NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Axials and Radials 260°C Wave Ceramic Commercial Molded Axials and Radials 260°C Wave Tantalum Through Hole 260°C Wave Product Type Ceramic MLCC Chip 260°C Reflow Tantalum MnO2 260°C Reflow KO-CAP Conductive Polymer, T520, T530 260°C* Reflow AO CAP Aluminum, A700 PWC = 605, 260°C PWC < 605, 250°C Reflow KO-CAP Conductive Polymer, T525 250°C Reflow *Note · T520, T530 V-case product 260°C capable since print week code (PWC) 501. All other ... | Original |
1 pages, |
T525 T520 Kemet T525 A700 equivalent A700 datasheet abstract |
|
|||
| Abstract: -260-CY peak temperature peak temperature Pb Cd Hg Cr6 PBB & PBDE Sn, Cu yes - yes - 260°C no no no no no MQ1 (UM-1) Sn, Cu or Au yes - yes - 260°C no no no no no MQ5 (UM-5) Sn, Cu or Au yes - yes - 260°C no no no no no Sn yes 7 EFUP 50 * - 260°C y no no no no MTF38 MTF38 Pb / Sn , EFUP 50 * 260°C / 10 sec - y no no no no SMQ32xx Sn, Cu yes 7 EFUP ... | Original |
1 pages, |
SM26F MTF38 JCO923-926 HC49 smd MTF32 MMTF32 JT75 HC49/U HC49/U abstract |
|
|||
| Abstract: Reject Duration Dev. Hrs. +260C Sn 0648 76 0 2000 152000 +260C Sn/Pb , 5.0YS 5A08813M29 5A08813M29 SOT223 L3 +260C Sn 0603 76 0 1000 76000 MIC37139 MIC37139 2.5BS , Plating Date Code MIC39100 MIC39100 3.3WS 7A49637 7A49637 SOT223 PREC.L3 +260C Sn 0813 90 0 MIC37139 MIC37139 1.8YS 6A22851M09 6A22851M09 SOT223 PREC.L3 +260C Sn 0648 176 0 MIC37138 MIC37138 2.5BS 6A31921M70 6A31921M70 SOT223 PREC.L2 +260C Sn/Pb 0647 176 0 MIC5200 MIC5200 5.0YS 5A08813M29 5A08813M29 ... | Original |
2 pages, |
prec MIC5200 MIC39100 MIC37139 50ys SOT223 MIC5239-3.3YS MIC37138 6A22851M09 6A31921M70 5A08813M29 2A06033M04 MIC5239 7A49637 4A44637M07 MIC37139 abstract |
|
|||
| Abstract: +260C +260C +260C +260C +260C +260C n/a +260C n/a +260C n/a n/a Sn Sn Sn Sn Sn Sn Sn , PREC.L3 PREC.L3 PREC.L3 PREC.L3 PREC.L3 PREC.L3 PREC.L3 PREC.L3 PREC.L3 +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C Sn Sn Sn Sn Sn Sn Sn Sn Sn Sn ... | Original |
2 pages, |
sn 0542 MIC69502 MIC69302 MIC49500 MIC49200 MIC49150 MIC37302 CARSEM 0545 MIC49150 abstract |
|
|||
| Abstract: 3.3BU A203232MEA A203232MEA TO-263-5 n/a MIC29151 MIC29151 3.3WU 3A18105M09 3A18105M09 TO-263-5 n/a Peak Temp Plating +260C Sn +260C Sn n/a Sn/Pb n/a Sn Date Code 0650 0617 0419 0343 SS 100 76 76 76 328 # , MIC2171 MIC2171 WU MIC39300 MIC39300 2.5WU 3A37205M01 3A37205M01 MIC29151 MIC29151 3.3WU 3A18105M09 3A18105M09 Peak Temp +260C +260C +260C +260C +260C +260C +260C +260C Plating Sn Sn Sn Sn/Pb Sn/Pb Sn Sn Sn Date Code 0650 0617 ... | Original |
2 pages, |
MIC29201 MIC2941A 0617 0343 MIC29151 MIC29302 TO263-5 6A04417 6A10125MEB A203232MEA 3A18105M09 MIC29302 abstract |
|
|||
| Abstract: L1 n/a n/a n/a n/a n/a n/a n/a +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C n/a n/a n/a n/a n/a n/a NiPdAu Sn Sn Sn Sn Sn NiPdAu , L2 L1 L1 L1 L1 +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C NiPdAu Sn Sn Sn , n/a n/a n/a n/a +260C +260C +260C +260C +260C +260C +260C n/a n/a n/a n/a n/a n/a ... | Original |
6 pages, |
SY87701VSH 6A1000 MIC2186 MIC2951 MIC38C43 mic38c43ym MIC4123 MIC4127 MIC4680 MIC4684 MIC69153 SY100EL16VZG SY100ELT22LZG SY100ELT22LZI 0549E SY100EL16VZG abstract |
|
|||
| Abstract: L1 L1 L1 L1 n/a n/a n/a n/a n/a L1 L1 L1 n/a n/a n/a n/a n/a +260C +260C +260C +260C +260C +260C n/a n/a n/a n/a n/a +260C +260C +260C n/a n/a n/a n/a n/a NiPdAu , PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C NiPdAu NiPdAu NiPdAu NiPdAu Sn Sn Sn Sn Sn Sn Sn Sn Sn Sn Sn Sn ... | Original |
