NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 9.53mm(375mil), plastic , 2002 FUJITSU LIMITED F16008-SET1 F16008-SET1:FJ99L-0018-E0008-1-K-1 FJ99L-0018-E0008-1-K-1 t = 0.6 ... | Original |
3 pages, |
Polycarbonate FPT-8P-M02 FPT-8P-M01 FPT-24P-M03 FPT-16P-M05 FJ990-0003-X0037-3-D-1 45600 datasheet abstract |
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| Abstract: standard values: TYPE I : 5.72mm ( 225mil) TYPE II : 7.62mm ( 300mil) TYPE III : 9.53mm ( 375mil) TYPE ... | Original |
6 pages, |
Marking MB Marking code CS marking 34 top marking codes MARKING CODE e1 6 lead 820 marking DB81-10003-1E DB81-10003-1E abstract |
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| Abstract: TYPE Pin Count 600mil/VI 44 450mil/IV 28 1.27mm(50mil) 375mil/III 300mil/II 14 ... | Original |
10 pages, |
TSOP 48 stacked flash bonding fcBGA PACKAGE thermal resistance CERAMIC PIN GRID ARRAY wire lead frame 30-PIN datasheet abstract |
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| Abstract: Enplas Yamaichi ic354 ) TYPEII :300mil (7.62mm) TYPEIII :375mil (9.53mm) TYPEIV :450mil (11.43mm) TYPEV :525mil (13.34mm ... | Original |
195 pages, |
phase control thyristor AT 1004 P10 smd code marking fujitsu capacitor smd diode marking A03 IC51-0484-806 IC297 IC189 Enplas drawings PC MOTHERBOARD CIRCUIT diagram pga 370 AU 7842 64 PIN marking code smd semiconductor fujitsu TSSOP YAMAICHI SOCKET smd p08 datasheet abstract |
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| Abstract: 20P2V-A 20P2V-A Plastic 20pin 375mil SOP EIAJ Package Code SOP20-P-375-1.27 JEDEC Code MS-013AC MS-013AC Weight(g) 0.48 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 10 Symbol F A D A2 A1 b y L e L1 HE e1 I2 20 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters Min Nom Max   2.65 0.1 0.2 0.3  2.3  0.35 0.4 0.49 0.23 0.25 0.3 12.7 12.8 12.9 7.4 7.5 7.6  1.27 ... | Original |
1 pages, |
SOP20 Package MS-013AC 20P2V-A 20P2V-A abstract |
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| Abstract: 28P2V-A 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE MS-013AE Weight(g) 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters Min Nom Max   2.65 0.1 0.2 0.3  2.3  0.35 0.4 0.49 0.23 0.25 0.3 17.8 17.9 18.0 7.4 7.5 7.6  1.27 ... | Original |
1 pages, |
SOP28 package 28P2V 28P2V-A MS-013AE 28P2V-A abstract |
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| Abstract: 16P2V-A 16P2V-A Plastic 16pin 375mil SOP EIAJ Package Code SOP16-P-375-1.27 JEDEC Code MS-013AA MS-013AA Weight(g) 0.4 Lead Material Cu Alloy e b2 9 E Recommended Mount Pad 8 1 Symbol F A D A2 A1 b y L e L1 HE e1 I2 16 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters Min Nom Max   2.65 0.1 0.2 0.3  2.3  0.35 0.4 0.49 0.23 0.25 0.3 10.2 10.3 10.4 7.4 7.5 7.6  1.27  ... | Original |
1 pages, |
SOP-16P 16P2V-A MS-013AA 16P2V-A abstract |
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| Abstract: Package Quantity (pcs) 42-pin稰lastic Shrink SOP (375mil) MAX.1,500 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: Tape Dimensions (Unit: mm) P P0 P2 D0 Symbol E T Specification 12�1 2�1 P0 4�1 D0 1.5 +0.1 -0 T 0.3 D1 W 1.75�1 P2 B0 11.5�1 P Direction of Feed 24�3 F D1 3.0 E K0 15.7 W A0 10.8 K0 F A0 B0 2.0 MIN. Reel Dimensions (Unit: mm) Sumbol Specification A B 24-pin Plastic SOP (375mil) A B C Applied Package 2.0�5 W 25.4 W1 W 21�8 E W1 13�2 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: UNIT : mm PPE 7 HEAT PROOF NEC 135°C MAX. 10.3 105.0 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 (322.6) SECTION A  A' 5.27 (6.35) 15.75 7.62 135.9 8Ã-14=112 A Applied Package Quantity (pcs) 48-pin · Plastic Shrink SOP (375mil)(1.7mm thick) MAX. 112 Tray Material Heat Proof Temp. Surface resistance 375mil48pSSOP Carbon PPE 135°C 12 less than 1 Ã- 10 / The tolerance of tray's dimensions are based on JEDEC ... | Original |
1 pages, |
datasheet abstract |
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