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Part Manufacturer Description PDF Samples Ordering
LFBGAINTPS1C Freescale Semiconductor PB-FREE 256 PIN 1.0 BGA ri Buy
LFBGADAS1C Freescale Semiconductor PB-FREE 256 PIN 1.0 MM Z ri Buy
LFBGAMS1C Freescale Semiconductor PB-FREE 256 PIN 1.0 PGA ri Buy

256-Lead

Catalog Datasheet Results Type PDF Document Tags
Abstract: Package Diagram Ball Grid Array Packages 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 1 ... Original
datasheet

1 pages,
260.97 Kb

BG256 BG256 abstract
datasheet frame
Abstract: Package Diagrams Ball Grid Array Packages 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115 1 Package Diagrams 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 2 Package Diagrams 352-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103 3 ... Original
datasheet

3 pages,
654.34 Kb

BG352 BG256 352-LEAD BG119 BG119 abstract
datasheet frame
Abstract: Package Diagram L2 Ball Grid Arrays 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256 BL256 51-85123-*E 1 Package Diagram 304-Lead L2 Ball Grid Array (31 x 31 x 1.57 mm) BL304 BL304 51-85154-*B 2 Package Diagram 504-Lead L2 Ball Grid Array (37.50 x 37.50 x 1.57 mm) BL504 BL504 51-85147-*B 3 ... Original
datasheet

3 pages,
816.62 Kb

BL304 BL256 BL256 abstract
datasheet frame
Abstract: Package Diagrams Ball Grid Array Packages 119-Lead PBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115-*A 1 Package Diagrams 209-Lead PBGA (14 x 22 x 2.20 mm) BG209 BG209 51-85143-*A 2 Package Diagrams 256-Lead PBGA (27 x 27 x 2.33 mm) BG256 BG256 51-85097-*A 3 Package Diagrams 272-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG272 BG272 51-85130 4 Package Diagrams 388-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103-*B 5 Package Diagrams 456-Lead Ball Grid Array (35 x ... Original
datasheet

7 pages,
1795.42 Kb

Package Diagrams BG352 BG256 BG-209 BG-272 5185143 Diagrams BG119 BG119 abstract
datasheet frame
Abstract: Package Diagrams Ball Grid Array Packages 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115 1 Package Diagrams 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 2 Package Diagrams 272-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG272 BG272 51-85130 3 Package Diagrams 352-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103 4 ... Original
datasheet

4 pages,
1043.99 Kb

BG-272 BG119 BG119 abstract
datasheet frame
Abstract: * (­40° to 85°C) 300 XPC823 XPC823 256-Lead ZT 66, 75, 81 B2T Portable System MPU XPC823 XPC823 256-Lead ZC 66, 75, 81 B2 CZC66 CZC66 0 XPC832 XPC832 256-Lead VF 66, 75, 81 B2 CVF66 CVF66 0 XPC823E XPC823E 256-Lead ZT 66, 75 B2 ON C MI CZT66 CZT66 0 SE 300 420 Description Integrated MPU for mobile computing. 256-lead ZT is the preferred package. 823E has 16 KI cache and 8 KD , XPC850 XPC850 256-Lead ZT 50, 66, 80 BU XPC850DE XPC850DE 256-Lead ZT 50, 66, 80 BU XPC850SR XPC850SR ... Original
datasheet

12 pages,
212.17 Kb

XPC862SR MC68824 motorola zc XCC501RX166LD0B XCC501RX200LD0B XPC180 XPC823 XPC8260A XPC855T XPC860EN "motorola computing group" XPC832 XPC823E datasheet abstract
datasheet frame
Abstract: 7/98 Advance Information MPC850 MPC850 Mechanical Data and Ordering Information This document contains mechanical data and ordering information for the MPC850 MPC850. Table 1. Ordering Information Frequency (MHz) Temperature Order Number 256-Lead Plastic Ball Grid Array 0-33 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array 0-50 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array 0-66 Jct Temp: 0°C to 95°C 256-Lead Plastic Ball Grid Array TBD Jct Temp:-40°C to ... Original
datasheet

