500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial visit Linear Technology - Now Part of Analog Devices
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial visit Linear Technology - Now Part of Analog Devices

Search Stock

Shift+Click on the column header for multi-column sorting 
Part
Manufacturer
Supplier
Stock
Best Price
Price Each
Ordering
Part : CR4-663-24-B-A1-0-S2-J-2 Supplier : Carling Technologies Manufacturer : Avnet Stock : - Best Price : $91.19 Price Each : $264.7900
Part : 3RV20324BA10 Supplier : Siemens Manufacturer : Allied Electronics & Automation Stock : - Best Price : $209.40 Price Each : $216.38
Part : 6EP1332-4BA00 Supplier : Siemens Manufacturer : Allied Electronics & Automation Stock : 8 Best Price : $247.38 Price Each : $260.40
Part : 6EP1332-4BA00 Supplier : Siemens Manufacturer : RS Components Stock : 4 Best Price : £101.71 Price Each : £113.00
Shipping cost not included. Currency conversions are estimated. 

324-ball

Catalog Datasheet MFG & Type PDF Document Tags

89HPES12NT12G2

Abstract: PCIe Switches Gen2 2.0 23 x 23 484-ball BGA 89HPES12NT12G2 12 12 Gen2 2.1 19 x 19 324-ball BGA 89HPES16NT16G2 16 16 Gen2 2.1 19 x 19 324-ball BGA 89HPES24NT24G2 24 24 Gen2 2.1 19 x 19 324-ball BGA 89HPES24NT6AG2 24 6 Gen2 2.1 23 x 23 , 4 Gen2 2.0 19x19 324-ball BGA 89HPES6T6G2 6 6 Gen2 2.0 19x19 324-ball BGA 89HPES10T4BG2 10 4 Gen2 2.0 19x19 324-ball BGA 89HPES12T3BG2 12 3
Integrated Device Technology
Original
PCIe Switches 89HPES32NT24AG2 324-BALL 1156-BALL pcie Gen2 payload 89HPES32NT8AG2 89HPES16T4BG2 89HPES16T4G2 89HPES24T3G2 89HPES24T6G2 89HPES32T8G2 89HPES48T12G2
Abstract: Output, Filtering Slew Rate Control on High Speed I/Os Impedance Control on DDR I/Os Package 324-ball , ] 11121BSâ'"ATARMâ'"08-Mar-13 9 4. Package and Pinout The SAMA5D3 product is available in a 324-ball LFBGA package. 4.1 Mechanical Overview of the 324-ball LFBGA Package Figure 4-1 shows the orientation of the 324-ball BGA Package. Figure 4-1. Orientation of the 324-ball LFBGA Package Bottom VIEW , 17 18 SAMA5D3 Series [SUMMARY DATASHEET] 11121BSâ'"ATARMâ'"08-Mar-13 10 4.2 324-ball Atmel
Original
IEEE1588

sama5d35

Abstract: SMD MARKING CODE sdp Impedance Control on DDR I/Os Package  324-ball LFBGA, 15 x 15 x 1.4 mm, pitch 0.8 mm  324-ball TFBGA, 12 x 12 x 1.2 mm, pitch 0.5 mm Table 1-1. SAMA5D3 Device Differences , packages:   4.1 324-ball LFBGA (15 x 15 x 1.4 mm, pitch 0.8 mm) 324-ball TFBGA (12 x 12 x 1.2 mm, pitch 0.5 mm) 324-ball LFBGA Package (15 x 15 x 1.4 mm, pitch 0.8 mm) Figure 4-1 shows the ball map of the 324-ball LFBGA package. Figure 4-1. 324-ball LFBGA Ball Map Bottom VIEW V U T
Atmel
Original
sama5d35 SMD MARKING CODE sdp

marking w13

Abstract: ) - 324-ball FBGA (220 user I/O) Optimized for 3.3V systems - Ultra low power operation - 5V tolerant , FT256 FG324 No. of Pins 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA
Xilinx
Original
marking w13 XCR3384XL DS024 DS012 TQ144

XCR3384XL-10TQ144C

Abstract: FT256 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O) Optimized for 3.3V systems , -7FT256C 7.5 ns FT256 256-ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , -ball Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG
Xilinx
Original
XCR3384XL-10TQ144C t11 2581 d1369 DS023 PQ208 F1959

324-BALL

Abstract: Array: 324-Ball (23 mm x 23 mm) LBB Notes: (See next page for detailed views) 1 All dimensions , Array: 324-Ball (23 mm x 23 mm) LBB Notes: 1 All dimensions are in millimeters. 2 Trays can
Advanced Micro Devices
Original
176-B 324-B 399-B 424-B

LXT998

Abstract: reliable connectivity s 324-ball PBGA packaging s Provides small profile s Low power consumption
Intel
Original
LXT998 10/100B 0800/ASI/CR/4K

