NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| TMS320TCI11027X27 | Texas Instruments | HARDWARE ACCELERATOR | 
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| TMS320TCI110-27X27MM | Texas Instruments | HARDWARE ACCELERATOR |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 256 PIN TAPE BGA (HEAT SPREADER TYPE) (27x27) B A A Q A1 R S T B W A2 D X C Y Index mark A S J H B G F L M P M M detail of A part E S A B *1 S *2 ITEM A K S N NOTES *1 Each ball centerline is located within 0.30 mm ( 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within 0.10 mm ( 0.004 inch) of its true position (T.P.) at maximum material condition. A1 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: 256 PIN PLASTIC BGA (27x27) A S B B A C 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D YWV U T R P N M L K J H G F E D C B A P Index mark J R I A H S F M N M S A B M S E G *1 ITEM MILLIMETERS INCHES A 27.00�20 1.063�008 B *2 detail of A part 24.0 0.945 C 24.0 0.945 D E 27.00�20 1.44 1.063�008 0.057 F 1.27 (T.P.) 0.050 (T.P.) G L 0.6�1 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution) Don't use the wild card (*) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 P22C-100-300A-1 Match Whole Word Only Match Case Find Backwards Find Cancel (Unit: mm) (1) 8 pin Package NEC Code EIAJ Code Lead pitch Packing Nominal Package dimensions height Weight Photo Mount pad Magazine Embossed Ta ... | Original |
240 pages, |
CDIP-22 MD-400 P-PGA-120 tray bga MD300-10A P32C-100-600A datasheet abstract |
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| Abstract: QFP 12x12 FPBGA 175 14x14 FPBGA 10x10 14x20 QFP 27x27 P-BGA 28x28 QFP 20x20 ... | Original |
24 pages, |
tray bga 10x10 116pin PEAK TRAY bga pcb warpage after reflow 224-pin plastic ball grid array 0.8mm FPBGA tray qfp 14x14 1.4 JIS-Z0202 116-Pin Lead Free reflow soldering profile BGA semiconductor cross index PBGA 256 reflow profile datasheet abstract |
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| Abstract: 432 PIN TAPE FBGA (HEAT SPREADER TYPE) (27x27) A W A1 S A A 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 (Q) (R) (S) (T) B (U) B (X) A2 AL AJ AG AE AC AA W U R N L J G E C A AK AH AF AD AB Y V T P M K H F D B (Y) Index area W S B J Y1 S A S (H) G B ITEM A K S F A1 (E) MILLIMETERS 27.00�20 15.11 MAX. A2 M L M S A B 15.11 MAX. ... | Original |
1 pages, |
1511 max datasheet abstract |
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| Abstract: 68 MG7xPB04 352 868 G G G Body Size (mm) 27x27 35x35 35x35 35x35 ... | Original |
22 pages, |
oki cross MSI IC application with calculation MG75P MG74P MG73P MG115P MG113P MG113P/114P/115P/73P/74P/75P MG113P/114P/115P/73P/74P/75P abstract |
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| Abstract: 225 PIN PLASTIC BGA (27x27) A S B B A C 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 D R P NM L K J HG F E DC B A P Index mark J R I A H S F L M N E M S A B M S G ITEM *2 MILLIMETERS INCHES A *1 27.00�20 1.063�008 B 0.945 24.0 0.945 D E 27.00�20 3.0 1.063�008 0.118 F 1.5 (T.P.) 0.059 (T.P.) G detail of A part 24.0 C 0.6�1 0.024 +0.004 �005 H K S 0.36 ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: 256 PIN TAPE BGA (27x27) A U B A B W A1 A2 V D X C Y Index mark J A S H B G F L E M M S A B *1 P M S *2 detail of A part N NOTES *1 Each ball centerline is located within 0.30 mm ( 0.012 inch) of its true position (T.P.) at maximum material condition. *2 Each ball centerline is located within 0.10 mm ( 0.004 inch) of its true position (T.P.) at maximum material condition. INCHES 1.063�008 A1 15.50 MAX. 0.611 MAX. 15.50 ... | Original |
1 pages, |
d 1047 datasheet abstract |
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| Abstract: (mm) 27x27 35x35 35x35 35x35 35x35 Ball Pitch (mm) 1.27 1.27 1.27 1.00 ... | Original |
20 pages, |
oki cross MG87P3/87P4/87P5 MG87P3/87P4/87P5 abstract |
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| Abstract: G MG7xMB28 588 560 148 G G G G Body Size (mm) 27x27 35x35 35x35 ... | Original |
22 pages, |
virage .spec virage oki cross MG75P MG75M MG74P MG73M ARM920T datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| ST | CHEMICAL SEMICONDUCTOR DEVICES PLASTIC BALL GRID ARRAY (PBGA) Preliminary data reference weight (mg) body (mm) packing quantity PBGA 256 2.620 27x27x2.4 TBD PBGA 532 4.010 35x35x2.4 TBD Table of main material declaration - Family representative: PBGA 256 Name of the part Material weig www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/053-v3.htm |