6 pages,
310.57 Kb

AN1231 XPC850SRZT33A IPB1 XPC850SE XPC850DHZT33A MOTOROLA d11 pb28 MPC850 MOTOROLA D26 xpc850SRZT50A XPC850SEZT33 XPC850DCZT33A MPC850 abstract
datasheet frame
Abstract: SECTION 23 MECHANICAL DATA AND ORDERING INFORMATION 23.1 ORDERING INFORMATION PACKAGE TYPE FREQUENCY (MHz) TEMPERATURE ORDER NUMBER 256-Lead Plastic Ball Grid Array with 1.27mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZT25 XPC823ZT25 XPC823ZT50 XPC823ZT50 XPC823CZT25 XPC823CZT25 256-Lead Plastic Ball Grid Array with 1.00mm Ball Pitch 25 50 25 0°C to 70°C 0°C to 70°C -45°C to -85°C XPC823ZC25 XPC823ZC25 XPC823ZC50 XPC823ZC50 XPC823CZC25 XPC823CZC25 23 MECHANICAL DATA AND ORDERING INFORMATION ... Original
datasheet

6 pages,
138.21 Kb

PC14 PB28 MPC823 127mm MPC823 user manual XPC823ZT50 XPC823ZT25 XPC823CZT25 XPC823ZC25 XPC823ZC50 XPC823CZC25 XPC823ZT25 abstract
datasheet frame
Abstract: Timing Model PCI compliant[1] Available in 160-Lead TQFP and CQFP, 208-Lead PQFP, 256-Lead BGA and 256-Lead FBGA packages Pinout compatible with the CY37256 CY37256, CY37128/37128V CY37128/37128V, CY37192/37192V CY37192/37192V, CY37384/37384V CY37384/37384V, CY37512/37512V CY37512/37512V Logic Block Diagram (256-Lead BGA) Clock/ Input Input 1 4 4 12 I/Os I/O0-I/O11 I/O0-I/O11 12 , Pin Configurations (continued) 256-Lead BGA (BG256 BG256) Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 , aid thermal dissipation. 5 CY37256V CY37256V Pin Configurations (continued) 256-Lead FBGA (BB256 BB256) Top ... Original
datasheet

20 pages,
504.6 Kb

CY37256V CY37256 CY37128/37128V CY37192/37192V CY37384/37384V CY37512/37512V CY37256V abstract
datasheet frame
Abstract: 160-Lead TQFP and CQFP, 208-Lead PQFP and 256-lead BGA packages Pinout compatible with the CY37256V CY37256V, CY37128/37128V CY37128/37128V, CY37192/37192V CY37192/37192V, CY37384/37384V CY37384/37384V, CY37512/37512V CY37512/37512V, CY7C375i Logic Block Diagram (256-Lead , TDO I/O95 I/O95 I/O96 I/O96 I/O97 I/O97 I/O98 I/O98 I/O99 I/O99 VCC0 4 CY37256 CY37256 Pin Configurations (continued) 256-Lead BGA , U162 Package Type 160-Lead Thin Quad Flat Pack 208-Lead Plastic Quad Flat Pack 256-Lead Ball Grid Array 160-Lead Thin Quad Flat Pack 208-Lead Plastic Quad Flat Pack 256-Lead Ball Grid Array 160-Lead Thin Quad ... Original
datasheet

20 pages,
466.7 Kb

IEEE 1149.1 JTAG CY37256-125 37256p CY37256 CY37256V CY37128/37128V CY37192/37192V CY37384/37384V CY37512/37512V CY37256 abstract
datasheet frame
Abstract: PRELIMINARY Delta39KTM ISRTM CPLD Family CPLDs at FPGA DensitiesTM 1 Features ·High density - 15K to 350K usable gates - 256 to 5376 macrocells - 92 to 520 maximum I/O pins - 12 Dedicated Inputs including 4 clock pins, 4 global control signal pins and 4 JTAG interface pins for reconfigurability ·Embedded Memory - 40K to 840K bits embedded SRAM · 32K to 672K bits of (single port) Cluster memory · 8K to 168K bits of (dual port) Channel memory ·High speed - 250-MHz in-system operati ... Original
datasheet

