NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN CERAMIC FPT-320C-A01 FPT-320C-A01 320-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Metal seal (FPT-320C-A01 FPT-320C-A01) 320-pin ceramic QFP (FPT-320C-A01 FPT-320C-A01) 39.64±0.20SQ (1.561±.008) 36.00±0.20SQ (1.417±.008) 31.60(1.244)REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 34.00(1.339) 15.00(.591) DIA DIA 37.40(1.472) TYP 0.20±0.03 (.008±.0012) 0.08(.003) 0.60 ... | Original |
1 pages, |
FPT-320C-A01 FPT-320C-A01 abstract |
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| Abstract: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M01 BGA-320P-M01 320-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 21 Package width Ã- package length 18.00 Ã- 18.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX Ball size 0.45 (BGA-320P-M01 BGA-320P-M01) 320-pin plastic FBGA (BGA-320P-M01 BGA-320P-M01) 18.00±0.10(.709±.004)SQ Note: The actual shape of coners may differ from the dimension. +0.20 +.008 1.25 Â0.10 .049 ... | Original |
1 pages, |
BGA-320P-M01 BGA-320P-M01 abstract |
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| Abstract: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN CERAMIC To Top / Package Lineup / Package Index FPT-320C-A01 FPT-320C-A01 320-pin ceramic QFP Lead pitch 0.40 mm Lead shape Gullwing Sealing method Metal seal (FPT-320C-A01 FPT-320C-A01) 320-pin ceramic QFP (FPT-320C-A01 FPT-320C-A01) 39.64±0.20SQ (1.561±.008) 36.00±0.20SQ (1.417±.008) 31.60(1.244)REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 34.00(1.339) 15.00(.591) DIA DIA 37.40(1.472 ... | Original |
1 pages, |
320c datasheet abstract |
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| Abstract: QUAD FLAT L-LEADED PACKAGE 320 PIN CERAMIC FPT-320C-A01 FPT-320C-A01 Lead pitch 0.40mm Lead shape Gullwing Sealing method Metal seal 320-pin ceramic QFP (FPT-320C-A01 FPT-320C-A01) 320-pin ceramic QFP (FPT-320C-A01 FPT-320C-A01) 39.64±0.20SQ (1.561±.008) 36.00±0.20SQ (1.417±.008) 31.60(1.244)REF 1.65±0.20 (.065±.008) 0.50(.0197) "A" Details of "A" part 1.02±0.25 (.040±.010) 34.00(1.339) 15.00(.591) DIA DIA 37.40(1.472) TYP 0.20±0.03 (.008±.0012) 0.08(.003) 0.60(.024) 0.51(.020)MIN 1.90(.075 ... | Original |
1 pages, |
320c FPT-320C-A01 FPT-320C-A01 abstract |
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| Abstract: 31.1*8. •0.76 2 I 1 used for: D-SUB COMBINATION ,»0.12 03.2*0.1 (2x) «3.1*0.1 (2x) 3.4310.1 A1 0 i in N P.C.B. EDGE P.C.B.-H0LE DRILLINGS METAL BRACKET PRESS FOR FIXING ON PCB « s 1 r \ 11*0.3 3.2*0.2 1 £ 4-40 UNC \ SEE NOTE 9 » V 6.35*03 Jig r Directive 2002 95 EC 1 ,.RoHS" L. Compliant À NOTES: 1. METALSHELLS: STEEL; min. 320pin TIN 2. INSULATORS: PBT GF UL 94 V-0 , MALE CONTACT ON POS. A1, FEMALE CONTACT ON POS. A2 5. METAL BRACKET: DIE-CASTING; min. 320pin TIN over ... | OCR Scan |
1 pages, |
fbb6ab 302W2CSXX 302W2CS 302W2CSXX56N40X datasheet abstract |
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| Abstract: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 320 PIN PLASTIC BGA-320P-M06 BGA-320P-M06 320-pin plastic PBGA Lead pitch 1.27 mm Package width Ã- package length 27.00 mm Ã- 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.46 mm Max Weight 2.90 g (BGA-320P-M06 BGA-320P-M06) 320-pin plastic PBGA (BGA-320P-M06 BGA-320P-M06) B 27.00(1.063) 24.13(.950) 24.00±0.10(.945±.004) 1.44 (.057) A 0.635 (.025) 1.27 (.050) 20 19 18 17 ... | Original |
1 pages, |
BGA-320P-M06 BGA-320P-M06 abstract |
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| Abstract: 320-PIN PLASTIC BGA (22x22) D w D1 ZE 4-C2.0 S B ZD B 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A E1 E W U R N L J G E C A Y V T P M K H F D B INDEX MARK w 25° S A A y1 A2 S S ITEM y e S A1 D MILLIMETERS 22.00±0.20 D1 b x M S AB 19.00 E E1 w 22.00±0.20 19.00 e 0.30 1.00 A A1 2.28±0.30 0.50±0.10 A2 b 1.78 0.60±0.10 x 0.15 y y1 0.15 0.35 ... | Original |
1 pages, |
320-PIN 320-PIN abstract |
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| Abstract: process technology operating at 2.5V and is available in 320-pin EPBGA packages. · 8B/10B 8B/10B encoder , operate independently with separate CDR · Address both 10G and backplane with one device · 320-pin ... | Original |
2 pages, |
serdes LSI R1109 8b/10b decoder LSI Logic EPBGA gigablaze L80710 10G serdes 2.5 quad LSI gigablaze serdes L84700 LSI LOGIC LSI serdes CMOS 8B/10B L80710 abstract |
