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Part : 27C64-12 Supplier : Major Brands Manufacturer : Jameco Electronics Stock : 336 Best Price : $3.85 Price Each : $4.49
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27C64-12/P Datasheet

Part Manufacturer Description PDF Type
27C64-12/P Microchip Technology 64k (8k x 8) CMOS EPROM Original
27C64-12/P Microchip Technology 64K (8Kx8) CMOS EPROM Original
27C64-12P Microchip Technology 64K (8K x 8) CMOS EPROM Original

27C64-12/P

Catalog Datasheet MFG & Type PDF Document Tags

EPROM AMD

Abstract: VSOP 28 27C512-20/P AMD Part Number Description Microchip Part Number Am27C64-120JC OTP 64K EPROM,120NS PLCC 32 27C64-12/L Am27C64-120PC OTP 64K EPROM,120NS PDIP 28 27C64-12/P , -10 OTP 256K EPROM,100NS PDIP 28 27C256-10/P HN27C256FP-10T* OTP 256K EPROM,100NS SOIC 28 , PDIP 28 27C64-15/P Am27C64-200JC OTP 64K EPROM,200NS PLCC 32 27C64-20/L Am27C64-200PC OTP 64K EPROM,200NS PDIP 28 27C64-20/P Am27C64-250JC OTP 64K EPROM,250NS PLCC 32
Microchip Technology
Original
EPROM AMD VSOP 28 TC54256AF NM27C256N120 27c256-20 TEXAS INSTRUMENTS 27c256-15 TEXAS INSTRUMENTS HN27C256A DS11178C- AT27C512R-90 27C512A

TMSC512

Abstract: NM27C64 PDIP 28 27C64-12/P Am27C64-150JC OTP 64K EPROM,150NS PLCC 32 27C64-15/L Am27C64-150PC OTP 64K EPROM,150NS PDIP 28 27C64-15/P Am27C64-200JC OTP 64K EPROM,200NS PLCC 32 27C64-20/L Am27C64-200PC OTP 64K EPROM,200NS PDIP 28 27C64-20/P Am27C64-250JC OTP 64K EPROM,250NS PLCC 32 27C64-25/L Am27C64-250PC OTP 64K EPROM,250NS PDIP 28 27C64-25/P , ,IND PDIP 28 27C64-15I/P Am27C64-200JI OTP 64K EPROM,200NS,IND PLCC 32 27C64-20I/L
Microchip Technology
Original
TMSC512 NM27C64 d8763-1 eprom AT27C256R-20PI 27c512a-20 27c512a-20ip DS11178D- TC57256A

NM27C64Q

Abstract: M27C128A-15F6 MICROCHIP P/N 27C256-10/J 27C256-10/P 27C256-KVSO 27C256-12/J 27C256-15/J 27C256-20/SO 27C512-20/J 27C512-20/P 27HC256-70/J 27HC256-7Q/P 27HC256-7Q/SO MICROCHIP P/N 27C64-12/J 27C64-12/K 27C64-12/L 27C64-12/P 27C64-15/J 27C64-15/K 27C64-15/L 27C64-15/P 27C64-20/J 27C64-2WK 27C64-20/L 27C64-20/P 27C64-25/J 27C64-25/K 27C64-25/L 27C64-25/P 27C64-12I/J 27C64-151/J 27C64-15I/K 27C64-15I/L 27C64-15I/P 27C64-20I/J 27C64-20I/K 27C64-20I/L 27C64-20I/P 27C64-251/J 27C64-251/K 27C64-25I/L 27C64-25I/P 27C128-12/J 27C128-12/K
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OCR Scan
NM27C64Q M27C128A-15F6 Am27C512-1500C NM27C64Q150 M27C128A-12F1 NM27C64Q-150 DS11178B-