5 pages, |
TSOT-23-5 8A550 c 2474 MIC2005M MIC2007 MIC2013 MIC2016 MIC2514 MIC280 MIC5255 MIC5301 sot23-6 ss 211 SOT-23-6 7A05 TSOT-23 MIC2005A TSOT-23 abstract |
|
|||
| Abstract: QUAD FLAT L-LEADED PACKAGE 260 PIN CERAMIC FPT-260C-A02 Lead pitch 0.51/0.76mm Lead shape Gullwing Sealing method Metal seal 260-pin ceramic QFP (FPT-260C-A02) 260-pin ceramic QFP (FPT-260C-A02) 0.76(.030) 0.71(.028) 0.20(.008) 0.51(.020) INDEX AREA 37.08(1.46) 17.70±0.10 (.70±.004) 40.41(1.59) TYP. "A" 0.75(.030) MIN. 1.52±0.15 (.060±.006) 4.19(.165) MAX. 4.06(.160) 3.56(.140) 41.15±0.51(1.62±0.02) 43.69±0.51(1.72±0.02) Details of ... | Original |
1 pages, |
FPT-260C-A02 FPT-260C-A02 abstract |
|
|||
| Abstract: Date Code SS # Reject Dev. Hrs. +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C NiPdAu NiPdAu NiPdAu Sn Sn Sn Sn Sn NiPdAu Sn Sn Sn Sn NiPdAu Sn , 74000 76000 76000 76000 1211 0 1211000 +260C Pre-conditioning Test 3x Reflow Cycles , PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 PREC.L1 +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C +260C ... | Original |
4 pages, |
SY88903VKG MIC2169A MIC3775 MIC384 MIC4830 MIC5239 MICRF112 MSOP ss 211 SY100EPT22VKG SY88345BLEY SY88903VKC MIC2159 msop10 MSOP-10 MIC3775 abstract |
|
|||
| Abstract: rating for this package from MSL1 at 260C to MSL4 at 260C. PRODUCT AFFECTED The products affected by , ISSUE Lot to lot variation in Moisture Sensitivity Level performance at 260C in 28 lead, 330mil SOIC , performance between lots at the 260C reflow temperature at the MSL1 rating, based on the J-STD-020C J-STD-020C specification. As of this date there have been no reported field failures from customers using the 260C peak , not perform consistently at 260C reflow temperatures. While most lots meet the MSL1 requirement at ... | Original |
1 pages, |
PCN10023 PCN10023 abstract |
|
|||
| Abstract: Farnell Order Code : 8637520 Manufacturer Part Number : 91-9550-10 Product Description : PFA TYPE J FP 7/0.2mm X 25M Conductor Size : 7/0.2mm Insulation Material : PFA Reel Length : 25M Temperature Rating : -75 to +260°C ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: Farnell Order Code : 8637555 Manufacturer Part Number : 91-9553-10 Product Description : PFA TYPE J FP 7/0.2mm X 100M Conductor Size : 7/0.2mm Insulation Material : PFA Reel Length : 100M Temperature Rating : -75 to +260°C ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: Farnell Order Code : 8637563 Manufacturer Part Number : 91-9554-10 Product Description : PFA TYPE K FP 7/0.2mm X 100M Conductor Size : 7/0.2mm Insulation Material : PFA Reel Length : 100M Temperature Rating : -75 to +260°C ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: Farnell Order Code : 8637580 Manufacturer Part Number : 91-9555-10 Product Description : PFA TYPE T FP 7/0.2mm X 100M Conductor Size : 7/0.2mm Insulation Material : PFA Reel Length : 100M Temperature Rating : -75 to +260°C ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: Farnell Order Code : 8637547 Manufacturer Part Number : 91-9552-10 Product Description : PFA TYPE T FP 7/0.2mm X 25M Conductor Size : 7/0.2mm Insulation Material : PFA Reel Length : 25M Temperature Rating : -75 to +260°C ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: SW51*G SW52*G Soldering Process SW53*G SW62*G SW63*G RoHS Compliant / Lead Free. See solder profile. SW 52 10 G RoHS Complient Package Outline and Pin Connections Solder Profile Temperature 260°C 260°C 220°C 180°C 150°C 120°C 0 120 S Max. Dimensional Tolerance: ±.005 (.127mm) SW052 SW052 00 09/13/08 GD Time 10 S 60 S Max. 360 Sec. Max. ... | Original |
