NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Si Zener-diode ChipTKN06ZD 1. Scope The specification applies to planar Zener diode. Extra lower leakage current Special thickness for special assembly process. 2. Structure Planar type Zener diode. Electrode N (cathode) Aluminum. (Gold for option) Electrode P (anode) sideGold. 3. Size Chip size 6mil Ã- 6mil ( 0.152mm Ã- 0.152mm ) Thickness 4mil / 6mil ( 0.110mm / 0.152mm ) Pad Size 4.8mil Ã- 4.8mil ( 0.122mm Ã- 0.122mm ) Pattern drawingper fig. 1 4. Electrical Characteristics Parameter ... | Original |
1 pages, |
ZENER Vr 3V zener diode 383 H 48 zener diode datasheet abstract |
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| Abstract: Si Zener-diode ChipTKS06ZD 1. Scope The specification applies to planar Zener diode. Extra lower leakage current Special thickness for special assembly process. 2. Structure Planar type Zener diode. Electrode P (anode) Aluminum. (Gold for option) Electrode N (cathode) sideGold. 3. Size Chip size 6mil Ã- 6mil ( 0.152mm Ã- 0.152mm ) Thickness 4mil / 6mil ( 0.110mm / 0.152mm ) Pad Size 4.8mil Ã- 4.8mil ( 0.122mm Ã- 0.122mm ) Pattern drawingper fig. 1 4. Electrical Characteristics Parameter ... | Original |
1 pages, |
zenerdiode 5v datasheet abstract |
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| Abstract: C16 1.8pF W =48mil L=150mil M W S11PH S11PH 41-C S W =48mil W 1=10mil L=5mil W 2=48mil C3 L=20mil 2.7pF T2 W =20mil L=825mil W =48mil L=50mil RF O UT W =48mil L=163mil C6 2.2pF ... | Original |
4 pages, |
MWS11-PH43-CS MWS11-PH41-CS CMDA2000 2000 W POWER AMPLIFIER ph43 PH41 datasheet abstract |
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| Abstract: OWER F ACTOR C ONTROL OF THE WITH D7 HT32 Core: L1 Ind: Gap: PQ2625 PQ2625 450uH 48mil R12 , Efficiency Power Factor Total Harmonic Distortion D7 HT32 Core: PQ2625 PQ2625 L1 Ind: 450uH Gap: 48mil #22 , 120V Pin numbers are for 8-pn dip package. D7 HT32 Core: PQ2625 PQ2625 L1 Ind: 450uH Gap: 48mil R3 , : 1.2mH Gap: 48mil D1 1N4004 1N4004 R3 D2 1N4004 1N4004 R1 2.2M AC+ 220V 4T D5 4 5 7T 8 , for 8-pn dip package. D7 HT32 Core: PQ2620 PQ2620 L1 Ind: 1.2mH Gap: 48mil D1 1N4007 1N4007 R3 D2 ... | Original |
19 pages, |
DIODE 1N4007 500ma SG3561AM pq2625 ballast 80W H7C1 TDK PCU zero crossing detector ic with 230v 12v schematic of fluorescent lamps 0.47uf 600v HT32 diac ht32 Electronic ballast 80W tdk h7c1 SG3561A SG3561A abstract |
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| Abstract: Ind: 450|jH Gap: 48mil #22 - A WG 62T V„ 1» < OUT MULT •O m COMP IN o 8 INV rs GND , : PQ2625 PQ2625 Ind: 450pH Gap: 48mil #22 - AWG 62T A set of formulas have been derived specifically for this , [Gap: 48mil #22 - A WG 62T v* w < OUT MULT , Gap: 48mil #24 - AWG 80T v„ l„ < OUT MULT IN •O m r? O in COMP INV GND C.S. FIGURE 16 - ... | OCR Scan |
19 pages, |
zener diode 1n400 LN4007 diode ballast 80W electronic ballast schematic TDK PCU schematic diagram 120v ballast 220v ac to 3.7v dc converter 68yF SG3561A Electronic ballast 80W ht32 BALLAST 277V pq2625 SG356XA SG3561A SG356XA abstract |
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| Abstract: plated-through hole of 48-mil diameter is used for the signal pin. To achieve the 75 impedance for the metal ... | Original |
7 pages, |
sma connector footprint LMH0307 LMH0302 BNC connector "reference plane" bnc board mount connector BNC edge connector layout bnc footprint LMH0384 LMH0384 abstract |
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| Abstract: R -*+ Intel® 810E Chipset Platform For Use with Universal Socket 370 Design Guide September 2001 Document Number: 298353-001 R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express o ... | Original |
140 pages, |
am2 motherboard block schematic diagram 82810e motherboard electronic circuit layout intel 810e pcb MOTHERBOARD schematic LM393 SMD intel MOTHERBOARD pcb design in pentiumiii motherboard ics Motherboard PGA 370 intel 810 MOTHERBOARD pcb CIRCUIT 370 socket pinout creative sbs circuit diagram datasheet abstract |
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| Abstract: R Intel® 815 Chipset Family: 82815P 82815P Chipset Platform Design Guide March 2001 Document Reference Number: 298251-001 Intel 815P Chipset Platform R Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel discl ... | Original |
138 pages, |
manual chipset intel 815 MOSFET 815P Motherboard IBM t21 PGA370 pentiumiii motherboard ics pcb thermal Design guide pcb trace pc MOTHERBOARD intel circuit diagram MOTHERBOARD BIOS 32 Pin PLCC dmm 939 foxconn 241 intel 815ep motherboard diagram intel 815ep 82815P 82815P abstract |
