NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| SCDA08GCT | Freescale Semiconductor | MC68HC908GX 48-PIN QFP Z | 
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| LFMPA08GCT | Freescale Semiconductor | PB-FREE 908G 48-PIN PROG |
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| S9S08AW16AE1CFT | Freescale Semiconductor | 16K FLASH,1K RAM 48 PINS |
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| S9S08AW16AE1MFT | Freescale Semiconductor | 16K FLASH,1K RAM 48 PINS |
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| S9S08AW16AE1VFT | Freescale Semiconductor | 16K FLASH,1K RAM 48 PINS |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Pin assignment 48Pin 52Pin 48Pin 52Pin ... | Original |
3 pages, |
datasheet abstract |
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| Abstract: PRINTED CIRCUITBOARD LEADLESS PACKAGE 48 PIN PLASTIC PCL-48P-M01 PCL-48P-M01 Lead pitch 0.65mm Lead shape Leadless type Sealing method 48-pin plastic PCLP Resin seal (PCL-48P-M01 PCL-48P-M01) 48-pin plastic PCLP (PCL-48P-M01 PCL-48P-M01) PRELIMINARY 9.00(.354)TYP. 11.00±0.20 SQ (.433±.008) 1.00(.039)TYP. 7.15(.281)TYP. 1.40(.055)MAX. 1.93±0.17 (.076±.0067) 0.65±0.08 (.026±.003) 48PIN 1PIN Details of "A" part 0.40±0.10 (.0157±.0039) "A" R0.20(.0079)TYP. C0.51(.020) 0.40±0.10 ... | Original |
1 pages, |
PCL 27 48-PIN PCL-48P-M01 PCL-48P-M01 abstract |
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| Abstract: data rate (LVDS disabled); 120uW standby power at 3.3V 30°C to +70°C ambient 48-pin CLCC Active , Rev. A 10/08 EN 1 CLCC (monochrome) 48-pin 48-pin 48-pin MT9V034C12STCD MT9V034C12STCD ES , Machine vision Automation 48-pin MT9V034C12STC MT9V034C12STC MT9V034C12STMD MT9V034C12STMD ES MT9V034C12STMH MT9V034C12STMH ES Applications · · · · · · · Key Performance Parameters 48-pin 48-pin CLCC (color) Monochrome ... | Original |
1 pages, |
qcif MT9V034C12STCD MT9V034C12STMD 48 pin clcc aptina CMOS image sensor aptina sensor cmos IMAGE SENSOR global shutter nir source global shutter image sensor 550NM photodiode CMOS global shutter monochrome cmos digital image CMOS image sensor with global shutter MT9V034 MT9V034 MT9V034 abstract |
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| Abstract: Two-chip V.92 modem solution: - APL43 APL43 in a 48-pin TQFP - CSP1034C CSP1034C or CSP1035 CSP1035 in a 48-pin TQFP s , comes in a small 48-pin TQFP package and requires no additional memory to implement modem solutions. , PARTIAL ISA 48-PIN TQFP CSP1035 CSP1035 (LINE-POWERED) LINE CODEC UNIVERSAL DAA REMAINING COMPONENTS FOR U-DAA TELEPHONE LINE 48-PIN TQFP PCI BUS PC HOST PROCESSOR MICROPHONE AUDIO CODEC CSP1027 CSP1027 AUDIO CIRCUITRY 48-PIN TQFP SPEAKER OPTIONAL FOR TELEPHONY FEATURES 5-9559 (F ... | Original |
4 pages, |
CSP1034 CSP1035 48-PIN CSP1034C APL43 CSP1027 APL43JT48SCLV "voice codec" modem CSP1034C-T11 S28000 APL43 abstract |
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| Abstract: PRINTED CIRCUITBOARD LEADLESS PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index PCL-48P-M01 PCL-48P-M01 48-pin plastic PCLP Lead pitch 0.65 mm Lead shape Leadless type Sealing method Resin seal (PCL-48P-M01 PCL-48P-M01) 48-pin plastic PCLP (PCL-48P-M01 PCL-48P-M01) PRELIMINARY 9.00(.354)TYP. 11.00±0.20 SQ (.433±.008) 1.00(.039)TYP. 7.15(.281)TYP. 1.40(.055)MAX. 1.93±0.17 (.076±.0067) 0.65±0.08 (.026±.003) 48PIN 1PIN Details of "A" ... | Original |
