does not provide hardware support for multiprocessor system functions provided by the PowerPC 604TM processor, many of the
Motorola
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PowerPC-603e

AN1272

Abstract: "PowerPC 601 TM microprocessor," the term "603" is used as an abbreviation for the phrase "PowerPC 603TM
Motorola
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AN1272 1AT53524 AN1272/D

3TB40

Abstract: 3TB60 The Effect of Solder-Joint Temperature Rise on Ceramic-Ball-Grid Array to Board Interconnection Reliability: The Motorola PowerPC 603TM and PowerPC 604TM Microprocessors and MPC105 Bridge/Memory Controller R. David Gerke Gary B. Kromann m Advanced Packaging Technology 6501 William Cannon Dr., OE55 Semiconductor Products Sector, Austin, Texas 78735 ABSTRACT To predict solder joint reliability of , the PowerPC 603TM and PowerPC 604TM RISC microprocessors. For the MPC105 PCI Bridge/Memory
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3TB40 3TB60 3TB25 3TD40 I44I-

IRHN3150

Abstract: IRHN4150 Freescale Semiconductor, Inc. Freescale Semiconductor AN1294/D (Freescale Order Number) 9/96 Application Note Multiprocessor Systems and the PowerPC 603e TM Microprocessor This application note describes some of the issues confronting the systems designer when the 603e or PowerPC 603TM processors are used to implement a multiprocessor system. Although the 603e (and the 603, unless otherwise noted) does not provide hardware support for multiprocessor system functions provided by the PowerPC
International Rectifier
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IRHN7150 JANSR2N7268U IRHN3150 IRHN4150 IRHN8150 90720C MIL-PRF-19500/603
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