ic 27c64

Abstract: 27C64 PACKAGE TYPE DIP/SOIC Vpp C · 1 A12C 2 A7 3 26 Vcc 27 p g m 26 n c 25 H a s 24 23 21 20 , voltages w.r.t. V s s . -0.6V to + 7.25V V pp voltage w.r.t. V s s during p rogra m m in g , . V s s . -0.6V to V c c + 1 .0V Storage te m p e ra tu re . -65"C to +150'C A m bient temp, w ith pow er a p p lie d .-6 5` C to +125` C ·Notice: Stresses , 2: V c c m ust be applied before V p p , and be removed simultaneously or after V pp .
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OCR Scan
ic 27c64 A0-A12 DS11107J-
Abstract: 27C64 AC Testing Waveform: Qutput Load: REA D O P E R A TIO N AC C h aracteristics Parameter , 70 70 75 100 ns CÃ' = Vil CE or OE to O/P High Impedance tOFF 0 60 ns , 6.5V ± 0.25V, V p p = V h = 13.0V ± 0.25V PR O G R A M M IN G DC C haracteristics Parameter , Characteristics) 0 0 -0 7 Read VlL VlL VlH Vcc X VlL VlH VlL Vh X D in P , the proper level, V p p is at the proper V h level, the CE line is low, the PGM line is high, and -
OCR Scan
DS11107H-
Abstract: packages. U.V. erasable versions are also available. - 2 8 - p in SOIC package â'" Tape and reel , A12 c i 2 A7 c i 3 3 Vcc 27 D p g m 26 H NC 28 01 c 12 0 2 C 13 17 D 0 5 V ssC 14 , ¡ !g ¡ ooliooo PLCC/LCC 26 P u Vcc 27 = b PGM 26 = b NC A6 c i 4 A5 c i 5 25 A8 , perature. -65" C to 150" C Ambient temp, with power a p p lie d -65' C to 125 , Automotive: T a m b = - 4 0 'C to 1 2 5 'C R E A D O P E R A T IO N D C C h a ra c te ris tic s Part -
OCR Scan
DS11107F-6 DS11107F-7 DS11107F-8

loo8

Abstract: >oo8 , Vcc = 5.5V; V p p =Vcc; f = 1MHz; OE = CE = V il; lout = 0mA; VlL= -0.1 to 0.8 V; VlH= 2.0 to Vcc , ASPECT DEVELOPMENT, INC. 1994. g2 © 1993 Microchip Technology Inc. MCHPD001 27C64 REA D O P E , Parameter Address to Output Delay tACC CE to Output Delay OE to Output Delay CE or OE to O/P High , ICC2 IPP2 0.45 20 25 11.5 12.5 V V mA mA V Vcc Current, program & verify V p p Current
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OCR Scan
loo8 1107H-
Abstract: . -0.6V to V c c + 1.0V Storage te m p e ra tu re .-6 5 'C to +150` C , Output Delay OE to Output Delay Ü E or Ü E to O/P High Impedance Output Hold from Address CE or OE , refer to the factory or the listed sales offices. 27C64 - 25 I /P L P SO Blank I 12 15 17 20 25 27C64 = = = = = = = = = Plastic Leaded Chip Carrier Plastic DIP (600 Mil) P lastic SOIC (300 Mil) 0 C to -
OCR Scan
DS11107L-

km27c64

Abstract: 27C64 hitachi CE to Output Delay OE to Output Delay CE or ÒE to O/P High Impedance Output Hold from Address CE or , appears on 00 through 07. P in - Identity I Input Output O 0 1 0 H e X c) the CE pin is low , factory or the listed sales offices. PART NUMBERS 27C64 - 25 I / K J K L P SO TS Cerdip Ceramic Leadless
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OCR Scan
27C64-1 27C64-15 27C64-17 27C64-2 27C64-20 27C64-25 km27c64 27C64 hitachi i2764 Hitachi Scans-001

27C64 8k EPROM

Abstract: 27c64 uv eprom Delay ÜE to Output Delay ÜE or ÜE to O/P High Impedance Output Hold from Address ÜE or ÖE, whichever , MODES CE VlL VlL VlL VlH VlH VlL VlL 5E VlL VlH VlL X X VlH VlL P S fil VlH VlL VlH X X VlH VlH , 13.010.25V ADDR = First Location Vcc = 6.5V V p p = 13.0V Yes Increment Address Vcc = V pp = 4.5V , the listed part numbers, and refer to the factory or the listed sales offices. 27C64 25 I /P rr _ Package: i Temperature Range: Access Time: - 1 Device: L = P = SO = Blank = I = 12 = 15 =
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OCR Scan
27C64 8k EPROM 27c64 uv eprom DS111071-

27C64 8k EPROM

Abstract: £ z o o o - CV » ^ n 9 *£? ·P in 1 indicator on PLCO on top of package * See 27C64 , . V s s . -0.6V to V cc +1,0V Storage te m p e ra tu re .-6 5' C to 150' C Am bient temp, with power a p p lie d -6 5' C to 125' C Function Address Inputs , affect device reliability. REA D O P E R A TIO N DC C h aracteristics V c c = +5V ±10% Comm ercial , Power; X = Industrial Tem p Range; Notes: (1 ) AC Power com ponent above 1 MHz; 8m A up to maxim um
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OCR Scan