1 pages, |
48-pin datasheet abstract |
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| Abstract: 2. pin to pin for 28-pin DIP socket AE403 AE403 LP48-TSOP-48PIN 1. 48-pin TSOP socket 2. pin to pin for 48-pin DIP socket Leaper-48 ... | Original |
1 pages, |
48-PIN LP-PLCC-20-PAL20 Leaper-48 LP-SOP-32PIN socket, plcc, 44pin LP48-TSOP-48PIN AA001 AB009 AB011 LP-SOP-44PIN AE403 AE002 AA001 abstract |
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| Abstract: 3M Interconnect Solutions : 3MTM Long Wire Test Clip, Alloy, 48-Pin (923690-48) : 923690-48 Select a Location 3M Worldwide : Electronics Manufacturing English Search This Product Catalog Product Catalog for Interconnects Assembly Compatible Test Clips 3MTM Breadboards & Test Clips Test Clips DIP Long Wire Cable By Keyword Printer-friendly format 3MTM Long Wire Test Clip, 48-Pin, .5/.6 Wide, Alloy-DIP Long Wire Test Clip Alloy, 48-Pin (923690-48) 3M Interconnect Solutions ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: 3M Interconnect Solutions : 3MTM Long Wire Test Clip, Gold, 48-Pin (923739-48) : 923739-48 Select a Location 3M Worldwide : Electronics Manufacturing English Search This Product Catalog Product Catalog for Interconnects Assembly Compatible Test Clips 3MTM Breadboards & Test Clips Test Clips DIP Long Wire Cable By Keyword Printer-friendly format 3MTM Long Wire Test 48-Pin, .5/.6 Wide, Gold, Long Wire Test Clip Clip, Gold, 48-Pin (923739-48) 3M Interconnect Solutions Home ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: Unit : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 500�0 +0.3 Thickness : 0.7-2.0 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP 14 28-Pin Plastic DIP 12 42-Pin Plastic DIP 8 42-Pin Plastic Shrinked DIP 12 48-Pin Plastic Shrink DIP 10 42-Pin Ceramic Shrinked DIP (brazed lead) 10 48-Pin Ceramic Shrinked DIP (brazed lead) 10 ... | Original |
1 pages, |
MD600-1A datasheet abstract |
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| Abstract: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 501�0 +0.3 Thickness : 0.7-0.2 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP MAX. 14 28-Pin Plastic DIP MAX. 12 42-Pin Plastic DIP MAX. 8 42-Pin Plastic Shrink DIP MAX. 12 48-Pin Plastic Shrink DIP MAX. 10 42-Pin Ceramic Shrink DIP (brazed lead) MAX. 10 48-Pin Ceramic Shrink DIP (brazed lead ... | Original |
1 pages, |
dip 28 datasheet abstract |
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| Abstract: 1 DATE: 08/29/08 DESCRIPTION: 48-Pin, 173mil wide TVSOP (TSSOP) PACKAGE CODE: K48 DOCUMENT CONTROL #: PD-1324 PD-1324 08-0442 REVISION: D ... | Original |
1 pages, |
PD-1324 173-MIL PD-1324 abstract |
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| Abstract: APRIL 2010 AS6C1616 AS6C1616 1024K 1024K X 16 BIT LOW POWER CMOS SRAM PACKAGE OUTLINE DIMENSION 48-pin 12mm x 20mm TSOP-I Package Outline Dimension APRIL/2010 APRIL/2010 V1.b ALLIANCE MEMORY ... | Original |
1 pages, |
AS6C1616 1024K AS6C1616 abstract |
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| Abstract: 1 DATE: 10/15/08 DESCRIPTION: 48-Pin, 154-Mil Wide BQSOP PACKAGE CODE: B48 DOCUMENT CONTROL #: PD-1210 PD-1210 08-0522 REVISION: F ... | Original |
1 pages, |
PD-1210 PD-1210 abstract |