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| Abstract: to local clock ! 8B/10B 8B/10B encoder/decoder ! XGMII SSTL-2 Parallel Interface ! 320-pin PBGA package , 0.25-micron process technology operating at 2.5V and is available in 320-pin PBGA packages. The ... | Original |
2 pages, |
serdes transceiver R1109 lsi gigablaze transceiver LSI gigablaze serdes GQ-100 serdes LSI MIPI LSI gigablaze gigablaze GQ-100 abstract |
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| Abstract: Plastic BGA ( 27) (1.53mm thick) MAX. 400 320-pin Plastic BGA ( 27) (1.53mm thick) SSD-A-H6297-2 SSD-A-H6297-2 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: TRAY CONTAINER UNIT : mm NEC 7 135°C MAX. 22.35 26.30 105.2 BGA22 BGA22Ã-22ESP -22ESP A' 15.35 22.35 25.80 283.8 15.60 315.0 (322.6) Section A  A' 22.35 (5.52) (6.35) 22.00 7.62 135.9 5Ã-12=60 PPE A Applied Package Quantity (pcs) Tray BGA 22Ã-22 ESP 320-pin Plastic BGA (22Ã-22) Material Carbon PPE 345-pin Plastic BGA (22Ã-22) Heat Proof Temp. 135°C MAX. 385-pin Plastic BGA (22Ã-22) 389-pin Plastic FBGA (22Ã-22) 429-pin Plastic ... | Original |
1 pages, |
tray datasheet bga JEDEC FBGA tray bga datasheet abstract |
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| Abstract: TRAY CONTAINER UNIT : mm 5Ã-12=60 A' 135°C MAX. 20.15 21.35 7 BGA21 BGA21Ã-21ESP -21ESP 23.90 NEC 95.6 135.9 PPE A 21.35 23.90 262.9 26.05 315.0 (322.6) SECTION A  A' 21.35 (5.95) 7.62 (6.35) 21.00 Applied Package Quantity (pcs) BGA21 BGA21Ã-21 ESP Tray 256-pin · Plastic BGA (21Ã-21) Material Carbon PPE 272-pin · Plastic BGA (21Ã-21) Heat Proof Temp. 135°C MAX. 292-pin · Plastic BGA (21Ã-21) 320-pin · Plastic BGA (21Ã-21) 337-pin ... | Original |
1 pages, |
tray datasheet bga Transistor 337 256-pin BGA 337 BGA datasheet abstract |
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| Abstract: Less than 1 Ã- 10 / The tolerance of tray's dimensions are based on JEDEC STANDARD. 320-pin ... | Original |
1 pages, |
tray datasheet bga 676 BGA package tray 596-PIN 676-Pin 27ES NEC 2415 datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over Drive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF) socket which www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v7.htm |
Intel | 01/11/1998 | 4.37 Kb | HTM | zp_oth-v7.htm |
| describes support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over OverDrive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v1.htm |
Intel | 01/11/1997 | 4.37 Kb | HTM | zp_oth-v1.htm |
| describes support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over ® OverDrive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v3.htm |
Intel | 31/01/1998 | 3.33 Kb | HTM | zp_oth-v3.htm |
| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over Drive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF) socket which www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v5.htm |
Intel | 30/04/1998 | 4.37 Kb | HTM | zp_oth-v5.htm |
| describes support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over OverDrive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v4.htm |
Intel | 31/01/1997 | 4.15 Kb | HTM | zp_oth-v4.htm |
| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over OverDrive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v6.htm |
Intel | 03/08/1997 | 3.69 Kb | HTM | zp_oth-v6.htm |
| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over Drive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF) socket which www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth-v2.htm |
Intel | 05/08/1998 | 4.37 Kb | HTM | zp_oth-v2.htm |
| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over Drive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF) socket which www.datasheetarchive.com/files/intel/design/motherbd/zp/zp_oth.htm |
Intel | 01/02/1999 | 4.36 Kb | HTM | zp_oth.htm |
| describes support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over OverDrive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF www.datasheetarchive.com/files/intel/products/design/motherbd/zp/zp_oth.htm |
Intel | 23/10/1996 | 4.51 Kb | HTM | zp_oth.htm |
| support for 320-pin PODP 3V-XXX Intel OverDrive processors which can be accommodated in the Advanced/ZP 320-pin Type 5 socket. The table lists the jumper settings required for the selected Over Drive processor speed. The Advanced/ZP baseboard has a 320-pin Type 5 Zero Insertion Force (ZIF) socket which www.datasheetarchive.com/files/intel/products two & tools/design/motherbd/zp/zp_oth.htm |
Intel | 02/05/1999 | 4.36 Kb | HTM | zp_oth.htm |