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EL5427CL-T13 Intersil Corporation 12 BUFFER AMPLIFIER, QCC32, EXPOSED PAD, LPP-32 visit Intersil
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44-PAD

Catalog Datasheet MFG & Type PDF Document Tags

LCC 44

Abstract: CERAMIC LEADLESS CHIP CARRIER LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width × package length 650 × 650mil Sealing method Frit seal 44-pad ceramic LCC (LCC-44C-F01) 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS) 2.16(.085) TYP 1 PIN INDEX 8. D 60( IA .3 , T 39 YP ) 1 PIN INDEX 16.51±0.25 SQ (.650±.010) 13.97(.550) TYP 1.40(.055)TYP 1.91(.075)TYP 3.30(.130)MAX C 1994 FUJITSU LIMITED C44001SC
Fujitsu
Original
LCC 44 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC C44001SC-2-2

CERAMIC LEADLESS CHIP CARRIER LCC 44

Abstract: WQFN044-G-S650-1 LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width × package length 650 × 650 mil Sealing method Frit seal (LCC-44C-F01) 44-pad ceramic LCC (LCC-44C-F01) 2.16(.085) TYP R0.23(.009)TYP (44 PLCS) 1 PIN INDEX 8. D 60( IA .3 , T 39 YP ) 1 PIN INDEX 16.51±0.25 SQ (.650±.010) 13.97(.550) TYP 1.40(.055)TYP 1.91(.075)TYP 3.30(.130)MAX
Fujitsu
Original
LCC44 44-pad

64 CERAMIC LEADLESS CHIP CARRIER LCC

Abstract: WQFN044-G-S650-1 LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width × package length 650 × 650 mil Sealing method Frit seal (LCC-44C-F01) 44-pad ceramic LCC (LCC-44C-F01) 2.16(.085) TYP R0.23(.009)TYP (44 PLCS) 1 PIN INDEX 8. D 60( IA .3 , T 39 YP ) 1 PIN INDEX 16.51±0.25 SQ (.650±.010) 13.97(.550) TYP 1.40
Fujitsu
Original
64 CERAMIC LEADLESS CHIP CARRIER LCC

ATMEGA1284PU

Abstract: ATMEGA644PA-AU Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF ­ 44-pad DRQFN ­ 49-ball VFBGA , ) Plastic Gull Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad , Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body , Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body, lead pitch 0.50mm, Thermally Enhanced Plastic , Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 ×
Atmel
Original
ATMEGA1284PU ATMEGA644PA-AU ATMEGA164A atmega1284p-pu 164PA atmega644a-au 20MIPS 16/32/64/128KB 512/1K/2K/4KB 1/2/4/16KB 8272DS

DRQFN

Abstract: ATMEGA644P programmer circuit -lead TQFP, 44-pad VQFN/QFN/MLF (ATmega164P/324P/644P) ­ 44-pad DRQFN (ATmega164P) Operating Voltages ­ 1.8V , Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body, lead pitch 0.50mm, Thermally Enhanced Plastic Very Thin , ) 44-pad, 7 × 7 × 1.0mm Body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin Quad Flat , Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body , : packagedrawings@atmel.com TITLE 44M1, 44-pad, 7 x 7 x 1.0mm body, lead pitch 0.50mm, 5.20mm exposed pad, thermally enhanced
Atmel
Original
DRQFN ATMEGA644P programmer circuit 44M1 DRQFN APPLICATION NOTE atmega644p-20au atmega644pv10au 16K/32K/64K 512B/1K/2K 85C/100

atmel 336

Abstract: ATMEGA164A Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF ­ 44-pad DRQFN ­ 49-ball VFBGA , ) Plastic Gull Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad , Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body , Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body, lead pitch 0.50mm, Thermally Enhanced Plastic , Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 ×
Atmel
Original
atmel 336 644A SEC ATMEGA1284P atmega1284 644PA ATmega644A 8272ES

ATmega1284

Abstract: ATMEGA644PA-AU Standby I/O and Packages ­ 32 Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF , ATmega164PA ATmega324A ATmega324PA ATmega644A ATmega644PA ATmega1284 ATmega1284P ­ 44-pad DRQFN ­ 49 , ) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body , 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin Quad Flat , Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced
Atmel
Original
ATMEGA324PA-AUR ATMEGA644PA ATMEGA324A ATMEL 1284p 324A ATmega644 16/32/64/128K 512B/1K/2K/4K 1/2/4/16K 8272AS

