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48-Pin TSOP - Type 1, CPL

Catalog Datasheet MFG & Type PDF Document Tags

L9939

Abstract: h9940 %/1000 hrs PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW,DG 1 45 4500 0 , Failure Rate Note Failure %/1000 hrs PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 0 , = chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = , a 1 273.15 + T 1 273.15 + T - use stress At = Temperature , . Failure Rate at Use Conditions: where: stress use= At + Av C I-4 ( V stress -
Integrated Device Technology
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L9939

Abstract: B897 rate at stress conditions 2 = chi-square function = (100 - confidence level)/100 d.f. = degrees of , : where: A = e t a 1 273.15 + T 1 273.15 + T - use stress , = A + Av I-4 stress A t A v - V use ) QUALITY & RELIABILITY MONITOR , Surface Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire , 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY ACCELERATED STRESS TEST (H A S T) Conditions: 1) 100 hours
Integrated Device Technology
Original

L9939

Abstract: k9920 rate at stress conditions 2 = chi-square function = (100 - confidence level)/100 d.f. = degrees of , : where: A = e t a 1 273.15 + T 1 273.15 + T - use stress , = A + Av I-4 stress A t A v - V use ) QUALITY & RELIABILITY MONITOR , Surface Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire , 1999 PLASTIC PACKAGE TEST TYPE: HIGHLY ACCELERATED STRESS TEST (H A S T) Conditions: 1) 100 hours
Integrated Device Technology
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h9910

Abstract: K2837 Total # Device CY 98 - YTD (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE P-DIP PD , chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = number of , 1 273.15 + T 1 - 273.15 + T use stress where: At = Temperature Acceleration , v - V use ) QUALITY & RELIABILITY MONITOR REPORT July 1999 The failure rate is , ) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull Purpose: The purpose
Integrated Device Technology
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h9910

Abstract: K2837 Total # Device CY 98 - YTD (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE P-DIP PD , chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = number of , 1 273.15 + T 1 - 273.15 + T use stress where: At = Temperature Acceleration , v - V use ) QUALITY & RELIABILITY MONITOR REPORT July 1999 The failure rate is , ) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull Purpose: The purpose
Integrated Device Technology
Original

pj 899 diode

Abstract: B897 Device CY 98 - YTD (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 1 , DATA April 1999 CY 99 - YTD (Jan/99 to Mar/99) Total # PACKAGE FAMILY PACKAGE TYPE P-DIP , chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = number of , 1 273.15 + T 1 - 273.15 + T use stress where: At = Temperature Acceleration , v - V use ) QUALITY & RELIABILITY MONITOR REPORT April 1999 The failure rate
Integrated Device Technology
Original

h9910

Abstract: h9940 Device Cycle Observed Failure Rate Note Failure %/1000 cyc PACKAGE FAMILY PACKAGE TYPE , failure rate at stress conditions 2 = chi-square function = (100 - confidence level)/100 d.f , Acceleration Factor: where: A = e t a 1 273.15 + T 1 273.15 + T - , = At + Av I-4 ( V stress - V use ) QUALITY & RELIABILITY MONITOR REPORT , Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull
Integrated Device Technology
Original

h9910

Abstract: h9940 rate at stress conditions 2 = chi-square function = (100 - confidence level)/100 d.f. = degrees of , : where: A = e t a 1 273.15 + T 1 273.15 + T - use stress , - V use ) QUALITY & RELIABILITY MONITOR REPORT January 2000 The failure rate is , Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull , & RELIABILITY MONITOR REPORT Summary Data for January 2000 PLASTIC PACKAGE TEST TYPE: HIGHLY
Integrated Device Technology
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MSM80C31F

Abstract: MSM80C51F drive CMOS inputs without external pull-ups. Port 3.0 - 3.7 RESET ALE Reset input pin. A , /38 ¡ Semiconductor · Package options 40-pin plastic DIP (DIP40-P-600-2.54) : 44-pin plastic QFP (QFP44-P-910-0.80-2K) : 44-pin plastic QFJ (PLCC) (QFJ44-P-S650-1.27) : MSM80C31F/80C51F , , 0 CPU¨PORT PCL 0 , , PORT-2 1 ¡ Semiconductor MSM80C31F/80C51F PIN , P2.1 20 21 P2.0 VSS P2.2 40-Pin Plastic DIP 5/38 ¡ Semiconductor
OKI Electric Industry
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MSM80C51F MSM80C31F 80C51F E2E1037-19-41 MSM80C31F/MSM80C51F

