NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: SIEMENS Standard EEPROM ICs SLx 24C01/02 1/2 Kbit (128/256x8 bit) Serial CMOS-EEPROM with I2C , Manufacturer SLx 24C01/02 Revision History: Current Version: Preliminary 1997-10-01 Previous Version: 06.97 , Manufacturer SIEMENS 1/2 Kbit (128/256 x 8 bit) Serial CMOS SLx 24C01/02 EEPROMs, I2C Synchronous 2-Wire Bus , 24C01/02 Ordering Information Type Ordering Code Package Temperature Voltage SLA 24C01-D Q67100-H3543 Q67100-H3543 P-DIP-8-4 -40 °C . + 85 °C 4.5 V.5.5 V SLA 24C01 -S Q67100-H321 Q67100-H321 8 P-DSO-8-3 -40 °C . + 85 °C 4.5 ... | OCR Scan |
22 pages, |
smd code marking csr 24c02 wp Q67100-H3492 Q67100-H3496 Q67100-H3543 Q67100-H3544 24C01 24C01 6 24C01 MARKING 24c02 eeprom circuit diagram 24C01 pin configuration 24C01/02 24C01/02 abstract |
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| Abstract: SIEMENS Standard EEPROM ICs SLx 24C01/02/P 1/2 Kbit (128/256x8 bit) Serial CMOS-EEPROM with I2C , By Its Respective Manufacturer SLx 24C01/02/P Revision History: Current Version: Preliminary , x 8 bit) Serial CMOS SLx 24C01/02/P EEPROMs, I2C Synchronous 2-Wire Bus, Page Protection Mode™ , Its Respective Manufacturer SIEMENS SLx 24C01/02/P Ordering Information Type Ordering Code Package Temperature Voltage SLA 24C01-D/P Q67100-H3547 Q67100-H3547 P-DIP-8-4 -40 °C . + 85 °C 4.5 V.5.5 V SLA 24C01 -S/P ... | OCR Scan |
27 pages, |
24C01 MARKING 24C01 24C01 pin configuration 24C01/02/P 24C01/02/P abstract |
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| Abstract: MARKING 8-Lead PDIP 8-Lead SOIC 24CXXLI 24CXXLI FYYWWR CSI XX I YY WW R F = = = = = = = 24CXXWI 24CXXWI FYYWWR CSI XX I YY WW R F Catalyst Semiconductor, Inc. Device Code (see Marking Code table below) Temperature Range Production Year Production Week Product Revision (see Marking Code , , Inc. Device Code (see Marking Code table below) Temperature Range Production Year Production Week Product Revision (see Marking Code table below) Lead Finish 4 = NiPdAu 3 = Matte-Tin 8-Lead TSSOP ... | Original |
18 pages, |
eeprom 24C16 5 pin diode MARKING CODE A9 24c02 wp reset 24C08 code example 24C02 catalyst 24C01 MARKING how to reset 24C04 csi 24c16 24c16 wp 24C16 example code application 24c02 wp 24C02 csi 24C04 CSI CAT24C01/02/04/08/16 CAT24C01/02/04/08/16 abstract |
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| Abstract: PACKAGE MARKING 8-Lead PDIP 8-Lead SOIC 24CXXLI 24CXXLI FYYWWR CSI XX I YY WW R F = = = = , (see Marking Code table below) Temperature Range Production Year Production Week Product Revision (see Marking Code table below) Lead Finish 4 = NiPdAu 3 = Matte-Tin = = = = = = = Catalyst Semiconductor, Inc. Device Code (see Marking Code table below) Temperature Range Production Year Production Week Product Revision (see Marking Code table below) Lead Finish 4 = NiPdAu 3 = ... | Original |
18 pages, |
DATA SHEET 24C16 24C02 csi 24C16 CAT24C03 c code for 24c04 AEC-Q100 24C01 MARKING 24C04 CSI 24c16 wp 24cxx CAT24C05 csi 24c16 24C01 24C01G CAT24C03/05 CAT24C03/CAT24C05 CAT24C03/05 abstract |
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| Abstract: DATA I I I I I IT D7p6p5p4p3p2pi p0 L R A S / C B w K S T O P W7 is optional in the S-24C01 A. AO , optional in the S-24C01 A. in the S-24C04A S-24C04A. ) ADR INC ADR INC ADR INC Figure 11 Page Write In the , 0.38 min. 13.05 min. 0.46 ±0.05 _^0.25± 0.05 r~io° Figure 17 LJ Marking 6.00 ±0.20 :0.84 inn 1.47 ±0.05 1.75max. t -0.22 ±0.03 1.27 0.42 ±0.09 m0.10 min. Figure 18 ^J Marking Package ... | OCR Scan |
20 pages, |
S-24C0XA S-24C01A S-24C01ADP S-24C01AFJ S-24C02A S-24C02ADP S-24C02AFJ S-24C04A S-24C04ADP S-24C04AFJ 24C01 MARKING 24CD2 24cd4 datasheet abstract |
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| Abstract: Marking SC65D02P40 SC65D02P40 16 SSOP-24-300-0 SSOP-24-300-0.65 SC65D02P40 SC65D02P40 SC65D02P40A SC65D02P40A 16 SOP-24-375-1.27 , SC65D02P40 SC65D02P40 TYPICAL APPLICATION CIRCUIT VBat VDD 0.1u 100u *R1 10 3V 2 24C01 VCC 8 ... | Original |
19 pages, |
SC65X SC65D02P40A marking is K52 diode k70 marking K52 24C01 MARKING SC65D02P40 SC65D02C40 SC65D02P40 abstract |