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| Abstract: 1 DATE: 02/16/06 Notes: 1) All dimensions are in millimeters, Angles in Degrees 2) Ref JEDEC: MO-026D MO-026D, variation ABC 3) Dimensions do not include mold protrusion DESCRIPTION: 48-pin Thin Quad Flat Package (TQFP) PACKAGE CODE: FA48 DOCUMENT CONTROL #: PD-2056 PD-2056 06-0182 REVISION: - - ... | Original |
1 pages, |
PD-2056 MO-026D MO-026D abstract |
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| Abstract: DUAL IN-LINE PACKAGE 48 PIN PLASTIC DIP-48P-M02 DIP-48P-M02 EIAJ code : DIP048-P-0600-1 DIP048-P-0600-1 Lead pitch 100mil Row spacing 600mil Sealing method 48-pin plastic DIP Plastic mold (DIP-48P-M02 DIP-48P-M02) 48-pin plastic DIP (DIP-48P-M02 DIP-48P-M02) +0.20 60.25 0.30 +.008 2.372 .012 INDEX-1 13.80±0.25 (.543±.010) INDEX-2 0.51(.020)MIN 4.96(.195)MAX 0.25±0.05 (.010±.002) 3.00(.118)MIN +0.50 0.865 0 +.020 .034 0 1.27(.050) MAX C 1994 FUJITSU LIMITED D48003S-3C-3 D48003S-3C-3 +0.50 1.27 ... | Original |
1 pages, |
DIP048-P-0600-1 d480 DIP-48P-M02 DIP-48P-M02 abstract |
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| Abstract: SHRINK DUAL IN-LINE PACKAGE 48 PIN PLASTIC DIP-48P-M01 DIP-48P-M01 EIAJ code : SDIP048-P-0600-1 SDIP048-P-0600-1 Lead pitch 70mil Row spacing 600mil Sealing method 48-pin plastic SH-DIP Plastic mold (DIP-48P-M01 DIP-48P-M01) 48-pin plastic SH-DIP (DIP-48P-M01 DIP-48P-M01) +0.20 43.69 0.30 +.008 1.720 .012 INDEX-1 13.80±0.25 (.543±.010) INDEX-2 0.51(.020)MIN 5.25(.207) MAX 0.25±0.05 (.010±.002) 3.00(.118) MIN +0.50 1.00 0 +.020 .039 0 1.778±0.18 (.070±.007) 1.778(.070) MAX C 1994 FUJITSU ... | Original |
1 pages, |
d480 DIP-48P-M01 SDIP048-P-0600-1 DIP-48P-M01 abstract |
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| Abstract: DUAL IN-LINE PACKAGE 48 PIN CERAMIC DIP-48C-A01 DIP-48C-A01 EIAJ code : DIP048-C-0600-1 DIP048-C-0600-1 Lead pitch 100mil Row spacing 600mil Sealing method 48-pin ceramic DIP Metal seal (DIP-48C-A01 DIP-48C-A01) 48-pin ceramic DIP (DIP-48C-A01 DIP-48C-A01) 60.96±0.64 (2.400±.025) R1.27(.050) REF 15.11±0.25 (.595±.010) INDEX AREA 1.02±0.10 (.040±.004) 4.50(.177)MAX 0.25±0.05 (.010±.002) 3.40±0.36 (.134±.014) 1.52(.060) MAX +0.13 2.54±0.25 (.100±.010) 15.24±0.25 (.600±.010) 0°~9° 0.46 0.08 ... | Original |
1 pages, |
d480 Fujitsu DIP 48-pin D4800 DIP-48C-A01 DIP048-C-0600-1 DIP-48C-A01 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| Ceramic Pin Grid Array (CGA) "G-48pin" Ceramic Pin Grid Array (CGA) "G-48pin" Pin Code Pin-Pitch (in) Area (in 2 ) Length (in) Width (in www.datasheetarchive.com/files/idt/docs/rp00017/rp017bb.htm |
IDT | 06/10/2000 | 43.7 Kb | HTM | rp017bb.htm |
| National TBD Package Folder: 48-Pin SSOP Please enable Javascript in your browser. National TBD Package 48-Pin SSOP Contents Dimensions Dimensions Body Size Wide Nom.: 0.051 inches Long Nom.: 0.114 inches Thickness: 0.035 inches Lead Frame Material: Alloy 42 Lead Finish: Sn/Pb Pitch: 0.075 inches Feedback Use of "Cookies" Copyright © 1996 National Semiconductor Corporation National is ISO www.datasheetarchive.com/files/national/htm/nsc01804-v4.htm |
National | 16/09/1998 | 4.37 Kb | HTM | nsc01804-v4.htm |
| National MTD48 MTD48 MTD48 MTD48 Package Folder: 48-Pin TSSOP Please enable Javascript in your browser. National MTD48 MTD48 MTD48 MTD48 Package 48-Pin TSSOP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MO-153 MO-153 MO-153 MO-153 Dimensions Body Size Wide Nom.: 6.1 mm Long Nom.: 12.5 mm Thickness: 0.9 mm Lead Frame Material: Lead Finish www.datasheetarchive.com/files/national/htm/nsc01773-v4.htm |