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| Abstract: R Intel® 815G Chipset Platform For Use with Universal Socket 370 Design Guide September 6, 2001 Document Number: 298253-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express o ... | Original |
152 pages, |
82815G 82801BA 82801AA 815G manual chipset intel 815 MBT3904 xstr USB/SCHEMATIC VGA board TRK 5213 schematic diagram UPS PGA370 pc MOTHERBOARD intel circuit diagram 2n3904, itt Transistor Q2N3904 silicon socket am2 pinout datasheet abstract |
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| Abstract: R Intel® 815EG 815EG Chipset Platform For Use with Universal Socket 370 Design Guide September 6, 2001 Document Number: 298301-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express ... | Original |
186 pages, |
82801BA 82562ET 82562EH intel DOC lc 9202 3203 MOSFET schematic usb to lan cable adapter RJ11 socket connector pinout to usb resistor 240 PGA370 PC MOTHERBOARD CIRCUIT diagram pga 370 mosfet woofer amplifier chipset DVD 815EG 815EG abstract |
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| Abstract: HICROSEMI CORP/POldER ' S?ED â- bllS^SG DDGDSa? G â- PTC 7"'33'- TSB15065 TSB15065 Power Transistor Chip, NPN 50 A, 650 V, tf= 50 ns i â- Planar Epitaxial â- Contact Metallization: Base and Emitter-Aluminum CoIIector(Au or Ti/NI/Ag) â- Chip Thickness: 22 mils â- Applications: • Switching regulatiors • Deflection circuits • Motor controls • PWM inverters i Electrical Characteristics At 25°C The chip is 100% probed to the conditions and limits specified. CHARACTERISTIC TEST CONDITIONS LIMITS ... | OCR Scan |
1 pages, |
TSB15065 5609 transistor 5609 TSB15065 abstract |
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| Abstract: CCMBD914 CCMBD914 PRODUCT SPECIFICATIONS TYPE : High Speed Switching Diodes CCMBD914 CCMBD914 CHIP APPEARANCE 11.6 mils ( 0.29 mm) CHIP SIZE ANODE SIZE 4.8 mil DIA ( 0.12 mm) CHIP THICKNESS 6-7 mil ( 0.15 - 0.18 mm) ALUMINIUM TOP METAL GOLD BACK METAL WAFER SIZE 4" DIA ( 100 mm) SURFACE PASSIVATION ABSOLUTE MAXIMUM RATINGS (Ta = 25oC) REVERSE BREAKDOWN VOLTAGE CONTINUOUS REVERSE VOLTAGE IF O POWER DISSIPATION (Ta=25 C) WIRE BONDING TYPE VBR 100 V VR 75 ... | Original |
2 pages, |
RECTRON CCMBD914 CCMBD914 abstract |
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| Abstract: â-¡IXYS Three Phase AC Controller Modules VW095 VW095 I RMS V RRM = 95 A = 800 -1600 V Preliminary data v * RSM v * RRM Type v v DSM DRM V V 800 800 VWO 95-08io7 1200 1200 VWO 95-12io7 1400 1400 VWO 95-14io7 1600 1600 VWO 95-16io7 14 1 16 2 17 3 7 10 8 11 9 13 Symbol Test Conditions Maximum Ratings 'rms 'trms 'tavm Tc = 85'C, 50 - 400 Hz (per phase) T., - Tyjy Tc = 85'C; (180" sine) 96 69 44 A A A 'tsm TVJ = 45-C; VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 11 ... | OCR Scan |
2 pages, |
VW095 VW095 abstract |
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| Abstract: +5V Prescreen Voltage Reference/ Temperature Transducer REF02 REF02 1.0 SCOPE This specification documents the detailed requirements for Analog Devices space qualified die including die qualification as described for Class K in MIL-PRF-38534 MIL-PRF-38534, Appendix C, Table C-II except as modified herein. The manufacturing flow described in the STANDARD DIE PRODUCTS PROGRAM brochure at http://www.analog.com/aerospace is to be considered a part of this specification. This data sheet specifically details ... | Original |
5 pages, |
REF02R000C REF02 REF02-000C MIL-PRF-38534 REF02 abstract |
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| Abstract: Quad Low-Power Voltage Comparator PM139 PM139 1.0 SCOPE This specification documents the detailed requirements for Analog Devices space qualified die including die qualification as described for Class K in MIL-PRF-38534 MIL-PRF-38534, Appendix C, Table C-II except as modified herein. The manufacturing flow described in the STANDARD DIE PRODUCTS PROGRAM brochure at is to be considered a part of this specification. This data sheet s ... | Original |
5 pages, |
PM139R000C PM139 MIL-PRF-38534 PM139-000C PM139 abstract |
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| mm (157.48mil) Round 4 NPTH 270.00 mm (10.63 Inch www.datasheetarchive.com/download/23830486-393100ZC/ard00280_gerbers.zip (104-00280-R3.DRR) |
Microchip | 11/10/2012 | 643.47 Kb | ZIP | ard00280_gerbers.zip |
| mm (157.48mil) Round 4 NPTH 270.00 mm (10.63 Inch www.datasheetarchive.com/download/23830486-393100ZC/ard00280_gerbers.zip (104-00280-R3.DRR) |
Microchip | 11/10/2012 | 643.47 Kb | ZIP | ard00280_gerbers.zip |
| 2 22.50 mm (0.89 Inch) T13 4mm (157.48mil) Round 4 www.datasheetarchive.com/download/96789795-393095ZC/105-00342-r2%20gerber.zip (104-00342-R2.1.DRR) |
Microchip | 14/01/2012 | 431.89 Kb | ZIP | 105-00342-r2%20gerber.zip |