56 pages,
1075.77 Kb

datasheet abstract
datasheet frame
Abstract: PRELIMINARY Delta39KTM ISRTM CPLD Family CPLDs at FPGA DensitiesTM Features ·High density - 15K to 350K usable gates - 256 to 5376 macrocells - 92 to 520 maximum I/O pins - 12 Dedicated Inputs including 4 clock pins, 4 global control signal pins and 4 JTAG interface pins for reconfigurability ·Embedded Memory - 40K to 840K bits embedded SRAM · 32K to 672K bits of (single port) Cluster memory · 8K to 168K bits of (dual port) Channel memory ·High speed - 250-MHz in-system operation ·A ... Original
datasheet

57 pages,
1160.56 Kb

datasheet abstract
datasheet frame
Abstract: QUAD FLAT L-LEADED PACKAGE 256 PIN PLASTIC FPT-256P-M04 FPT-256P-M04 Lead pitch 0.50mm Package width - package length 40 - 40mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.50mm Target use 256-pin plastic QFP For hybrid ICs (FPT-256P-M04 FPT-256P-M04) 256-pin plastic QFP (TYPE AA) (FPT-256P-M04 FPT-256P-M04) 4.40(.173)MAX 42.60±0.30 SQ (1.677±0.12) 40.00±0.30 SQ (1.575±0.12) 192 (Mounting height) 0(0)MIN. (STAND OFF) 129 193 ... Original
datasheet

1 pages,
147.08 Kb

FPT-256P-M04 FPT-256P-M04 abstract
datasheet frame
Abstract: CA2E 256P6K-E 256P6K-E Plastic 256pin 28!28mm body HQFP EIAJ Package Code HQFP256-P-2828-0 HQFP256-P-2828-0.40 Weight(g) JEDEC Code ­ Under Planning HD D 256 Lead Material Cu Alloy 193 E HE 192 1 Symbol 64 129 128 65 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E e HD HE L L1 y Dimension in Millimeters Min Nom Max ­ ­ 3.7 0.13 0.25 0.05 ­ ­ 3.37 0.13 0.16 0.21 0.13 0.15 0.2 27.9 28.0 28.1 27.9 28.0 28.1 ... Original
datasheet

1 pages,
34.45 Kb

HQFP256-P-2828-0 256P6K-E 256P6K-E abstract
datasheet frame

Datasheet Content (non pdf)

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use of smaller single-ended voltage swings. The AD8152 AD8152 AD8152 AD8152 is offered in a 256-lead SBGA package that
www.datasheetarchive.com/files/analog-devices/productdescriptions/2008.html
Analog Devices 24/03/2005 1.69 Kb HTML 2008.html
swings. The AD8152 AD8152 AD8152 AD8152 is offered in a 256-lead SBGA package that operates over the industrial temperature
www.datasheetarchive.com/files/analog-devices/doc/productdescriptions/2008.html
Analog Devices 1.69 Kb HTML 2008.html
single-ended voltage swings. The AD8152 AD8152 AD8152 AD8152 is offered in a 256-lead SBGA package that operates over the industrial
www.datasheetarchive.com/files/analog-devices/gendesc/1899.htm
Analog Devices 05/06/2003 1.76 Kb HTM 1899.htm
a 27mm, 256-lead BGA. Samples are available now. Production quantities will be available within 60
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Maxim 02/05/2002 8.04 Kb HTM view_111.htm
- * - - FILE : zl50031qeg.bsd - generated by Cz.P. as zl50031 on Wed Sep 22 16:35:03 EDT 2004 - using p.jtag.bsd rev 3.3 July 18, 2003 - - BSDL description for top level entity zl50031 - Device : ZL50031 ZL50031 ZL50031 ZL50031 Flexible Digital switch with H.110 - Package : 256-lead MQFP - - Number of BSC cells: 257 - - * - Modification History: - Initial release: Wed Sep 22 16:35:03 EDT 2004 -
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Zarlink 03/02/2006 37.88 Kb BSD zl50031qeg.bsd
| | | * | | Zarlink Semiconductor | http://www.zarlink.com | | | Device: ZL50031 ZL50031 ZL50031 ZL50031 Flexible Digital Switch with H.110 | Package: 256-lead MQFP | | [IBIS Ver] 3.2 [File Name] zl50031qeg.ibs [File Rev] 3.0 [Date] Mon Sep 20 16:07:36 EDT 2004 | | * | Modification History: | Initial release: Mon Sep 20 16:07:36 EDT 2004
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Zarlink 03/02/2006 57.39 Kb IBS zl50031qeg.ibs