89H16NT16G2

Abstract: PES16NT16G2 Requires three power supply voltages (1.0V, 2.5V, and 3.3V) Packaged in a 19mm x 19mm 324-ball Flip Chip
Integrated Device Technology
Original
PES16NT16G2 89H16NT16G2

XCR3384XL-10FG324C

Abstract: TQ-144 -pin TQFP (118 user I/O) - 208-pin PQFP (172 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (220 , FG324 TQ144 PQ208 FT256 FG324 TQ144 PQ208 FT256 FG324 No. of Pins 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball Package Type Thin Quad Flat Pack (TQFP) Plastic Quad Flat Pack , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA
Xilinx
Original
XCR3384XL-10FG324C TQ-144
Abstract: (1.0V, 2.5V, and 3.3V)  Packaged in a 19mm x 19mm 324-ball Flip Chip BGA with 1mm ball spacing Integrated Device Technology
Original

PEX8615-BA50BI

Abstract: PEX8615 Version 1.4 2010 Features PEX 8615 General Features o 12-lane PCI Express switch - Integrated 5.0 GT/s SerDes o Up to 12 configurable ports o 19 x 19mm2, 324-ball HSBGA o Typical Power: 1.79 Watts PEX 8615 Key Features o Standards Compliant - PCI Express Base Specification r2.0 (Backwards , Port PCIe Switch, 324-ball HSBGA 19x19mm2 pkg 12 Lane, 12 Port PCIe Switch, 324-ball HSBGA 19x19mm2 pkg, Pb-free 12 Lane, 12 Port PCIe Switch, 324-ball HSBGA 19x19mm2 pkg, Pb-free, Industrial
PLX Technology
Original
PEX8615-BA50BC PEX8615 PEX8615-BA50BI PEX8615BA-AIC4U4D PEX8615-SIL-PB-1 BA50BC HSBGA plx 8112 8615RDK 8615BA-BB4U1D

FT256

Abstract: footprint packages - 208-pin PQFP (180 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (260 user I , PQ208 FT256 FG324 No. of Pins 208-pin 256-ball 324-ball 208-pin 256-ball 324-ball 208-pin 256-ball 324-ball 208-pin 256-ball 324-ball 208-pin 256-ball 324-ball Package Type Plastic Quad Flat Pack
Xilinx
Original
XCR3512XL DS081

89H16NT16G2

Abstract: 89HPES16NT16G2 Requires three power supply voltages (1.0V, 2.5V, and 3.3V) Packaged in a 19mm x 19mm 324-ball Flip Chip
Integrated Device Technology
Original

89HPES12T3G2ZBBCGI

Abstract: PES12T3G2 pins have selectable alternate functions Packaged in a 19mm x 19mm 324-ball BGA with 1mm ball , BC324 324-ball CABGA BCG BCG324 324-ball CABGA, Green ZA ZB ZA revision ZB revision G2 , 89 Serial Switching Product Valid Combinations 89HPES12T3G2ZABC 324-ball BGA package, Commercial Temp. 89HPES12T3G2ZABCI 324-ball BGA package, Industrial Temp. 89HPES12T3G2ZABCG 324-ball Green BGA package, Commercial Temp. 89HPES12T3G2ZABCGI 324-ball Green BGA package, Industrial Temp
Integrated Device Technology
Original
89HPES12T3G2 PES12T3G2 89HPES12T3G2ZBBC 89HPES12T3G2ZBBCGI 89HPES12T3G2ZBBCI 89HPES12T3G2ZBBCG
Abstract: user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (260 user I/O) Optimized for 3.3V systems , FG324 324-ball Fineline BGA Package (FG) C XCR3512XL-10PQ208C 10 ns PQ208 208 , (FT) C XCR3512XL-10FG324C 10 ns FG324 324-ball Fineline BGA Package (FG) C , -10FT256I 10 ns FT256 256-ball Fine-Pitch BGA (FT) I XCR3512XL-10FG324I 10 ns FG324 324-ball , -12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG) C XCR3512XL-12PQ208I 12 ns PQ208 Xilinx
Original
Abstract: user I/O) - 208-pin PQFP (172 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O , FT256 256-ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , -ball Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG Xilinx
Original
Abstract: user I/O) - 208-pin PQFP (172 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O , FT256 256-ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , -ball Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG Xilinx
Original