5M80C

Abstract: cjne 00 Q_ - < < > r- Iâ'" Iâ'" 00 x x o. 44-Pin Plastic QFP 6/38 OKI Semiconductor MSM80C31F , ) 0.41 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ , , QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very , '¢ Package options 40-pin plastic DIP (DIP40-P-600-2.54) 44-pin plastic QFP (QFP44-P-910-0.80-2K) 44-pin , -2 CPU^PORT PORT^CPU - S1 S2 S3 S4 S5 S6 - M1 PCL PCL M1 - S1 -ti- S2-A- S3-A- S4-A- S5-A- S6 -
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OCR Scan
5M80C cjne 2f 1001 oki

k1917

Abstract: JESD22-B100 98 - YTD (Jan/98 to Dec/98) PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW 1 SOIC , DATA April 1999 CY 99 - YTD (Jan/99 to Mar/99) Total # PACKAGE FAMILY PACKAGE TYPE P-DIP , chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = number of , 1 273.15 + T 1 - 273.15 + T use stress where: At = Temperature Acceleration , v - V use ) QUALITY & RELIABILITY MONITOR REPORT April 1999 The failure rate
Integrated Device Technology
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k1917 JESD22-B100 L9726 9806 cga 624 Monitor Hyundai Service 42573K 41244K 62374L 61373L 61543N 41807P

h9740

Abstract: k1917 . CY 98 - YTD (Jan/98 to Dec/98) Total # PACKAGE FAMILY PACKAGE TYPE P-DIP PD, PT, PW , = chi-square function = (100 - confidence level)/100 d.f. = degrees of freedom = 2r + 2 r = , a 1 273.15 + T 1 273.15 + T - use stress where: At = Temperature , -4 stress A t A v - V use ) QUALITY & RELIABILITY MONITOR REPORT January 1999 The , Mount Components) Solder Type S, 63/37 (Tin-Lead) Flux R-Type (Rosin Base) Wire Pull
Integrated Device Technology
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h9740 B934 H9817 l9735 n9831 Y9846 K17651 PK100 71V546Z H54538 PN100 72215U

l9938

Abstract: K9950 - YTD (Jan/00 to Sep/00) PACKAGE FAMILY PACKAGE TYPE Total # of Lots Total # of , : JEDEC-STD-22, Method A102 CY 99 - YTD (Jan/99 to Dec/99) PACKAGE FAMILY PACKAGE TYPE Total # , rate at stress conditions 2 = chi-square function = (100 - confidence level)/100 d.f. = degrees of , : where: A = e t a 1 273.15 + T 1 273.15 + T - use stress , 8 18.868 9 20.951 10 23.031 11 25.106 12 27.179 I-4 - V use
Integrated Device Technology
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l9938 K9950 h9940 l9923 L9939 l9940 FP0PAB08D3 LM0PAB21D3 K59789 79RV475Z 77V400Z 79RV464XB

MT29F1G08ABADAWP

Abstract: MT29F1G08ABA +85ºC · Package ­ 48-pin TSOP type 1, CPL 2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 specification is , . 2 Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Operating Voltage Range A = 3.3V (2.7­3.6V) B = 1.8V (1.7­1.95V) Package Code WP = 48-pin TSOP 1 HC = , Proprietary 1Gb x8, x16: NAND Flash Memory Signal Assignments Signal Assignments Figure 2: 48-Pin TSOP
Micron Technology
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MT29F1G08ABADAWP MT29F1G08ABBDAH4 MT29F1G08ABBDAHC MT29F1G16ABBDAH4 MT29F1G16ABBDAHC MT29F1G08ABADAH4 MT29F1G08ABA MT29F1G08ABADA Micron ONFI 2.2 MT29F1G08ABAD

MT29F1G08ABCHC

Abstract: MT29F1G08AAC . 2 Figure 2: 48-Pin TSOP ­ Type 1, CPL (Top View , ) . 11 Figure 5: 48-Pin TSOP ­ Type 1, CPL , Performance Blank = Standard Package Code Feature Set C = Feature set C WP = 48-pin TSOP CPL HC = , TSOP type 1, CPL2 ­ 63-ball VFBGA Notes: 1. The ONFI 1.0 specification is available at www.onfi.org. 2 , Proprietary 1Gb: x8, x16 NAND Flash Memory Signal Descriptions and Assignments Figure 2: 48-Pin TSOP ­
Micron Technology
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MT29F1G08AACWP MT29F1G08AACH4 MT29F1G08ABCHC MT29F1G16ABCHC MT29F1G08ABCH4 MT29F1G16ABCH4 MT29F1G08AAC MT29F1G08ABC MT29F1G16abc

