NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Package Diagrams Ball Grid Array Packages 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115 1 Package Diagrams 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 2 Package Diagrams 352-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103 3 ... | Original |
3 pages, |
BG352 BG256 BG119 BG119 abstract |
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| Abstract: Package Diagram Ball Grid Array Packages 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 1 ... | Original |
1 pages, |
BG256 BG256 abstract |
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| Abstract: Package Diagram L2 Ball Grid Arrays 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256 BL256 51-85123-*E 1 Package Diagram 304-Lead L2 Ball Grid Array (31 x 31 x 1.57 mm) BL304 BL304 51-85154-*B 2 Package Diagram 504-Lead L2 Ball Grid Array (37.50 x 37.50 x 1.57 mm) BL504 BL504 51-85147-*B 3 ... | Original |
3 pages, |
BL304 BL256 BL256 abstract |
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| Abstract: Package Diagrams Ball Grid Array Packages 119-Lead PBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115-*A 1 Package Diagrams 209-Lead PBGA (14 x 22 x 2.20 mm) BG209 BG209 51-85143-*A 2 Package Diagrams 256-Lead PBGA (27 x 27 x 2.33 mm) BG256 BG256 51-85097-*A 3 Package Diagrams 272-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG272 BG272 51-85130 4 Package Diagrams 388-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103-*B 5 Package Diagrams 456-Lead Ball Grid Array (35 x ... | Original |
7 pages, |
Package Diagrams BG352 BG256 BG-209 Diagrams BG119 BG119 abstract |
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| Abstract: * (Â40° to 85°C) 300 XPC823 XPC823 256-Lead ZT 66, 75, 81 B2T Portable System MPU XPC823 XPC823 256-Lead ZC 66, 75, 81 B2 CZC66 CZC66 0 XPC832 XPC832 256-Lead VF 66, 75, 81 B2 CVF66 CVF66 0 XPC823E XPC823E 256-Lead ZT 66, 75 B2 ON C MI CZT66 CZT66 0 SE 300 420 Description Integrated MPU for mobile computing. 256-lead ZT is the preferred package. 823E has 16 KI cache and 8 KD , XPC850 XPC850 256-Lead ZT 50, 66, 80 BU XPC850DE XPC850DE 256-Lead ZT 50, 66, 80 BU XPC850SR XPC850SR ... | Original |
12 pages, |
XPC855T MC68824 motorola zc XCC501RX166LD0B XCC501RX200LD0B XPC180 XPC8260A "motorola computing group" XPC832 XPC823E datasheet abstract |
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| Abstract: 7/98 Advance Information MPC850 MPC850 Mechanical Data and Ordering Information This document contains mechanical data and ordering information for the MPC850 MPC850. Table 1. Ordering Information Frequency (MHz) Temperature Order Number 256-Lead Plastic Ball Grid Array 0-33 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array 0-50 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array 0-66 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array TBD Jct Temp:-40°C to ... | Original |
6 pages, |
AN1231 IPB1 MOTOROLA d11 MOTOROLA D26 MPC850 pb28 XPC850DHZT33A xpc850SRZT50A XPC850DCZT33A XPC850SEZT33 MPC850 abstract |
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| Abstract: SECTION 23 MECHANICAL DATA AND ORDERING INFORMATION 23.1 ORDERING INFORMATION PACKAGE TYPE FREQUENCY (MHz) TEMPERATURE ORDER NUMBER 256-Lead Plastic Ball Grid Array with 1.27mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZT25 XPC823ZT25 XPC823ZT50 XPC823ZT50 XPC823CZT25 XPC823CZT25 256-Lead Plastic Ball Grid Array with 1.00mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZC25 XPC823ZC25 XPC823ZC50 XPC823ZC50 XPC823CZC25 XPC823CZC25 23 MECHANICAL DATA AND ORDERING INFORMATION ... | Original |
6 pages, |
PC14 PB28 MPC823 127mm MPC823 user manual XPC823ZT25 XPC823ZT50 XPC823CZT25 XPC823ZC25 XPC823ZC50 XPC823CZC25 XPC823ZT25 abstract |
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| Abstract: 160-pin TQFP, 208-pin PQFP and 256-lead BGA packages · Pinout compatible with all other Ultra37000 , Quad Flatpack 256-Lead Ball Grid Array CY37256P160-125AC CY37256P160-125AC A160 160-Pin Thin Quad Flatpack CY37256P208-125NC CY37256P208-125NC N208 208-Pin Plastic Quad Flatpack CY37265P256-125BGC CY37265P256-125BGC BG256 BG256 Commercial 256-Lead , Quad Flatpack 256-Lead Ball Grid Array CY37256P160-83AI CY37256P160-83AI A160 160-Pin Thin Quad Flatpack ... | Original |
