NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
2SB1537 2SD2357 - Datasheet Archive
2SB1537 Silicon PNP epitaxial planer type For low-frequency amplification Complementary to 2SD2357 M Di ain sc te on na tin nc ue
Transistor 2SB1537 2SB1537 Silicon PNP epitaxial planer type For low-frequency amplification Complementary to 2SD2357 2SD2357 M Di ain sc te on na tin nc ue e/ d Unit: mm 0.4±0.08 0.5±0.08 1.5±0.1 2.5±0.1 +0.25 0.4max. 4.00.20 +0.1 45° 1.00.2 q Low collector to emitter saturation voltage VCE(sat). Large collector power dissipation PC. Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing. 2.6±0.1 q ue pl d in an c se ed lud pl vi an m m es si tf ed ain ai fo ol t n l ht low disc dis ena ten low tp in o co n an in :// g nt n ce c g pa U in tin t e fo na RL ue ue ype typ ur so a d t d e Pr od ty ni bo yp p c. u e e uc ne t l d tl ife t/s ate cy c/ st en in cl e fo st rm ag at e. io n. q 1.5±0.1 4.5±0.1 1.6±0.2 s Features 0.4±0.04 3.0±0.15 s Absolute Maximum Ratings (Ta=25°C) 3 Parameter Ratings VCBO 10 V Collector to emitter voltage VCEO 10 V Emitter to base voltage VEBO 5 V Peak collector current ICP 1.2 A Collector current IC Collector power dissipation PC* Junction temperature Tj Storage temperature Tstg 1 Unit Collector to base voltage 1 °C 1cm2 Printed circuit board: Copper foil area of thickness of 1.7mm for the collector portion s Electrical Characteristics ce Collector to base voltage M ai nt en an Collector to emitter voltage Emitter to base voltage 1L or more, and the board nt in is /D Collector cutoff current Marking symbol : (Ta=25°C) co Parameter EIAJ:SC62 Mini Power Type Package °C 55 ~ +150 1:Base 2:Collector 3:Emitter W 150 marking A 1 Symbol Conditions min typ max Unit 1 µA ICBO VCB = 7V, IE = 0 VCBO IC = 10µA, IE = 0 10 V VCEO IC = 1mA, IB = 0 10 V VEBO IE = 10µA, IC = 0 5 V 100mA* Forward current transfer ratio hFE VCE = 2V, IC = Collector to emitter saturation voltage VCE(sat) IC = 500mA, IB = 5mA* Transition frequency fT VCB = 5V, IE = 50mA, f = 200MHz 120 Collector output capacitance Cob VCB = 5V, IE = 0, f = 1MHz 45 Pl ea * Symbol 2 200 800 0.15 V MHz pF * Pulse measurement 1 Transistor 2SB1537 2SB1537 PC - Ta IC - VCE Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. 1.0 1.0 1.4mA 1.0mA 0.6 0.6 0.6mA 0.6 0.2mA 0.2 60 80 100 120 140 160 Forward current transfer ratio hFE 25°C 25°C 0.1 0.03 0.01 0.003 1 3 10 Collector current IC (A) IE=0 f=1MHz Ta=25°C 100 80 60 40 20 0 1 3 10 10 12 0 0.4 0.8 1.2 30 480 500 Ta=75°C 400 25°C 300 25°C 200 100 0 0.01 0.03 0.1 0.3 100 Collector to base voltage VCB (V) 1.6 2.0 2.4 Base to emitter voltage VBE (V) fT - I E VCB=5V Ta=25°C f=200MHz 400 320 240 160 80 0 1 3 Collector current IC (A) Cob - VCB 120 8 VCE=2V 1 0.001 0.01 0.03 0.1 0.3 6 600 3 Ta=75°C 4 hFE - IC IC/IB=100 0.3 2 Collector to emitter voltage VCE (V) VCE(sat) - IC 10 0 0 Transition frequency fT (MHz) 40 25°C 0.8 0 20 Ta=75°C 0.4 0.4mA 0.2 0.2 Ambient temperature Ta (°C) Collector to emitter saturation voltage VCE(sat) (V) 0.8mA 0.4 0.4 0 Collector output capacitance Cob (pF) 1.2mA 25°C 1.0 IB=1.6mA 0.8 0.8 VCE=2V Ta=25°C 0 2 1.2 Collector current IC (A) 1.2 IC - VBE 1.2 Collector current IC (A) Collector power dissipation PC (W) 1.4 10 1 3 10 30 100 300 Emitter current IE (mA) 1000 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.