WSI MagicPro II Programmer

Abstract: PAC1000 organizations. The M A P I 68 device signifi­ 44-pin Plastic Leaded Chip Carrier package 44-pad Ceram ic , . MAP168 Pin Assignments 44-pin CLDCC Package 44-pin PLDCC Package 44-pad CLLCC Package Pin No , -883C Standard Standard Standard M IL-STD-883C 44-pin PLDCC 44-pin CLDCC 44-pin CPGA 44-pad CLLCC 44-pad CLLCC 44-pad CLLCC 44-pad CLLCC 44-pin PLDCC 44-Pin CLDCC 44-Pin CLDCC 44-pin CLDCC 44-pin CPGA
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OCR Scan
PAC1000 WSI MagicPro II Programmer SAM448 T-90-20
Abstract: System VCXO7050 4 Series No Holder Type VCXO7050     C1 Pad Type Parameters 4=4pad Cinetech
Original

atmel 811

Abstract: AT28C010 Mil ) 32L 32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) 44L 44-Pad, Non-Windowed , ) 32L 32-Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) 44L 44-Pad, Non-Windowed , -Pad, Non-Windowed, Ceramic Leadless Chip Carrier (LCC) Dimensions in Inches and (Millimeters)* 44L, 44-Pad
Atmel
Original
atmel 811 AT28C010 Mil 128-B AT28C010 0010C

ATV2500B

Abstract: ATV2500BL ) 44LW 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC) 15 Ordering Information (Continued , ) 44LW 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC) 16 ATV2500B ATV2500B Ordering , " Wide, Plastic, Dual Inline Package OTP (PDIP) 44LW 44-pad, Windowed, Ceramic Leadless Chip , ) .610(15.5) 18 Packaging Information 44LW, 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC
Atmel
Original
ATV2500BQ ATV2500BL ATV2500BQL ATV2500H/L I/O17 I/O16

0249J

Abstract: 40-pin EPROM pinout ) 44LW 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC) 16 ATV2500B(Q)(L) ATV2500B(Q)(L , Inline Package OTP (PDIP) 44LW 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC) 17 , , Plastic, Dual Inline Package OTP (PDIP) 44LW 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC , ) REF .690(17.5) .610(15.5) ATV2500B(Q)(L) Packaging Information 44LW, 44-pad, Windowed
Atmel
Original
0249J 40-pin EPROM pinout 40-Pin Plastic DIP OTP I/O06 I/O15 I/O14 I/O13

DRQFN

Abstract: ATMEGA324PV10AU -lead TQFP, 44-pad VQFN/QFN/MLF (ATmega164P/324P/644P) ­ 44-pad DRQFN (ATmega164P) Operating Voltages ­ , -pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 , Flat Package (TQFP) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad , ) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body , : packagedrawings@atmel.com TITLE 44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally
Atmel
Original
ATMEGA324PV10AU ATMEl 326 8011C avr 328 644p 0x54 16/32/64K C/100 8011MS

DRQFN APPLICATION NOTE

Abstract: ATMEGA644PV-10AU 32 Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF (ATmega164P/324P/644P) ­ 44-pad DRQFN (ATmega164P) 8-bit Microcontroller with 16/32/64K Bytes In-System Programmable , Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced , Flat Package (TQFP) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad , 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead
Atmel
Original
ATMEGA644PV-10AU DR-QFN 92 ATMEGA644P 8011-D atmega324pa-cu AS 324P 8011LS

ATMEGA644pa

Abstract: ATMEGA644PA-AU Standby I/O and Packages ­ 32 Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF , ATmega324PA ATmega644PA ATmega1284P Summary ­ 44-pad DRQFN ­ 49-ball VFBGA · Operating Voltages , (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin , (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin , -pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50
Atmel
Original
ATmega644PA-MU ATMEGA644PA-PU ATmega164PA-PU atmega164paau ATMEGA1284P-AU 1284P 164PA/324PA/644PA/1284P 8152GS

ATV2500BQ

Abstract: Chip Carrier (JLCC) 40-pin, 0.600" Wide, Plastic, Dual Inline Package OTP (PDIP) 44-pad, Windowed , ) 44-pad, Windowed, Ceramic Leadless Chip Carrier (LCC) 16 ATV2500B(Q)(L) ATV2500B(Q)(L , -pin, 0.600" Wide, Plastic, Dual Inline Package OTP (PDIP) 44-pad, Windowed, Ceramic Leadless Chip Carrier , (.203) 18 ATV2500B(Q)(L) ATV2500B(Q)(L) Packaging Information 44LW, 44-pad, Windowed
Atmel
Original
I/O12 0249I

