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Part Manufacturer Description Datasheet BUY
SMP-MSSB-PCR Amphenol RF SMP(M)PIN CONT,PCB,REAR MNT visit Digikey
034-1030 Amphenol RF HDBNC RIGHT ANGLE PCB JACK visit Digikey
031-5329-52RFX Amphenol RF RF Connectors PCB RECEPTACLE visit Digikey
FA1-NESP-PCB-1 Amphenol RF CONN PLUG FAKRA EDGECARD PCB visit Digikey
FA1-NKSP-PCB-1 Amphenol RF CONN PLUG FAKRA EDGECARD PCB visit Digikey
132289 Amphenol RF CONN RCPT BULKHEAD SMA PCB visit Digikey

3.5mm+PCB+RF

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: THE PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1 -
OCR Scan
HMC129G8
Abstract: PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL -
OCR Scan
HMC205 T0G4125
Abstract: IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 I EADS S PACKAGE -
OCR Scan
HMC204
Abstract: MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE -
OCR Scan
HMC204C8
Abstract: SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA -
OCR Scan
HMC132C8 C132G7
Abstract: PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA (92%) 6 I EADS S PACKAGE BOTTOM: COPPER C -
OCR Scan
HMC147S8 HMC175MS8
Abstract: CONDUCT IVfc fcPOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 I EADS -
OCR Scan
HMC143 HMC144 HMC141/ TD0412S
Abstract: CERAMIC PACKAGE 4 THE PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF -
OCR Scan
HMC131
Abstract: . RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE -
OCR Scan
HMC140G8 DDD03
Abstract: 4 THE PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1 -
OCR Scan
HMC156C8
Abstract: CERAMIC PACKAGE 4 THE PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF -
OCR Scan
HMC132 DC-15 T0041E5
Abstract: PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 I EADS S PACKAGE BOTTOM: COPPER C -
OCR Scan
HMC157C8
Abstract: SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA -
OCR Scan
HMC172QS24 800-1000M
Abstract: PACKAGE 4 THE PACKAGE BOTTOM. RF GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO -
OCR Scan
HMC135
Abstract: SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA -
OCR Scan
HMC219MS8
Abstract: MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE -
OCR Scan
HMC158
Abstract: CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 I EADS S -
OCR Scan
HMC159QS16
Abstract: GROUND MUST BE SOl DERCD OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY -
OCR Scan
HMC137
Abstract: CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 I EADS S -
OCR Scan
HMC157
Abstract: OR CONDUCT IVfcfcMOXlEO TO THF PCBRF GROUNO 1. MATERIAL: A PACKAGE BODY WHITE ALUMINA ^92% ) 6 -
OCR Scan
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