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Part Manufacturer Description Datasheet BUY
CP2725AC54TEZ GE Critical Power CP2725AC54TE CPL High Efficiency Rectifier, 100-120/200-277VAC input; Default Outputs: ±54VDC @ 2725W, 5VDC @ 4W visit GE Critical Power
CP2725AC54TEP GE Critical Power CP2725AC54TE CPL High Efficiency Rectifier, 100-120/200-277VAC input; Default Outputs: ±54VDC @ 2725W, 5VDC @ 4W visit GE Critical Power
EQW020A0F GE Critical Power EQW020 Series, Eighth-Brick Power Module, Input Voltage: 48V (36-75Vdc); Output Voltage: 3.3V; Output Current: 20A; Efficiency: 0.88; Connector Type: Through Hole visit GE Critical Power
EQW023A0G1-S GE Critical Power EQW023 Series, Eighth-Brick Power Module, Input Voltage: 48V (36-75Vdc); Output Voltage: 2.5V; Output Current: 23A; Efficiency: 0.87; Connector Type: Through Hole visit GE Critical Power
HW010A0F1-S GE Critical Power HW010 Series Power Modules; dc-dc Converter, Input Voltage: 36 – 75 Vdc; Output Voltage: 3.3V; Output Current: 10A; Connector Type: SMT visit GE Critical Power
HW004A0A1 GE Critical Power HW004 Series DC-DC Power Module, Input Voltage: 48 Vdc; Output Voltage: 5.0V; Output Current: 4A; Remote On/Off Logic: Negative; Connector Type: Through-Hole visit GE Critical Power

48-Pin TSOP Type 1, CPL

Catalog Datasheet MFG & Type PDF Document Tags

MT29F2G08AAD

Abstract: MT29F2G08ABD 48-Pin TSOP Type 1 CPL (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , Assignment 48-Pin TSOP Type 1 CPL (Top View) x16 NC NC NC NC NC NC R/B# RE# CE# NC NC Vcc Vss NC NC CLE ALE , : 2.7­3.6V · VCC: 1.65­1.95V · Package ­ 48-pin TSOP type I CPL4 (lead-free plating) ­ 63-ball VFBGA , 3.3V (2.7­3.6V) Blank = Standard Package Code Feature Set D = Feature set D WP = 48-pin TSOP CPL , 2 on page 2 and Figure 3 on page 3. 4. CPL = center parting line 5. Only available in 1.8V VFBGA
Micron Technology
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MT29F2G08AAD

Abstract: . . . . . . . . . . . . . 3 Pin Assignment 48-Pin TSOP Type 1 CPL (Top View) . . . . . . . . . . . , . Figure 4: Pin Assignment 48-Pin TSOP Type 1 CPL (Top View) x16 x8 NC NC NC NC NC NC R/B , Common â'¢ VCC: 2.7â'"3.6V â'¢ VCC: 1.65â'"1.95V â'¢ Package â'" 48-pin TSOP type I CPL3 (lead-free , ) Package Code WP = 48-pin TSOP CPL Feature Set D = Feature set D PDF: 09005aef82784784 / Source , . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 48-Pin TSOP Package . . . . . . . . . .
Micron Technology
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MT29F1G08ABADAWP

Abstract: MT29F1G08ABA +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 specification is , . 2 Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Operating Voltage Range A = 3.3V (2.7­3.6V) B = 1.8V (1.7­1.95V) Package Code WP = 48-pin TSOP 1 HC = , Proprietary 1Gb x8, x16: NAND Flash Memory Signal Assignments Signal Assignments Figure 2: 48-Pin TSOP
Micron Technology
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MT29F2G08ABAFAWP

Abstract: MT29F2G08ABAFA (IT): ­40ºC to +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 , (1.7­1.95V) H4 = 63-ball VFBGA (9 x 11 x 1.0mm) WP = 48-pin TSOP CPL Type 1 Interface Feature Set F = , . 2 Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Signal Assignments Signal Assignments Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View) x16 NC NC NC
Micron Technology
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MT29F8G16ADBDA