DS60011

Abstract: maxim 27c64 OE to O/P High Impedance tOFF Output Hold from Address CE or OE, whichever occurs first , Logic" 1â' Logicâ'0â' P ara m ete r Conditions Ili -10 10 HA Logicâ , before V p p and removed simultaneously or after V p p . TABLE 1-5: PROGRAMMING AC CHARACTERISTICS , Chip Carrier L Plastic Leaded Chip Carrier P Package: Plastic DIP SO I Temoerature
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OCR Scan
DS60011 maxim 27c64 DS11107D-6 DS11107D-7 DS11107D-8
Abstract: 100 ns CE = VIL CE or OE to O/P High Impedance tOFF 0 50 0 50 0 50 0 , numbers, and refer to the factory or the listed sales offices. 27C64 ­ 25 I /P Package: Temperature Range: L = Plastic Leaded Chip Carrier P = Plastic DIP (600 Mil) SO = Plastic SOIC (300 Mil -
OCR Scan

27C64 8k EPROM

Abstract: 27C64 Microchip Technology Inc. 3V 10MHz 2.7V P I C 1 6 L C X X - 0 4 100KHz 5V P I C 1 6 C X X - 0 4 4MHz 5V P I C 1 6 C X X - 1 0 8MHz 5V P I C 1 6 C X X - 2 0 11MHz 5V , MH z CR IC S Hz M * Vcc *(V ) 3 V,W DT -off ,Ty p , ,Ty p Hz, Typ 5 V,4 M B OR , I/0 Vcc *(V ) / 3 V,W DT -off ,Ty p mA Hz, Typ es
Microchip Technology
Original
27C64 microchip 200B eprom 27c64 PROGRAMMER CIRCUIT 11F-3 DK-2750 D-81739

16F866

Abstract: 12f675 oo / ! » Ijn ijo jlS * - J jü lì r i i f i I D Li A B ;J LU A 9 J p i A11 [n NC =! 5J , removed simultaneously or after V p p . DSl1107K-page 2 © 1995 Microchip Technology Inc. blD32Dl , tCE â'" à E to Output Delay tOE C E or à E to O/P High Impedance Output Hold from , current will drop from 20 m A to 100 p A Verify After the array has been programmed it must be , : PROGRAMMING EXPRESS ALGORITHM Conditions: Tant> - 25'C ±5 'C Vcc - 6 .5 10.25V V p p - 1 3 . 0 Â
Microchip Technology
Original
16F866 12f675 16F867 ST T8 3560 12C519 12F676 US100 DS00031K-J02 27LV256-30 27LV256-25 27LV256-20 32AY0438
Abstract: . Tape and reel packaging is also available - 2 8 - p in TSOP package for PLCC or SOIC packages , to V cc + 1.0V Storage te m p e ra tu re . -65' C to 150' C Ambient temp, with power a p p lie d -65' C to 125' C â'˜ Notice: Stresses above those listed under â'Maximum , : R E A D O P E R A T .O N AC C h aracteristics Qutput Lo^d: 1 TTL Load + 100 pF |np Ut R is e anc| p an Times: 10nsec Am bient Tem perature: Parameter V i h = 2.4V and V i l = 0.45V; V -
OCR Scan
Abstract: '" 65 CE or ÃE to O/P High Impedance tOFF 0 50 Output Hold from Address CE or OE , NUMBERS 27C64 - 25 I / K T Package: J K L P SO TS Temperature Range: I E Access , thermally enhanced) L = PLCC (Plastic Leaded Chip Carrier) P = Plastic S = Die in Waffle Pack W = , ' M $ PACKAGING ic r o c h ip TABLE OF CONTENTS (Cont'd) SECTION 2: PLASTIC A. P la stic Dual In-Line Package ("P , SP" Case O utlin es) Symbol List for Plastic Dual In-Line Package -
OCR Scan
DS11107G-6 DS11107G-7 DS11107G-8
Abstract: - 75 - 100 ns CE = VIL CE or OE to O/P High Impedance tOFF 0 50 0 , the factory or the listed sales offices. 27C64 - 25 I /P Package: Temperature Range: L P SO I Access Time: 12 15 17 20 25 Device: 27C64 Plastic Leaded Chip Carrier -
OCR Scan
001DS11 DS00049E

27C64

Abstract: eprom 27c64 PROGRAMMER CIRCUIT 100 ns CE = VIL CE or OE to O/P High Impedance tOFF 0 50 0 50 0 50 0 , numbers, and refer to the factory or the listed sales offices. 27C64 ­ 25 I /P Package: Temperature Range: L = Plastic Leaded Chip Carrier P = Plastic DIP (600 Mil) SO = Plastic SOIC (300 Mil
Microchip Technology
Original
10F-1C DS11107K-
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