STMicroelectronics | 14/06/1999 | 3.05 Kb | HTM | 053-v3.htm |
| ST | CHEMICAL SEMICONDUCTOR DEVICES PLASTIC BALL GRID ARRAY (PBGA) Preliminary data reference weight (mg) body (mm) packing quantity PBGA 256 2.620 27x27x2.4 TBD PBGA 532 4.010 35x35x2.4 TBD Table of main material declaration - Family representative: PBGA 256 www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/053-v1.htm |
STMicroelectronics | 20/10/2000 | 3.22 Kb | HTM | 053-v1.htm |
| ST | CHEMICAL SEMICONDUCTOR DEVICES PLASTIC BALL GRID ARRAY (PBGA) Preliminary data reference weight (mg) body (mm) packing quantity PBGA 256 2.620 27x27x2.4 TBD PBGA 532 4.010 35x35x2.4 TBD Table of main material declaration - Family representative: PBGA 256 Name of the part Material weig www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/053-v2.htm |
STMicroelectronics | 02/04/1999 | 3.05 Kb | HTM | 053-v2.htm |
| ST | CHEMICAL SEMICONDUCTOR DEVICES PLASTIC BALL GRID ARRAY (PBGA) Preliminary data reference weight (mg) body (mm) packing quantity PBGA 256 2.620 27x27x2.4 TBD PBGA 532 4.010 35x35x2.4 TBD Table of main material declaration - Family representative: PBGA 256 Name of the part Material weig www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/053.htm |
STMicroelectronics | 21/01/1999 | 3.09 Kb | HTM | 053.htm |
| ST | Presentation | Wireless Solutions | Packages | Ball Grid Array Packages | PBGA - Plastic BGA Package Availability Plastic BGA BGA Family Packages Availability - 1.27mm pitch www.datasheetarchive.com/files/stmicroelectronics/stonline/prodpres/dedicate/wireless/technolo/pbga.htm |
STMicroelectronics | 20/07/2000 | 7.9 Kb | HTM | pbga.htm |
| DSP Hotline Techbits : Sockets for TMS320C3x Sockets for TMS320C3x TMS320C30 TMS320C30 TMS320C30 TMS320C30 - PGA EMC S18181A-03-445A S18181A-03-445A S18181A-03-445A S18181A-03-445A: 180 pin PGA wirewrap S18181A-03-445A S18181A-03-445A S18181A-03-445A S18181A-03-445A: 180 pin PGA through hole soldering Emulation Technology: AP5132QF03SC31 AP5132QF03SC31 AP5132QF03SC31 AP5132QF03SC31 : 'C30-to-'C31 socket - solders to a board like a www.datasheetarchive.com/files/texas-instruments/data/sc/docs/dsps/hotline/techbits/125a3.htm |
Texas Instruments | 08/02/1999 | 5.72 Kb | HTM | 125a3.htm |
| Cross Reference List of YAMAICHI BURN-IN SOCKET for DSP Families Cross Reference List of YAMAICHI BURN-IN SOCKET for DSP Families keywords: socket, package, pin, yamaichi, part numbers DEVICE DEVICE PIN PACKAGE PIN YAMAICHI SOCKET PART NUMBER NO. SIZE PITCH PART NUMBER - - - - - > 320C16PGL 320C16PGL 320C16PGL 320C16PGL 64 www.datasheetarchive.com/files/texas-instruments/sc/docs/dsps/hotline/socket_y.htm |
Texas Instruments | 20/12/1996 | 5.26 Kb | HTM | socket_y.htm |
| |* | Texas Instruments Incorporated | IBIS Model for GC5322 GC5322 GC5322 GC5322 Transmit Sector Solution | | Marketing part# Voltage Range Package-type #pins/pkg drawing | GC5325IZND GC5325IZND GC5325IZND GC5325IZND 3.0V - 3.6V(VDDSHV) S-PBGA 352-ball 27x27mm | 1.71V - 1.89V(VDDS/VHSTL) | 1.14V - 1.26V(VDD) |* | www.datasheetarchive.com/download/32261181-917991ZC/slam046.zip (gc5325.ibs) |
Texas Instruments | 06/08/2011 | 61.62 Kb | ZIP | slam046.zip |
| TITLEBLK TITLEBLK SIZE CONTRACT NO. APPROVALS TECHNOLOGY Milpitas, CA 95035 1630 McCarthy Blvd. LTC Confidential-For Customer Use Only CUSTOMER NOTICE LINEAR TECHNOLOGY HAS MADE A BEST EFFORT TO DESIGN A CIRCUIT THAT MEETS CUSTOMER-SUPPLIED SPECIFICATIONS; HOWEVER, IT REMAINS THE CUSTOMER'S RESPONSIBILITY TO VERIFY PROPER AND RELIABLE OPERATION IN THE ACTUAL APPLICATION. COMPONENT SUBSTITUTION AND PRINTED CIRUIT BOARD LAYOUT MAY SIGNIFICANTLY AFFECT CIRCUIT PERFORMANCE OR RELIABILITY. CONTACT www.datasheetarchive.com/download/66904533-364854ZC/1540a.zip (1360A.DSN) |
Linear | 22/09/2009 | 7133.91 Kb | ZIP | 1540a.zip |
| GND POWER Title Size Document Number Dgnd Agnd Agnd HEADER 14_3.Normal Connex 112404\gnd2_4.Normal CONN SOCKET 27x2_3.Normal 2 PIN HEADER 100 MIL PITCH.Normal CONN SOCKET 27x2_6.Normal HEADER 14_6.Normal HEADER 14_9.Normal HEADER 14_9.Normal MISO CONN SOCKET 27x2.Normal 3 PIN HEADER 100 MIL PITCH_0.Normal 3 PIN HEADER 100 MIL PITCH_3.Normal 3 PIN HEADER 100 MIL PITCH_3.Normal 3 PIN HEADER 100 MIL PITCH BIGPWR LGKPWR ALERTB OUTEN AUXSCL AUXSDA HEADER 27X2_0.Normal HEADER 14_1.Normal CONN SOCKET 2 www.datasheetarchive.com/download/57707030-364831ZC/1508a.zip (DC1508A.DSN) |
Linear | 25/01/2010 | 1436.79 Kb | ZIP | 1508a.zip |