Abstract: MT29F4G08 ): â'"40°C to +105°C â'¢ Package â'" 48-pin TSOP type 1, CPL 2 â'" 63-ball VFBGA â'¢ Open NAND , ) . 11 Figure 5: 48-Pin TSOP â'" Type 1, CPL , Flash Memory Package Dimensions Package Dimensions Figure 5: 48-Pin TSOP â'" Type 1, CPL 20.00  , Code Operating Voltage Range WP = 48-pin TSOP Type 1 A = 3.3V (2.7â'"3.6V) HC = 63-ball VFBGA , . 2 Figure 2: 48-Pin TSOP â'" Type 1 (Top View
Micron Technology
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MT29F4G08ABADAWP

Abstract: MT29F4G08abada ): ­40ºC to +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Dimensions Figure 5: 48-Pin TSOP ­ Type 1, CPL 0.25 for reference only 0.50 TYP for reference only Mold , . 2 Figure 2: 48-Pin TSOP ­ Type 1 (Top View , Mark Die B D J 1 2 4 nCE 1 1 2 Package Code WP = 48-pin TSOP 1 HC = 63-ball VFBGA (10.5 x 13 x
Micron Technology
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mt29f4g08abadawp

Abstract: MT29F4G08ABADAH4 ): ­40ºC to +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , : 48-Pin TSOP ­ Type 1, CPL 0.25 for reference only 0.50 TYP for reference only Mold compound: Epoxy , . 2 Figure 2: 48-Pin TSOP ­ Type 1 (Top View , Package Code WP = 48-pin TSOP 1 HC = 63-ball VFBGA (10.5 x 13 x 1.0mm) H4 = 63-ball VFBGA (9 x 11 x 1.0mm
Micron Technology
Original

MT29F2G08ABAEA

Abstract: MT29F2G08ABAEAWP : 0°C to +70°C ­ Industrial (IT): ­40ºC to +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA , . 2 Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Assignments Signal Assignments Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View) x16 NC NC NC NC NC NC R/B , 5: 48-Pin TSOP ­ Type 1, CPL 0.25 for reference only 0.50 TYP for reference only Mold compound
Micron Technology
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MT29F2G08ABAEAWP

Abstract: MT29F2G16ABBEAHC ): â'"40°C to +105°C â'¢ Package â'" 48-pin TSOP type 1, CPL 2 â'" 63-ball VFBGA â'¢ Open NAND , . 2 Figure 2: 48-Pin TSOP â'" Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP â'" Type 1, CPL , Memory Signal Assignments Signal Assignments Figure 2: 48-Pin TSOP â'" Type 1, CPL (Top View) x16 , Voltage Range A = 3.3V (2.7â'"3.6V) Package Code B = 1.8V (1.7â'"1.95V) WP = 48-pin TSOP HC =
Micron Technology
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MT29F8G08aba

Abstract: MT29F8G08ab TSOP type 1, CPL 2 â'" 63-ball VFBGA â'¢ Open NAND Flash Interface (ONFI) 1.0-compliant1 â , 1 Package Code 1 D 1 H4 = 63-ball VFBGA (9 x 11 x 1.0mm) WP = 48-pin TSOP CPL Type 1 , . 2 Figure 2: 48-Pin TSOP â'" Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP â'" Type 1, CPL , Figure 2: 48-Pin TSOP â'" Type 1, CPL (Top View) x16 x8 NC NC NC NC NC NC R/B# RE# CE# NC
Micron Technology
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L9939

Abstract: h9940 Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull , PLASTIC PACKAGE TEST TYPE: HIGHLY ACCELERATED STRESS TEST (H A S T) Conditions: 1) 100 hours at 130 , Dec/99) PACKAGE FAMILY PACKAGE TYPE Total # Total # Device Observed Failure Rate , %/1000 hrs PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW,DG 1 45 4500 0 , TYPE: STEAM PRESSURE POT (AUTOCLAVE) Conditions: 1) 168 hours, Saturated Steam at 121°C, 2 ATM
Integrated Device Technology
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L9939

Abstract: B897 Surface Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire , 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY ACCELERATED STRESS TEST (H A S T) Conditions: 1) 100 hours , (Jan/97 to Dec/97) PACKAGE FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 10 SOIC , related gross functional failure. CY 98 (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE Total , 1999 CY 99 ­ YTD (Jan/99 to Sept/99) PACKAGE FAMILY PACKAGE TYPE Total # P-DIP PD, PT
Integrated Device Technology
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L9939

Abstract: k9920 Surface Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire , 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY ACCELERATED STRESS TEST (H A S T) Conditions: 1) 100 hours , (Jan/97 to Dec/97) PACKAGE FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 10 SOIC , related gross functional failure. CY 98 (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE Total , 1999 CY 99 ­ YTD (Jan/99 to Sept/99) PACKAGE FAMILY PACKAGE TYPE Total # P-DIP PD, PT
Integrated Device Technology
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h9910