AS 324P

Abstract: 8011AS /O and Packages ­ 32 Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, and 44-pad QFN/MLF Operating , " Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Quad Flat , ) 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF , ) 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF , 2325 Orchard Parkway San Jose, CA 95131 TITLE 44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm
Atmel
Original
8011AS

fujitsu uv erasable eprom

Abstract: 6V25V In a 65,536-word/16-blts format. The MBM27C1024 Is housed in both 40-pin DIP and 44-pad LCC package , : 12.5V JEDEC approved pin assignment 40-pin Ceramic(Cerdip) DIP Package: suffix =Z 44-pad Frit seal LCC , A12 All A10 A9 GND NC AB A7 A6 44-PAD CERAMIC (FRIT SEAL) LEADLESS CHIP CARRIR (CASE No.: LCC
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OCR Scan
MBM27C1024-20 MBM27C1024-25 fujitsu uv erasable eprom 6V25V 12Sv quickpro MBM27C1024-15 02ITYP C44001S-2C

AD1145

Abstract: 74als990 + 5V Supply Operation Low Power Consumption: 2.5mW Small Size: 44-Pad Plastic LLCC Low Cost , , BG) 44-Pad Plastic Leadless Chip Carrier 44-Pin Grid Array â'¢ OUTLINE DIMENSIONS Dimensions shown in , INFORMATION The AD1145 is packaged in a 44-pad glass epoxy chip carrier. This package is ideal for automated
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OCR Scan
74als990 LDIC NOTES AD1145AG 244-4961-00 44-PIN AD711 AD1I45 CS044-01TG PPS044-3A0802-L MPAS-044-ZS-8

ATMEGA644P

Abstract: ATMEGA164P-20AU -lead TQFP, 44-pad VQFN/QFN/MLF (ATmega164P/324P/644P) ­ 44-pad DRQFN (ATmega164P) Operating Voltages ­ , -pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 , Flat Package (TQFP) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad , ) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body , : packagedrawings@atmel.com TITLE 44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally
Atmel
Original
ATMEGA164P-20AU

FOX924

Abstract: LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width × package length 650 × 650 mil Sealing method Frit seal (LCC-44C-F01) 44-pad ceramic LCC (LCC-44C-F01) 2.16(.085) TYP R0.23(.009)TYP (44 PLCS) 1 PIN INDEX 8. D 60( IA .3 , T 39 YP ) 1 PIN INDEX 16.51±0.25 SQ (.650±.010) 13.97(.550) TYP 1.40(.055)TYP 1.91(.075)TYP 3.30(.130)MAX
Fox Electronics
Original
FOX924 888-GET-2-FOX FOX-G-3877

WS57C257

Abstract: Waferscale Integration LEADLESS CHIP CARRIER FUJITSU SEMICONDUCTOR DATA SHEET 44 PAD CERAMIC To Top / Package Lineup / Package Index LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 44-pad ceramic LCC Lead pitch 50 mil Package width × package length 650 × 650 mil Sealing method Frit seal (LCC-44C-F01) 44-pad ceramic LCC (LCC-44C-F01) 2.16(.085) TYP R0.23(.009)TYP (44 PLCS) 1 PIN INDEX 8. D 60( IA .3 , T 39 YP ) 1 PIN INDEX 16.51±0.25 SQ (.650±.010) 13.97(.550) TYP 1.40
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OCR Scan
WS57C257 Waferscale Integration TMS320XX WS*57c257 AP1684 3231F WSMAP168 AP168-40C WSMAP168-40CMB MIL-STD-883C AP168-40J WSMAP168-40X

WS27C210L-15

Abstract: Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF ­ 44-pad DRQFN ­ 49-ball VFBGA , ) Plastic Gull Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad , Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body , Dual Inline Package (PDIP) 44-pad, 7 × 7 × 1.0mm body, lead pitch 0.50mm, Thermally Enhanced Plastic , Wing Quad Flat Package (TQFP) 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44-pad, 7 × 7 ×
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OCR Scan
WS27C210L-15 WS27C210L WS27C210L-12CMB WS27C210L-12DMB WS27C210L-15CMB WS27C210L-15DMB WS27C21OL-15LMB

WS27C210L-15CMB

Abstract: WS27C210L-15 Standby I/O and Packages ­ 32 Programmable I/O Lines ­ 40-pin PDIP, 44-lead TQFP, 44-pad VQFN/QFN/MLF , ATmega324PA ATmega644PA ATmega1284P Summary ­ 44-pad DRQFN ­ 49-ball VFBGA · Operating Voltages , (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin , (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin , -pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50
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OCR Scan
S27C210L S27C210L-15LMB WS27C210L-17CMB WS27C210L-17DMB 27C210
Abstract: -lead TQFP, 44-pad VQFN/QFN/MLF (ATmega164P/324P/644P) ­ 44-pad DRQFN (ATmega164P) Operating Voltages ­ , -pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 , Flat Package (TQFP) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad , ) 40P6 40-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44M1 44-pad, 7 x 7 x 1.0 mm body , : packagedrawings@atmel.com TITLE 44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally -
OCR Scan
WS27C210L-15LMB
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