1 pages, |
SW63 SW62 datasheet abstract |
|
|||
| Abstract: Soldering Profile for Bourns Lead-Free Chip Inductors and Power Chokes 275 Maximum of 10 seconds between +255°C and +260°C 260°C peak 255°C 225 220°C Temperature (°C) 190°C 60 seconds maximum 175 Ramp Down 5°C/second 150°C 125 120 - 150 seconds 10 seconds minimum 75 Ramp Up 4°C/second maximum 25 0 50 100 150 Time (seconds) 200 250 300 ... | Original |
1 pages, |
datasheet abstract |
|
|||
| Abstract: Lead-free(Pb-free) Reflow Profile Peak Temperature 260(E) 300 C 200 D 100 A F B sec Reflow Profile Peak Temp. Heat-up(A) Pre-heat(B) Heat-up(C) Maintain(D) Reflow peak(E) Cooling down(F) Max. 260'C 1~3'C/sec 160~190'C Max. 120sec 1~3'C/sec Max. 50sec (Over 220'C) Max. 260'C Max. 10sec 1~3'C/sec ... | Original |
1 pages, |
reflow profile datasheet abstract |
|
|||
| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
|||||
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/21eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 21eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/23eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 23eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/25eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 25eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/28eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 28eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 100°C 60sec Max. Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/poc6eso.txt |
Murata | 14/07/2000 | 0.83 Kb | TXT | poc6eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/22eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 22eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/26eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 26eso.txt |
| 1. Soldering condition (Flow soldering) Pre-heat temp. : 80-100°C Soldering temp. : 260°C Max. Dipping time : 3sec Max. (Soldering iron) Soldering temp. : 300°C Max. Soldering time. : 3sec Max. Wattage of iron : 40W Max. Before using other soldering conditions more than those listed above, please consult with Murata factory representative prior to using. If the soldering conditions are not suitable www.datasheetarchive.com/files/murata/products/data/a00x/27eso.txt |
Murata | 14/07/2000 | 0.82 Kb | TXT | 27eso.txt |
| RVG4 Soldering 1.Standard soldering condition for soldering iron. Temperature of tip : 260°C±10°C Soldering time : 3sec.MAX. Diameter : 2mm MAX. Wattage of iron : 30W MAX. Before using other soldering conditions than those listed above,please consult with Murata factory representative prior to using. If the soldering conditions are not suitable,e.g.,excessive time and /or excessive temperature,the potentiometer may de- viate from www.datasheetarchive.com/files/murata/products/data/a00x/11eso.txt |
Murata | 08/10/1996 | 0.98 Kb | TXT | 11eso.txt |
| temperature for Sn/Pb, which is between 220-235 o C. Impact of 260°C Peak Reflow One major impact on NEMI 260° C Reflow Profile Packaging | Lead-Free Status | What's driving the move www.datasheetarchive.com/files/national/htm/nsc00057-v1.htm |
National | 16/08/2002 | 11.25 Kb | HTM | nsc00057-v1.htm |
| NTE Electronics Part | Industry Part |