Abstract: K2837 ) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull Purpose: The purpose , -2 QUALITY & RELIABILITY MONITOR REPORT SUMMARY DATA July 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY , TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of Lots of Samples Device , PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of , FAMILY PACKAGE TYPE P-DIP PD, PT, PW 2 SOIC PS, PE SOJ Total # of Lots of
Integrated Device Technology
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h9910

Abstract: K2837 ) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull Purpose: The purpose , -2 QUALITY & RELIABILITY MONITOR REPORT SUMMARY DATA July 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY , TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of Lots of Samples Device , PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of , FAMILY PACKAGE TYPE P-DIP PD, PT, PW 2 SOIC PS, PE SOJ Total # of Lots of
Integrated Device Technology
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h9910

Abstract: h9940 Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull , -2 QUALITY & RELIABILITY MONITOR REPORT Summary Data for April 2000 PLASTIC PACKAGE TEST TYPE: HIGHLY , . Reference: JEDEC-STD-22, Method A110 CY 97 (Jan/97 to Dec/97) PACKAGE FAMILY PACKAGE TYPE Total , FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # , FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 3 SOIC PS, PE SOJ Total #
Integrated Device Technology
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7054Y h9910 h9940 L9939 L9938 PB44 K9930 41652H I49465 PM144 RP0PAA11D3- LM0PAA08D3- XI-16

pj 899 diode

Abstract: B897 ) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull Purpose: The purpose , -2 QUALITY & RELIABILITY MONITOR REPORT SUMMARY DATA April 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY , TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of Lots of Samples Device , PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # of , TYPE P-DIP PD, PT, PW 2 SOIC PS, PE SOJ Total # of Lots of Samples Device
Integrated Device Technology
Original
pj 899 diode B897 k1917 JESD22-B100 K9814 B953 42573K 41244K 62374L 61373L 61543N 41807P

h9910

Abstract: h9940 Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull , & RELIABILITY MONITOR REPORT Summary Data for January 2000 PLASTIC PACKAGE TEST TYPE: HIGHLY , . Reference: JEDEC-STD-22, Method A110 CY 97 (Jan/97 to Dec/97) PACKAGE FAMILY PACKAGE TYPE Total , FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 10 SOIC PS, PE SOJ Total # , FAMILY PACKAGE TYPE Total # P-DIP PD, PT, PW 3 SOIC PS, PE SOJ Total #
Integrated Device Technology
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z9939 hyundai 9734 ram l9923 l9934 Hyundai 9944 733W PK100 71V547Z H64418 71V432VF H64375B2D R0002-05S

MSM80C31F

Abstract: MSM80C51F /38 ¡ Semiconductor · Package options 40-pin plastic DIP (DIP40-P-600-2.54) : 44-pin plastic QFP (QFP44-P-910-0.80-2K) : 44-pin plastic QFJ (PLCC) (QFJ44-P-S650-1.27) : MSM80C31F/80C51F , , 0 CPU¨PORT PCL 0 , , PORT-2 1 ¡ Semiconductor MSM80C31F/80C51F PIN , P2.1 20 21 P2.0 VSS P2.2 40-Pin Plastic DIP 5/38 ¡ Semiconductor , P0.1 37 P0.0 38 VCC 39 NC 40 P1.0 41 P1.1 42 P1.2 43 P1.3 44 P1.4 PIN
OKI Electric Industry
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MSM80C51F MSM80C31F 80C51F E2E1037-19-41 MSM80C31F/MSM80C51F

5M80C

Abstract: cjne ) 0.41 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ , , QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very , '¢ Package options 40-pin plastic DIP (DIP40-P-600-2.54) 44-pin plastic QFP (QFP44-P-910-0.80-2K) 44-pin , 2 (/> 00 o O u 00 o O Cl OKI Semiconductor MSM80C31F/80C51F PIN CONFIGURATION fTOP VIEW) P1 , 25 24 P2.4 P2.3 XTAL2 18 23 P2.2 XTAL1 19 22 P2.1 Vss 20 21 P2.0 40-Pin Plastic DIP 5/38 OKI
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OCR Scan
5M80C cjne 2f 1001 oki
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