LEAPER-3

Abstract: 74189 to 8-pin D type adaptor X 1 *Disk X 1 *8-pin cable X 1 *User's manual X 1 *Reset signal line X 1 *DC 6V/250mA adaptor X 1 *25-pin 19 Supported Devices CAPACITY Q'TY TYPE VOLTAGE 2K x 8 1 , ; please indicate the Cartridge module type when you order. *Software disk x 1 *User's manual x 1 , for 24,28,32 pin DIP EPROM, 8 socket module support for SEEPROM in 20-pin DIP EEPROM and FLASH SEEPORM-248D(SOP) FLASH-328P 8 socket module support for 32-pin PLCC over 1M bits EPROM, EEPROM and
Leap Electronic
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LEAPER-3 74189 7489 sram 89C51 interfacing with lcd display 4N34 ic 74192 pin configuration SU-2000 PIC16C52/54/54A PIC16C55/56/57/57A/58A PIC12C508/509 PIC16C61 PIC16C620/621/622

48-Pin TSOP - Type 1, CPL

Abstract: SpecTek flash FNNL41A Features Figure 1: 48-Pin TSOP Type 1 · Organization ­ Page size: x8: 2,112 bytes (2 , 48-pin TSOP type I OCPL2 (lead-free plating) · Operating temperature: Commercial (0°C to 70 , Functional Density Package Type Single die = 8.0Gb, 7.8Gb, W = 48-lead TSOP Type 1 (CPL) PB-Free , : Figure 40: 48-Pin TSOP Type 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . . . . . . .7 Pin Assignment (Top View) 48-Pin TSOP Type 1 . . .
SpecTek
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48-Pin TSOP - Type 1, CPL SpecTek flash SpecTek nand nand flash 32gb x16 flash chip 8gb SpecTek nand 8

48-Pin TSOP - Type 1, CPL

Abstract: SpecTek flash FNNL41A Features Figure 1: 48-Pin TSOP Type 1 · Organization ­ Page size: x8: 2,112 bytes (2 , 48-pin TSOP type I OCPL2 (lead-free plating) · Operating temperature: Commercial (0°C to 70 , , 7.8Gb, W = 48-lead TSOP Type 1 (CPL) PB-Free 7.5Gb, 6.0Gb, and 4.0Gb P = 48-lead TSOP Type 1 , : 48-Pin TSOP Type 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . . . . . . . . . . . . . . . . . .7 Pin Assignment (Top View) 48-Pin TSOP Type 1 . . . . . . . .
SpecTek
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micron nand flash chip 16gb 8GB-16GB spectek nand flash SpecTek 16gb Micron NAND flash 32gb 8gb mlc FLASH MEMORY

MCM517400DJ60

Abstract: MCM517400D PACKAGE 300 MIL SOJ CASE 880A-02 T PACKAGE 300 MIL TSOP II CASE 892A-02 PIN ASSIGNMENT 300 MIL SOJ , 1 1 1 2 A2 [ PIN NAMES A 0 -A 1 1 . Address Input DQ0 - D Q 3 , characteristics only; if t w c s - tw C S (min), the cycle is an early write cycle and the data out pin will , 11 FAST PAGE MODE READ CYCLE RAS VI H - - 'RASP1RHCP CRP RCD - X `CPl PC CAS » I r» - « , package (TSOP). Three-State Data Output Fast Page Mode TTL-Compatible Inputs and Outputs RAS-Only Refresh
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OCR Scan
MCM517400D MCM517400DJ60 MCM517400DT60 MCM516400D/D MCM516400D MCM51X400D-50 MCM51X400D-60 MCM516400D--

misplaced Wire Bonds

Abstract: TOP SIDE MARKING M27C512 Mount: ­ SO Package ­ TSOP Package Cumulative Sample/Fail = 900/0 Cumulative Sample/Fail = -/24/44 2015 , Mount: ­ SO Package ­ TSOP Package Cumulative Sample/Fail = 200/0 Cumulative Sample/Fail = -/2015 4 , QUALITY & RELIABILITY REPORT January to December 1995 - EPROM, FLASH Memory, EEPROM and SRAM , ceramic FDIP and plastic PDIP, PLCC, SO and TSOP. Static RAMs: Fast SRAM, both Synchronous and , ,143 1,143 1,143 900 900 900 - 0 0 0 0 0 0 0 - 882 805 805 805 296 296 296 - 0 0 0 0 0 0 0 -
STMicroelectronics
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misplaced Wire Bonds TOP SIDE MARKING M27C512 1562Q M27C512 SGS-THOMSON QRR032/0296 QRR032
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