National | 16/09/1998 | 4.86 Kb | HTM | nsc01773-v4.htm |
| Please enable Javascript in your browser. National MTD48 MTD48 MTD48 MTD48 Package Folder: 48-Pin TSSOP Design Purchasing Quality Company Jobs National MTD48 MTD48 MTD48 MTD48 Package 48-Pin TSSOP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MO-153 MO-153 MO-153 MO-153 Dimensions Body Size Wide Nom.: 6 www.datasheetarchive.com/files/national/htm/nsc01697-v3.htm |
National | 13/08/1999 | 6.67 Kb | HTM | nsc01697-v3.htm |
| Please enable Javascript in your browser. National TBD Package Folder: 48-Pin SSOP National TBD Package 48-Pin SSOP Contents Dimensions Dimensions Body Size Wide Nom.: 0.051 inches Long Nom.: 0.114 inches Thickness: 0.035 inches Lead Frame Material: Alloy 42 Lead Finish: Sn/Pb Pitch: 0.075 inches Feedback Use of "Cookies" Copyright © National Semiconductor Corporation National is ISO 9000 www.datasheetarchive.com/files/national/htm/nsc04925.htm |
National | 18/12/1998 | 4.38 Kb | HTM | nsc04925.htm |
| Please enable Javascript in your browser. National N48A Package Folder: 48-Pin MDIP Design Purchasing Quality Company Jobs National N48A Package 48-Pin MDIP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MS-011 MS-011 MS-011 MS-011 Dimensions Body Size Wide Nom.: 0 www.datasheetarchive.com/files/national/htm/nsc01711-v6.htm |
National | 13/08/1999 | 6.69 Kb | HTM | nsc01711-v6.htm |
| Please enable Javascript in your browser. National N48A Package Folder: 48-Pin MDIP National N48A Package 48-Pin MDIP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MS-011 MS-011 MS-011 MS-011 Dimensions Body Size Wide Nom.: 0.55 inches Long Nom.: 2.43 inches Thickness: 0.16 inches Lead Frame Material: COPPER www.datasheetarchive.com/files/national/htm/nsc04909.htm |
National | 18/12/1998 | 4.9 Kb | HTM | nsc04909.htm |
| Please enable Javascript in your browser. National MTD48 MTD48 MTD48 MTD48 Package Folder: 48-Pin TSSOP National MTD48 MTD48 MTD48 MTD48 Package 48-Pin TSSOP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MO-153 MO-153 MO-153 MO-153 Dimensions Body Size Wide Nom.: 6.1 mm Long Nom.: 12.5 mm Thickness: 0.9 mm Lead Frame Material: Lead Finish www.datasheetarchive.com/files/national/htm/nsc04895.htm |
National | 18/12/1998 | 4.88 Kb | HTM | nsc04895.htm |
| Please enable Javascript in your browser. National TBD Package Folder: 48-Pin SSOP Design Purchasing Quality Company Jobs National TBD Package 48-Pin SSOP Contents Dimensions Dimensions Body Size Wide Nom.: 0.051 inches Long Nom.: 0.114 inches Thickness: 0.035 inches Lead Frame Material: Alloy 42 Lead Finish: Sn/Pb Pitch: 0.075 inches www.datasheetarchive.com/files/national/htm/nsc01727-v6.htm |
National | 13/08/1999 | 6.13 Kb | HTM | nsc01727-v6.htm |
| National N48A Package Folder: 48-Pin MDIP Please enable Javascript in your browser. National N48A Package 48-Pin MDIP Note: Lead count on this 3D picture may be different. This picture depicts the package type. Contents Standards Dimensions Packaging Mechanical Drawing Standards JEDEC Spec: MS-011 MS-011 MS-011 MS-011 Dimensions Body Size Wide Nom.: 0.55 inches Long Nom.: 2.43 inches Thickness: 0.16 inches Lead Frame Material: COPPER www.datasheetarchive.com/files/national/htm/nsc01787-v4.htm |
National | 16/09/1998 | 4.88 Kb | HTM | nsc01787-v4.htm |