15 pages, |
ieee1149.1 cypress CY37256P160-125AI datasheet abstract |
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| Abstract: 10-bit-serdes CYP32G0401DX CYP32G0401DX 256-Lead Ball Grid Array (256 L2BGA) Top View 1 2 3 4 5 6 A DGND , Diagram 256-Lead Ball Grid Array (27 x 27 x 1.57 mm)256 L2BGA 51-85123 Infiniband is a trademark of ... | Original |
5 pages, |
CYP32G0401DX TXPA serdes 8b 10b CYP32G0401DX abstract |
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| Abstract: . 22 256-Lead PBGA Package - Signal Name Order. 24 256-Lead PBGA Package - Ballpad Number Order . 27 Thermal , PCI-X to Serial ATA Controller Pinout." In Table 10, "256-Lead PBGA Package - Signal Name Order" , SCS# (for Ball C2); replaced RFU with SDI (for Ball E6). In Table 11, "256-Lead PBGA Package - , Serial ATA Controller Package Information Table 11. 256-Lead PBGA Package - Signal Name Order ... | Original |
37 pages, |
REQ64 31244 package ata controller B0418 B0419 GD31244 S PAR64 31244 intel 31244 GD31244 datasheet abstract |
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| Abstract: CA2E 256P6K-E 256P6K-E Plastic 256pin 28!28mm body HQFP EIAJ Package Code HQFP256-P-2828-0 HQFP256-P-2828-0.40 Weight(g) JEDEC Code  Under Planning HD D 256 Lead Material Cu Alloy 193 E HE 192 1 Symbol 64 129 128 65 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters Min Nom Max   3.7 0.13 0.25 0.05   3.37 0.13 0.16 0.21 0.13 0.15 0.2 27.9 28.0 28.1 27.9 28.0 28.1 ... | Original |
1 pages, |
HQFP256-P-2828-0 256P6K-E 256P6K-E abstract |
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| Abstract: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M04 FPT-256P-M04 Lead pitch 0.50mm Package width Ã- package length 40 Ã- 40mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50mm Target use 256-pin plastic QFP For hybrid ICs (FPT-256P-M04 FPT-256P-M04) 256-pin plastic QFP (TYPE AA) (FPT-256P-M04 FPT-256P-M04) 4.40(.173)MAX 42.60±0.30 SQ (1.677±0.12) 40.00±0.30 SQ (1.575±0.12) 192 (Mounting height) 0(0)MIN. (STAND OFF) 129 193 ... | Original |
1 pages, |
FPT-256P-M04 FPT-256P-M04 abstract |
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| Abstract: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC FPT-256P-M04 FPT-256P-M04 256-pin plastic QFP Lead pitch 0.50 mm Package width Ã- package length 40 Ã- 40 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50 mm Target use For multichip module (FPT-256P-M04 FPT-256P-M04) 256-pin plastic QFP (TYPE AA) (FPT-256P-M04 FPT-256P-M04) 42.60±0.30 SQ (1.677±0.12) 40.00±0.30 SQ (1.575±0.12) 192 4.40(.173)MAX (Mounting he ... | Original |
1 pages, |
FPT-256P-M04 FPT-256P-M04 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| ) SA-1110 SA-1110 SA-1110 SA-1110 Microprocessor (mBGA) 256 Lead (mBGA) 256 Lead GD (mBGA) 256 Lead DE (mBGA) 256 Lead DE www.datasheetarchive.com/files/intel/products two & tools/design/strong/packdata/index.htm |
Intel | 06/05/1999 | 25.11 Kb | HTM | index.htm |
| swings. The AD8152 AD8152 AD8152 AD8152 is offered in a 256-lead SBGA package that operates over the industrial temperature www.datasheetarchive.com/files/analog-devices/doc/productdescriptions/2008.html |
Analog Devices | 1.69 Kb | HTML | 2008.html | |
| swings. The AD8152 AD8152 AD8152 AD8152 is offered in a 256-lead SBGA package that operates over the industrial temperature www.datasheetarchive.com/files/analog-devices/gendesc/1899.htm |
Analog Devices | 05/06/2003 | 1.76 Kb | HTM | 1899.htm |
| ) SUPER-BGA, 192/256 Lead HC(192), HF(256 www.datasheetarchive.com/files/maxim/0000/packinfo.htm |
Maxim | 04/04/2001 | 23.18 Kb | HTM | packinfo.htm |
| AVAILABILITY The MC92500 MC92500 MC92500 MC92500 ATM Cell Processor is packaged in a space-saving 256- lead, perimeter ball-grid array www.datasheetarchive.com/files/motorola/design-n/home2/press/html/pr960_47.htm |
Motorola | 25/11/1996 | 10.43 Kb | HTM | pr960_47.htm |