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| Abstract: Temperature Range I = Industrial (-40ºC to +85ºC) E = Extended (-40ºC to +125ºC) 24C01 24C02 24C02 24C04 24C04 , 31-Jul-06 B Update Package Marking 29-Nov-06 C Update Features Update Pin Configuration Update Functional Symbol Added 8-Lead MSOP Package Outline Remove Package Marking Update Example of ... | Original |
17 pages, |
MS-001 AEC-Q100 CAT24C01 CAT24C02 CAT24C04 CAT24C08 CAT24C16 do ic 24C02 free IC 24c16 150mils 24C02 wp st TSOT-23 CAT24C01 abstract |
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| Abstract: 24C16L 24C16 24C16 Y Product Number 24C01 24C02 24C02 24C04 24C04 24C08 24C08 24C16 24C16 L: W: Y: Z: VP2: TD: I , Marking 11/29/06 C Update Features Update Pin Configuration Update Functional Symbol Added 8-Lead MSOP Package Outline Remove Package Marking Update Example of Ordering Information Copyrights ... | Original |
17 pages, |
CAT24C16 24c16 AEC-Q100 CAT24C01 CAT24C02 CAT24C04 CAT24C08 24C01 MARKING 24C02 catalyst CAT24C01/02/04/08/16 CAT24C01/02/04/08/16 abstract |
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| Abstract: 24xCxx SVC/SVC-64 SVC/SVC-64 Development Kit Manual With Sensory Voice LockTM Technology © 2003 Sensory, Inc. P/N 80-256-A SVC-64 SVC-64 Development Kit Manual SVC/SVC-64 SVC/SVC-64 Family Table of Contents Chapter 1: Overview . 3 Introduction . ... | Original |
112 pages, |
Voice Direct II Sensory atmel part marking AT29c020 cut template DRAWING intel batch MARKING flash mini project with 8051 programs SVC-64 24C01 MARKING atmel bootloader tutorial Password based door locking system 8051 mini projects password based door access using 8051 SVC/SVC-64 SVC/SVC-64 SVC/SVC-64 abstract |
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| Abstract: RSC-300/364 RSC-300/364 Development Kit Manual With Sensory SpeechTM 6 Technology © 2002 Sensory, Inc. P/N 80-184-I 80-184-I Development Kit Manual RSC-300/364 RSC-300/364 Table of Contents Chapter 1: Overview . 5 Introduction . ... | Original |
199 pages, |
RSC-300 voice activated recorder circuit Voice Dialer 364 Development kit RSC-264T Voice Direct II Sensory RSC-164 RSC B20 pwm fan speed control 8051 VOICE RECORDER playback system musical SCANNING KEYBOARD schematic RSC-364 atmel 8051 40-PIN datasheet RSC-300/364 80-184-I RSC-300/364 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| Datasheet 16K/8K/4K/2K/1K 16K/8K/4K/2K/1K 16K/8K/4K/2K/1K 16K/8K/4K/2K/1K SERIAL I 2 C BUS EEPROM M24C01-BN6 M24C01-DW6T M24C01-MN6T M24C01-MN6 M24C01-RBN6 M24C01-RDW6T M24C01-RMN6T M24C01-RMN6 M24C01-R M24C01-W M24C01 M24C02-BN6 M24C02-BN6 M24C02-BN6 M24C02-BN6 M24C02-DW6T M24C02-DW6T M24C02-DW6T M24C02-DW6T 2000 M24C16 M24C16 M24C16 M24C16, M24C08 M24C08 M24C08 M24C08 M24C04 M24C04 M24C04 M24C04, M24C02 M24C02 M24C02 M24C02, M24C01 16/8/4/2/1 Kbit Serial I C Bus EEPROM n Two Wire I 2 C , M24C04 M24C04 M24C04 M24C04, M24C02 M24C02 M24C02 M24C02, M24C01), and operate with a power supply down to 2.5 V (for the -W version of each , M24C01 are available in Plastic Dual-in-Line, Plastic Small Outline and Thin Shrink www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/5067.htm |
STMicroelectronics | 20/10/2000 | 34.1 Kb | HTM | 5067.htm |
| design. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST identifier. This letter is marked after the datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 the datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C801 M27C801 M27C801 M27C801 revision identifier. This letter is marked after the datecode on device marking. Test Procedure MIL www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6655-v1.htm |
STMicroelectronics | 25/05/2000 | 70.03 Kb | HTM | 6655-v1.htm |
| Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 ST24C16 ST24C16 ST24C16 ST24C16 ST25C16 ST25C16 ST25C16 ST25C16 Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp. Fail Samp. Fail Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail Operating Life Test Related Tests April 1998 to March 1999 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C256 M27C256 M27C256 M27C256 (D) M87C257 M87C257 M87C257 M87C257 (D) M27C www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6655.htm |