PEX8619-BA50BI

Abstract: PEX8619-BA50BC G Version 1.4 2010 Features PEX 8619 General Features o 16-lane PCI Express switch - Integrated 5.0 GT/s SerDes o Up to 16 configurable ports o 19 x 19mm2, 324-ball HSBGA o Typical Power: 1.99 Watts PEX 8619 Key Features o Standards Compliant - PCI Express Base Specification r2.0 (Backwards , PEX8619-BA50BC PEX8619-BA50BC G 16 Lane, 16 Port PCIe Switch, 324-ball HSBGA 19x19mm2 pkg 16 Lane, 16 Port PCIe Switch, 324-ball HSBGA 19x19mm2 pkg, Pb-free 16 Lane, 16 Port PCIe Switch, 324-ball HSBGA
PLX Technology
Original
PEX8619-BA50BI 8619BA-BB4U1D PEX8619BA-AIC4U4D PEX8619-SIL-PB-1 PEX8619-BA50BC G PEX8619 PEX8619-BA50BI G 8619RDK PEX8619-BA50BIG
Abstract: (1.0V, 2.5V, and 3.3V)  Packaged in a 19mm x 19mm 324-ball Flip Chip BGA with 1mm ball spacing  Integrated Device Technology
Original
Abstract: (1.0V, 2.5V, and 3.3V)  Packaged in a 19mm x 19mm 324-ball Flip Chip BGA with 1mm ball spacing  Integrated Device Technology
Original
Abstract: Impedance Control on DDR I/Os Package  324-ball LFBGA, 15 x 15 x 1.4 mm, pitch 0.8 mm  324-ball TFBGA, 12 x 12 x 1.2 mm, pitch 0.5 mm Table 1-1. SAMA5D3 Device Differences , packages:   4.1 324-ball LFBGA (15 x 15 x 1.4 mm, pitch 0.8 mm) 324-ball TFBGA (12 x 12 x 1.2 mm, pitch 0.5 mm) 324-ball LFBGA Package (15 x 15 x 1.4 mm, pitch 0.8 mm) Figure 4-1 shows the ball map of the 324-ball LFBGA package. Figure 4-1. 324-ball LFBGA Ball Map Bottom VIEW V U T Zarlink Semiconductor
Original
MT90880 MT90881 MT90882 MT90883 ZL50110 ZL50111

PBSRAM

Abstract: 512 552 ] (REF) Smallest Extended Industrial Temperature Range MIL-STD-1553 Micro-ACE TE Terminal - 324-Ball
Zarlink Semiconductor
Original
ZL50114 ZL50115 ZL50116 ZL50117 PBSRAM 512 552 ZL50112 ZL50118 ZL50119

bu61740b

Abstract: BU-61860B Requires three power supply voltages (1.0V, 2.5V, and 3.3V) Packaged in a 19mm x 19mm 324-ball Flip Chip
Data Device
Original
bu61740b BU-61860B DDC total ace 1553 chip pcb footprint BU-61740B BU-BU-64863B 61840B BU-6181 BU-64863B8-600 1-800-DDC-5757 A5976

BU-6474XB

Abstract: BU-64840R3 ) - 324-ball FBGA (220 user I/O) Optimized for 3.3V systems - Ultra low power operation - 5V tolerant , FT256 FG324 No. of Pins 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA
Data Device
Original
BU-6474XB BU-64840R3 BU-64860B3 BU-6174 BU-6184
Abstract: pins have selectable alternate functions Packaged in a 19mm x 19mm 324-ball BGA with 1mm ball , BC324 324-ball CABGA BCG BCG324 324-ball CABGA, Green ZA ZB ZA revision ZB revision G2 , 89 Serial Switching Product Valid Combinations 89HPES12T3G2ZABC 324-ball BGA package, Commercial Temp. 89HPES12T3G2ZABCI 324-ball BGA package, Industrial Temp. 89HPES12T3G2ZABCG 324-ball Green BGA package, Commercial Temp. 89HPES12T3G2ZABCGI 324-ball Green BGA package, Industrial Temp Atmel
Original
AT91SAM SAM9263 AT91SAM9263 ARM926EJ-S 6249IS

STANAG 3838

Abstract: BU-BU-64863B (1.0V, 2.5V, and 3.3V)  Packaged in a 19mm x 19mm 324-ball Flip Chip BGA with 1mm ball spacing 
Data Device
Original
STANAG 3838 BU-61860B3-601
Abstract: -pin TQFP (118 user I/O) - 208-pin PQFP (172 user I/O) - 256-ball FBGA (212 user I/O) - 324-ball FBGA (220 , FG324 TQ144 PQ208 FT256 FG324 TQ144 PQ208 FT256 FG324 No. of Pins 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball 144-pin 208-pin 256-ball 324-ball Package Type Thin Quad Flat Pack (TQFP) Plastic Quad Flat Pack , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA Integrated Device Technology
Original

89HPES16NT16G2

Abstract: 89H16NT16 '¢ RT Only Version Available â'¢ Small Plastic Package - 128-ball or 324-ball BGA Package - 0.815
Integrated Device Technology
Original
89H16NT16 89hpes16nt16g2 port interconnect
Showing first 20 results.