STMicroelectronics | 20/10/2000 | 74.66 Kb | HTM | 6655.htm |
| -STD-883 -STD-883 -STD-883 -STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 ST24C16 ST24C16 ST24C16 ST24C16 ST25C16 ST25C16 ST25C16 ST25C16 Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp. Fail Samp. Fail Samp " robustness through product and process design. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail Temperature,Humidity, Bias revision identifier. This letter is marked after the datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6655-v2.htm |
STMicroelectronics | 14/06/1999 | 68.16 Kb | HTM | 6655-v2.htm |
| Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 ST Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp. Fail Samp. Fail Samp Related Tests October 1997 to September 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail Temperature,Humidity, Bias device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C256 M27C256 M27C256 M27C256 (D) M87C257 M87C257 M87C257 M87C257 (D) M27C512 M27C512 M27C512 M27C512 (D www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6351-v1.htm |
STMicroelectronics | 02/04/1999 | 64.07 Kb | HTM | 6351-v1.htm |
| Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 December 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail Temperature letter is marked after the datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6493.htm |
STMicroelectronics | 20/10/2000 | 69.54 Kb | HTM | 6493.htm |
| " robustness through product and process design. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 -STD-883 -STD-883 -STD-883 -STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp -STD-883 -STD-883 -STD-883 -STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail 1998 to December 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C256 M27C256 M27C256 M27C256 (D) M87C257 M87C257 M87C257 M87C257 (D) M27C512 M27C512 M27C512 M27C512 (D www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6493-v2.htm |
STMicroelectronics | 14/06/1999 | 63.11 Kb | HTM | 6493-v2.htm |
| Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 ST Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp. Fail Samp. Fail Samp Related Tests October 1997 to September 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp. Fail Samp. Fail Samp. Fail Temperature,Humidity, Bias device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C256 M27C256 M27C256 M27C256 (D) M87C257 M87C257 M87C257 M87C257 (D) M27C512 M27C512 M27C512 M27C512 (D www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6351-v2.htm |
STMicroelectronics | 14/06/1999 | 64.03 Kb | HTM | 6351-v2.htm |
| . Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 Procedure Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp Die revision identifier. This letter is marked after the datecode on device marking. Test Procedure datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M27C2001 M27C2001 M27C2001 M27C2001 (D) M27 www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6493-v3.htm |
STMicroelectronics | 25/05/2000 | 64.99 Kb | HTM | 6493-v3.htm |
| Test Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 ST24C16 ST24C16 ST24C16 ST24C16 ST25C16 ST25C16 ST25C16 ST25C16 ST24 Conditions ST24C01 ST24W01 ST24W01 ST24W01 ST24W01 ST24C02 ST24C02 ST24C02 ST24C02 ST24W02 ST24W02 ST24W02 ST24W02 ST24C04 ST24C04 ST24C04 ST24C04 ST24W04 ST24W04 ST24W04 ST24W04 ST24C08 ST24C08 ST24C08 ST24C08 Samp. Fail Samp. Fail Samp. Fail Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C08 M24C08 M24C08 M24C08 Samp. Fail Samp to September 1998 Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test Conditions M24C01 M24C02 M24C02 M24C02 M24C02 M24C04 M24C04 M24C04 M24C04 M24C letter is marked after the datecode on device marking. Test Procedure MIL-STD-883 MIL-STD-883 MIL-STD-883 MIL-STD-883 Procedure Test www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/6351.htm |
STMicroelectronics | 20/10/2000 | 70.45 Kb | HTM | 6351.htm |